JP2018144335A - Molding mold, mold press, and mold device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of molding both of an upper cavity and a lower cavity.SOLUTION: A molding mold (10) comprises a first mold (11) having a first mold surface (11a) and a second mold (12) having a second mold surface (12a). A resin mold is made in a cavity (C) by clamping a work-piece (w) with the first mold surface (11a) and the second mold surface (12a). The first mold (11) has a chuck (20) for holding the work-piece (W) with the first mold surface (11a). The second mold (12) has the cavity (C) recessed from the second mold surface (12a). An upper cavity method in which the first mold (11) is a lower mold and the second mold (12) is an upper mold, and a lower cavity method in which the first mold (11) is an upper mold and the second mold (12) is a lower mold are exchangeable.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a molding technique. In the present application, a method in which a cavity (concave portion) is provided in a lower mold in a mold, in other words, a method in which a surface to be sealed is formed downward is a “lower cavity method”, and a method in which a cavity is provided in an upper die. In other words, a method in which the surface to be sealed is molded upward is called an “upper cavity method”. For this reason, for example, even when a workpiece is set on the bottom surface of the concave portion of the lower mold and molded in the concave portion on the upper side of the workpiece (molded on the workpiece), it is a mold by the “lower cavity”.

  Japanese Unexamined Patent Application Publication No. 2017-7095 (Patent Document 1) describes a case where a cavity recess is provided in the upper mold (upper cavity) and a case where the lower mold is provided (lower cavity) as separate molding apparatuses. .

JP 2017-7095 A

  As described in Patent Document 1, conventionally, separate molding apparatuses corresponding to the upper cavity system and the lower cavity system have been required. This is because the method of supplying and setting the resin and the workpiece is different between the upper cavity method and the lower cavity method.

  An object of the present invention is to provide a technique capable of molding with an upper cavity and a lower cavity even when the same mold is used. One and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A mold according to one solution of the present invention includes a first mold having a first mold surface and a second mold having a second mold surface, and the first mold surface and the second mold surface. A mold that clamps a workpiece in between and resin-molds in a cavity, wherein the first mold includes a chuck that holds the workpiece on the first mold surface, and the second mold includes the second mold An upper cavity system comprising the cavity recessed from the mold surface, the first mold as a lower mold and the second mold as an upper mold, and the first mold as an upper mold and the second mold It is characterized in that it can be replaced with a lower cavity type which is a lower mold.

  According to this, by using the first mold and the second mold that constitute one mold mold upside down, it is possible to perform molding by either the upper cavity system or the lower cavity system.

  Further, in the mold, the chuck includes a claw having a rotation shaft, and the claw has a first position that is applied to the work as a state of holding the work, and a second position that is separated from the work as a state of not holding the work. It is more preferable that the rotating shaft is rotated. According to this, the workpiece can be held or released at a desired timing.

  Further, in the mold, the claw includes a seesaw portion on which the rotation shaft is provided, the chuck has a return spring, a first pin that presses one of the seesaw portions via the return spring, and the other. It is more preferable that the claw is moved between the first position and the second position by swinging the seesaw portion by pressing the first pin and the second pin. According to this, the chuck can have a simple configuration.

  Further, in the mold, the first mold has a work suction circuit that opens on the first mold surface side so as to attract the work, and the first mold surface side that depressurizes the inside of the mold. A pressure reducing circuit in the mold that opens at the second mold surface, and the second mold surface adsorbs the film to the second mold surface of the second mold including the inner surface of the cavity. It is more preferable to provide a film suction circuit that opens on the side. According to this, it is possible to eliminate the air by reducing the pressure in the mold while holding the workpiece and the film regardless of the upper cavity method or the lower cavity method.

  In the mold, the first mold includes a first chase unit having the first mold surface, and a first guide that is inserted and removed in an intersecting direction in which the first chase unit intersects the mold opening / closing direction. A first base having a cavity piece, a clamper provided around the cavity piece and having the second mold surface, and an assembly surface on which the cavity piece and the clamper are assembled. And a second base having a second guide with which the second chase unit is inserted and removed in the intersecting direction, and the first chase unit has the second guide with respect to the second guide. More preferably, the chase unit is also inserted into and removed from the first guide. According to this, it is possible to easily switch from the upper cavity system to the lower cavity system and from the lower cavity system to the upper cavity system.

  A mold press according to one solution of the present invention has a first mold surface, the work suction circuit that opens on the first mold surface side so as to suck the work, and the first press so as to depressurize the inside of the mold. A film on the second mold surface including a first mold having an in-mold decompression circuit opened on the first mold surface side, and a second mold surface including an inner surface of a cavity recessed from the second mold surface. A second mold having a film suction circuit that opens on the second mold surface side so as to adsorb the workpiece, and a workpiece is clamped between the first mold surface and the second mold surface to thereby form the cavity A mold press comprising an upper platen and a lower platen sandwiching the mold dies, wherein the upper platen and the lower platen are the first mold and Set any of the second molds An in-mold decompression pipe connected to the in-mold decompression circuit, a workpiece suction pipe connected to the workpiece suction circuit, and a film connected to the film suction circuit A suction pipe is provided so as to be connectable between the upper platen and the lower platen, and the workpiece suction circuit of the first mold assembled to one of the upper platen and the lower platen is used for the workpiece suction. The second metal mold connected to the pipe and the pressure reducing circuit in the mold of the first mold connected to the pressure reducing pipe in the mold and assembled to the other of the upper platen and the lower platen. The film suction circuit of the mold is connected to the film suction pipe. According to this, the circuit in the mold and the piping outside the mold can be connected even if the mold method is changed.

  A mold press according to another solution of the present invention includes a mold die that can be switched between an upper cavity method and a lower cavity method, an upper platen and a lower platen sandwiching the mold die, and a mold die of the mold die. In-mold decompression piping connected to the in-mold decompression circuit, workpiece suction piping connected to the workpiece suction circuit of the mold, and film connected to the film suction circuit of the mold A suction pipe, and the upper platen and the lower platen are provided with the in-mold decompression pipe, the workpiece suction pipe and the film suction pipe, respectively. According to this, even if the mold method is changed, the circuit in the mold and the piping outside the mold can be easily connected.

  A molding apparatus according to one solution of the present invention is configured to hold a workpiece on the back side opposite to the surface to be molded by reversing the front and back sides of the workpiece, and a mold die that can be switched between an upper cavity method and a lower cavity method. And a reversing mechanism. According to this, for example, a workpiece having a surface to be molded (molding surface) facing upward or downward can be reversed in accordance with the mold method.

  The mold apparatus includes a first resin supply mechanism that supplies a resin onto a workpiece and a second resin supply mechanism that supplies a resin onto a film. It is more preferable that the resin is transported from the first resin supply mechanism, and the resin is transported from the second resin supply mechanism together with the film to the lower cavity mold. According to this, resin can be supplied according to the method of the mold. Further, according to the second resin supply mechanism, since the resin can be supplied without being mounted on the work, it is possible to prevent the work from being lost due to a resin mounting failure.

  In the molding apparatus, it is more preferable that the first resin supply mechanism and the second resin supply mechanism are arranged in a plane with the mold die interposed therebetween. According to this, for example, two mold presses (mold dies) are fixed adjacent to each other, and on the other hand, a first resin supply mechanism is added on the work port side (one side), and the mold press is sandwiched between them. A second resin supply mechanism can be added on the opposite side (the other side).

  In the molding apparatus, it is more preferable that the first resin supply mechanism and the second resin supply mechanism are combined. According to this, the apparatus can be miniaturized, and the footprint can be reduced in the planar arrangement.

  More preferably, the mold apparatus includes a work loader that conveys the mold in a state where the work is held by a hand, and the hand is replaced according to a lower cavity system or an upper cavity system. According to this, even if the chip component mounted on the work is upward or downward, the work can be held and transported corresponding to each.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to one solution of the present invention, even if the same mold is used, molding can be performed in the upper cavity and the lower cavity.

It is explanatory drawing of the mold opening state which used the mold metal mold | die which concerns on one Embodiment of this invention as the lower cavity system. It is explanatory drawing of the mold closing state of the mold metal mold | die shown in FIG. It is explanatory drawing of the mold open state which made the mold metal mold | die shown in FIG. 1 the upper cavity system. It is explanatory drawing of the mold closing state of the mold die shown in FIG. 5A and 5B are explanatory views of a chuck included in the mold shown in FIG. 1, in which FIG. 5A shows a chucked state and FIG. 5B shows a chuck released state. It is a plane arrangement figure showing a schematic structure of a mold device concerning one embodiment of the present invention. 7A and 7B are explanatory views of a configuration of an example of a robot arm included in the molding apparatus illustrated in FIG. 6, in which FIG. 7A is a schematic plan view, FIG. 7B is a schematic side view in which the workpiece is supported upward, and FIG. It is the typical side view supported. It is explanatory drawing of the work loader with which the molding apparatus shown in FIG. 6 is provided. It is explanatory drawing of the work loader with which the molding apparatus shown in FIG. 6 is provided. It is explanatory drawing of the film loader (resin loader) with which the molding apparatus shown in FIG. 6 is provided. It is a plane arrangement | positioning figure which shows schematic structure of the molding apparatus made to respond | correspond only to an upper cavity system. It is explanatory drawing of the mold process of the lower cavity system of the molding apparatus which concerns on other embodiment of this invention. It is explanatory drawing of the mold process of the upper cavity system of the molding apparatus shown in FIG.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
First, a mold 10 (a pair of molds) and a mold press 50 including the mold 10 according to an embodiment of the present invention will be described mainly with reference to FIGS. Here, the mold opening / closing direction of the mold 10 will be referred to as a vertical direction (vertical direction), the upper mold of the mold 10 will be described as “upper mold”, and the lower mold will be described as “lower mold”. FIG. 1 and FIG. 2 are explanatory diagrams of the mold mold 10 in a state where the mold is opened and a state where the mold is closed in a lower cavity system (a system in which the cavity C is in the lower mold). FIG. 3 and FIG. 4 are explanatory diagrams of the mold mold 10 in the upper cavity system (the system in which the upper mold has the cavity C), with the mold opened and the mold closed, respectively. 1 to 4 show the main part of the mold 10 in cross section.

  The mold press 50 includes an upper platen 51 and a lower platen 52 that are arranged to face each other, and a press drive mechanism that appropriately opens and closes them, and is sandwiched between the upper platen 51 and the lower platen 52 when the apparatus is operating. It is further provided with a mold 10 provided so as to be openable and closable so as to be opposed to each other and capable of compression molding. The press drive mechanism is a publicly known mechanism such as a drive source (not shown) (for example, a servo motor) and a drive transmission mechanism (for example, a linear motion mechanism using a ball screw or a toggle link mechanism). In addition, a plurality of tie bars (for example, two corresponding to two sides and four corresponding to four corners) are provided on the outer peripheral portions (for example, four corners of the opposing surface) of the upper platen 51 and the lower platen 52 as examples of these guide members. 53 is provided penetrating. In the mold press 50, for example, when the upper platen 51 is fixed and the lower platen 52 is configured to move, the lower platen 52 is moved up and down by being guided by the tie bar 53 with respect to the upper platen 51 by a press drive mechanism. Thus, the mold 10 can be opened and closed. Of the mold dies 10 that can be opened and closed, those that are assembled to the upper platen 51 are “upper molds” and those that are assembled to the lower platen 52 are “lower molds”.

  Thus, the mold die 10 is composed of a pair of molds (first mold 11 and second mold 12) used as an upper mold and a lower mold that are arranged to face each other. That is, the first mold surface 11a included in the first mold 11 and the second mold surface 12a included in the second mold 12 are disposed to face each other. The first mold surface 11a and the second mold surface 12a are clamping surfaces when the workpiece W is clamped, are parting surfaces to be combined with the mold, and are so-called mold surfaces. The mold 10 clamps the work W (see FIG. 7) between the mold surface 11a and the mold surface 12a and molds the resin R in the cavity C. However, the work W is set on the mold surface 11a, and the mold surface 12a A cavity C is provided to be recessed. Therefore, in the following description, the first mold 11 is referred to as “work mold 11”, and the second mold 12 is referred to as “cavity mold 12”. When the cavity mold 12 is used as an upper mold, the upper cavity system is used, and when the cavity mold 12 is used as a lower mold, the lower cavity system is used.

  In the lower cavity system (FIGS. 1 and 2), the work mold 11 is assembled as an upper mold at the center of the upper platen 51, and the cavity mold 12 is assembled as a lower mold at the center of the lower platen 52. As a result, the mold 10 (work mold 11 and cavity mold 12) is configured to be openable and closable, and the cavity mold 12 is close to the work mold 11 while the cavity mold 12 is closed. 12 is opened apart. In the upper cavity method (FIGS. 3 and 4), the work mold 11 is assembled as a lower mold at the center of the lower platen 52, and the cavity mold 12 is assembled as an upper mold at the center of the upper platen 51. As a result, the mold 10 is configured to be openable and closable, and the work mold 11 is closed close to the cavity mold 12, while the work mold 11 is separated and opened. Thus, in the mold press 50, the mold 10 is used in place of the upper cavity system and the lower cavity system.

  As shown in FIGS. 1 to 4, the mold 10 according to the present embodiment includes base blocks 13 and 33 fixedly assembled to platens 51 and 52, and a chase that can be exchanged (detached). Units 14 and 34 are included. In this embodiment, the mold 10 will be specifically described on the assumption that compression molding is performed using the release film F. One work mold 11 constituting the mold 10 is assembled with a base block (hereinafter simply referred to as “base”) 13 and a chase unit 14 assembled with an arbitrary block constituting the mold surface 11a. With. For example, as shown in FIG. 1, the base 13 is assembled and fixed to the upper platen 51 with, for example, bolts. In addition, the base 13 has a guide 15 (rail) in which the chase unit 14 is inserted and removed in a crossing direction (horizontal direction which is the depth direction of the paper surface) where the chase unit 14 intersects the mold opening / closing direction (vertical direction). Since the slide groove 16 corresponding to the guide 15 is formed in the chase unit 14, the chase unit 14 slides on the base 13 and is configured to be detachable. The base 13 includes a built-in heater 17 and is configured to be able to heat the inside of the mold 10 to a predetermined temperature. In addition, the slide groove 16 may be provided in the base 13, and the guide 15 may be provided in the chase unit 14.

  Moreover, the workpiece mold 11 includes a chuck 20 configured to hold the workpiece W on the mold surface 11a. A plurality of chucks 20 are arranged in the mold surface 11a along the outer periphery of the workpiece W. Here, an example of the configuration of the chuck 20 will be specifically described with reference to FIG. 5A and 5B are diagrams for explaining the chuck 20, FIG. 5A shows a chucked state, and FIG. 5B shows a chuck released state. Note that a space for ensuring the movement of the chuck 20 is provided in the work die 11, but in FIG. 5, the space is not shown in order to facilitate understanding of the operation of the chuck 20.

  As shown in FIG. 5, the chuck 20 has a rotating shaft 21, includes a claw 22 protruding from the mold surface 11 a, and enters the chucked state when the claw 22 is hooked on the outer periphery of the workpiece W. The claw 22 is a first position (FIG. 5A) that is applied to the workpiece W as a state that holds the workpiece W, and a second position that retreats (leaves) outward from the workpiece W as a state where the workpiece W is not held (released state). The rotating shaft 21 is rotated so as to be in the position (FIG. 5B). In this configuration, since the claw 22 retreats from the work W while rotating around the position in the mold, the lower surface of the work W in the mold opening / closing direction (vertical direction) when the claw 22 retreats from the work W. Move to a position that does not protrude downward. Thereby, even if the recessed part etc. which accommodate the nail | claw 22 are not provided in the mold surface 12a, the workpiece | work W can be clamped without pinching the nail | claw 22 with the mold surface 11a and the mold surface 12a. According to this, before the workpiece W is clamped (FIGS. 1 and 3), the workpiece W is held by the chuck 20, and after the workpiece W is clamped at the time of molding (FIGS. 2 and 4), the chuck is held. The workpiece W can be held or released at a desired timing so as to release the workpiece W from the workpiece 20. The structure of the chuck 20 may be provided in the upper cavity system (FIG. 3). In this case, since the workpiece mold 11 is applied to the lower mold and the workpiece W is supported by the mold surface 11a, if the chuck 20 is released, it can be used in the same manner as a mold without the chuck 20. Can do. If there is a possibility that the workpiece W may be dropped, the workpiece W may be held by the chuck 20 and the lifting or warping of the workpiece W due to heating may be corrected. As a result, the mold 10 can be used for either the upper cavity method or the lower cavity method.

  A specific configuration of the chuck 20 as an example shown in FIG. 5 will be described. The claw 22 includes a seesaw portion 22a on which the rotation shaft 21 is provided. The chuck 20 includes a return spring 23, a first pin 24 that presses one of the seesaw portions 22 a via the return spring 23, and a second pin 25 that presses the other. For example, an air cylinder can be used to drive the second pin 25 (pressing pin). The claw 22 is moved between the first position (FIG. 5A) and the second position (FIG. 5B) by the swinging of the seesaw portion 22a by the pressing of the first pin 24 and the second pin 25. According to this, the workpiece | work W can be hold | maintained or released by making the chuck | zipper 20 into a simple structure.

  Further, as shown in FIG. 1 and the like, the workpiece mold 11 includes an eject pin 26 that ejects the workpiece W from the mold surface 11a. A plurality of eject pins 26 are arranged inside a plurality of chucks 20 arranged along the outer periphery of the workpiece W. The eject pin 26 is housed in the chase unit 14 so as to retract from the mold surface 11a when the work W is set on the mold surface 11a, and advances from the mold surface 11a when the work W is conveyed. Protrudes out of the chase unit 14. For example, an air cylinder can be used to drive the eject pin 26. According to this, in a state where the chuck 20 is released, the workpiece W can be floated (separated) from the mold surface 11a, and delivery of the workpiece W is facilitated. Further, the chuck 20 is provided on the mold surface 11a of the workpiece mold 11. However, the workpiece W is transferred without interfering with the chuck 20 by moving the eject pin 26 beyond the chuck 20 from the mold surface 11a. be able to.

  Further, when the workpiece W is held on the mold surface 11a, the workpiece mold 11 includes a workpiece suction circuit (not shown) that opens on the mold surface 11a side so as to attract the workpiece W. This work suction circuit is connected (communication) to a work suction pipe 54 and a suction device (for example, a vacuum pump) provided in the mold press 50, and sucks the work W onto the mold surface 11a by discharging air. For this reason, the mold surface 11 a side end of the work suction circuit is arranged in a plurality inside the plurality of chucks 20 that hold the work W. Note that a hole in which the eject pin 26 is provided may be used as the work suction circuit. Further, it is possible to adopt a configuration in which the eject pin 26 is not provided and can be sucked through a hole arranged at the same position.

  The work mold 11 includes an in-mold depressurization circuit 27 that opens on the mold surface 11a side so as to depressurize the mold including the cavity C in a closed state. This pressure reducing circuit 27 in the mold is connected (communication) to the pressure reducing piping 55 (FIGS. 1 and 3) and the suction device (for example, vacuum pump) provided in the mold press 50, and discharges air. Depressurize the inside of the mold. For this reason, a plurality of mold surface 11 a side ends of the in-mold decompression circuit are arranged outside the plurality of chucks 20 that hold the workpiece W.

  Further, the work mold 11 includes a seal ring 30 (for example, an O-ring) that seals between the work mold 11 and the cavity mold 12 in a closed state. As a result, the inside of the closed mold is sealed, and the inside of the mold can be decompressed by the in-mold decompression circuit 27. For this reason, the mold surface 11 a side end of the in-mold decompression circuit 27 is disposed inside the seal ring 30. By the way, the above-described release of the chuck 20 is preferably performed after the seal ring 30 is touched to be in a sealed state or immediately before the workpiece W is clamped. In this case, in a state where the mold is opened, it is preferable that the seal ring 30 is located higher (separated) than the chuck 20 with respect to the mold surface 11a. Therefore, the workpiece mold 11 includes a ring 31 that holds the seal ring 30 and a spring 32 that holds the ring 31, and these are provided in a circumferential groove recessed from the mold surface 11 a to adjust the height of the seal ring 30. It is good also as a structure which can be performed.

  The other cavity mold 12 constituting the mold 10 includes a base 33 and a chase unit 34 assembled to the base 33. For example, the base 33 is assembled to the lower platen 52 with, for example, bolts as shown in FIG. The base 33 has a guide 35 (rail) in which the chase unit 34 is inserted and removed in a crossing direction intersecting the mold opening / closing direction. Since the slide groove 36 corresponding to the guide 35 is formed in the chase unit 34, the chase unit 34 is configured to be slidable on the base 33 and detachable. The base 33 includes a built-in heater 37 and is configured to be able to heat the inside of the mold 10 to a predetermined temperature.

  By the way, when the mold die 10 is used instead of the upper cavity method or the lower cavity method, the assembly between the upper platen 51 and the lower platen 52 is changed in correspondence with the work die 11 and the cavity die 12 respectively. It becomes. At that time, the chase unit 14 for functioning as the work mold 11 is removed from the base 13, the chase unit 34 for functioning as the cavity mold 12 is removed from the base 33, and switching is performed by exchanging and mounting them. Can do. Even when switching is reversed, the molding method can be switched by removing the chase units 14 and 34 and replacing the upper and lower units. That is, the upper platen 51 and the lower platen 52 are configured so that both the work mold 11 and the cavity mold 12 can be assembled.

  In order to enable such switching, in the present embodiment, the guide 15 of the base 13 of the work mold 11 and the guide 35 of the base 33 of the cavity mold 12 have the same function, and have the same shape and dimensions. It can be set as the structure which has the part which becomes. For example, as the same function, the positions of pins, support pillars, pipes, etc. can be made common, or the shapes and dimensions of the parts that are inserted and removed during attachment / detachment can be made the same or correspond to each other.

  Specifically, the slide groove 16 of the chase unit 14 of the work mold 11 and the slide groove 36 of the chase unit 34 of the cavity mold 12 can have the same shape and size so that they have the same function. That is, the chase unit 14 is inserted into and removed from the guide 35 of the base 33 and the chase unit 34 is also inserted into and removed from the guide 15 of the base 13. According to this, from the upper cavity method to the lower cavity method, from the lower cavity method to the upper cavity method, without removing the bases 13 and 33, only the chase units 14 and 34 are inserted and removed in the horizontal direction and replaced. It can be easily changed without changing the entire mold. In the present embodiment, the base 13 and the base 33 have the same function, shape, and dimensions (the base 33 also has an in-mold decompression circuit 38).

  Further, in the case where the chase units 14 and 34 and the like are replaceable in order to switch between the upper cavity type and the lower cavity type, it is preferable that the following functions are also provided. For example, a detection mechanism (reading mechanism) for recognizing which of the pair of chase units 14 and 34 is assembled in the upper and lower bases 13 and 33 is used as the upper and lower bases 13 and 33 or the upper platen 51. And the lower platen 52. Specifically, the pair of chase units 14 and 34 is attached with identification information (such as uneven processing, laser mark, plate attachment, RFID attachment, etc.) indicating one of them.

  In addition, the upper and lower bases 13 and 33 and the upper platen 51 and the lower platen 52 can be provided with a configuration for reading identification information by an optical method or an electromagnetic method as a detection mechanism. And the detected identification information is transmitted to the control part mentioned later, and is utilized for control of an apparatus. In this case, since the upper and lower sides cannot be mounted with a normal mold, they cannot be mounted by mistake. However, the pair of chase units 14 and 34 is intended even in a replaceable configuration as in this embodiment. It can be prevented from being placed upside down with respect to the orientation. As another configuration of the detection mechanism, identification information may be attached to only one of the pair of chase units 14 and 34. Also in this case, it is possible to detect which is assembled from the detection state.

  The cavity mold 12 includes a cavity piece 40 and a clamper 41 provided around the cavity piece 40 and having a mold surface 12a. The cavity piece 40 is provided in a state of being inserted into a through hole that penetrates the clamper 41. The cavity piece 40 is fixedly assembled to the assembly surface 34 a of the chase unit 34. The clamper 41 is assembled to the assembly surface 34a via a spring 42 so as to be reciprocable in the mold opening / closing direction. And the cavity C (recessed part) recessed from the mold surface 12a is formed by providing the cavity piece 40 at the position (lowered position) where the cavity piece 40 is drawn in the thickness direction from the mold surface 12a of the cavity mold 12 (clamper 41). The That is, the bottom surface of the cavity C is configured by the end surface of the cavity piece 40, and the side surface of the cavity C is configured by the inner peripheral surface (inner wall surface) of the clamper 41. Note that the opening of the cavity C (concave portion) is closed by the workpiece W by clamping the workpiece W.

  The cavity mold 12 includes a film suction circuit 43 (43a, 43b) that opens on the mold surface 12a side so that the release film F is attracted to the mold surface 12a including the inner surface of the cavity C. The film suction circuit 43 is connected (communicated) to a film suction pipe 56 and a suction device (for example, a vacuum pump) included in the mold press 50, and follows the concave shape of the cavity C by discharging air. In this way, it is adsorbed on the mold surface 12a. Therefore, a plurality of ends 43a on the mold surface 12a side of the film suction circuit 43 are arranged around the cavity C (outside), and a plurality of ends Cb of the cavity C side 43b of the film suction circuit 43 are arranged on the cavity C side (around the bottom surface). Is done. Here, a seal ring 44 is provided in the gap between the outer peripheral surface of the cavity piece 40 and the inner peripheral surface of the clamper 41 at the cavity C side end 43b, and the gap is used as a circuit.

  About the release film F, the supply method to the mold 10 differs depending on the upper cavity method and the lower cavity method. In the upper cavity system (FIGS. 3 and 4), the long release film F is supplied by a film supply device including a pair of reels 57a and 57b provided on the upper platen 51. The release film F is unwound from the reel 57a so as to cover the mold surface 12a of the cavity mold 12, and is taken up by the reel 57b. The release film F is a film material that has heat resistance that can withstand the heating temperature of the mold 10 and is easily peeled off from the mold surface 12a of the cavity mold 12 and has flexibility and extensibility. Use. For example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinyl chloride, etc. are used as the release film F. In the lower cavity method (FIGS. 1 and 2), the pair of reels 57a and 57b is not used, and it may be preferable to use another release film F supply method described later. , 57b may be provided.

  In this way, the work mold 11 and the cavity mold 12 constituting the mold 10 are replaced by using one mold press 50 by changing the assembly of the mold press 50 to the upper platen 51 and the lower platen 52. Molding can be performed using various types of methods (upper cavity method and lower cavity method). In addition, the workpiece mold 11 includes a workpiece suction circuit and an in-mold decompression circuit 38, the cavity mold 12 includes a film suction circuit 43, and a configuration in which appropriate piping can be connected thereto is provided. . According to this, while maintaining the work W and the release film F regardless of the upper cavity system or the lower cavity system, the inside of the mold can be depressurized to eliminate air, and the release film F of the work W can be removed. Adsorption and depressurization in the mold can be carried out. Then, by providing the workpiece suction pipe 54, the in-mold decompression pipe 55, and the film suction pipe 56 (pipe set) in advance on each of the upper platen 51 and the lower platen 52, the mold mold 10 can be used. Regardless, the circuit and piping can be easily connected. Moreover, by arranging in advance, the piping can be made thicker and pressure reduction can be performed quickly.

  In addition, as a simple configuration for obtaining the same effect, by providing a long pipe connected to each of the work mold 11 and the cavity mold 12, when these are turned upside down, any It can also be made connectable. In this case, the length of the pipe is determined in consideration of the gap between the work mold 11 and the cavity mold 12 when the mold is opened. In other words, the length of the pipe needs to be a length that can be connected to any mold when the mold is opened. As in these configurations, each circuit on the mold side and each pipe on the platen side are provided so as to be connectable between the upper platen 51 and the lower platen 52, so that the mold mold 10 that requires decompression and suction is used. Even if it exists, the work metal mold | die 11 and the cavity metal mold | die 12 can be reversed and arrange | positioned, and it can shape | mold.

  Next, a molding apparatus 60 according to an embodiment of the present invention will be described mainly with reference to FIG. FIG. 6 is a plan layout view showing a schematic configuration of the molding apparatus 60. The molding apparatus 60 is configured to be compatible with both the upper cavity system and the lower cavity system of the mold 10. In FIG. 6, a part of the configuration is shown in a transparent state.

  The molding apparatus 60 includes a mold press 50 having a mold 10 that can be switched between an upper cavity system and a lower cavity system, and can perform molding by either an upper cavity system or a lower cavity system with one apparatus. In the molding apparatus 60 shown in FIG. 6, two mold presses 50 (two mold dies 10) are arranged adjacent to each other in the press area. In the molding apparatus 60, each of the two mold dies 10 can be used as an upper cavity system and a lower cavity system, and both of the two mold dies 10 can be used as an upper cavity system or a lower cavity system.

  The molding apparatus 60 includes a work port 61, a robot arm 62, a first resin supply mechanism 63, a work loader 64, a second resin supply mechanism 65, and a film loader 66. Here, it is more preferable that the first resin supply mechanism 63 and the second resin supply mechanism 65 are arranged in a plane with the mold press 50 (mold die 10) interposed therebetween. According to this, for example, two mold presses 50 (mold dies 10) are fixed adjacent to each other, and on the other hand, the first resin supply mechanism 63 is added on the work port 61 side (one side). A second resin supply mechanism 65 can be added on the opposite side (the other side) across the press 50. The molding apparatus 60 includes a CPU (Central Processing Unit) and a control unit (not shown) having a storage unit such as a ROM and a RAM. In the molding apparatus 60, the operation of each unit (mechanism) is controlled by the CPU reading and executing various control programs recorded in the storage unit.

  For example, the work port 61 transfers the work W into and out of the apparatus to a FOUP (Front Opening Unified Pod) as a magazine capable of storing a plurality of works W. In the work port 61, the workpiece W (molded product) before molding is received from the FOUP as the workpiece supply side, and the workpiece W (molded product) after molding is transferred to the FOUP as the workpiece storage side.

  The robot arm 62 is provided on, for example, a robot body and is configured to be rotatable in an arbitrary direction. The robot arm 62 is configured to convey the workpiece W between the parts such as the work port 61 and the first resin supply mechanism 63 disposed so as to surround the robot arm 62 ( Delivery). As the robot arm 62, for example, a vertical articulated type, a horizontal articulated type, or an articulated type of robot combining these is used, and the work W is held by suction or gripping with the hand 70 at the tip. Transport. Here, the robot arm 62 will be specifically described with reference to FIG. FIG. 7 is an explanatory diagram of an example of the configuration of the robot arm 62 provided in the molding apparatus 60. FIG. 7A is a schematic plan view, FIG. 7B is a schematic side view in which the workpiece W is supported upward, and FIG. It is the typical side view which supported

  As shown in FIG. 7, the robot arm 62 includes a hand 70 that holds the workpiece W (for example, a Y shape divided into two forks from the arm side shown in FIG. 7A). In the present embodiment, as the workpiece W, for example, a substrate 101 (for example, an interposer substrate, a carrier plate, a semiconductor wafer, glass, or the like) on which a plurality of chip components 100 (for example, chip-shaped electronic components such as semiconductor chips) are mounted in a matrix. The shape may be a rectangular shape in addition to a circular shape). As the front and back surfaces of the substrate 101, the chip component 100 is mounted on the front surface (main surface), and the workpiece W is held on the back surface side. As the holding mechanism for holding the workpiece W, various mechanisms including those described later are used.

  The robot arm 62 can hold the workpiece W by, for example, a suction mechanism (holding mechanism). The robot arm 62 as the suction mechanism includes, for example, a work suction circuit 71 that opens at the surface 70 a so that the work W is sucked by the hand 70. The work suction circuit 71 is connected (communication) to a suction device (for example, a vacuum pump) included in the molding device 60, and sucks the work W onto the surface 70a by discharging air.

  The robot arm 62 can hold the workpiece W by, for example, a chuck mechanism (holding mechanism). The robot arm 62 as the chuck mechanism includes a plurality of pins 72 protruding from the surface 70 a so as to sandwich the workpiece W at the outer peripheral portion of the workpiece W so that the workpiece W is chucked by the hand 70, for example. The tip of the pin 72 has, for example, a tapered flange shape (inverted truncated cone shape) so as to press the workpiece W toward the surface 70a. A plurality of pins 72 includes a pin 72a that is fixed at a tip where the hand 70 is divided into two branches, and a pin 72b that is provided on the arm side (base end side) so as to be able to reciprocate toward the pin 72a. Used). In a state where the pin 72b is retracted, the workpiece W is set on the surface 70a so as to be in contact with the pin 72a, and then the pin 72a is advanced to the pin 72a side so that the workpiece W is sandwiched and held by the plurality of pins 72. The By adopting such a configuration, the workpiece W is held without contacting the mounting surface (molded surface) of the chip component 100 before molding, and the workpiece W that is likely to warp due to contraction of the resin sealing layer after molding. It can be properly held and transported.

  Further, the robot arm 62 can reverse the front and back surfaces of the workpiece W by, for example, a reversing mechanism. The robot arm 62 as a reversing mechanism includes a rotating shaft 73 (for example, driven by a motor) that rotates the hand 70. According to the robot arm 62, for example, the workpiece W held in the FOUP with the surface to be molded (molding surface) facing upward can be reversed according to the method of the mold 10. In addition, depending on the state in which the workpiece W is stored in the FOUP, for example, the workpiece W can be inverted so that the molding surface faces upward. That is, in the case of the lower cavity method, it is necessary to form the work W downward and to make it upward after forming. The work W reversing mechanism may be provided in the robot arm 62 from the viewpoint of reducing the device area, but may be provided as a separate device between the transfer of the robot arm 62 and the work loader 64.

  The first resin supply mechanism 63 (FIG. 6) supplies the resin R onto the workpiece W. The workpiece W is carried into the first resin supply mechanism 63 by the robot arm 62, supplied with resin, and carried out. In the first resin supply mechanism 63, when supplying the liquid resin R, a known liquid dispenser is used. The liquid dispenser discharges and supplies the liquid resin R stored in the syringe 74 from a nozzle (not shown) onto the workpiece W set on the stage. For example, by discharging the resin R while moving the nozzle, the resin R can be supplied onto the workpiece W so as to have a predetermined shape such as a dot shape, a spiral shape, or a concentric shape. Further, in the liquid dispenser, a plurality of syringes 74 are on standby by a revolver 75 configured to be able to rotate and supply, so that the resin dispensed and empty can be easily replaced. The first resin supply mechanism 63 is used in the upper cavity system when supplying the resin R to the mold 10, but is used because the lower cavity system is supplied from the resin R from the second resin supply mechanism 65. Absent. Note that the first resin supply mechanism 63 can be arbitrarily disposed within the movable range (peripheral position) of the robot arm 62, and the position between the robot that operates the robot arm 62 and the mold press 50 (for example, in FIG. 6). It can also be provided at the position of the film collection box 83).

  The work loader 64 can be reciprocated along the transport rail 67a by a known drive mechanism, and can advance and retreat (reciprocate) along the transport rail 68a with respect to the mold press 50 (molding die 10). Composed. The resin R is conveyed from the first resin supply mechanism 63 together with the work W by the work loader 64 to the upper cavity mold 10. Thus, the resin R is supplied according to the method of the mold 10.

  Specifically, the work loader 64 receives the work W from the robot arm 62 via the transfer stage 76 as an in-loader of a molded product, and carries (supplies) the work W to the mold 10 of the mold press 50. Further, the work loader 64 is an offloader of a molded product, receives the workpiece W from the mold 10 and carries it out, and delivers the workpiece W to the robot arm 62 via the delivery stage 76. The work loader 64 includes a loader hand 80 (FIGS. 8 and 9), and conveys the work W with the loader hand 80 held to the mold 10. Here, a reversing mechanism for reversing the workpiece W may be provided in the delivery stage 76, and the reversing mechanism may not be provided for the robot arm 62.

  Here, the work loader 64 will be specifically described with reference to FIGS. 8 and 9. FIG. 8 is an explanatory view from a side view of the work loader 64 when the mold 10 is in the lower cavity system. FIG. 9 is an explanatory view from a side view of the work loader 64 when the mold 10 is the upper cavity type. In the work loader 64, the loader hand 80 (80a, 80b) is replaced according to the lower cavity method or the upper cavity method. According to this, even if the chip component 100 mounted on the workpiece W is upward or downward, the workpiece W can be held and transported corresponding to each.

  As shown in FIG. 8, the loader hand 80 a for the lower cavity includes a holding pin 81 that is provided on the upper surface and holds the workpiece W. A plurality of holding pins 81 are provided on the outer periphery of the workpiece W, and a notch (stepped portion) is provided on the inner side so that the outer periphery of the workpiece W can be held. When the mold 10 is of the lower cavity type, the work W is set on the mold surface 11a of the work mold 11 with the chip part 100 facing downward. For this reason, the loader hand 80a holds the workpiece W by the holding pins 81 so that the chip component 100 does not come into contact with the upper surface of the loader hand 80a even when the chip component 100 faces downward.

  The lower cavity loader hand 80a includes a suction pad 82 that is provided on the lower surface and sucks and holds a used release film F (used as a sheet film F described later). The suction pad 82 is connected to a suction device (for example, a vacuum pump) through a suction circuit (not shown), and sucks the sheet film F by drawing air. For this reason, the loader hand 80a sucks and holds the single-wafer film F by the suction pad 82 in order to collect the used single-wafer film F used at the time of molding in the film collection box 83.

  As shown in FIG. 9, the loader hand 80 b for the upper cavity includes a chuck 84 that is provided on the lower surface and holds the workpiece W. A plurality of chucks 84 are provided on the outer periphery of the workpiece W, and holding claws are provided so that the outer periphery of the workpiece W can be held. When the mold 10 is of the upper cavity type, the workpiece W is set on the mold surface 11a of the workpiece mold 11 with the chip part 100 facing upward. As described above, since the resin R is supplied onto the workpiece W during molding in the upper cavity, the workpiece W is suspended by the chuck 84 so that the resin R on the workpiece W does not contact the lower surface of the loader hand 80b. Hold. As described above, the work loader 64 including the loader hand 80b functions as a resin loader for transporting the resin R in addition to transporting the work W.

  The second resin supply mechanism 65 supplies the resin R onto the release film F (sheet-fed film F). As the second resin supply mechanism 65, at least one of the liquid resin R and the granular resin R can be supplied to the release film F. In the second resin supply mechanism 65 shown in FIG. 6, when supplying the liquid resin R, a known liquid dispenser including the syringe 74 described in the first resin supply mechanism 63 is used. The second resin supply mechanism 65 uses a known granule dispenser when supplying granular resin R. The granule dispenser includes a hopper 85 in which the resin R is stored, and a trough 86 that drops the resin R while moving the resin R from the hopper 85 relatively. According to the granule dispenser, the granular resin R can be supplied in an arbitrary shape, and the granular resin R can be supplied evenly on the single-wafer film F without any deviation.

  In addition, the second resin supply mechanism 65 includes a film supply device 90 that supplies the release film F as a single wafer film F. The film supply device 90 pulls out the roll-like release film F attached to the reel and cuts (cuts) it into an arbitrary shape (rectangular or circular) and size, and then applies a predetermined tension to the chuck of the frame 91. It is supplied as a single wafer film F by holding. The second resin supply mechanism 65 is used in the lower cavity system when supplying the resin R to the mold 10. However, in the upper cavity system, the second resin supply mechanism 65 is used because the resin R is supplied from the first resin supply mechanism 63. Absent.

  The film loader 66 (resin loader) can reciprocate along the transport rail 67b by a known drive mechanism, and can advance and retreat (reciprocate) along the transport rail 68b with respect to the second resin supply mechanism 65. Configured. In addition, said conveyance rail containing conveyance rail 67b, 68b may be comprised with a pair of rail with which the rail was provided in parallel, and a monorail may be sufficient as it. Furthermore, the moving body may be configured to move on the rail, or may be configured to move while being suspended from the rail. Moreover, in order to implement | achieve these structures, each rail can be arrange | positioned in arbitrary members and positions other than the arrangement | positioning mentioned above. For example, one rail can be disposed on the housing wall surface (upper surface) on the lower side of the apparatus, and the other rail can be disposed on the housing wall surface (lower surface) on the upper side of the apparatus.

  The resin R is transported from the second resin supply mechanism 65 together with the sheet film F by the film loader 66 to the lower cavity mold 10. Specifically, the film loader 66 receives the sheet film F on which the resin R is mounted together with the frame 91 from the second resin supply mechanism 65, and carries (supply) it into the mold 10 of the mold press 50. Thus, the resin R is supplied according to the method of the mold 10.

  Here, the film loader 66 will be specifically described with reference to FIG. FIG. 10 is an explanatory view from the side view of the film loader 66 when the mold 10 is in the lower cavity system. The film loader 66 includes a chuck 92 (see FIG. 6) that is provided on the lower surface and holds the sheet film F via the frame 91. A plurality of chucks 92 are provided on the outer periphery of the frame 91. When the mold 10 is of the lower cavity type (FIGS. 1 and 2), the sheet film F has the mold surface 12a of the cavity mold 12 with the resin R facing upward so that the resin R is accommodated in the cavity C. Set (supplied). At this time, the sheet F is sucked and held by the film suction circuit 43 of the cavity mold 12 and released from the frame 91. The film loader 66 and the technology related thereto are described in Patent Document 1.

  According to the present embodiment, the work mold 11 and the cavity mold 12 constituting one mold mold 10 are inverted and used to perform molding by either the upper cavity system or the lower cavity system. Can do. The lower cavity method (FIGS. 1 and 2) is suitable for a method in which the resin R is entirely supplied into the cavity C of the lower mold, and it is easy to perform molding with reduced resin flow during compression molding.

  On the other hand, in the upper cavity system (FIGS. 3 and 4), since the workpiece W is set in the lower mold, it is possible to prevent the mounted object (for example, the resin R) from falling on the workpiece W. For example, even if it is a large work W or a heavy work W that uses the FOWLP (Fan Out Wafer Level Package) or FOPLP (Fan Out Panel Level Package) process, it ensures production stability. Can be molded. Moreover, since the resin R can be carried in by carrying in the workpiece W, the conveying structure can be simplified, the manufacturing process can be made efficient, and high productivity can be produced.

  In addition, as shown in FIG. 11, only the upper cavity system can be obtained by omitting a part from the same configuration as shown in FIG. 11 with respect to the molding apparatus 60 configured to be compatible with both the upper cavity and the lower cavity of the mold 10. It can also be configured as an apparatus capable of molding. FIG. 11 is a plan layout view showing a schematic configuration of a molding apparatus 60A corresponding to only the upper cavity system. In the molding apparatus 60 </ b> A, the mold die 10 is configured in an upper cavity system in one mold press 50. As described above, when the lower cavity system is not used, the apparatus can be reduced in size and arranged in a plane unless the second resin supply mechanism 65 and the film loader 66 of the molding apparatus 60 shown in FIG. 6 are added. The footprint can be reduced. Further, since the film loader 66 is not added, the transport mechanism can be simplified.

(Embodiment 2)
A molding apparatus 60B according to another embodiment of the present invention will be described mainly with reference to FIGS. 12 and 13 are plan layout views showing a schematic configuration of a molding apparatus 60B in which a workpiece transfer robot is arranged in the center of the apparatus. Specifically, it is a plan layout diagram showing a schematic configuration of a molding apparatus 60B in which each part is arranged around a robot arm 62 provided on a robot body, and is an explanatory diagram of a lower cavity type molding process. FIG. 13 is a plan view showing a schematic configuration of the molding apparatus 60B, and is an explanatory view of an upper cavity type molding process.

  In the molding apparatus 60 (FIG. 6) according to the first embodiment, the case where the first resin supply mechanism 63 for the upper cavity system and the second resin supply mechanism 65 for the lower cavity system are separately provided has been described. On the other hand, in this embodiment, the point which is the structure by which each part was provided so that the robot arm 62 provided with the hand 70 which conveys the workpiece | work W might be enclosed differs greatly. Another difference is that a resin supply mechanism 93 for both the upper cavity system and the lower cavity system is provided. Below, it demonstrates centering on these different points. The molding apparatus 60B is not only configured to perform molding by compression molding of the workpiece W (molded product Wa), but also after the workpiece W (molded product Wb) is inspected, additional non-defective products are heat-cured (cured). Although the thing including the structure accommodated and shown is shown, it is not necessarily required about the structure heat-cured additionally.

  The molding apparatus 60B includes a mold press 50 including the mold 10, a work port 61, a robot arm 62 including a hand 70, a resin supply mechanism 93, inspection units 94a and 94b, and a curing furnace 95. In the molding apparatus 60B, each part (mechanism) is disposed so as to surround the robot arm 62. For this reason, it can be transported only by the robot arm 62, the delivery time can be reduced, the moving distance of the work W and the resin R between the respective parts is shortened, and the work W etc. can be transported efficiently. .

  The resin supply mechanism 93 combines the functions of the first resin supply mechanism 63 and the second resin supply mechanism 65 of the molding apparatus 60 described in the first embodiment. That is, the resin supply mechanism 93 can both supply the resin R onto the release film F (sheet-fed film F) and supply the resin R onto the workpiece W. In the resin supply mechanism 93, when supplying the liquid resin R, a known liquid dispenser including the syringe 74 described in the first resin supply mechanism 63 is used. In the resin supply mechanism 93, the film supply apparatus 90 including the frame 91 described in the second resin supply mechanism 65 is used.

  Further, the pre-molding inspection unit 94a and the post-molding inspection unit 94b inspect the state of the workpiece W and read predetermined information given to the workpiece W. Examples of items to be inspected and read include inspections such as thickness measurement of the workpiece W, appearance inspection, and reading of a two-dimensional code. Further, the curing furnace 95 heat cures (cures) the resin portion of the workpiece W. The curing furnace 95 is closed to the outside by an open / close door (not shown), and the inside is heated to a predetermined temperature. When the workpiece W held by the robot arm 62 approaches the curing furnace 95, the opening / closing door is opened, and when the workpiece W is placed inside and the robot arm 62 is retracted, the opening / closing door is closed and heated and cured for a predetermined time. Instead of the curing furnace 95 as described above, the workpiece W may be sandwiched between plate members at a predetermined temperature to promote heat curing and correct the warpage of the molded product.

  When the mold 10 is of the lower cavity type (FIG. 12), in the resin supply mechanism 93, after the film supply device 90 pulls out the roll-like release film F attached to the reel and cuts (cuts) it to an arbitrary size, The sheet is supplied as a single-sheet film F by being held by a chuck of the frame 91 in a state where a predetermined tension is applied. Then, the liquid resin R stored in the syringe 74 is discharged and supplied from the nozzle onto the single wafer film F set on the stage. For example, by discharging the resin R while relatively moving the nozzle and the stage, the resin R can be supplied onto the sheet film F so as to have, for example, a spiral shape or a concentric shape. In the mold press 50, the sheet F is set (supplied) in the mold 10 together with the workpiece W and the resin R by the robot arm 62, and is molded.

  On the other hand, when the mold 10 is of the upper cavity type (FIG. 13), the resin supply mechanism 93 discharges and supplies the liquid resin R stored in the syringe 74 onto the workpiece W set on the stage. To do. For example, by discharging the resin R while relatively moving the nozzle and the stage, the resin R can be supplied onto the workpiece W so as to have a spiral shape, for example. In the mold press 50, the work W is set (supplied) together with the resin R in the mold 10 by the robot arm 62, and the release film F is supplied from a film supply apparatus including a pair of reels 57a and 57b. And molded.

  As described above, in the molding apparatus 60B, the workpiece transfer robot is arranged in the center of the apparatus, and each part is provided so as to surround the robot arm 62. In this configuration, the workpiece W held by the hand 70 is transferred between the parts. Yes. Further, a resin supply mechanism 63 is used which serves as both the first resin supply mechanism 63 for the upper cavity system and the second resin supply mechanism 65 for the lower cavity system. According to this, the molding apparatus 60B becomes smaller than the molding apparatus 60 described in the first embodiment, and the footprint can be reduced in the planar arrangement.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the first embodiment, the case where two mold presses are provided adjacent to each other in the press area between the first resin supply mechanism for the upper cavity system and the second resin supply mechanism for the lower cavity system will be described. did. However, the present invention is not limited to this, and one or more mold presses may be provided in the press area. Even in this case, the mold can be molded by constituting at least one of the upper cavity method and the lower cavity method. Further, in the molding by the molding apparatus 60 of the first embodiment, one of the two mold presses 50 performs an upper cavity type mold and the other performs a lower cavity type mold so that these are parallel to each other. You may go. Alternatively, these moldings may be sequentially performed on the workpiece W to mold the upper and lower surfaces of the workpiece W.

10 Mold 11 First mold (work mold)
11a Mold surface 12 Second mold (cavity mold)
12a Mold surface 20 Chuck C Cavity W Workpiece

Claims (13)

A mold comprising a first mold having a first mold surface and a second mold having a second mold surface, wherein the workpiece is clamped between the first mold surface and the second mold surface and resin-molded in a cavity Mold,
The first mold includes a chuck for holding a workpiece on the first mold surface;
The second mold comprises the cavity recessed from the second mold surface;
An upper cavity system in which the first mold is a lower mold and the second mold is an upper mold, and a lower cavity system in which the first mold is an upper mold and the second mold is a lower mold A mold that can be replaced. The mold according to claim 1, wherein
The chuck includes a claw having a rotation axis;
The mold is rotated by the rotating shaft so that the claw is in a first position that is applied to the workpiece as a state of holding the workpiece and a second position of being retracted from the workpiece in a state of not holding the workpiece. . The mold according to claim 2, wherein
The claw includes a seesaw portion provided with the rotation shaft,
The chuck includes a return spring, a first pin that presses one of the seesaw portions via the return spring, and a second pin that presses the other.
A mold according to claim 1, wherein the claw is moved between the first position and the second position by swinging the seesaw portion by pressing the first pin and the second pin. In the mold according to any one of claims 1 to 3,
The first mold has a work suction circuit that opens on the first mold surface side so as to suck the work, and the in-mold pressure reduction that opens on the first mold surface side so as to depressurize the inside of the mold. A circuit,
The second mold includes a film suction circuit that opens on the second mold surface side so that the film is adsorbed on the second mold surface of the second mold including the inner surface of the cavity. Mold mold. In the mold according to any one of claims 1 to 4,
The first mold includes a first chase unit having the first mold surface, and a first base having a first guide that is inserted and removed in an intersecting direction in which the first chase unit intersects the mold opening / closing direction. ,
The second mold is a cavity piece, a clamper provided around the cavity piece and having the second mold surface, a second chase unit having an assembly surface on which the cavity piece and the clamper are assembled, A second base having a second guide in which two chase units are inserted and removed in the crossing direction,
The mold according to claim 1, wherein the first chase unit is inserted into and removed from the second guide, and the second chase unit is inserted into and removed from the first guide. A work suction circuit that has a first mold surface and opens on the first mold surface side so as to attract the workpiece, and an in-mold decompression circuit that opens on the first mold surface side so as to decompress the inside of the mold. A first mold having a circuit, and a second mold surface, and having a second mold surface on the second mold surface side so as to adsorb the film to the second mold surface including the inner surface of the cavity recessed from the second mold surface A second mold having a film suction circuit to be opened is provided, and a mold that clamps a workpiece between the first mold surface and the second mold surface and is resin-molded in the cavity can be assembled. A mold press comprising an upper platen and a lower platen sandwiching the mold dies,
The upper platen and the lower platen are configured so that both the first mold and the second mold can be assembled,
The in-mold decompression pipe connected to the in-mold decompression circuit, the workpiece adsorption pipe connected to the workpiece adsorption circuit, and the film adsorption pipe connected to the film adsorption circuit Provided to be connectable between the upper platen and the lower platen;
The work suction circuit of the first mold assembled to one of the upper platen and the lower platen is connected to the work suction pipe, and the pressure reducing circuit in the mold of the first mold is the The film suction circuit of the second mold, which is connected to the pressure reducing pipe in the mold and assembled to the other of the upper platen and the lower platen, is connected to the film suction pipe. Mold press to do. Mold mold that can be replaced with upper cavity method and lower cavity method,
An upper platen and a lower platen sandwiching the mold dies,
In-mold decompression piping connected to the in-mold decompression circuit of the mold,
A workpiece suction pipe connected to the workpiece suction circuit of the mold,
A film suction pipe connected to the film suction circuit of the mold, and
With
A mold press, wherein the upper platen and the lower platen are provided with the in-mold decompression pipe, the workpiece suction pipe, and the film suction pipe, respectively. A molding apparatus comprising the mold press according to claim 6 or 7,
A molding apparatus, comprising a reversing mechanism for holding a work on a back surface opposite to a surface to be molded and reversing the front and back surfaces of the work. Mold mold that can be replaced with upper cavity method and lower cavity method,
A reversing mechanism for holding the work on the back side opposite to the surface to be molded and reversing the front and back surfaces of the work;
A molding apparatus comprising: The molding apparatus according to claim 9, wherein
A first resin supply mechanism for supplying resin onto the workpiece;
A second resin supply mechanism for supplying resin onto the film;
With
Resin is conveyed from the first resin supply mechanism together with the workpiece to the mold mold of the upper cavity system,
Resin is transferred to the lower cavity type mold from the second resin supply mechanism together with a film. The molding apparatus according to claim 10, wherein
The molding apparatus, wherein the first resin supply mechanism and the second resin supply mechanism are arranged in a plane with the mold die interposed therebetween. The molding apparatus according to claim 10, wherein
The molding apparatus characterized in that the first resin supply mechanism and the second resin supply mechanism are combined. In the molding apparatus according to any one of claims 8 to 12,
A work loader that conveys the mold while holding the work with a hand,
A molding apparatus, wherein the hand is changed according to a lower cavity system or an upper cavity system.