TWI407118B - Electronic component testing device - Google Patents

Abstract

An electronic component testing apparatus is provided with a testing section and a transfer apparatus. The testing section presses an IC device to a socket (70) of a test head (7), in a status where a rib (93) is holding the IC device on a cover tray (9) positioned in substantially the same arrangement as a storage section of a customer tray (8A), and brings an input/output terminal (HB) of the IC device into electrical contact with a contact pin (71) of the socket (70). The transfer apparatus transfers the cover tray (9), which is holding the IC device, to the testing section.

Description

Electronic component testing device

The present invention relates to an electronic component testing apparatus for performing testing of an electronic component such as a semiconductor integrated circuit component (hereinafter also referred to as an IC component).

In an electronic component testing device called a processor, a plurality of IC components housed in the tray are moved into the processor, and each IC component is electrically contacted with the test head, and then the electronic component testing device body (below) Called the tester) for testing. Then, after the test is completed, each IC component is discharged from the test head, and is replaced with a tray corresponding to the test result, thereby classifying into a good or defective product.

As such a processor, it is known to reload the IC component into the processor 1 from a tray (hereinafter referred to as a custom tray) that has been carried out from the processor in a state in which the IC component has been tested or tested. A tray that is cyclically transported (hereinafter referred to as a test tray) is placed in the test tray so that the IC component electrically contacts the socket of the test head to perform the test of the IC component.

In this electronic component testing device, the IC component is replaced from the custom pallet to the test tray before the test, and the IC component is also replaced from the test tray to the custom pallet after the test, which takes a lot of pick-and-place operations. time. Therefore, in order to increase productivity, when the number of simultaneous tests (hereinafter referred to as simultaneous measurement) is increased in the test section, the pick-and-place operation of the IC component becomes a bottleneck step.

Further, in such an electronic component testing apparatus, since a transfer device for replacing an IC component or a dedicated test tray between a custom tray and a test tray is required, the cost of the electronic component test device itself is increased.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component testing apparatus which can reduce the pick-and-place operation of an electronic component to be tested and can reduce the cost.

In order to achieve the object, according to the present invention, there is provided an electronic component testing device (refer to claim 1 of the patent application) for testing a tested electronic component, characterized in that it comprises: a testing section, which is to be tested The electronic component is received or held in a custom tray having a receiving portion for receiving the electronic component to be tested, or arranged in substantially the same arrangement as the receiving portion of the customized tray to maintain the electronic component to be tested. The state of the cover tray of the part, pressing the tested electronic component against the socket of the test head, and electrically connecting the output of the tested electronic component into the terminal to electrically contact the contact terminal of the socket; and the carrying means is for receiving Or the custom tray or the lid tray holding the tested electronic component is moved to the test portion.

In the present invention, the customized tray or the cover tray in which the accommodating portion has received or held the electronic component to be tested is moved to the test portion, and the electronic component to be tested is pressed in the test portion in a state where the customized tray or the cover tray has been received or held. Socket and perform testing of the tested electronic components.

In the present invention, since the test tray is not used, and the test tray or the lid tray has been in the state of accommodating or holding the electronic component to be tested, it is not necessary to change between the custom tray and the test tray before and after the test. The electronic components are tested to reduce pick and place operations.

Further, since it is not necessary to replace the transfer device of the electronic component to be tested or the dedicated test tray between the custom tray and the test tray, the cost of the electronic component test device itself can be reduced.

Although the invention is not particularly limited, the test portion is in a state in which the input and output terminals of the electronic component to be tested are facing upward, and the input and output terminals of the electronic component to be tested are preferably pressed against the contact terminal of the socket (refer to Apply for patent scope 2).

By setting the posture of the tested electronic component to the state in which the input and output terminals of the tested electronic component are facing upward, the length of the contact terminal of the socket can be shortened, and the electronic component to be tested is tested using a high frequency signal. The situation becomes effective.

Although the invention is not particularly limited, the cover tray is preferably made of a material having a higher strength than the material constituting the custom tray (see the third item of the patent application).

Since the custom tray is made of a synthetic resin material or the like, it has insufficient strength for pushing force when the electronic component to be tested is pressed against the socket, or cannot efficiently transfer heat to the electronic component to be tested when the application processing portion is hot. Or the problem that the tested electronic component cannot be accurately positioned on the socket when the tested electronic component and the socket are in contact.

Further, in the present invention, by a material having a higher strength than a material constituting a custom tray such as a metal material or a ceramic, it is possible to ensure the strength required at the time of pressing or the high-efficiency heat conduction when a thermal stress is applied. It can also be positioned with high precision when in contact.

Although the invention is not particularly limited, it further includes a mounting means for attaching the lid tray or the order tray to the order tray or the lid tray (refer to item 4 of the patent application).

Although the test tray includes a latch mechanism for preventing ejection of the contained electronic component to be tested, a means for preventing ejection is not provided in the custom tray. Therefore, in the present invention, when the customized tray is transported in the electronic component testing apparatus, the cover tray is covered by the mounting means on the custom tray for accommodating the electronic component to be tested, thereby preventing the electronic component to be tested from being customized from the tray. pop up.

Although the invention is not particularly limited, the mounting means includes: a first mounting means for covering the cover tray on the custom tray for receiving the tested electronic component before the test; and the second mounting Preferably, the customized tray is placed on the cover tray for accommodating the tested electronic component after testing (refer to claim 5).

Although the invention is not particularly limited, it further includes a reversing means for reversing the custom tray that is covered by the cover tray or the cover tray that is covered by the custom tray (refer to the patent application) Item 6 of the scope).

Although the invention is not particularly limited, the reversing means includes: a first reversing means for inverting the customized electronic component before the test and being reversed by the custom tray that covers the cover tray; and The reversal means is such that the test piece after the test is held and the cover tray covered with the custom tray is reversed preferably (refer to claim 7).

Although the invention is not particularly limited, it further includes a detaching means for detaching the order tray or the lid tray from the lid tray or the custom tray (refer to item 8 of the patent application).

Although the invention is not particularly limited, the detaching means includes: a first detaching means for detaching the customized tray from the cover tray of the electronic component to be tested before the test; and the second It is preferable to remove the cover tray from the custom tray on which the electronic component to be tested is subjected to the test (refer to item 9 of the patent application).

Although the invention is not particularly limited, it further includes a returning means for returning the cover tray or the customized tray from the detaching means or the mounting means to the mounting means or the detaching means (refer to the application). Patent area 10).

Although the invention is not particularly limited, the return means includes: a first return means for returning the lid tray from the second detaching means to the first attachment means; and the second return means It is preferable that the customized tray is returned to the second mounting means from the first detaching means (refer to item 11 of the patent application).

Although the invention is not particularly limited, the test head has a guiding means for guiding the electronic component to be tested held by the cover tray to the socket (refer to claim 12).

The guiding means is disposed on the side of the test head, and the guiding electronic component held by the cover tray is guided to the socket by using the guiding means, thereby preventing contact failure of the electronic component to be tested and the socket.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Fig. 1 is a schematic plan view showing the entire structure of an electronic component testing device according to an embodiment of the present invention.

The processor 1 of the present embodiment tests (checks) the IC component by applying a test signal to the IC component via the test head 7 by applying a tester (not shown) to a temperature component in which a high temperature or a low temperature is applied to the IC component. Whether the device is operating properly. By the test of the IC component of the electronic component test apparatus, the test tray 91 is held in a state in which the accommodating portion 91 holds the IC package in the same manner as the custom tray 8A.

Therefore, as shown in FIG. 1, the processor 1 of the present embodiment includes the loading unit 200, the application unit 300, the test unit 400, the heat removal unit 500, and the removal unit 600.

The loading unit 200 carries the application unit 300 piece by piece under the order of the custom tray 8A that is supplied to the processor 1 in a state where the lid tray 9 is placed in a stacked state.

In the application unit 300, after the IC unit is still housed in the order tray 8A, high temperature or low temperature thermal stress is applied to the IC unit, and the state in which the order tray 8A and the lid tray 9 are overlapped is reversed and carried in. Test section 400.

Next, in the test portion 400, the custom tray 8A is detached from the cover tray 9, the cover tray 9 is moved under the test head 7, and the test of the IC assembly is performed, and then the customized tray 8A is placed on the cover. Above the tray 9, it is moved to the heat removing unit 500.

In the heat removal unit 500, after the lid tray 9 and the order tray 8A are overlapped, the thermal stress is removed from the IC unit and transferred to the carry-out unit 600.

After the cover tray 9 is removed from the order tray 8A in the carry-out unit 600, the order tray 8A is stacked on the order tray 8A that has been carried to the carry-out unit 600.

The customized tray of the IC component thus tested is housed and transferred to a sorting machine different from the processor 1 by an operator in the test step or an automatic carrier such as an ADV. The test result of the electronic component test apparatus is assigned to each of the order pallets itself by, for example, a barcode or the like, or is transmitted as data from the processor 1 to the sorting dedicated machine. Then, the classifier is used to classify the IC components into categories that are appropriate for the test results.

Next, the custom tray 8A and the lid tray 9 used in the electronic component testing device of the present embodiment will be described first.

2A is a plan view showing a custom tray used in the electronic component testing device according to the embodiment of the present invention, FIG. 2B is a side view of the custom tray shown in FIG. 2A, and FIG. 2C is a view showing FIG. 2B. An enlarged cross-sectional view of Section IIC.

In the customized tray 8A of the present embodiment, as shown in FIGS. 2A and 2B, a plurality of accommodating portions 82 for accommodating the IC module are formed in a flat plate-shaped tray made of, for example, a synthetic resin material. In the present embodiment, a total of 126 accommodating portions 82 are formed in the tray main body 81 in a row of seven rows and eight rows.

On the lower surface side of each of the accommodating portions 82, as shown in Fig. 2C, ribs 83 projecting downward are provided. This rib 83 is formed so as to substantially face the periphery of the accommodating portion 82 of the other customized tray 8A when the order tray 8A is stacked on the other custom tray 8A (see FIG. 6A to be described later).

The cover tray 9 of the present embodiment has the same shape as the custom tray 8A, and includes: a flat-shaped tray body 91; a plurality of accommodating portions 92 provided in the tray body 91; and ribs 93 are provided on The lower surface side of each housing portion 92.

The tray main body 91 of the lid tray 9 is different from the custom tray 8A, and is made of, for example, a metal material such as aluminum or stainless steel or a ceramic such as aluminum disulfide (Al ₂ O ₃ ). The synthetic resin material has a higher material composition. Thus, by forming the lid tray 9 with a metal material, the strength required to press the IC module against the socket 70 of the test head 7 (see FIG. 6E) can be ensured. Further, when the application portion 300 or the heat removing portion 500 applies or removes thermal stress to the IC component, thermal stress can be efficiently applied to the IC component. Further, when the IC package is in contact with the socket 70, the IC component can be positioned with high precision for the socket 70. Further, the metal lid tray 9 may be subjected to a slow electric leakage treatment as an ESD (Electro-Static Discharge) countermeasure.

When the lid tray 9 is placed on the order tray 8A in which the IC unit has been housed in the accommodating portion 82, when the order tray 8A and the lid tray 9 are reversed, the yoke 93 of the lid tray 9 is held to hold the IC unit. (Refer to Figure 6B). Therefore, the rib 93 of the lid tray 9 of the present embodiment corresponds to an example of the holding portion of the lid tray of the present invention.

Next, each part of the electronic component testing device of the present embodiment will be described in detail.

<Loading unit 200>

Fig. 3 is a plan view showing a mounting device of an electronic component testing device according to an embodiment of the present invention.

As shown in FIG. 1, the loading unit 200 includes a first transfer device 210 for transferring the order tray 8A supplied to the processor 1 in a stacked state to the first transfer device 230 one by one; the first installation The device 220 covers the custom tray 8A with the lid tray 9 and the first conveying device 230, and moves the customized tray 8A to the application unit 300.

As shown in FIG. 3, the first transfer device 210 includes a Y-axis direction guide 211 that is mounted on the device substrate of the processor 1 along the Y-axis direction, and a movable arm 212 that can be in the Y-axis direction guide 211. The upper portion reciprocates in the Y-axis direction; and the grip head 213 is disposed at the front end of the movable arm 212 and is movable up and down by an actuator not specifically shown. The holding head 213 has an opening and closing grip claw 214 for holding the custom tray 8A downward. Further, the Y-axis direction guide rail 211 is provided to straddle the first conveying device 230.

The first transfer device 210 holds the custom tray 8A at the uppermost stage of the laminate constituted by the custom tray 8A supplied from the processor 1 in the previous step by the gripping claw 213, and uses the When the grip head 213 is raised by the actuator (not shown), the movable arm 212 moves on the Y-axis direction guide rail 211, and the custom tray 8A is delivered to the first conveyance device 230.

As shown in FIG. 3, the first mounting device 220 includes an X-axis direction guide 221 which is mounted on the device substrate of the processor 1 along the X-axis direction, and a movable arm 222 on the X-axis direction guide 221 The reciprocating movement is performed along the X-axis direction; and the grip head 223 is provided at the front end of the movable arm 222 and is movable up and down by an actuator not specifically shown. The grip head 223 has an open-close type gripping claw 224 for gripping the lid tray 9 on the lower side.

In the first mounting device 220, the gripping head 223 holds the lid tray 9 at the end of the first feeding device 101 by the grip claws 224, and raises the gripping head 223 by an actuator (not shown). The movable arm 222 moves on the X-axis direction rail 221, and covers the held lid tray 9 on the order tray 8A located on the first conveying device 230.

Since the cover tray 9 is placed on the order tray 8A, the ribs 93 of the cover tray 9 are pressed against the IC package housed in the accommodating portion 82 of the order tray 8A (refer to FIG. 6A), and the processor 1 is placed in the processor 1. When the customized tray 8A is handled, the IC component can be prevented from being ejected from the custom tray 8A.

Further, the first returning device 101 is constituted by, for example, a belt conveyor provided on the device substrate of the processor 1, and the cover tray 9 that is removed from the order tray 8A by the second detachable device 620 is sent to the carry-out unit 600. The first mounting device 220 of the loading unit 200 is moved back.

As shown in FIG. 3, for example, the first conveying device 230 is configured by arranging a plurality of rotating rollers that can be driven by a motor or the like (not shown) in two parallel rows, so that the customized tray 8A can be along the Y-axis. Move in direction.

The first conveyance device 230 is sent to the application unit 300 by the custom tray 8A that is moved by the first transfer device 210 and covered with the lid tray 9 by the first attachment device 220.

<application unit 300>

Fig. 4A is a plan view showing a first inverting device of the electronic component testing device of the embodiment, and Fig. 4B is a front view of the first inverting device shown in Fig. 4A.

The application unit 300 has a thermostatic bath that applies a target high temperature or low temperature thermal stress to the IC package housed in the custom tray 8A. As shown in FIG. 1 , the inside of the constant temperature bath includes: The vertical conveyance device shown in the figure; the second conveyance device 310 moves the cover tray 9 and the order tray 8A to the test unit 400; and the first reversing device 320 is in a state in which the custom tray 8A and the cover tray 9 are overlapped. Reverse the order.

The vertical conveying device can hold the plurality of sets of the customized trays 8A and the lid trays 9, and can move the custom trays 8A and the lid trays 9 in order toward the Z-axis direction. The custom tray 8A waits in the application portion 300 while being held by the vertical conveying device, thereby applying a high-temperature or low-temperature thermal stress of about -55 to +150 °C to the IC assembly. .

The second transport device 310 is configured by arranging a plurality of rotating rollers that can be driven by a driving source (not shown) such as a motor in substantially parallel rows, so that the customized tray 8A and the lid tray 9 can be along the X axis. Move in direction.

As shown in FIGS. 4A and 4B, the first inverting device 320 includes a pair of rotating portions 321 which are provided on the device substrate of the processor 1 and an extending portion 322 which is disposed opposite to each other in each of the rotating portions 321. And the collet 323 is disposed at the front end of each of the elongated portions 322.

Each of the rotating portions 321 is constituted by, for example, a rotating motor and a gear mechanism (not shown) connected to the drive shaft, and the extending portion 322 is rotatable around the Y-axis direction.

Each of the elongated portions 322 is constituted by, for example, a pneumatic cylinder, and the rod 322a can be elongated in the Y-axis direction. The two elongated portions 322 are disposed such that the front ends of the rods 322a face each other. Therefore, when each of the extending portions 322 is extended, the distance between the front ends of the rods 322a is shortened, and conversely, when the respective extending portions 322 are shortened, the distance between the front ends of the rods 322a becomes long.

A chuck 323 is provided at the front end of the rod 322a of each of the elongated portions 322. Each of the chucks 323 is opened and closed by air pressure or the like, and the custom-made pallet 8A and the lid tray 9 which are overlapped can be gripped.

In the first transfer device 310, the second transfer device 310 moves the order tray 8A and the lid tray 9 from the vertical transport device to the test unit 400, so that the order tray 8A and the lid tray 9 are covered from the cover tray 9. The state on the tray 8A is rotated substantially 180 degrees into a state in which the order tray 8A is placed on the lid tray 9.

Further, as shown in FIG. 4B, in order to avoid interference with the order tray 8A and the lid tray 9, one of the second conveying devices 310 can be lowered when the first reversing device 320 is reversed.

<Test section 400>

Fig. 5 is a plan view showing the detaching and detaching device of the electronic component testing device of the embodiment.

The test portion 400 has a test chamber which is in a state of maintaining thermal stress applied to the IC component, presses the IC component held by the cover tray 9 against the contact terminal 71 of the test head 7, and allows the output of the IC component to enter the terminal and the socket. The contact terminals 71 of 70 are in electrical contact and perform testing of the IC components. Inside the test chamber, an upper portion of the test head 7 is accessed via an opening (not shown) formed in the device substrate, and the socket 70 is located inside the test chamber. Further, inside the test chamber, as shown in Fig. 1, a dismounting device 410 is provided which detaches the order tray 8A from the cover tray 9 which has been housed before the test, and is tested in the IC component. When finished, the custom tray 8A is overlaid on the lid tray 9.

As shown in Fig. 1, the detachable device 410 is composed of the following members. The first detachable device 420 removes the custom tray 8A from the lid tray 9, and moves the customized tray 8A to the second return. The second returning device 430 moves the customized tray 8A moved by the first attaching and detaching device 420 to the second mounting device 440, and the second mounting device 440 carries the second returning device 430. The custom tray 8A is then placed over the lid tray 9.

As shown in FIG. 5, the first detachable device 420 includes a Y-axis direction guide 421 that is mounted on the device substrate of the processor 1 along the Y-axis direction, and a movable arm 422 that can be used in the Y-axis direction guide 421. The upper portion reciprocates in the Y-axis direction; and the grip head 423 is disposed at the front end of the movable arm 422 and is movable up and down by an actuator not specifically shown. The holding head 423 has an opening and closing grip claw 424 for holding the custom tray 8A downward. Further, the Y-axis direction guide rail 421 is provided to straddle the second conveying device 310 and the second returning device 430.

The second returning device 430 is configured by, for example, a belt conveyor or the like, and can move the customized tray 8A from the operating region of the first attaching and detaching device 420 to the operating region of the second mounting device 440.

As shown in FIG. 5, the second mounting device 440 includes a Y-axis direction guide 441 which is mounted on the device substrate of the processor 1 along the Y-axis direction, and a movable arm 442 on the Y-axis direction guide 441. The reciprocating movement is performed along the Y-axis direction; and the grip head 443 is provided at the front end of the movable arm 442 and is movable up and down by an actuator not specifically shown. The grip head 443 has an opening and closing grip claw 444 for holding the custom tray 8A downward. Further, the Y-axis direction guide rail 441 is provided to straddle the second returning device 430 and the third conveying device 510.

In the test unit 400, first, the first detachable device 420 of the detachable device 410 detaches the customized tray 8A from the cover tray 9 on the second transfer device 310 on the side of the application unit 300, and moves the customized tray 8A. Go to the second return device 430.

The lid tray 9 from which the customized tray 8A has been removed is moved to the test head 7, and the IC assembly is pushed by a push rod (not shown) by a Z-axis drive mechanism (not shown) while being held by the cover tray 9. The socket 70 of the test head 7 is pressed so that the output terminal of the IC component and the contact terminal 71 of the socket are electrically contacted, and the test of the IC component is performed by the test head 7 using a tester (not shown). The test result of the IC component is given to the custom pallet 8A itself by, for example, an ID of a bar code or the like, or transmitted as data from the processor 1 to the sorting dedicated machine. After the test is completed, the cover tray is discharged from the test head 7 to the third conveyance device 510 on the side of the heat removal unit 500 while the IC components that have been tested are still being held.

With the test of this IC component, the second returning device 430 moves the order tray 8A in the X-axis direction. Next, after the lid tray 9 is placed on the third conveying device 510 on the side of the heat removing unit 500, the second mounting device 440 receives the order tray 8A from the second feeding unit 430, and reattaches the order tray 8A to the lid. On the tray 9. When the lid tray 9 and the order tray 8A are overlapped, the third conveying device 510 is moved to the heat removing unit 500.

<heat removal unit 500>

The heat removing unit 500 has a heat removing groove for removing the applied thermal stress from the tested IC component. As shown in FIG. 1, the inside of the constant temperature bath includes: a third carrying device 510, which is to be customized. The state in which the tray 8A and the lid tray 9 are overlapped is transferred from the test unit 400 to the heat removing unit 500; and the second inverting device 520 is reversed in a state in which the order tray 8A and the lid tray 9 are overlapped; and The vertical handling device shown in the schematic.

The third transporting device 510 is configured by arranging a plurality of rotating rollers that can be driven by a driving source (not shown) such as a motor in substantially parallel rows, so that the customized tray 8A and the lid tray 9 can be along the X-axis. Move in direction.

The second inverting device 520 includes a pair of rotating portions provided on the device substrate of the processor 1 as in the first transfer device 310 described above, and the extended portion is provided in each of the rotating portions. The two are opposed to each other; and the collet is disposed at the front end of each of the elongated portions.

The second reversing device 520 causes the order tray 8A and the lid tray 9 to be covered from the order tray 8A while the third transport device 510 is moving the order tray 8A and the lid tray 9 from the test unit 400 to the vertical transport unit 510. The state on the lid tray 9 is rotated substantially 180 degrees so that the lid tray 9 is placed on the custom tray 8A.

Further, although not specifically illustrated, one of the third conveying devices 510 can be lowered when the second reversing device 520 is reversed in order to avoid interference with the order tray 8A and the lid tray 9.

The vertical conveying device can hold the plurality of sets of the customized trays 8A and the lid trays 9, and can move the custom trays 8A and the lid trays 9 in order toward the Z-axis direction.

In the heat removing unit 500, when the application unit 300 applies a high temperature to the IC unit, the IC unit is cooled by the air blower and returned to the room temperature, and then moved to the carry-out unit 600. On the other hand, when the application unit 300 applies a low temperature to the IC module, the IC unit is heated by a warm air, a heater, or the like, and returned to the temperature at which the dew condensation does not occur, and then moved to the carry-out unit 600.

<Mobile unit 600>

As shown in Fig. 1, the carry-out unit 600 includes a fourth transport device 610 that carries the order tray 8A from the heat removing unit 500, and a second detachable device 620 that removes the lid tray 9 from the custom tray 8A; The second transfer device 630 moves the order tray 8A one by one from the fourth transfer device 610 to the laminate composed of the order tray 8A carried out by the processor 1.

As shown in FIG. 1, the fourth conveying device 610 has the same structure as the first conveying device 230 of the loading unit 200, and is configured by, for example, arranging a plurality of rotating rollers that can be driven by a motor or the like in substantially parallel rows. The custom tray 8A can be moved in the Y-axis direction.

The fourth transport device 610 transports the staple tray 8A located at the uppermost stage of the vertical transport device of the heat removing unit 500 to the carry-out unit 600.

As shown in FIG. 1, the second attachment/detachment device 620 has the same structure as the first attachment device 220 of the loading unit 200, and includes an X-axis direction guide rail, a movable arm, a grip head, and a grip claw.

The second attaching and detaching device 620 removes the lid tray 9 that is placed on the order tray 8A located at the end of the fourth conveying device 610 from the order tray 8A, and moves to the starting point of the first returning device 101.

As shown in FIG. 1, the second transfer device 630 has the same structure as the first transfer device 210 of the loading unit 200, and includes a Y-axis direction guide rail, a movable arm, a grip head, and a grip claw.

The second transfer device 630 is located at the end of the fourth transfer device 610, and transfers the customized tray 8A from which the cover tray 9 has been removed by the second attaching and detaching device 620 to the order from the self-processor 1 to the subsequent step. The uppermost section of the laminate formed by the tray.

The function will be described below.

6A to 6E are cross-sectional views showing the state of the order tray and the lid tray in each step of the electronic component testing apparatus of the embodiment.

First, when the stacked body of the processor 1 is carried in a stacked body in which a plurality of customized trays 8A having the IC components before the test are stacked, the first transfer device 210 is placed in the stacked body. The uppermost custom tray 8A is moved to the first conveying device 230. In addition, the order tray 8A is carried into the loading unit 200 of the processor 1 in a state where the input/output terminal HB of the IC unit faces downward.

After the order tray 8A is placed on the first transport device 230, the first mounting device 220 covers the lid tray 9 at the end of the first return device 101 on the order tray 8A. After the lid tray 9 is placed on the order tray 8A, as shown in Fig. 6A, the lower portion of the lid tray 9 enters the upper portion of the order tray 8A, and the rib 93 of the lid tray 9 presses the housing portion 82 of the order tray 8A. The top of the IC component that is contained. Thus, since the IC component is held between the custom tray 8A and the cover tray 9, it is possible to prevent the IC component from being ejected from the order tray 8A during transportation in the processor 1.

Next, the first conveyance device 230 carries the order tray 8A and the lid tray 9 into the application unit 300, and the vertical conveyance device in the application unit 300 causes the order tray 8A to sequentially rise, during which high temperature or low temperature heat is applied to the IC assembly. stress.

The order tray 8A that has risen to the uppermost portion of the vertical conveyance device is moved to the test unit 400 by the second conveyance device 310. At the time of conveyance, the first reversing device 320 substantially reverses the order tray 8A and the lid tray 9 which are overlapped each other by 180 degrees. When the staple tray 8A and the lid tray 9 are reversed by the first reversing device 320, as shown in Fig. 6B, the custom tray 8A is placed on the lid tray 9, and the IC module is oriented upward with its output terminal HB. The posture is maintained by the cover tray 9.

When the order tray 8A and the lid tray 9 are carried into the test unit 400, as shown in FIG. 6C, the first detachable device 420 of the detachable device 410 detaches the order tray 8A from the lid tray 9, and the lid tray 9 is detached. Moving to the lower side of the test head 7, the custom tray 8A is transferred to the second returning device 430.

As shown in FIG. 6D, the test head 7 of the present embodiment includes four guide posts 72 that protrude downward. These guide posts 72 are disposed around the socket 70 so as to surround the four corners of the IC assembly held by the ribs 93 of the cover tray 9 when the IC assembly is pressed against the contact terminals 71. An inclined tapered surface 73 is formed at each of the front end portions of the respective guide posts 72 facing each other.

When the lid tray 9 from which the order tray 8A has been removed is moved to the lower side of the test head 7, the Z-axis driving mechanism (not shown) presses the IC component held by the lid tray 9 via a push rod (not shown). The socket 70 is connected to the terminal HB of the IC component to electrically contact the contact terminal 71 of the socket 70, and the test of the IC component is performed by a tester (not shown) via the test head 7.

In addition, in FIG. 6D and FIG. 6E, only one socket 70 is shown, but actually, for example, the same number (M=N) as the total number (N) of the accommodating portions 82 of the order tray 8A, The total number (N) is divided by the number of integers (M=N/A, where A is an integer), or the number of integer multiples of the total number (N) (M=N×A. where A is an integer The socket 70 is disposed on the test head 7, and performs testing of a plurality of IC components.

Further, the plurality of sockets 70 on the test head 7 are arranged at the same distance as the pitch between the accommodating portions 82 of the custom tray 8A or an integral multiple thereof. Further, when the socket 70 is arranged at an integral multiple of the pitch of the accommodating portion 82 of the order tray 8A, the accommodating portion 92 of one or a plurality of the lid trays 9 is skipped and the IC module is tested. As a result, the IC is performed a plurality of times. Testing of components.

When pressed here, the IC assembly is guided to the socket 70 under the tapered surface 73 formed at the front end of each of the guide posts 72, as shown in Fig. 6E, at the output of the IC assembly into the terminal HB and the socket 70. Before the contact terminal 71 is about to come into contact, the IC package is accurately positioned to the socket 70 by the guide post 72. Further, as shown in FIG. 6E, in order to prevent the guide post 72 and the cover tray 9 from interfering when the guide post 72 guides the IC package, the cover tray 9 is formed in a concave shape around the rib 93.

In the present embodiment, as shown in Fig. 6, the IC module is in a posture in which the input/output terminal HB is directed upward when the test is performed. Therefore, the length L ₁ of the contact terminal 71 of the socket 70 (see FIG. 6D) can be shortened compared to the case where the test of the IC module is performed in a posture in which the input/output terminal HB is directed downward (see FIG. 7B). Therefore, it is effective to test an IC component using a high frequency signal.

When the test of the IC module is completed, the custom tray 8A is placed on the lid tray 9 holding the IC unit by the second mounting device 440 of the detachable device 410, and then transferred to the heat removing unit 500 by the third conveying device 510.

In the heat removal unit 500, the second reversing device 520 reverses the custom tray 8A and the lid tray 9 which are overlapped with each other, and then removes the heat of the IC unit, and the vertical transfer device causes the order tray 8A and the lid tray 9 to be sequentially arranged. It is lowered and delivered to the fourth conveying device 610.

When the order tray 8A and the lid tray 9 are transported to the carry-out unit 600 by the fourth transport device 610, the second attaching and detaching device 620 removes the lid tray 9 from the order tray 8A, and the second transfer unit 630 The order tray 8A is transferred to the uppermost stage of the laminate formed by the custom tray that has been moved from the processor 1 to the subsequent step.

Fig. 7A is a cross-sectional view showing a state in which an IC package housed in a cover tray is close to a socket of a test head, and Fig. 7B is a view showing an output of an IC component in another embodiment of the present invention. A cross-sectional view of the state in which the contact terminals of the terminal and the socket are in electrical contact.

In the other embodiment of the present invention, the test of the IC component is performed not in the state of being held by the cover tray 9, but the IC component is tested in the state of being housed by the custom tray 8B.

In the custom tray 8B according to another embodiment of the present invention, as shown in FIGS. 7A and 7B, a recess 84 having an upper portion of the socket 70 is provided below the housing portion 82 in which the IC module is housed. This concave portion 84 communicates with the upper receiving portion 82 via the opening 85. The opening 85 has a size in which all of the input and output terminals HB of the IC package housed in the housing portion 82 can face the recess 84.

When the IC assembly is tested, the Z-axis drive mechanism (not shown) is lowered. As shown in FIG. 7B, the upper portion of the socket 70 enters the recess 84 of the custom tray 8B, and the input and output terminals of the IC assembly are electrically connected to the socket 70. Contact terminal 71.

In the case of using the customized tray 8B, since it is not necessary to replace the IC unit from the order tray 8B to the lid tray 9B, the first reversing device 320 of the applying unit 300 and the second counter of the heat removing unit 500 are not required. Turning device 520. Further, the first detachable device 420 of the detachable device 410 detaches the cover tray 9 from the custom tray 8B, and presses the IC assembly to the socket 70 of the test head 7 in a state of being housed by the customized tray 8B. On the other hand, the second returning device 430 returns the lid tray 9 and the second mounting device 440 covers the lid tray 9 on the custom tray 8B.

The embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, the respective elements disclosed in the above-described embodiments are intended to include all modifications and equivalents of the embodiments of the invention.

For example, in the case where it is required to ensure the strength required for pressing, or the positioning accuracy of the IC component to the socket 70 at the time of contact, the metal cover tray 9 may be replaced, and the custom tray 8A may be used, and the empty tray may be used. The custom tray 8A is placed over the custom tray 8A for housing the IC components to prevent the IC components from being dispersed.

Further, in the above-described embodiment, the custom tray 8A and the lid tray 9 are reversed immediately before or after the test. However, the present invention is not limited thereto, and may be configured as follows, for example, in the loading unit 200. (1) The mounting device 220 reverses the lid tray 9 just after it is placed on the order tray 8A, and reverses the loading tray 600 until the lid tray 9 is removed from the staple tray 8A by the second attachment/detachment device 620. .

Alternatively, the guide post 72 may not be disposed around the socket 70, or the guide pin 72 may be disposed on the test head 7 in addition to the guide post 72, and a guide hole may be formed in the cover tray 9, and the cover tray 9 may be placed on the test head. 7 positioning.

1. . . processor

101. . . First return device

200. . . Moving in

210. . . First transfer device

220. . . First mounting device

230. . . First handling device

300. . . Application department

310. . . Second handling device

320. . . First reversal device

400. . . Testing Division

410. . . Disassembly and assembly device

420. . . First disassembly device

430. . . Second return device

440. . . Second mounting device

500. . . Heat removal department

600. . . Moving out

7. . . Test head

70. . . socket

72. . . Guide column

8A, 8B. . . Custom tray

82. . . Containment department

84. . . Concave

85. . . Opening

9. . . Cover tray

93. . . rib

Fig. 1 is a schematic plan view showing the entire structure of an electronic component testing device according to an embodiment of the present invention.

Fig. 2A is a plan view showing a custom tray used in the electronic component testing device according to the embodiment of the present invention.

Fig. 2B is a side view of the custom tray shown in Fig. 2A.

Fig. 2C is an enlarged cross-sectional view showing a portion IIC of Fig. 2B.

Fig. 3 is a plan view showing a mounting device of an electronic component testing device according to an embodiment of the present invention.

Fig. 4A is a plan view showing a first inverting device of the electronic component testing device according to the embodiment of the present invention.

Fig. 4B is a front view of the first inverting device shown in Fig. 4A.

Fig. 5 is a plan view showing the detachable device of the electronic component testing device according to the embodiment of the present invention.

Fig. 6A is a cross-sectional view showing a state in which the lid tray is attached to the order tray by the mounting device in the embodiment of the present invention.

Fig. 6B is a cross-sectional view showing a state in which the order tray and the lid tray are reversed by the first reversing device in the embodiment of the present invention.

Fig. 6C is a cross-sectional view showing a state in which the order tray on the lid tray is removed by the detachable device in the embodiment of the present invention.

Fig. 6D is a cross-sectional view showing a state in which the IC package housed in the lid tray approaches the socket of the test head in the embodiment of the present invention.

Fig. 6E is a cross-sectional view showing a state in which the input and output terminals of the IC module and the contact terminals of the socket are electrically contacted in the embodiment of the present invention.

Fig. 7A is a cross-sectional view showing a state in which the IC package housed in the cover tray approaches the socket of the test head in another embodiment of the present invention.

Fig. 7B is a cross-sectional view showing a state in which the input and output terminals of the IC module and the contact terminals of the socket are electrically contacted in another embodiment of the present invention.

7. . . Test head

8A. . . Custom tray

9. . . Cover tray

101. . . First return device

200. . . Moving in

210. . . First transfer device

220. . . First mounting device

230. . . First handling device

300. . . Application department

310. . . Second handling device

320. . . First reversal device

400. . . Testing Division

410. . . Disassembly and assembly device

420. . . First disassembly device

440. . . Second mounting device

500. . . Heat removal department

510. . . Third handling device

520. . . Second reversal device

600. . . Moving out

610. . . Fourth carrying device

620. . . Second disassembly device

630. . . Second transfer device

Claims (9)

An electronic component testing device for testing a tested electronic component, comprising: a testing portion for receiving or holding the tested electronic component in a housing having a receiving portion for receiving the tested electronic component a tray, or a state in which a cover tray for holding the holding portion of the electronic component to be tested is disposed in substantially the same arrangement as the receiving portion of the customized tray, pressing the tested electronic component against the socket of the test head, and The output terminal of the tested electronic component is electrically connected to the contact terminal of the socket; and the carrying means moves the customized tray or the cover tray for receiving or holding the tested electronic component to the testing portion Wherein the lid tray is made of a material having a higher strength than a material constituting the custom tray. The electronic component testing device of claim 1, wherein the testing portion is in a state in which the input and output terminals of the tested electronic component are upward, and the input and output terminals of the tested electronic component are pressed against the contact of the socket. Terminal. An electronic component testing device for testing a tested electronic component, comprising: a testing portion for receiving or holding the tested electronic component in a housing having a receiving portion for receiving the tested electronic component a tray, or arranged in substantially the same arrangement as the receiving portion of the customized tray to hold the tray a state of the cover tray of the holding portion of the electronic component to be tested, pressing the tested electronic component against the socket of the test head, and causing the output of the tested electronic component to be electrically connected to the contact terminal of the socket; Attaching the customized tray or the cover tray for accommodating or holding the electronic component to be tested to the test portion; and mounting means for covering the cover tray or the customized tray on the customized tray or the Above the cover tray, wherein the mounting means comprises: a first mounting means for covering the cover tray on the customized tray for receiving the tested electronic component before the test; and a second mounting means The ordering tray is placed over the lid tray for receiving the tested electronic component after testing. An electronic component testing device for testing a tested electronic component, comprising: a testing portion for receiving or holding the tested electronic component in a housing having a receiving portion for receiving the tested electronic component a tray, or a state in which a cover tray for holding the holding portion of the electronic component to be tested is disposed in substantially the same arrangement as the receiving portion of the customized tray, pressing the tested electronic component against the socket of the test head, and The input and output terminals of the tested electronic component are electrically connected to the contact terminals of the socket; the carrying means is to transport the customized tray or the cover tray for receiving or holding the tested electronic component to the test portion; a mounting means for covering the cover tray or the custom tray on the custom tray or the cover tray; and a reversing means for ordering the custom tray to be covered by the cover tray, or being covered The cover tray on the custom tray is reversed. The electronic component testing device of claim 4, wherein the reversing means comprises: a first reversing means for accommodating the electronic component to be tested before the test and the customized tray of the cover tray Inverting; and the second reversal means for maintaining the tested electronic component after the test and being reversed by the cover tray that covers the customized tray. An electronic component testing device for testing a tested electronic component, comprising: a testing portion for receiving or holding the tested electronic component in a housing having a receiving portion for receiving the tested electronic component a tray, or a state in which a cover tray for holding the holding portion of the electronic component to be tested is disposed in substantially the same arrangement as the receiving portion of the customized tray, pressing the tested electronic component against the socket of the test head, and The input and output terminals of the tested electronic component are electrically connected to the contact terminals of the socket; the carrying means is to transport the customized tray or the cover tray for receiving or holding the tested electronic component to the test portion; a mounting means for covering the cover tray or the custom tray on the custom tray or the cover tray; and a detaching means for detaching the customized tray or the cover tray from the cover tray or the custom tray, wherein the detaching means comprises: a first detaching means, the detachment means before the test is held The custom tray is removed from the cover tray of the test electronic component; and the second removal means is to remove the cover tray from the custom tray of the tested electronic component after the test. An electronic component testing device for testing a tested electronic component, comprising: a testing portion for receiving or holding the tested electronic component in a housing having a receiving portion for receiving the tested electronic component a tray, or a state in which a cover tray for holding the holding portion of the electronic component to be tested is disposed in substantially the same arrangement as the receiving portion of the customized tray, pressing the tested electronic component against the socket of the test head, and The input and output terminals of the tested electronic component are electrically connected to the contact terminals of the socket; the carrying means is to transport the customized tray or the cover tray for receiving or holding the tested electronic component to the test portion; a mounting means for covering the cover tray or the custom tray on the custom tray or the cover tray; and removing means for removing the custom tray from the cover tray or the custom tray Or the cover tray; and the return means for removing the cover tray or the custom tray from the handle The segment or the mounting means returns the mounting means or the means of removal. The electronic component testing device according to claim 7, wherein the returning means includes: a first returning means for returning the cover tray from the second removing means to the first mounting means; and the second sending means In the return means, the customized tray is returned to the second attachment means from the first detaching means. The electronic component testing device of claim 1, wherein the test head has guiding means for guiding the tested electronic component held by the cover tray to the socket.