JP2012126076A - Resin mold apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin mold machine in which, out of a series of works after molding a resin by inspecting a molding and heating and curing, only non-defective products are efficiently carried out by a compact apparatus structure, the warpage of the work does not occur and heat radiation is suppressed.SOLUTION: A heating and curing section E in which a mold resin is heated and cured in a tightly closed curing furnace 43 as the work W after molding the resin is held by inserting a carrier plate K into a slit 43a formed at the curing furnace 43 is provided in a part of a work transporting path from a press C toward a work housing F.

Description

  The present invention relates to a resin molding apparatus in which a workpiece in which a semiconductor chip is held on a carrier plate is carried into a press portion together with a resin to perform resin molding.

  When a workpiece is supplied to a plurality of press sections and resin molded, each press section is provided with a workpiece and resin (tablet resin, liquid resin, powder / granular resin, paste resin, etc.) in the press section by a loader. It is resin-molded by carrying in a mold and clamping it. At this time, in order to efficiently perform resin molding in multiple press sections, in addition to making the loader and decompression device shared in each press section, the molding cycle is adjusted to the resin mold operation of the slowest press section. (See Patent Document 1).

JP 2010-83027 A

In addition to supplying workpieces and carrying them in and out of the press section, a series of devices that store the cooled workpieces by heat-curing only the non-defective products after judging the quality of the molded product are compactly arranged, and the process There was a need to improve the work efficiency through coordination between them.
In general, a curing furnace for curing by heating the mold resin cross-linking reaction is incorporated into the resin molding equipment because the heat dissipation when loading and unloading the workpiece into and from the curing furnace has a large effect on other processes and the environment. It is not done. In addition, it is inefficient to perform the work of loading and unloading the molded products that are resin-molded in a limited number of press sections to the curing furnace in order to reduce the work efficiency and cause warping There is a fear.
Further, there is no disclosure about an apparatus configuration that includes a plurality of press sections and efficiently performs a series of operations from supplying a workpiece to resin molding for different products to heat-curing and storing only good products. In addition, simply gathering the devices that perform each of these steps may increase the installation area, require time for assembly work and maintenance, and may complicate the control operation.

  The present invention solves the above-mentioned problems of the prior art, and a series of operations for inspecting a molded product after resin molding and heating and curing only good products can be efficiently realized with a compact apparatus configuration, and the workpiece is not warped. In addition, an object of the present invention is to provide a resin molding apparatus that suppresses heat radiation into the apparatus.

In order to achieve the above object, the present invention comprises the following arrangement.
A resin molding apparatus in which a workpiece in which a semiconductor chip is held on a carrier plate is carried into a press portion together with a resin to perform resin molding, and the workpiece after resin molding is placed in a plurality of holding portions provided in a curing furnace. While being held, the curing furnace is hermetically sealed, and a heating / curing part that heats and cures the mold resin is provided in a part of the work conveyance path from the press part to the work storage part.

  According to the above configuration, since the heat curing unit is incorporated in a part of the workpiece conveyance path from the press unit to the workpiece storage unit, the molded product after the resin molding is quickly carried into the curing furnace and the mold resin is heated. Can be cured. Therefore, the work efficiency is improved, and the molded product is not cooled and the possibility of warping is eliminated.

  Further, the curing furnace provided with an inner door having a plurality of openings on the loading / unloading side facing the work transfer area is provided, and an opening / closing door that always shuts off each opening is provided inside the inner door. The doors can be opened and closed individually, the doors are opened individually, the carrier plate is inserted into the slit, and the workpiece is held and heat-cured while holding the workpiece. It is taken out.

  Thereby, without taking up the installation area of a some workpiece | work, it can accommodate in a curing furnace compactly and can be heat-hardened. Since the work can be carried into and out of the cure furnace by simply opening and closing the door to the cure furnace individually, the temperature inside the furnace can be prevented from decreasing and the heat radiation to the transfer area can be suppressed. .

  In addition, it is equipped with a multi-joint robot capable of rotating and linearly moving to hold the work in the robot hand as a work transfer mechanism, and opening and closing the door while holding the work in the robot hand of the multi-joint robot. The workpiece is carried in and out by moving back and forth in the curing furnace.

  This allows the workpiece to be carried in and out by opening and closing the door while moving the workpiece in the curing furnace while holding the workpiece in the robot hand of the articulated robot, so that the workpiece is held by posture control of the articulated robot. The robot hand can be positioned, and different doors can be opened and closed individually to advance and retreat, so that the work can be carried in and out quickly.

  In addition, a workpiece supply unit, a resin supply unit, a press unit, a workpiece inspection unit, a heating and curing unit, a cooling unit, a workpiece storage unit, and a control unit are arranged around the movement range of the articulated robot. The thickness and appearance of the molded product after the resin molding are inspected, and only the non-defective product is carried into a curing furnace of the heat curing unit to heat and cure the mold resin.

  As a result, a series of operations from performing the resin molding from the supply of the workpiece and resin to inspecting the molded product, heating and curing only the non-defective product, and efficiently storing the resin mold with the specifications according to the product can be performed. .

  Using the above resin mold equipment, a series of operations to inspect the molded product after resin molding from supply of the work and resin to the press part and heat and cure only good products can be realized efficiently with a compact equipment configuration. It is possible to provide a resin molding apparatus that does not warp and suppresses heat dissipation into the apparatus.

It is a plane layout figure which shows the example of whole structure of the resin mold apparatus. It is a side view of an articulated robot and an explanatory view of a robot hand. It is sectional explanatory drawing which shows the compression molding operation | movement of a press part. It is explanatory drawing of a workpiece | work inspection part. It is explanatory drawing which shows the shutter opening / closing operation | movement of a heat-hardening part. It is a front view of the curing furnace with the inner door closed, and a front view of the curing furnace with the inner door opened. It is a state diagram which shows an example of the workpiece | work carrying-in operation | movement of the robot hand with respect to a curing furnace. It is a timing chart figure which shows the timing of the workpiece | work supply operation | movement to the press part by a workpiece conveyance mechanism.

  Hereinafter, a preferred embodiment of a resin mold device according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, a compression molding apparatus is used as an example of a press apparatus, a lower mold is described as a movable mold, and an upper mold is described as a fixed mold.

(Overall configuration of resin molding equipment)
FIG. 1 is a plan layout view showing an embodiment of a resin molding apparatus according to the present invention. The resin molding apparatus of the present embodiment surrounds the movement range of the articulated robot provided in the workpiece conveyance mechanism H, and includes a workpiece supply unit A, a resin supply unit B, a press unit C, a workpiece inspection unit D (cooling unit), and heat curing. A processing unit that performs each processing step, such as the unit E and the workpiece storage unit F, and a control unit G that controls the operation of these processing units are arranged. In the vicinity of the press part C, an information reading part I is provided. A display unit J and an operation unit M are provided in the vicinity of the resin supply unit B. Thus, by arranging each process so as to surround the movement range of the articulated robot, the movement distance is shortened, and efficient workpiece transfer can be realized between the processes. In particular, since the heat curing portion E is incorporated in the resin mold apparatus, the molded product after the resin mold can be quickly brought into a curing furnace and heat cured. The configuration of each part will be specifically described below.

  In FIG. 1, a work W in which a semiconductor chip is held on a carrier is used. The workpiece W is used for a resin sealing method called E-WLP (Embedded Wafer Level Package) or eWLB (Embedded Wafer Level BGA). Specifically, for example, a peripheral plate such as a wafer transfer jig is shared, so that it is the same size as a semiconductor wafer, and is peeled off on a round metal plate (SUS, etc.) having a diameter of 12 inches (about 30 cm). A pressure-sensitive adhesive sheet (adhesive tape) is attached, and a plurality of semiconductor chips are adhered to the pressure-sensitive adhesive sheet in a matrix. An information code (QR code, bar code, etc.) associated with information on the product is assigned to the edge of each workpiece W. The carrier plate K may be rectangular. In this case, when the semiconductor chips are arranged in a matrix of a plurality of rows, an area where the semiconductor chips cannot be arranged can be reduced, which is preferable in terms of molding efficiency.

  The workpiece W is not a workpiece W for E-WLP (eWLB) in which a semiconductor chip is held on the carrier plate K, but a wafer level package (WLP) in which a wafer mounted on a rewiring layer is resin-molded. The workpiece W may be used. In this case, when possible, an information code may be given to the wafer itself, or an information code may be given individually to each slit (storage position) of the magazine. Furthermore, the workpiece W may be a resin substrate or a lead frame on which a semiconductor chip is mounted.

(Display unit L and operation unit M)
As shown in FIG. 1, the display part L and the operation part M are integrally arranged. While checking the information displayed on the display unit L, the operator can operate the operation unit M as necessary to control the operation of each unit (for example, the articulated robot 2) in the apparatus. It is also possible to input or change various information described later. In addition, it is good also as a structure which provides a display part and an operation part in the position distant from the apparatus by using a communication line, and performs remote operation.

(Work transfer mechanism H)
In FIG. 2A, the workpiece transfer mechanism H includes a multi-joint robot 2 that holds a workpiece W on the robot hand 1 and transfers and moves between the steps. The articulated robot 2 is configured by a combination of a vertical articulated robot that can move up and down by a foldable vertical link 2a and a horizontal articulated robot that can rotate and move the horizontal link 2b in a horizontal plane. A robot hand 1 is provided at the tip of the horizontal link 2b. The two horizontal links 2b and the robot hand 1 are rotatably supported around vertical axes 2c, 2d and 2e, respectively. Each link is subjected to feedback control by detecting the amount of rotation by an encoder provided in a servo motor (not shown).

  As described above, by adopting the configuration including the articulated robot 2, the robot hand 1 is moved to an arbitrary position in the vertical direction by the vertical link 2a, and the robot is moved to an arbitrary position in the horizontal direction by the horizontal link 2b. The operation of moving the hand 1 can be performed in parallel. For this reason, the workpiece | work W can be conveyed linearly between each process part arrange | positioned surrounding the movement range of the articulated robot 2, and the time required to convey to each process part can be minimized. it can. As a result, as will be described later, the workpiece W and the liquid resin can be rapidly conveyed to the next process in which the workpiece W and the liquid resin are carried into the press part C and resin-molded, thereby contributing to an improvement in molding quality.

  Further, as shown in FIG. 2B, the robot hand 1 can hold the vicinity of the outer periphery of the workpiece W by avoiding the center of the workpiece W by dividing the tip into a bifurcated shape. As shown in the figure, the robot hand 1 is formed with suction holes 1a capable of sucking the outer periphery of the workpiece W at three positions on the tip and base sides, and a suction path 1b communicating therewith. The robot hand 1 is configured to place a carrier plate K and suck and hold the back surface thereof. The robot hand 1 may be of a type that mechanically chucks the workpiece W so as to be sandwiched between claws in addition to holding the workpiece W by suction. The robot hand 1 may be configured to be able to invert the workpiece W by rotating around the horizontal axis in addition to rotating around the vertical axis 2e.

  In FIG. 1, the base portion 3 of the horizontal articulated robot 2 is provided so as to be reciprocally movable along the linear motion guide rail 4. For example, a ball screw is connected to a nut provided in the base 3, and the horizontal articulated robot 2 reciprocates along the linear motion guide rail 4 by being driven forward and reverse by a servo motor (not shown). It has become.

(Work supply part A and work storage part F)
In FIG. 1, a workpiece supply unit A and a workpiece storage unit F are provided on the front side of the linear motion guide rail 4 on which the articulated robot 2 reciprocates. Specifically, a supply magazine 9 storing workpieces W (molded products) and a storage magazine 10 capable of storing workpieces W (molded products) are provided in two rows. Since the supply magazine 9 and the storage magazine 10 have the same structure, the structure of the supply magazine 9 will be described below as a representative. Further, the supply magazines 9 provided in two rows may be either for storing the same type of workpieces W or for storing different types of workpieces W. The same applies to the storage magazine 10. In addition, the supply magazine 9 and the storage magazine 10 may be provided in one row, or each may be provided in three or more rows.

(Information reading unit I)
In FIG. 1, the information reading unit I is provided with a code information reading device 16 and an aligner 16a, and the information code of the work W is rotated by rotating the aligner 16a that has received the work W conveyed from the supply magazine 9. Is moved directly below the code information reading device 16. At this time, the workpiece W is unified in a certain direction. The code information reading device 16 reads an information code (QR code, bar code, etc.) relating to a product given to the workpiece W. Corresponding to this information code, the storage unit 47 stores resin supply information (resin type, resin supply amount, supply time, etc.), mold conditions (press number, press temperature, press time, molding thickness, etc.), cure information ( Molding conditions such as cure temperature, cure time, and cooling information (cooling time) are stored. Based on the molding condition information corresponding to the information code read by the code information reading device 16, processing of each process described later is performed on the workpiece W being conveyed. The multi-joint robot 2 sequentially conveys the workpiece W for which the molding conditions have been read to the subsequent processing steps from the resin supply unit B to the workpiece storage unit F.

(Configuration of resin supply part B)
In FIG. 1, a resin supply unit B is provided adjacent to the workpiece supply unit A. The resin supply unit B is provided with a liquid resin supply device. The liquid resin supply device is provided with a pair of dispense units 18 on both sides of a revolver type syringe supply unit 17 holding a plurality of syringes 19 rotatably. In addition, the resin supply part B can adjust internal temperature and humidity for resin cooling and dehumidification. Moreover, the door is provided in the apparatus side surface, and the operator can replace | exchange a syringe.

  A syringe supply unit 17 that holds a plurality of replacement syringes 19 is rotatably provided between a pair of dispense units 18 that discharge and supply liquid resin to the workpiece W. Each dispensing unit 18 shares the syringe supply unit 17 to receive the replacement syringe 19 and discharge and supply a predetermined amount of liquid resin to the workpiece W held at the liquid material discharge position.

  Specifically, the syringe supply unit 17 holds six syringes 19 at 60 ° rotation angles. The pair of dispensing units 18 can move between the syringe receiving position L and the liquid material supply position J of the syringe supply unit 17, and the angle connecting the syringe reception position and the rotation center of the syringe supply unit 17 is set. It arrange | positions so that it may become 120 degrees.

  Thereby, for example, since the robot hand 1 can supply the workpiece from the same position to the liquid material discharge position J and supply the liquid material by the dispensing unit 18, the liquid resin supply device can be arranged in a compact manner. Since the syringe 19 is held in the syringe supply unit 17 at every rotation angle of 60 °, the syringes held in the syringe supply unit 17 in each dispense unit 18 can be simultaneously replaced. In addition, although the said embodiment demonstrated the apparatus structure which supplies liquid resin, according to the form of a workpiece | work, the supply apparatus of other resin (Tablet resin, powder-granular resin, or paste-form resin, sheet-form resin, etc.). Can be selected as appropriate. Further, in the case of powder / granular resin or the like, a configuration may be adopted in which the robot hand 1 is provided with a resin transporting configuration and the resin is not directly supplied onto the workpiece W in the resin supply unit B. In this case, since the robot hand 1 carries the workpiece W and the resin into the press portion C, and heat-melts the workpiece W and the resin in the press portion C, and then touches the workpiece W and performs resin molding, it contributes to improvement of molding quality. it can.

  The workpiece W from which the liquid resin has been discharged is sucked and held by the robot hand 1 from the workpiece placement unit 22 and conveyed to the press unit C. In this case, for example, when the time required to move from the resin supply unit B to the press unit C becomes long, the supplied liquid resin seal absorbs moisture or is heated before being carried into the press unit C. Such problems may occur. However, since the work W can be moved in a short time using the multi-joint robot 2, it can be performed in a short time compared to a structure that operates on a predetermined transport path that can be moved by, for example, an air cylinder. It can move in a uniform time.

(Press part C)
Next, the structure of the press part C is demonstrated with reference to FIG.1 and FIG.3.
As shown in FIG. 1, in the present embodiment, a plurality of press portions C are provided at the back of the linear motion guide rail 4. As an example, two press sections C are provided, but there may be one or three or more. Moreover, the press part C may be provided with either a mold die for resin-molding the same product or a mold die for resin-molding different products. A partition wall 24 is provided on the side of the pressing unit C facing the conveyance area 11, and an opening (not shown) is provided in the partition wall 24. The opening is normally closed by a shutter 25 that can be opened and closed. The shutter 25 is provided so as to be opened and closed by a driving source such as a cylinder or a solenoid.

  Further, a loader 32 capable of reciprocating from the press device 26 to the transport area 11 is provided in the press section C. In addition, a work placement unit (not shown) is provided in the transport area 11 on the near side by the shutter 25. The workpiece W applied with the liquid resin adsorbed and held by the robot hand 1 is delivered to the workpiece placement unit, or the workpiece W taken out by the loader 32 from the press device 26 is delivered.

  In FIG. 1, each press device 26 is provided with a film supply device 35. As shown in FIG. 3A, the film supply device 35 is a device for feeding and winding a long release film 36 covering the clamp surface of the upper mold 28 between reels. The release film 36 is adsorbed and held on the upper mold surface by a known suction mechanism. The release film 36 has heat resistance that can withstand the heating temperature of the mold, and is easily peeled off from the mold surface, and is a film material having flexibility and extensibility, such as PTFE and ETFE. PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinyl chloride, etc. are preferably used. In addition, you may employ | adopt the structure using what was cut | disconnected in the strip shape of the magnitude | size which covers the clamp surface as the release film 36. FIG.

  The carrying-in / out operation | movement to the press part C and the press operation of the workpiece | work W are demonstrated. In FIG. 3A, the upper die 28 and the lower die 30 of the press device 26 are in the opened state, and the shutter 25 of the partition wall 24 shown in FIG. 1 is in a state of closing the opening. The workpiece W sucked and held by the robot hand 1 is placed on a workpiece placing portion (not shown), the suction is released, and the workpiece W is delivered. When the robot hand 1 is retracted, the loader 32 grasps the workpiece W from the workpiece placement unit by the hand, enters the press device 26 through the opening with the shutter 25 opened, and sets the workpiece W on the lower die 30.

  A state where the workpiece W is set on the lower mold 30 is shown in FIG. When the loader 32 on which the workpiece W is set returns from the press device 26 to the transfer area 11 through the opening, the shutter 25 is closed (see FIG. 1), and the press device 26 clamps the workpiece W to perform compression molding. As shown in FIG. 3B, the lower mold 30 is raised and the workpiece W is clamped between the upper mold 28. A release film 36 is held by suction on the clamping surface including the cavity 28a of the upper die 28.

  When the compression molding is completed, the press device 26 is opened as shown in FIG. 3C, and the work W is released from the upper die 28 to which the release film 36 is adsorbed and placed on the lower die 30. It is in a state that remains. When the shutter 25 is opened, the loader 32 enters the press device 26 from the transfer area 11 and grabs the workpiece W placed on the lower mold 30 and takes it out to the transfer area 11 and delivers it to the workpiece placement unit (see FIG. 1).

(Work Inspection D)
Next, the configuration of the workpiece inspection unit D will be described with reference to FIGS. 1 and 4. The base portion 39 is provided with a linear motion rail 39a. A movable stage 40 is provided on the linear motion rail 39a so as to be capable of reciprocating in the rail longitudinal direction. The movable stage 40 has, for example, a known drive mechanism and a nut portion connected to a ball screw, and reciprocates on the linear motion rail 39a by driving the ball screw forward and reversely by a motor. The movable stage 40 also serves as a cooling unit for the workpiece W after heat curing.

  The movable stage 40 stands by at a workpiece receiving position that is one end side of the linear motion rail 39. The workpiece W compression-molded by the press part C is placed on the movable stage 40 by the robot hand 1, the suction is released, and the workpiece W is delivered. A laser displacement meter 41 is provided as a pair of upper and lower workpieces W on the workpiece transfer mechanism H side of the movable stage 40 at the delivery position. Before the workpiece W is placed on the movable stage 40 by the robot hand 1, The thickness of the workpiece W is measured by irradiating the laser beam with the laser displacement meter 41. The control unit G stores the measured thickness in the storage unit 47 as operation information. In this case, the thickness of the molded product can be calculated by subtracting the thickness of the carrier plate K from the thickness of the workpiece W.

The movable stage 40 moves from one end side of the linear motion rail 39 to the other end side. An appearance inspection unit 42 is provided above the other end of the linear motion rail 39. In the appearance inspection unit 42, the molded product is imaged in a lump or divided, and it is inspected by the appearance observation whether there is a molding defect such as unfilled, flow mark or flying die. When there are good and bad molding, the type of defect and the captured image are stored in the storage unit 47 as operation information. When the inspection is completed, the movable stage 40 on which the workpiece W is placed returns to the delivery position, is delivered to the robot hand 1, and is conveyed to the heat curing unit E.
In addition, when an abnormality (such as unfilling exceeding the expected value) is detected, the fact is notified to the display unit J, and the operation of the entire apparatus is stopped and maintenance is performed, thereby preventing defective products from being continuously produced. it can.

(Heat curing part E)
Next, the configuration of the heat curing unit E will be described with reference to FIGS. A curing furnace 43 is provided in the heat curing unit E, and the inspected work W is stored in the curing furnace 43 by the robot hand 1 and the mold resin is heated and cured (post-cured) at about 120 ° C. to 150 ° C. To complete the heat curing. In the curing furnace 43, opposed slits (holding portions) 43a are formed at a predetermined pitch in the height direction, and the workpiece W is held at this pitch. When the work W is stored in the curing furnace 43, the work W is inserted and held along the slits 43a formed in any of them (see FIG. 5).

In FIG. 1, an inner door 44 is provided on the side surrounding the transfer area 11 of the curing furnace 43, and an outer door 45 is provided on the outer surface side of the apparatus so as to be opened and closed. The inner door 44 is provided with an opening 44a corresponding to the position of the slit 43a for two steps. An opening / closing door 46 is provided inside the inner door 44 so as to be individually openable and closable so as to always block each opening 44a. As a result, since the work can be carried into and out of the curing furnace simply by opening and closing the opening / closing door 46 with respect to the curing furnace 43, the temperature in the furnace is prevented from being lowered and the heat radiation to the transfer area 11 side is suppressed. can do.
Further, as shown in FIG. 5A and FIG. 1, by providing two rows of 12-stage slits 43a in plan view, a total of 24 workpieces W can be post-cured in parallel. Yes.

  When the time from the resin molding at the press part C to the start of post-cure becomes long, the resin mold part may be warped. However, since the multi-joint robot 2 is used to smoothly move the workpiece W in the height direction, it can be moved in a short time with respect to the desired slits 43a having different heights. . As described above, in the molding apparatus in which the time required for conveyance affects the molding quality, the effect of shortening the conveyance time by the articulated robot 2 is particularly great.

  In the present embodiment, as shown in FIG. 5, when one opening / closing door 46 is opened, two workpieces W can be inserted and held in the upper and lower slits by the robot hand 1. Thus, by opening and closing the door 46 individually, the open / close area can be reduced and the workpiece W can be stored and taken out, so that the temperature in the furnace can be prevented from being lowered and heat radiation to the transfer area 11 side can be suppressed. be able to.

  The workpiece W inspected by the workpiece inspection unit D is sucked and held by the robot hand 1 and is conveyed to the curing furnace 43. As shown in FIG. 5A, the curing furnace 43 is heated to a predetermined temperature with the door 46 being closed. For example, when the workpiece W is inserted into the uppermost slit 43a, when the robot hand 1 approaches the inner door 44, the control unit G controls a driving mechanism (not shown) and the uppermost slit as shown in FIG. The open / close door 46 facing 43a opens, and the robot hand 1 enters the furnace and inserts the workpiece W along the slit 43a. The robot hand 1 is retracted from the cure furnace 43 after the suction of the robot hand 1 is released and the workpiece W is transferred to the cure furnace 43. When the robot hand 1 is separated from the inner door 44, the open / close door 46 is closed. The above operation is repeated. When a predetermined time elapses after the work W is stored in the curing furnace 43, the robot hand 1 enters the curing furnace 43 again, and the work W is sucked and held from the curing furnace 43 to be transported to the cooling unit N. It has become.

(Cooling part N)
As shown in FIG. 4, the cooling unit N is provided with a cooling magazine 48 in a space above the workpiece inspection unit D. Oppositely arranged slits 48a are formed at a predetermined pitch in the height direction on both side walls in the cooling magazine 48, and the workpiece W can be held at this pitch. In this case, the work W can be delivered to the predetermined slit 48a by the articulated robot 2 that can move the robot hand 1 to an arbitrary height. The workpiece W on which the heat curing of the molded product has been completed is conveyed to the slit 48a (delivery position) of the cooling unit N while being adsorbed and held by the robot hand 1, and is released after being adsorbed. The workpiece W is naturally cooled by leaving it in this state for a predetermined time. Although the cooling unit can be provided separately from the workpiece inspection unit D, the apparatus can be configured in a compact manner by utilizing the vacant area of the workpiece inspection unit D.

(Work storage part F)
The configuration of the workpiece storage unit D is the same as the configuration of the workpiece supply unit A as described above. The robot hand 1 receives the workpiece W cooled by the cooling unit from the movable stage 40, conveys it to the adjacent storage magazine 10, and stores it.

(Control part G)
In FIG. 1, the control unit G includes a storage unit 47 such as a CPU (Central Processing Unit), ROM, and RAM, and controls the operation of each unit described above. In addition to various control operation programs stored in the ROM, a workpiece transfer target candidate list, transfer order information, and code information attached to the workpiece W are stored. The CPU reads a necessary control operation program from the ROM into the RAM, executes it, stores the input information temporarily using the RAM, performs arithmetic processing according to the input information, and performs the processing based on the control program. Output the command.

In the control unit G, the operation information of the workpiece supply unit A (the supply magazine slit number that has been delivered), the operation information of the code information reading device 16 (recipe information; resin conditions, mold conditions, curing conditions, cooling conditions), resin supply Information of part B (syringe number; (type of resin, resin thawing time, total storage amount), usage fee (per supply / total amount, supply start / end time), operation information of press part C (mold temperature curve, Clamping pressure curve, forming thickness, film usage), operation information of curing furnace 43 (in-furnace temperature), operation information of workpiece inspection part D (flying die, forming thickness), information of work storage part F (reception of received slits) Information such as (position) is input at any time, and necessary commands are output to each part. The control unit G stores such operation information, the above-described molding conditions, etc. in association with the workpiece W. Thereby, the actual manufacturing conditions etc. about the workpiece | work W after shaping | molding can be confirmed. For example, by reading the information code on the carrier plate K of the workpiece W after molding, the molding conditions and operation information can be confirmed, and information related to the actual molded product can be easily viewed. It can be used to optimize conditions.
The control unit G is disposed so as to surround the workpiece transfer mechanism H, but may be a device that can be remotely operated by wire or wireless, such as a controller.

  The control unit G controls the timing of the workpiece supply operation and the workpiece removal operation by the articulated robot 2 in accordance with the repetition cycle of the most time-consuming process. Incidentally, the minimum cycle of each process is calculated by dividing the required time by the number of devices. In the present embodiment, since the minimum cycle of the resin molding process in the press device 26 is the maximum between the processes, the timing for loading and unloading the workpiece W is determined according to this.

Here, the work loading / unloading operation with respect to the curing furnace 43 will be described with reference to FIGS. 6 and 7.
As shown in FIG. 6 (A), the inner door 44 has openings 44a arranged in two rows in the vertical direction and provided in a total of twelve places. Each opening is blocked by an opening / closing door 46. As shown in FIG. 6B, when one open / close door 46 is opened in the curing furnace 43, the slits 43a are provided in two upper and lower stages so that two workpieces W can be held. It has become. The interval between the pair of upper and lower slits 43a is set to an interval at which the robot hand 1 can move forward and backward. In the case of this embodiment, when the workpieces W are stored in all the slits 43a, the 24 workpieces W can be heat-cured (cured). It should be noted that the number of slits 43a and open / close doors 46 can be increased or decreased as appropriate. Further, the number of workpieces W that can be taken in and out when one opening / closing door 46 is opened may be one, or may be three or more.

The workpiece W that has been resin-molded and has been determined to be non-defective by the inspection unit D is conveyed to the curing furnace 43 while being attracted and held by the robot hand 1.
7A, the robot hand 1 approaches the inner door 44 from the transfer area 11 while holding the workpiece W by suction. It is assumed that the opening / closing door 46 keeps the opening 44 a blocked, and the work W has not yet been carried into the lower slit 43 a in the curing furnace 43.

  In FIG. 7B, when the robot hand 1 approaches the inner door 44, the control unit G controls a driving mechanism (not shown) and the opening / closing door 46 rotates from the standing posture to the horizontal posture, thereby opening the opening 44a. The robot hand 1 enters the curing furnace 43 through the opening 44a while holding the workpiece W by suction. At this time, the workpiece W is placed in the vacant upper slit 43a. The upper and lower slits 43a are positioned so as to advance and retreat into the curing furnace 43 by adjusting the height position on the horizontal articulated robot 2 side.

Next, as shown in FIG. 7C, the suction of the workpiece W by the robot hand 1 is released, and only the robot hand 1 is retracted from the curing furnace 43 to the transfer area 11 through the opening 44a.
As shown in FIG. 7D, when the robot hand 1 passes through the opening 44a and retreats to the transfer area 11, the control unit G controls a driving mechanism (not shown) so that the opening / closing door 46 changes from a horizontal posture to a standing posture. Rotates to block the opening 44a. As a result, the curing furnace 43 is hermetically sealed and curing is performed for a predetermined time while preventing a temperature drop in the furnace.

  In addition, what is necessary is just to perform in the reverse procedure, when taking out the workpiece | work W in which the curing was completed from the curing furnace 43. That is, when the robot hand 1 is moved closer to the inner door 44 from the transfer area 11 (FIG. 7D) and the opening door 46 rotates to open the opening 44a, the robot hand 1 moves to a predetermined slit (for example, the upper slit). It enters below 43a (refer FIG.7 (C)). Then, the workpiece W is unloaded from the curing furnace 43 through the opening 44a while being held by the robot hand 1 (see FIG. 7B). When the workpiece W is carried out to the transfer area 11, the open / close door 46 rotates to block the opening 44a (see FIG. 7A).

  FIG. 8 is an example of a timing chart showing a transfer procedure from sequentially supplying four workpieces W (1 to 4) from one supply magazine to storing them in one storage magazine. Using a pair of dispense units 18f and 18g and a pair of press devices 26a and 26b (see FIG. 1), the number of slits 43a of the curing furnace 43 is 24, and the number of slits 48a of the cooling magazine 48 of the cooling unit N is four. A device configuration that is a location is assumed. In this case, the processing cycle in each processing step is a time obtained by dividing the processing time required for each individual apparatus by the maximum number of simultaneous processes (the number of apparatuses and the number of slits in this embodiment). For this reason, the heat-hardening part E which requires a comparatively long processing time increases the maximum number which can process simultaneously by providing many slits 43a, and an apparatus with which processing does not stagnate there as a whole apparatus It has a configuration.

  However, since the processing cycles cannot be matched, the work W carry-in timing and the carry-out timing with respect to other processing units are determined based on the work W carry-in timing and the carry-out timing with respect to the processing unit that performs the process with the longest processing cycle. Has been decided. In FIG. 8, since the processing cycle in the press devices 26a and 26b is the longest, the timing for unloading the workpiece W3 from the workpiece supply unit A is determined by back calculation. In this case, each workpiece W (1-4) is used so as not to waste time between the resin molds of the workpiece W1 and the workpiece W3 in the press device 26a, and similarly between the resin molds of the workpiece W2 and the workpiece W4 in the press device 26b. ) Supply timing is determined. Specifically, when the resin mold for the workpiece W1 of the press device 26a is completed and becomes empty, the timing is determined by calculating backward so that the next workpiece W3 can be carried into the press device 26a.

  When the work number 1 is conveyed from the press device 26a to the inspection, the next work number 3 is carried into the press device 26a from the dispensing unit 18f, and when the inspection of the work number 1 is finished, it is carried into the curing furnace 43. Similarly, when the workpiece number 2 is conveyed from the pressing device 26b to the workpiece inspection unit D (laser displacement meter 41 and appearance inspection unit 42), the next workpiece number 4 is carried from the dispensing unit 18g to the pressing device 26b, and the workpiece number 2 is transferred. When the above inspection is completed, it is carried into the curing furnace 43. In this way, when a plurality of workpieces W are processed in parallel in each processing unit, the entire apparatus can be efficiently processed by minimizing the waiting time required for loading / unloading the workpiece W into / from each processing unit. It is possible.

  Further, the workpiece W1 is sequentially carried into the curing furnace 43 from the workpiece W1 to the workpiece W4 where the inspection is completed, and is sequentially cooled from the workpiece W1 to which the curing is completed to the workpiece W4 and stored in the workpiece storage portion F. The number of workpieces W accommodated in the curing furnace 43 is determined so that the time required for post-curing the workpiece W in the curing furnace 43 can be balanced with the previous and subsequent inspection times and the cooling time.

  By using the above resin molding device, a series of operations for inspecting the molded product after resin molding from supplying the workpiece W or resin to the press part and heating and curing only the non-defective product can be efficiently realized with a compact device configuration. It is possible to provide a resin molding apparatus in which warpage of W does not occur and heat dissipation into the apparatus is suppressed.

In the resin molding apparatus described above, the dispensing unit 18 is provided in the resin supply section B and the two pressing apparatuses 26 are provided in the pressing section C. However, the number may be further increased. Also, the number of articulated robots provided in the work transport mechanism H is not limited to one, and a plurality of multi-joint robots may be provided to transport the work by sharing the transport area.
Further, the press device 26 is not limited to the compression molding device, and may be a transfer molding device, or may be molded by forming a reduced pressure space.

A Work supply part B Resin supply part C Press part D Work inspection part E Heat curing part F Work storage part G Control part H Work transport mechanism I Information reading part K Carrier plate L Display part M Operation part N Cooling part W Work 1 Robot Hand 2 Horizontal articulated robot 3,39 Base part 4 Linear guide rail 5 Liquid resin 7 Rotating mechanism 8 Holding arm 9 Supply magazine 10 Storage magazine 11 Transport area 16 Code information reader 16a Aligner 17 Syringe supply part 18, 18f, 18 g Dispensing unit 19 Syringe 21 Discarding cup 22 Work placement part 22a Support projection 23 Weigh scale 24 Partition wall 25 Shutter 26, 26a, 26b Press device 28 Upper mold 28a Cavity 29 Lower mold platen 30 Lower mold 32 Loader 35 Film supply device 36 Release Film 39a linear motion rail 40 movable stage 41 laser displacement meter 42 appearance inspection unit 43 curing oven 43a, 48a slit 44 in the door 45 outer door 46 opening and closing door 47 storage unit 48 cooling Magazine

Claims (4)

A resin molding apparatus in which a workpiece is carried into a press section together with a resin and resin molding is performed,
Work transfer from the press part to the work storage part through the heat curing part that heats and cures the mold resin by sealing the cure furnace while holding the work after resin molding in a plurality of holding parts provided in the cure furnace A resin molding apparatus characterized by being provided in a part of a path.   The curing furnace provided with an inner door having a plurality of openings on the loading / unloading side facing the work transfer area is provided, and an opening / closing door that always shuts off each opening is individually provided inside the inner door. It is provided so that it can be opened and closed, the doors are opened individually, the carrier plate is inserted into the slit, and the work is held and heat-cured while holding the work. The resin molding apparatus according to claim 1.   As a work transfer mechanism, a multi-joint robot capable of rotating and linearly moving to hold the work in the robot hand and transporting between each process, and opening and closing the door while holding the work in the robot hand of the multi-joint robot is cured. The resin molding apparatus according to claim 1 or 2, wherein a work loading / unloading operation is performed by moving forward and backward in the furnace.   A workpiece supply unit, a resin supply unit, a press unit, a workpiece inspection unit, a heat curing unit, a cooling unit, a workpiece storage unit, and a control unit are arranged around the movement range of the articulated robot. The resin molding apparatus according to claim 3, wherein the thickness and appearance of a subsequent molded product are inspected, and only non-defective products are carried into a curing furnace of a heat curing unit to heat and cure the mold resin.

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