CN110815707A

CN110815707A - Workpiece conveying device, resin conveying device and resin molding device

Info

Publication number: CN110815707A
Application number: CN201910734984.9A
Authority: CN
Inventors: 中村一雄; 西泽义晃; 北岛德幸; 伊藤幸雄
Original assignee: Apic Yamada Corp
Current assignee: Apic Yamada Corp
Priority date: 2018-08-10
Filing date: 2019-08-09
Publication date: 2020-02-21
Anticipated expiration: 2039-08-09
Also published as: JP7068094B2; TWI828702B; KR20200018314A; TW202012138A; JP2020026088A; CN110815707B

Abstract

The invention provides a workpiece conveying device, which can position a workpiece to a molding die and transfer the workpiece to the molding die by using a simple device structure. A work conveying device (1) holding a work (W) performs positioning of a conveying device main body (2) by means of a positioning part provided on a mold clamping surface of a mold (6), and moves a work holding part (3) in a horizontal direction with respect to a conveying mechanism main body (2) which is positioned in a state where the work (W) is held, thereby conveying the work (W) to a set position provided on a mold surface by the work holding part (3) in a state where the work (W) is positioned, and/or takes the formed work (W) from the set position by the work holding part (3) and conveys the work out from the mold.

Description

Workpiece conveying device, resin conveying device and resin molding device

Technical Field

The present invention relates to a workpiece conveying device for conveying a workpiece before and after molding into and out of a mold, a resin conveying device for conveying a resin before and after molding into and out of a mold, and a resin molding device including at least one of the devices.

Background

In recent years, work is becoming thinner and thinner, and the trend is: the cavity to be filled with the molding resin becomes thin, and on the other hand, the resin molding area (work size) is enlarged. In addition, from the viewpoint of speeding up a semiconductor device, many products have appeared: a semiconductor chip (hereinafter, simply referred to as a chip) is flip-chip connected to a substrate by a terminal connection method using a bump, instead of connecting the semiconductor chip to the substrate via a wire. Therefore, underfill molding of a narrow gap between the chip and the substrate is required. Further, since it is necessary to dissipate heat emitted from the chip, there is also a demand for resin molding in which the surface of the chip is exposed. For example, a heat dissipation plate is bonded to the exposed surface to obtain a heat dissipation effect. In addition, for the purpose of reducing the manufacturing cost, since the substrate is of a strip substrate type having a workpiece size of, for example, 100mm × 300mm or less, there is an example in which a chip is connected to a substrate in which a wiring pattern is formed on a larger semiconductor wafer-shaped workpiece. Further, since there are many semiconductor manufacturing methods, there are, for example, the following methods called ewlb (embedded Wafer Level Ball Grid array): a thermoplastic tape is attached to a circular carrier in the form of a semiconductor wafer, a chip is attached to the tape, the carrier and the tape are peeled off after molding, and a wiring layer is connected to the terminal side of the chip. In this case, there is a demand for molding the back surface of the chip so as to be exposed in order to improve the heat dissipation effect. That is, resin molding is required to realize a carrier having a workpiece in the same shape as the semiconductor wafer, that is, a circular shape, and to expose the chips. Further, it is conceivable that, in response to a demand for further cost reduction in the future, a demand for die-exposure forming of a large-sized square workpiece larger than a circular workpiece is also emerging.

In the case where the circular workpiece is carried into the mold and transfer molding is performed with the outer peripheral edge portion of the workpiece sandwiched therebetween, since a resin path (including a runner gate, an overflow gate, a vent portion, and the like) intersects with an end portion of the workpiece, the mold resin is likely to leak from the end surface, and in order to prevent the mold resin from bypassing the end surface of the workpiece, it is necessary to align the end surface of the workpiece with the end surface of the mold facing the end surface of the workpiece in advance to eliminate the possibility of occurrence of a gap as much as possible.

However, since the workpiece is circular, it is difficult to position the workpiece as close as possible to the end face of the die. There is proposed a technique (patent document 1: Japanese patent laid-open No. 2015-51557): one end face of a rectangular strip-shaped substrate is pushed by a structure on the mold side, and the end face on the opposite side of the one end face is abutted against the end face of a loading part insertion opening (Japanese: ポットインサート) for alignment.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2015-51557

Disclosure of Invention

Problems to be solved by the invention

In the case of the die-exposed wafer type molding for flip-chip die bonding, it is necessary to perform resin molding in a cavity region having a small thickness and a large area, and since the resin pressure cannot be increased by compression molding, transfer molding is recommended in order to perform molding with a resin pressure increased even in a narrow region.

However, in the case of resin molding a workpiece of the so-called eWLB type by transfer molding, since many chips are mounted on the workpiece and are mounted in the vicinity of the end face of the circular cavity, it is necessary to avoid leaving voids and unfilled areas between the outer periphery of the workpiece and the chips and below the chips. In order to maintain a good resin injection balance, it is desirable to widen the width of the gate as much as possible. However, since the work is circular, unlike a rectangular substrate whose end face is a flat face, the overhang (based on the overlapping length of the holding unit from the work end to the cavity end) of the holding unit disclosed in patent document 1 in forming the resin path is excessively large. Further, since the workpiece is circular, even when the edge abutting mechanism is provided on the die side and the end face of the workpiece is pushed by a plurality of moving means as shown in patent document 1, the end face is curved, and therefore, displacement is likely to occur even when the workpiece is pushed.

Means for solving the problems

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a workpiece transfer device and a resin transfer device that can position and transfer a workpiece and/or resin to a mold die by a simple device structure, and to provide a resin molding device that can prevent the mold resin from going around to the end face of the workpiece regardless of the shape of the workpiece, and can form a flip-chip bonded chip-exposed semiconductor product with high quality.

The following disclosure relates to a plurality of embodiments having at least the following structures.

That is, a workpiece conveying device that performs at least one conveying operation of an operation of conveying a workpiece into a mold and an operation of conveying a formed workpiece out of the mold, the workpiece conveying device comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die clamping surface of the molding die; and a workpiece holding unit provided in the conveying apparatus main body and configured to hold the workpiece, the workpiece holding unit being configured to: the work can be moved in a horizontal direction with respect to the conveying device main body positioned on the die clamping surface while holding the work.

With the above-described configuration, in the workpiece conveying apparatus holding a workpiece, the conveying apparatus main body is positioned by the positioning portion provided on the mold clamping surface of the mold, and the workpiece holding portion is moved in the horizontal direction with respect to the conveying apparatus main body that has been positioned, in a state where the workpiece is held, so that the workpiece can be carried into the set position provided on the mold surface in a state where the workpiece is positioned by the workpiece holding portion, and/or the workpiece after forming can be taken out from the set position by the workpiece holding portion and carried out from the mold.

A workpiece conveying device for conveying a workpiece into a mold and conveying a formed workpiece out of the mold, the workpiece conveying device comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die clamping surface of the molding die; and a workpiece holding unit provided in the conveying apparatus main body and configured to hold the workpiece, the workpiece holding unit being configured to: the work can be moved in a horizontal direction with respect to the conveying device main body positioned on the die clamping surface while holding the work.

With the above configuration, the workpiece can be carried into the set position provided on the surface of the mold in a state of being positioned at the set position by the workpiece holding portion, and the molded workpiece can be taken out from the set position by the workpiece holding portion and carried out from the molding die.

A resin transfer device for transferring a molding resin into a molding die and for transferring a molded unnecessary resin out of the molding die, the resin transfer device comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die clamping surface of the molding die; and a resin holding portion provided in the conveying device main body and capable of holding the molding resin supplied to the molding die and the molded unnecessary resin, respectively, wherein the resin holding portion is provided with: is movable in a horizontal direction with respect to the carrying device body which has been positioned on the mold clamping surface.

With the above configuration, the molding resin can be supplied to the setting position provided on the surface of the mold by the resin holding portion, and the unnecessary resin separated from the molded workpiece can be removed by the resin holding portion and can be carried out from the mold.

A workpiece conveying device for conveying a workpiece and a molding resin to a molding die and conveying the molded workpiece and an unnecessary resin from the molding die, the workpiece conveying device comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die clamping surface of the molding die; a workpiece holding unit provided in the conveying apparatus main body and configured to hold the workpiece; and a resin holding portion provided in the conveying device main body and capable of holding the molding resin supplied to the molding die and the molded unnecessary resin, respectively, wherein the resin holding portion is provided with: the apparatus includes a first resin holding portion for holding the mold resin supplied to the mold, and a second resin holding portion for holding the molded resin, wherein the first resin holding portion and the second resin holding portion are alternately movable to a carrying-in/out position of the carrier main body.

With the above configuration, the work holding portion carries the work into the set position provided on the surface of the mold in a state of being positioned at the set position, and can take the molded work out of the set position by the work holding portion and carry the work out of the mold, and the resin holding portion alternately moves to the carry-in and carry-out position of the conveying apparatus main body by the first resin holding portion and the second resin holding portion, so that the molding resin can be held by the first resin holding portion and supplied to the mold, and the molded unnecessary resin can be held by the second resin holding portion and carried out of the mold. Therefore, the operation of carrying the workpiece and the resin into the mold and the operation of carrying the workpiece and the resin out of the mold can be performed at the same time, and the apparatus structure can be simplified.

The first and second resin holding portions are provided as follows: the mold is movable in a horizontal direction in a direction in which the mold enters the conveying device main body, and in this case, the operation of carrying in the molding resin by the first resin holding portion is performed when the work carrying-in operation is performed, and the operation of carrying out the unnecessary resin by the second resin holding portion is performed when the work carrying-out operation is performed, so that the work conveying device can be operated in a switched manner by the same work conveying device. Therefore, the body shape of the carrier main body is not large in the direction of entering the mold, and can be arranged compactly.

Preferably, the first resin holding portion is capable of holding a molding resin in any form of a sheet resin, a powdery resin, a granular resin, or a liquid resin, and the second resin holding portion is capable of holding a returned molded product by suction.

Thus, the first resin holding part can carry in molding resin of various forms, and the second resin holding part can carry out a molded product return after molding.

A resin molding apparatus for clamping a workpiece and a molding resin carried in by any one of the workpiece conveying apparatuses by a first mold and a second mold of the molding mold to perform resin molding, and carrying out a molded workpiece and an unnecessary resin by the workpiece conveying apparatus, characterized in that the resin molding apparatus comprises a movable unit having a bridge portion arranged so as to overlap an end portion of the workpiece so as to form an air moving passage or a molding resin moving passage connected to a cavity recess formed in either one of the first mold and the second mold, and the movable unit is supported by: when the mold is opened, the movable unit moves upward to be separated from the mold clamping surface, and in a state where the mold is opened, the movable unit is separated from the mold clamping surface to horizontally move the workpiece holding portion to a set position where the workpiece held by the workpiece conveying device and the bridging portion are overlapped to transfer the workpiece, and then, the movable unit is pressed down by a mold clamping operation to clamp and clamp an end portion of the workpiece by the bridging portion.

In this way, the workpiece holding section is horizontally moved to the set position where the workpiece held by the workpiece transport device is separated from the die clamping surface and overlaps the bridge section of the movable unit, and the workpiece is transferred, and therefore, the workpiece can be positioned and transferred to the molding die by the workpiece holding section not only in the case of a rectangular workpiece but also in the case of a circular workpiece.

Further, the movable unit can be pressed down by the mold clamping operation, and the end portion of the workpiece can be clamped by the bridging portion, so that the mold resin can be prevented from going around the end face of the workpiece.

The movable unit may be: and a housing unit, a runner gate unit, and a ventilation unit configured to connect the bridge to the cavity recess.

Thus, regardless of whether the molding die is used for transfer molding or compression molding, and regardless of the shape of the work, the molding die can be accurately positioned, and leakage of resin to the end of the work can be prevented.

And a plurality of support pins that are capable of advancing and retracting relative to the surface of the mold are provided at a set position where the workpiece is transferred, and the workpiece conveying device moves to a position where the end surface of the workpiece overlaps the movable unit and transfers the workpiece to the support pins at the protruding position.

Thus, when the workpiece is transferred to the mold, the workpiece is not damaged by sliding against the surface of the mold.

A resin molding method for carrying a workpiece and a molding resin into a molding die having a first die and a second die by a workpiece transfer device, clamping the workpiece and the molding resin, and carrying out a resin molding by the workpiece transfer device, wherein the molded workpiece and an unnecessary resin are carried out from the molding die, the resin molding method comprising the steps of: aligning a carrier body with a mold clamping surface of the first mold of the mold molds that open the molds; horizontally moving a workpiece holding section, which is provided in the conveying apparatus main body so as to be movable and holds a workpiece, to a set position where a movable unit is overlapped with an end of the workpiece, wherein the movable unit is supported by: the movable unit is urged to be away from the mold clamping surface of the first mold when the mold is opened; delivering the work and the molded resin from the work holding portion to the first mold clamping surface; clamping the molding die in a state where the movable unit is overlapped with the end of the workpiece, and heating and curing the molding resin filled in the cavity concave portion; when the first mold and the second mold are opened, the movable unit is separated from the mold clamping surface of the first mold, and the molded workpiece is separated from the unnecessary resin; holding the work by the work conveying device and adsorbing and holding the unnecessary resin; and carrying out the molded article and the unnecessary resin from the molding die in a state where the molded article and the unnecessary resin are held by the work carrying device.

In the resin molding method, the same workpiece transfer device can be used to hold the workpiece and the molding resin and carry them into the molding die, and the molded workpiece and the unnecessary resin can be carried out from the molding die in a state of being separated from each other, so that the device configuration can be simplified.

Further, when the workpiece conveying device is carried into the mold, the workpiece holding portion is horizontally moved to a set position where the workpiece is separated from the mold clamping surface and overlapped with the bridge portion of the movable unit to transfer the workpiece, and therefore, the workpiece can be positioned and transferred to the mold by the workpiece holding portion not only in a rectangular shape but also in a circular shape. Further, the movable unit can be pressed down by the mold clamping operation, and the movable unit can be clamped so as to overlap the end portion of the workpiece, so that the mold resin can be prevented from flowing around the end surface of the workpiece.

ADVANTAGEOUS EFFECTS OF INVENTION

The present invention can provide a workpiece conveying device and a resin conveying device which can position a workpiece and/or resin to a molding die and deliver the workpiece and/or resin to the molding die by using a simple device structure.

The present invention can also provide a resin molding apparatus capable of preventing the molding resin from winding around the end face of the workpiece regardless of the shape of the workpiece and capable of forming a flip-chip connected chip-exposed semiconductor product with high quality.

Drawings

Fig. 1A and 1B are cross-sectional views illustrating the supply of a workpiece and a resin sheet with respect to a mold die of a resin molding apparatus used for transfer molding.

Fig. 2A and 2B are explanatory views of a resin molding process showing a loading operation of a workpiece and a mold resin, which is continued from fig. 1A and 1B.

Fig. 3A and 3B are explanatory views of a resin molding process showing a loading operation of a workpiece and a mold resin, which is continued from fig. 2A and 2B.

Fig. 4A and 4B are explanatory views of a resin molding process showing a mold closing operation and a mold opening operation, which are continued from fig. 3A and 3B.

Fig. 5A and 5B are explanatory views of a resin molding process showing a molded article and an unnecessary resin carrying-out operation, which are continued from fig. 4A and 4B.

Fig. 6 is an explanatory diagram of a resin molding process showing a removal operation of the molded article and the unnecessary resin, which is continued from fig. 5A and 5B.

Fig. 7A is a plan view illustrating the reason why the workpiece is abutted by the workpiece conveying device, and fig. 7B is a cross-sectional view illustrating the reason why the workpiece is abutted by the workpiece conveying device.

Fig. 8A is a plan view of the upper die, and fig. 8B is a plan view of the lower die.

Fig. 9 is an explanatory diagram illustrating an operation of positioning the workpiece with respect to the position of the containing section.

Fig. 10A is a plan view of the workpiece conveying device during the carrying-in operation, and fig. 10B is a plan view of the workpiece conveying device during the carrying-out operation.

Fig. 11A is a cross-sectional angle explanatory view of a resin molding apparatus having a runner gate as a movable unit, and fig. 11B is a cross-sectional angle explanatory view of a resin molding apparatus having a vent portion and a runner gate as a movable unit.

Fig. 12 is a sectional view of a resin molding apparatus for compression molding in which a vent portion is a movable unit.

Detailed Description

Preferred embodiments of a workpiece conveying apparatus, a resin molding apparatus having the workpiece conveying apparatus, and a resin molding method according to the present invention will be described in detail below with reference to the accompanying drawings. When the mold is referred to as a molding die, the mold refers to an upper die and a lower die supported by a die holder, respectively, and refers to a portion not including a die opening/closing mechanism (press device). The term "resin molding device" means a device including at least a mold and a mold opening/closing mechanism (for example, an electric motor and a pressing device such as a screw or toggle mechanism; not shown) for opening and closing the mold, and further includes a resin conveying device or a workpiece conveying device, and a workpiece carrying-out device capable of carrying out a molded workpiece, for the purpose of automation. In the case of transfer molding, it is considered to have a transfer mechanism for operating a plunger inserted into a container, a decompression mechanism for forming a decompression space in a mold after mold clamping, and the like. Next, the structure of the molding die will be mainly explained. Further, assume the case: the workpiece W is resin-molded into a circular shape having a semiconductor wafer shape on which chips are mounted, but the workpiece W is not particularly limited to a circular shape, and may be a square or a rectangle. The mold is described with an example in which the lower mold is a movable mold and the upper mold is a fixed mold, but the upper mold may be the movable mold and the lower mold may be the fixed mold, or both the upper mold and the lower mold may be the movable mold.

First, an example of a workpiece transfer apparatus 1 applied to a resin molding apparatus for transferring a workpiece and a molding resin to a molding die and for carrying out a molded workpiece and an unnecessary resin from the molding die will be described with reference to fig. 1B, 10A, and 10B.

The conveying apparatus main body 2 is provided with a work holding portion 3 for holding a work by sandwiching an outer peripheral end portion of the work at a plurality of positions of the outer peripheral end portion of the work, and a resin holding portion 4 capable of holding the molded resin R1 and the molded unnecessary resin R2, respectively. The conveying device body 2 is provided with positioning blocks 2a at a plurality of positions, and as will be described later, positioning with respect to the mold clamping surface of the mold can be achieved by positioning portions (locking blocks) provided on the mold clamping surface.

As shown in fig. 10A, the workpiece holding portion 3 is provided with openable and closable jaws 3a at four positions so as to be disposed at 90 degrees along the outer periphery of the workpiece W in order to be able to hold the circular workpiece W. In addition, although the gripping jaws are provided at four places, the number is not limited as long as stable gripping and conveyance can be ensured. A notch portion W1 for positioning is provided on the outer periphery of the circular workpiece W. The workpiece holding portion 3 holds the workpiece W by locking the positioning pin 3b to the notch portion W1 to stop and position the workpiece W.

Further, the work holding portion 3 is provided with: can move relative to the conveying device body 2 in at least one of the mutually orthogonal X-direction or Y-direction. In the present embodiment, the workpiece holding portion 3 is provided with: the linear motion mechanism having the linear motion guide mechanism built therein and the cylinder can reciprocate between a carrying-in/out position (see fig. 10A) and a delivery position (see fig. 10B) along the longitudinal direction of the conveying device main body 2. The transfer position is a position where the center of the workpiece portion of the conveying device main body 2 coincides with the center of the workpiece portion of the lower die 8. The carrying-in/out position refers to a position: when the workpiece W moves up and down as described later, the workpiece W is deviated from the transfer position to a position where the workpiece end does not contact the bridge 8e1 of the containing unit 8 e.

Further, a cleaning brush 2b is provided on the leading side in the mold entering direction of the conveying device body 2. When the cleaning brush 2b is operated, the surface of the mold can be cleaned when the workpiece conveying device 1 advances and retreats relative to the mold.

With the above configuration, the workpiece conveying device 1 holding the workpiece W and the mold resin R1 can position the conveying device main body 2 by the positioning portion provided on the mold clamping surface of the mold, and can supply the workpiece W and the mold resin R1 into the mold in a state aligned with the mold by the workpiece carrying-in operation of the workpiece conveying device 1 by moving the workpiece holding portion 3 in at least one of the X-Y directions (horizontal direction).

As shown in fig. 10A and 10B, the resin holding portion 4 is provided in the conveying device body 2 so as to be aligned with the workpiece holding portion 3. The resin holding portion 4 is provided with: the first resin holder 4a for holding the mold resin R1 supplied to the mold and the second resin holder 4b for holding the molded unnecessary resin R2 can be alternately moved to the loading/unloading position (the storing hole 8e2) of the conveyor main body 2. In the present embodiment, the first resin holding portion 4a is provided therein; a cylindrical housing portion 4a1 for holding a solid resin (sheet-like resin); and an opening/closing section 4a2 for opening and closing the bottom of the cylindrical housing section 4a 1. Further, the second resin holding portion 4b is provided with a suction pad 4b 1. The suction pad 4b1 sucks air by a suction device not shown, and sucks and holds the unnecessary resin R2 after resin molding. The waste resin R2 may be sucked by the suction cup 4b1, but may be held by a gripper mechanism.

The first resin holding portion 4a and the second resin holding portion 4b are provided with: can move to the carrying-in and carrying-out position (position corresponding to the container) of the carrying device body 2 along the direction orthogonal to the direction of entering with respect to the mold (the short side direction of the carrying device body 2: the Y direction). Further, it is also possible to provide: can move in the longitudinal direction (X direction) of the conveying device body 2. Thus, when the work loading operation (see fig. 10B) is performed, the loading operation of loading the mold resin R1 (sheet-like resin) into the mold by the first resin holder 4a can be performed, and when the work unloading operation (see fig. 10A) is performed, the operation can be switched to the unloading operation of unloading the unnecessary resin R1 (molded article return) from the mold by the second resin holder 4B.

With the above configuration, the work holding portion 3 can hold the work W before and after the forming, and the resin holding portion 4 is provided with: since the first resin holder 4a for holding the molding resin R1 supplied to the molding die and the second resin holder 4b for holding the unused resin R2 (molded product return) after molding can alternately move to the carrying in/out position (container hole 8e 2: see fig. 1A) of the conveying device main body 2, the work and the resin before and after molding can be carried in/out by the same work conveying device.

The first resin holding portion 4a can hold any one of the molding resins R1, such as a powdery resin, a granular resin, and a liquid resin, in addition to a solid resin. As a result, regardless of the type of resin used, the resin can be carried in and out together with the workpiece W by the general-purpose workpiece conveying device 1. In the case of a liquid resin, a syringe may be used.

Next, the structure of the resin molding device 5 will be described with reference to fig. 1A and 1B. Fig. 1A and 1B illustrate a resin molding apparatus 5 for transfer molding. The mold opening and closing mechanism is omitted, and the structure of the mold 6 will be mainly described.

The molding die 6 is resin-molded by sandwiching the workpiece W and the molding resin R1 carried in by the workpiece transfer device 1 between an upper die 7 (first die) and a lower die 8 (second die), and then carrying out the molded product W and the unnecessary resin R2 by the workpiece transfer device 1.

First, the structure of the upper mold 7 will be explained. As shown in fig. 1A, an upper module 7b is supported in a ring-like manner along the outer peripheral edge of the upper die base 7 a. An upper mold locking piece 7c for positioning with the lower mold 8 is provided protrudingly on the lower end surface of the upper mold 7 b. As shown in fig. 8A, upper die locking pieces 7c (convex pieces) are arranged on the center lines passing through the centers of the works W on the two opposite sides of the upper die block 7b, respectively. Further, the lock block does not necessarily have to be arranged on the center line passing through the center of the workpiece W, and it is sufficient to provide the lock block at least on each side of the upper block 7 b.

In the upper die space surrounded by the upper die block 7b, an upper die clamping portion 7d having a rectangular shape and an upper die cavity unit 7e having a circular shape are suspended and supported by the upper die base 7a via coil springs 7f, respectively (see fig. 1A and 8A). An upper cavity recess 7n is formed by an upper cavity unit 7e (cavity bottom) and an upper mold clamping portion 7d (cavity side) surrounding the upper cavity unit 7 e.

An upper die material passage 7g and an upper die runner gate 7h connected to the upper die material passage 7g are formed on a clamping surface (lower end surface) of the upper die clamping portion 7d so as to be connected to the upper die cavity recess 7 n. Further, a plurality of upper vent grooves 7i connected to the upper cavity recess 7n are formed in the upper mold clamping portion 7d on the side opposite to the upper runner gate 7h across the upper cavity recess 7 n. A closing pin 7j is incorporated in each upper vent groove 7i, and the closing pin 7j can open and close the upper vent groove 7 i. The closing pin 7j is assembled in the upper die holder 7a in a state of being biased downward via a coil spring 7 k. Thereby, the tip (lower end surface) of the closing pin 7j is supported at a position substantially flush with the groove bottom of the upper die vent groove 7 i.

Further, the upper cavity concave portion 7n and the upper mold clamping surface including the resin path connected to the upper cavity concave portion 7n are covered with a release film F, which is sucked and held by a suction hole not shown. The reason is that in order to form the surface of the semiconductor chip T mounted on the workpiece W in an exposure-type manner, it is necessary to cover the surface with the release film F sucked and held in the upper cavity recess 7 n. The release film F may be a long film that is continuous between reels in a long shape, or may be a segmented film that is cut in accordance with the size of the upper mold clamping surface, and the release film may be any of the films described above. The release film F has a thickness of about 50 μm, is heat-resistant, is easily released from the surface of the mold, and has flexibility and ductility, and for example, a single-layer film or a composite film mainly composed of PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film, polyvinylidene chloride (ビニリデン (PVDC) ポリ) or the like is recommended.

Next, the structure of the lower die 8 will be explained.

As shown in fig. 1A, a lower die block 8a is supported in a ring shape along an outer peripheral edge portion of a lower die holder, not shown. A lower die locking piece 8b (two rectangular parallelepiped blocks or one concave block in a pair) for positioning the upper die 7 is provided on the upper end surface of the lower die block 8 a. As shown in fig. 8B, recesses 8c of the lower mold lock block 8B are disposed on the center line passing through the center of the workpiece W on the opposite sides of the lower mold block 8 a. Further, the lock block does not necessarily have to be arranged on the center line passing through the center of the workpiece W, and may be arranged at any position on the side as long as the lock block is provided at least on each side of the lower block 8a, and the upper and lower mold lock blocks 7c and 8b can be combined and engaged with each other.

Therefore, the upper mold 7 and the lower mold 8 can be aligned and clamped by engaging the upper mold lock piece 7c with the recess 8c of the lower mold lock piece 8 b.

A seal 8d is annularly fitted to the holding surface of the lower block 8 a. The lower mold block 8a abuts against the clamping surface of the upper mold block 7b facing thereto, and seals the space in the mold. In the lower die block 8a, a container unit 8e (movable unit) is supported in a floating manner by a coil spring 8s so as to be biased upward with respect to the lower die base at the time of mold opening. The upper end of the containing unit 8e includes a flat mold separation surface and a bridge 8e1, and a containing hole 8e2 is formed at substantially the center of the upper end of the containing unit 8 e. The containing hole 8e2 has a cylindrical shape into which the mold resin R1 can be filled, and the plunger 8f is inserted into the containing hole 8e2 so that the plunger 8f can be lifted and lowered.

In the die space surrounded by the lower die block 8a, a work support block 8g having a circular shape is supported and fixed to the lower die base. The upper end surface of the work support block 8g is supported at a height lower than the height of the upper end surface of the surrounding lower die block 8a and lower than the plate thickness of the work W. Thus, the workpiece W can be placed on the placement recess 8h formed by the workpiece support block 8g and the lower block 8a enclosing the workpiece support block 8 g. The seating recess 8h can also achieve the positioning function for placing the workpiece W, but by vertically providing the positioning pin 8t (see fig. 8B) corresponding to the positioning V-notch provided in the workpiece W to the lower die 8, the seating portion does not necessarily have to be a recess.

As shown in fig. 7A and 7B, a bridge portion 8e1 is formed at the upper end portion of the container unit 8e, and the bridge portion 8e1 is arranged such that: the upper end of the workpiece W placed in the seating recess 8h is overlapped in an overhanging manner. The bridge 8e1 is provided at a position opposing the upper mold runner gate 7h, and the bridge 8e1 is formed in a wedge shape so as to become thinner as the thickness thereof becomes thinner from the container portion side toward the outer peripheral edge portion. Thus, the mold resin R1 can pass between the bridge 8e1, which is the upper end surface of the container unit 8e, and the upper mold runner gate 7h, and then be filled into the upper mold cavity recess 7n, and therefore, the resin does not pass through the end of the workpiece W but straddles the end of the workpiece, and thus, no resin leakage occurs. In the present embodiment, the runner and the gate groove forming the upper runner gate 7h are provided on the upper mold side, but may be provided on the bridge portion 8e1 side, or may be provided on both sides. Since the boundary between the upper mold runner gate 7h and the cavity is a gate, the cross-sectional shape is formed in an inclined shape so as to easily realize gate breaking (japanese: ゲートブレイク) described later.

As shown in fig. 8B, a plurality of chips T are arranged on the workpiece W, and the chips T are arranged up to the vicinity of the end of the circular workpiece. Since the molding region is thin and wide in area, it is necessary to ensure resin injection balance to avoid a horizontal direction gap between the chips T and a gap below the chips T from generating a region not filled with the molding resin R1. Therefore, in consideration of the filling property of the molding resin R1, it is desirable to ensure that the gate width G (see fig. 7A) on the tip side connected to the cavity (the gate on the side connected to the cavity and the runner) is as wide as possible, and therefore, the gate has an inclined shape in which the width G gradually increases from the containing portion toward the cavity. When the housing unit 8e is overlapped with the circular workpiece W in a plan view, the overhanging amount L of the bridge portion 8e1 (the overlapping length from the end portion of the housing unit 8e overlapped with the workpiece to the outer peripheral end portion of the workpiece: refer to fig. 7B) is large. Therefore, when the upper and lower molds are clamped, a resin path can be formed between the upper end surface of the container unit 8e and the upper mold runner gate 7 h.

Then, the bridge portion 8e1 of the container unit 8e is separated from the lower mold clamping surface (see fig. 1A) in the state where the mold is opened, and after the end surface of the workpiece held by the workpiece conveying device 1 is positioned in the seating recess 8h (see fig. 3B) below the bridge portion 8e1, the bridge portion 8e1 is overlapped with the workpiece so as to overlap the outer peripheral end portion of the workpiece, and the mold 6 is made to clamp the workpiece W. In this way, the workpiece W is positioned not only by the die but also by the workpiece conveying apparatus 1, because, particularly when the workpiece W is circular, even if the workpiece end is pushed toward the container portion side by using the moving means or the like as in the edge abutting mechanism applied to the conventional rectangular substrate, when the workpiece W is large, the amount of movement (the overhanging amount L of the bridge portion 8e 1) is large, and misalignment and rotation of the workpiece W are likely to occur. Further, the lower die 8 may be provided with positioning pins 8t corresponding to V-notches provided in the workpiece W for positioning, thereby achieving both rotation stopping and positioning (see fig. 8B).

As shown in fig. 1A, the workpiece support block 8g is provided with a plurality of suction holes 8i at a plurality of positions, and the suction holes 8i are used for sucking and holding the workpiece W placed on the placement recess 8 h. The suction hole 8i is connected to a suction device not shown. Further, a plurality of movable support pins 8j are provided to penetrate the workpiece support block 8 g. The support pin 8j is provided with: can move between a position where the pin tip end portion is projected from the bottom of the seating recess portion 8h and a position where the pin tip end portion is retracted into the work support block 8 g. When transferring the workpiece W held by the workpiece conveying device 1 to the seating recess 8h, the pin tip portions of the plurality of support pins 8j are protruded from the seating recess 8h in advance, and the workpiece W is transferred to the support pins 8 j. Thus, when the workpiece W is positioned to the mold, the workpiece W is not damaged by sliding against the mold surface. Further, the support pin 8j may be omitted.

Further, a suction hole 8k is provided in the lower block 8A at a position radially inward of the seal 8d and facing the upper overflow chamber 7r (see fig. 8A and 8B). The suction holes 8k are connected to a suction device not shown. In a state where the mold 6 is caused to clamp the workpiece W, air is sucked from the suction holes 8k, and resin molding is performed while air remaining in the upper cavity concave portion 7n is discharged through the upper mold vent groove 7i, thereby preventing generation of voids.

With the above configuration, when the workpiece W held by the workpiece conveying device 1 is conveyed to the mold 6, the workpiece W is positioned by sliding the workpiece to a position where the end face of the workpiece overlaps the bridge portion 8e1 of the containing unit 8e, and the workpiece W is transferred to the lower mold 8 (the placing recess 8h), so that the workpiece W can be accurately positioned to the mold 6 regardless of the shape of the workpiece W, and the resin does not leak to the end portion of the workpiece.

Here, an operation example of carrying in and out a workpiece by the workpiece conveying device 1 and an operation example of resin molding by the resin molding device 5 will be described with reference to fig. 1 to 6.

Fig. 1A shows the molding die 6 in an open state. A release film F (a long film or a segmented film) is supplied to the nip surface of the upper die 7. In the lower mold 8, the containing unit 8e is biased upward so that the bridge 8e1 is separated from the lower mold block 8 a.

Fig. 1B shows a process of carrying the workpiece W and the sheet-like resin R1 into the mold 6 in an open state by the workpiece carrying device 1. The outer peripheral end of the workpiece W is held by the jaws 3a of the workpiece holding portion 3, and the sheet-like resin R1 is held by the resin holding portion 4 (first resin holding portion 4 a). The positioning block 2a of the conveying device body 2 is aligned with the recess 8c of the lower mold lock block 8 b. Since the workpiece holding portion 3 is at the carrying-in/out position, the workpiece W held by the workpiece holding portion 3 is held at a position deviated from the seating recess 8 h. Further, the workpiece W and the sheet-like resin R1 may be carried in by separate conveying devices, not by the same conveying device.

Next, as shown in fig. 2A, the workpiece conveying device 1 is lowered toward the clamping surface of the lower mold 8, and the positioning block 2A of the conveying device body 2 is fitted into the concave portion 8c of the lower mold lock block 8b so as to be fitted into the concave and convex portions, thereby positioning the conveying device body 2 with respect to the lower mold 8. Thus, the cylindrical housing portion 4a1 of the resin holding portion 4 is positioned directly above the containing hole 8e2 and aligned concentrically with the containing hole 8e 2.

As shown in fig. 2B, the workpiece holding portion 3 holding the workpiece W moves from the carrying-in/out position to the delivery position. At this time, the workpiece W is horizontally moved to a position overlapping the bridge 8e1 below the bridge 8e1 of the container unit 8 e. Thereby, the outer peripheral end portion of the workpiece W is aligned with the seating recess 8 h.

Further, the containing hole 8e2 of the containing unit 8e is filled with the sheet-like resin R1 from the resin holding portion 4. Specifically, the openable/closable portion 4a2 that closes the bottom of the cylindrical housing portion 4a1 is opened, and the sheet-like resin R1 is dropped into the containing hole 8e 2.

As shown in fig. 3A, the workpiece W is delivered to the support pin 8j by projecting the distal end portion of the support pin 8j inserted into the workpiece support block 8g from the bottom of the seating recess 8h and releasing the jaw 3A of the workpiece holding portion 3.

Next, as shown in fig. 3B, the workpiece conveying device 1 is raised with respect to the lower mold 8 and then retreated outside the mold 6. Then, the support pin 8j is retracted into the workpiece support block 8g, and the workpiece W is accommodated in the seating recess 8h and sucked and held by the suction hole 8 i. The release film F is sucked and held on the nip surface of the upper mold 7.

As shown in fig. 4A, for example, the lower mold 8 is raised relative to the upper mold 7 to close the mold 6. When the suction from the suction hole 8k is started and the upper block 7b and the lower block 8a sandwich the seal 8d, the upper vent groove 7i functions to form a decompression space in the upper cavity concave portion 7 n. The workpiece W is sandwiched by the upper mold clamping portion 7d, and the surface of the chip T is in contact with the upper cavity unit 7e via the release film F. The plunger 8f is raised, and the molten molding resin R1 in the containing hole 8e2 is filled into the upper cavity recess 7n through the upper sprue 7g and the upper sprue gate 7 h. When the mold is closed again when the resin reaches the vicinity of the vent portion, the tip end of the closing pin 7j protrudes relative to the upper mold clamping portion 7d to close the upper mold vent groove 7i, thereby blocking the flow of the resin and the air. The molding resin R1 in the cavity concave portion 7n, which has been prevented from flowing, is heated and pressurized, and pressure holding is performed in this state, so that the resin is cured.

When the curing of the molding resin is completed, the molding die 6 is opened as shown in fig. 4B. The containing unit 8e is moved by the urging force of the coil spring 8s (see fig. 8B) so that the bridge 8e1 is separated from the lower block 8 a. The holding unit 8e is not limited to the upward movement by the coil spring 8s, and may be moved upward by a cylinder or a motor that can be driven independently. The workpiece W is still held by suction in the seating recess 8 h. Thereby, the unnecessary resin R2 (molded article return) on the containing unit 8e can be separated and lifted by being gate-disconnected from the molded article (package portion). Since the release film F is adsorbed and held on the sandwiching surface of the upper mold 7, it is easily separated from the resin. Further, since the height position of the plunger 8f is not changed, the unnecessary resin R2 can be detached from the plunger tip with the upward movement of the containing unit 8 e. Further, the plunger 8f may be moved upward to push the unnecessary resin R2 on the container unit 8e downward and upward, thereby separating the unnecessary resin. The above-described upward movement of the plunger is preferably performed when the second resin holding portion 4b of the workpiece conveying apparatus 1 is disposed above the unnecessary resin R2, and the unnecessary resin R2 can be prevented from splashing.

After the mold 6 is opened, the work carrier 1 enters the mold. Specifically, the conveyance device main body 2 enters a position where it can be aligned with the lower mold 8. The workpiece holding portion 3 is located at the workpiece transfer position and in a state where the jaws 3a are opened. As shown in fig. 10A, the resin holding portion 4 is moved to a position where the second resin holding portion 4b faces the containing hole 8e 2.

As shown in fig. 5A, the support pin 8j is raised relative to the workpiece support block 8g, and the workpiece W is lifted from the seating recess 8h while being supported at the pin tip. In this state, the workpiece conveying apparatus 1 is lowered, the outer peripheral end portion of the workpiece W is held by the chuck 3a of the workpiece holding portion 3, and the unnecessary resin R2 (returned molded product) is sucked and held by the suction pad 4b1 of the second resin holding portion 4 b. At this time, the plunger 8f may be raised to push the unnecessary resin R2 down from the upper surface of the containing unit 8e, thereby positively urging the unnecessary resin to be removed. When the workpiece conveying apparatus 1 is raised in this state, the outer peripheral end portion of the workpiece W interferes with the bridge portion 8e1 of the containing unit 8 e. Thus, the support pin 8j is lowered, and the workpiece holding section 3 holding the workpiece W is moved from the delivery position shown in fig. 5A to the carry-in/out position separated from the housing unit 8e shown in fig. 5B. Thereby, the outer peripheral end portion of the workpiece W and the bridge portion 8e1 of the container unit 8e do not overlap in the height direction.

As shown in fig. 6, in a state where the workpiece holding section 3 holds the workpiece W and the second resin holding section 4b (the suction pad 4b1) holds the unnecessary resin R2 (the molded article return), the workpiece conveying apparatus 1 is raised and retreated outside the mold 6. At this time, the cleaning brush 2b provided in the conveying apparatus body 2 is lowered to the lower mold clamping surface, and the brush portion is rotated to wipe the lower mold surface and suck air, thereby retracting while removing the resin residue. The release film F sucked and held on the nip surface of the upper mold 7 is released from the suction, peeled off, and replaced with a new release film F. In the case of a long release film, the film is conveyed in a transverse direction and replaced with a new one.

Then, the workpiece W and the unnecessary resin R2 carried out of the mold 6 by the workpiece conveying device 1 are sorted and collected.

With the above-described resin molding method, the workpiece W and the molded resin R1 can be held by the workpiece transfer device 1 and carried into the mold 6, and the molded workpiece W and the unnecessary resin R2 can be carried out of the mold 6 in a state separated from each other, so that the transfer device configuration can be simplified.

Further, when the workpiece conveying device 1 is carried into the mold 6, the workpiece W is slid from the carrying-in and carrying-out position to the delivery position corresponding to the placement recess 8h, the workpiece W is slid to the position overlapping the bridge portion 8e1 of the containing unit 8e in the height direction, and in this state, the workpiece W is delivered to the lower mold 8 (placement recess 8h), and therefore, not only a rectangular workpiece but also a circular workpiece can be accurately positioned to the mold 6 regardless of the shape of the workpiece W, and the resin does not leak to the end portion of the workpiece.

In the above-described embodiment, the workpiece W is assumed to be a circular semiconductor wafer, but the workpiece W is not necessarily limited to a circular shape, and may be an elongated substrate or a large-sized (square or rectangular) substrate. Further, the containing portion of the lower die 8 is provided at one position for the containing unit, but a plurality of containing portions may be arranged in one containing unit, or a plurality of rows of containing portions may be provided. Although only one containing unit 8e is illustrated, a plurality of containing units 8e may be provided for the workpiece W.

Further, although the workpiece holding unit 3 of the workpiece conveying apparatus 1 is movable in the longitudinal direction of the conveying apparatus main body 2 between the carrying-in/out position and the delivery position, it may be provided as shown in fig. 9: can move in the X-Y direction in accordance with the arrangement of the containing unit 8e, in accordance with the arrangement of the containing hole 8e 2. Further, the work holding portion 3 may be moved obliquely without being limited to the X-Y direction, as long as it can be moved in the horizontal direction, and any method may be selected as long as it can avoid the work W from interfering with the loading unit 8e due to vertical movement when the work W is set in the die.

Fig. 11A is a cross-sectional angle explanatory diagram of a resin molding apparatus of another embodiment in which, instead of the containing unit 8e as a movable unit before, a movable runner gate unit 8n (movable unit) is provided as a movable unit and a containing portion is fixed. The same members as those of the above embodiment are denoted by the same reference numerals and will be described, and the configurations of the workpiece conveying apparatus 1 and the upper die 7 are the same as those of the above embodiment, and therefore, the configuration of the lower die 8 will be mainly described.

A cylindrical and fixed housing portion 8m is assembled to a lower die block 8a of the lower die 8, and a plunger 8f is inserted into the housing portion 8 m. Further, a lower mold runner gate unit 8n that can be raised and lowered is provided between the container portion 8m and the placement recess portion 8 h. The lower mold runner gate unit 8n is connected to and supported by the upper end of the lift rod 8p penetrating the lower module 8 a. The lower runner gate unit 8n is biased upward by a coil spring or the like, not shown, when the mold is opened.

A resin path is formed between the upper surface of the lower mold runner gate unit 8n and the upper mold runner 7g and the upper mold runner gate 7h opposed thereto. In particular, a bridge portion 8n1 is formed on a surface of the lower mold runner gate unit 8n facing the upper mold runner gate 7h, and the bridge portion 8n1 is arranged to overlap an upper end portion of the workpiece W placed in the seating recess 8h in a cantilevered manner. The bridge 8n1 has a gradually reduced thickness toward the outer peripheral end connected to the upper cavity recess 7n and toward the outer peripheral end connected to the container portion 8m, and both ends of the bridge 8n1 are formed in a wedge shape.

Fig. 11B is a cross-sectional view illustrating the resin molding apparatus further including, as a movable unit, a lower die bridge vent unit 8q connected to the upper die cavity recess and the upper die vent groove in addition to fig. 11A. A cylindrical and fixed housing portion 8m is assembled to a lower die block 8a of the lower die 8, and a plunger 8f is inserted into the housing portion 8 m. A lower mold runner gate unit 8n that can be raised and lowered is provided between the receiving portion 8m and the receiving recess 8h of the lower mold block 8 a. The lower mold runner gate unit 8n is connected to and supported by the upper end of the lift rod 8p penetrating the lower module 8 a. When the mold is opened, the lower mold runner gate unit 8n is biased upward by a coil spring or the like, not shown.

An upper bridge vent groove 7m connected to the upper cavity recess 7n and the upper vent groove 7i is formed in the upper mold clamping portion 7 d. A lower bridge ventilation unit 8q (movable unit) which can be raised and lowered is provided at a position of the lower die block 8a facing the upper bridge ventilation groove 7 m. The lower bridge ventilation unit 8q is coupled to and supported by the upper end of a lift rod 8p inserted through the lower module 8 a. The lower bridge ventilation unit 8q is biased upward by a coil spring or the like, not shown, when the mold is opened. A vent path is formed between the upper surface of the lower mold bridge vent unit 8q and the upper mold bridge vent groove 7m opposed thereto. In particular, a bridge 8q1 is formed in the lower die bridge ventilation unit 8q, and the bridge 8q1 is arranged to overlap an upper end portion of the workpiece W placed in the seating recess 8h in a cantilevered manner. The bridge 8q1 has a gradually reduced plate thickness toward the outer peripheral end connected to the upper cavity recess 7n and toward the end closer to the upper overflow cavity 7r, and both ends of the bridge 8q1 are formed in a wedge shape.

As described above, in the configuration in which the lower mold runner gate unit 8n and the lower mold bridge ventilation unit 8q are disposed on both sides of the seating recess 8h, the workpiece holding portion 3 of the workpiece conveying device 1 slides in the short side direction of the conveying device body 2 (the direction perpendicular to the paper surface on which fig. 11B is located), and positioning of the workpiece W and the seating recess 8h and transfer of the workpiece W are performed.

The resin molding apparatus 5 described above uses the mold 6 for transfer molding, but may be a resin molding apparatus 5 having a mold 6 for compression molding.

The resin molding apparatus 5 shown in fig. 12 has the following configuration: the structure of the lower die 8 and the upper die 7 in the structure of the molding die 6 in fig. 11B are interchanged, and the workpiece carrier device 1 is turned upside down. That is, the structure of the upper mold 7 'in fig. 12 is a structure obtained by reversing the structure of the lower mold 8 in fig. 11B, and is denoted by a symbol'. The structure of the lower die 8 ' is different from that described above in that the structure enclosed by the lower die base 8a ' and the lower die block 8b ' is different from that described above. Next, a description will be given of different configurations.

In the lower die 8 ', a lower die block 8b ' is supported in a ring shape along an outer peripheral edge portion of the lower die base 8a '. A lower die lock block (not shown) for positioning the upper die 7 'is provided to protrude from the upper end surface of the lower die block 8 b'.

In the lower die space surrounded by the lower die block 8b ', the annular lower die clamping portion 8 d' is supported by the lower die holder 8a 'in a floating manner by the coil spring 8 f'. The lower die cavity unit 8e ' is surrounded by the lower die clamping portion 8d ' and is supported and fixed to the lower die base 8a '. A lower cavity recess 8r is formed by a lower cavity unit 8e ' (cavity bottom) and a lower clamping portion 8d ' (cavity side) surrounding the lower cavity unit 8e '.

A lower mold bridge vent groove 8m 'connected to the lower mold cavity recess 8r is cut in the clamping surface (upper end surface) of the lower mold clamping portion 8 d'. A plurality of lower die vent grooves 8i 'are also connected to the lower die bridge vent groove 8 m'. A closing pin 8j ' is incorporated in each lower vent groove 8i ', and the closing pin 8j ' can open and close the lower vent groove 8 i. The closing pin 8j ' is assembled in the lower die base 8a ' in a state of being biased upward by the coil spring 8k '. Thereby, the tip (upper end surface) of the closing pin 8j 'is supported at a position substantially flush with the groove bottom of the lower mold vent groove 8 i'. Preferably, the release film F is sucked and held on the lower mold clamping surface including the lower mold cavity recess 8 r.

The workpiece conveying apparatus 1 enters the mold 6 (in the left-right direction on the paper of fig. 12) with the workpiece W held by the workpiece holding portion 3, and sucks and holds the workpiece W in the seating recess 7h 'of the upper mold 7'. The workpiece holding portion 3 slides in the short side direction of the conveying device body 2 (the direction perpendicular to the paper surface on which fig. 12 is placed), and carries the workpiece in the direction perpendicular to the paper surface on which fig. 12 is placed until the upper bridge ventilation units 7 q' overlap the outer peripheral end portions of the workpiece W, respectively, in an overhanging manner. The workpiece holding portion 3 may hold the workpiece W by the chuck 3a, or may hold the workpiece W by suction in the seating recess 7h 'while pressing the workpiece W against the seating recess 7 h'. Although the workpiece conveying apparatus 1 may not have the cleaning mechanism, it is preferable to have the cleaning mechanism because resin residue may adhere to the surface of the upper bridge ventilation unit 7 q'.

Further, the mold resin R1 (for example, a granular resin, a powdery resin, a liquid resin, or the like) may be supplied to the lower cavity concave portion 8R by the work conveying apparatus 1, or only the mold resin R1 may be conveyed by a relatively independent resin conveying and supplying apparatus, and only the molded unnecessary resin R2 may be taken out by a relatively independent resin conveying and discharging apparatus. In the compression molding, the work W and the resin are taken out in an integrated state without causing the unnecessary resin R2 after molding to flow into the relief cavity. Further, although the lower cavity compression molding die is described as an example, in the case of the upper cavity compression molding die, the resin R1 may be loaded on the workpiece, and then the resin and the workpiece may be simultaneously carried into the die by the workpiece carrying device. Further, the mold may be a mold in which an upper cavity recess and a lower cavity recess are formed.

Further, two types of resins (R1, R2) before and after molding may be supplied and taken out independently from the workpiece conveying device 1 by one resin conveying device. Further, although the workpiece conveying apparatus 1 performs supply and take-out by the same workpiece conveying apparatus, supply and take-out may be performed by separate workpiece conveying apparatuses. In any case, the work conveying apparatus of the present invention is effective when the work is supplied to and carried out from the same surface of the mold in carrying in and out the work with respect to the mold surface on the side where the movable unit of the mold is present, and is effective when the mold surfaces to which the resin is supplied and carried out are the same surface of the mold.

Claims

1. A workpiece conveying device for performing at least one of an operation of conveying a workpiece into a molding die and an operation of conveying a molded workpiece out of the molding die,

the work conveying apparatus includes:

a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die clamping surface of the molding die; and

a workpiece holding section provided in the conveying apparatus main body and holding the workpiece,

the work holding portion is provided with: the work can be moved in a horizontal direction with respect to the conveying device main body positioned on the die clamping surface while holding the work.

2. A workpiece conveying device for conveying a workpiece into a molding die and conveying a formed workpiece out of the molding die,

the work conveying apparatus includes:

3. A resin carrying device for carrying a molding resin into a molding die and carrying a molded unnecessary resin out of the molding die,

the resin conveying device comprises:

a resin holding portion provided in the conveying device main body and capable of holding the molding resin supplied to the molding die and the unnecessary resin after molding, respectively,

the resin holding portion is provided with: is movable in a horizontal direction with respect to the carrying device body which has been positioned on the mold clamping surface.

4. A work conveying apparatus for conveying a work and a molding resin into a molding die and for conveying a molded work and an unnecessary resin out of the molding die,

the work conveying apparatus includes:

a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die clamping surface of the molding die;

a workpiece holding unit provided in the conveying apparatus main body and configured to hold the workpiece; and

the resin holding portion is provided with: the apparatus includes a first resin holding portion for holding the mold resin supplied to the mold, and a second resin holding portion for holding the molded resin, wherein the first resin holding portion and the second resin holding portion are alternately movable to a carrying-in/out position of the carrier main body.

5. The workpiece handling device of claim 4,

the first and second resin holding portions are provided as follows: can move in the horizontal direction with respect to the carrying device main body in the direction in which the molding die enters.

6. The workpiece handling device of claim 4 or 5,

the first resin holding portion can hold a molding resin in any form of a sheet resin, a powdery resin, a granular resin, and a liquid resin, and the second resin holding portion holds a molded product preform by suction.

7. A resin molding apparatus in which a molded resin is molded while clamping a workpiece and the molded resin carried in by the workpiece carrying apparatus according to any one of claims 4 to 6 by a first mold and a second mold of the molding mold, and the molded workpiece and an unnecessary resin are carried out by the workpiece carrying apparatus, characterized in that,

the resin molding device includes a movable unit having a bridge portion arranged to overlap an end portion of the workpiece so as to form an air moving passage or a molding resin moving passage that is continuous with a cavity concave portion formed in either one of the first mold and the second mold, and supported by: when the mold is opened, the movable unit is moved upward so as to be separated from the mold clamping surface,

when the mold is opened, the movable unit is separated from the mold clamping surface, the workpiece holding portion is moved to a set position where the end portion of the workpiece held by the workpiece conveying device is overlapped with the bridging portion to transfer the workpiece, and then the movable unit is pressed down by a mold clamping operation to clamp and clamp the end portion of the workpiece by the bridging portion.

8. The resin molding apparatus according to claim 7,

the movable unit is: and a housing unit, a runner gate unit, and a ventilation unit configured to connect the bridge to the cavity recess.

9. The resin molding apparatus according to claim 7 or 8,

10. A resin molding method in which a workpiece and a molding resin are carried into a molding die having a first die and a second die by a workpiece carrying device, and the workpiece and the molding resin are clamped to each other to perform resin molding, and the molded workpiece and an unnecessary resin are carried out of the molding die by the workpiece carrying device, characterized in that,

the resin molding method comprises the following steps:

aligning a carrier body with a mold clamping surface of the first mold of the mold molds that open the molds;

horizontally moving a workpiece holding section, which is provided in the conveying apparatus main body so as to be movable and holds a workpiece, to a set position where a movable unit is overlapped with an end of the workpiece, wherein the movable unit is supported by: when the mold is opened, the movable unit moves upwards and leaves the first mold clamping surface;

delivering the work and the molded resin from the work holding portion to the first mold clamping surface;

clamping the molding die in a state where the movable unit is overlapped with the end of the workpiece, and heating and curing the molding resin filled in the cavity concave portion;

when the first mold and the second mold are opened, the movable unit is separated from the mold clamping surface of the first mold, and the molded workpiece is separated from the unnecessary resin;

holding the work by the work conveying device and adsorbing and holding the unnecessary resin; and

the molded article and the unnecessary resin are carried out from the molding die in a state where the molded article and the unnecessary resin are held by the work carrier.