TW202410218A - Resin sealing device and resin sealing method - Google Patents

Abstract

The present invention provides a resin sealing device and a resin sealing method that can remove a gate portion with higher accuracy and can achieve miniaturization and high-density mounting of molded products. The resin sealing method of the present invention includes: a resin sealing step, in which the ingot-shaped resin R is put into the tank 240 and pressed by the plunger 242; The workpiece W is sealed with the resin R; and in the gating step, the molded product Wp after the resin sealing step is taken out from the sealing mold 202, and the unnecessary resin portion in the molded product Wp is removed. In the gating step, After performing the runner disconnection step of removing the unnecessary resin portions formed at the positions of the reject pool 246 and the runner 247 , that is, the reject pool portion Rc and the runner portion Rr, the runner 247 and the mold cavity are separated. The gate cutting step is a gate cutting step in which the unnecessary resin portion at the position of the gate 248 between 208 is removed, that is, the gate portion Rg.

Description

Resin sealing device and resin sealing method

The present invention relates to a resin sealing device and a resin sealing method.

As an example of a resin sealing device and a resin sealing method that seals a workpiece with electronic components mounted on a base material using a sealing resin (hereinafter, sometimes simply referred to as "resin") and processes it into a molded product, transfer injection is known. Forming method.

The transfer molding method is a technique in which a tank is provided to supply a predetermined amount of resin to a pair of sealing areas (cavities) provided in a sealing mold composed of an upper mold and a lower mold, workpieces are arranged at positions corresponding to the respective sealing areas, and resin sealing is performed by clamping the upper mold and the lower mold and injecting the resin from the tank into the cavity. [Prior art literature] [Patent literature]

[Patent Document 1] Japanese Patent Application Publication No. 2012-231030 [Patent Document 2] Japanese Patent Application Laid-Open No. 3-184351

[Problems to be solved by the invention] In the previous transfer molding resin sealing method, in the sprue step of removing the unnecessary resin part in the resin-sealed molded product, a structure is generally adopted in which the unnecessary resin part is removed at once for each molded product. As an example, there is a known method of removing the unnecessary resin part by rotating a predetermined amount around the sprue of the molded product (see patent document 1: Japanese Patent Laid-Open No. 2012-231030), and as another example, there is a known method of forming a contact part at a predetermined position during resin sealing and removing the contact part by pressing the contact part with a pin (see patent document 2: Japanese Patent Laid-Open No. 3-184351).

Here, if the "molded product" is a case where a frame (a workpiece in which a plurality of electronic components are mounted in a matrix on a continuous substrate of a predetermined shape) is sealed with resin, then in consideration of the size of the frame (vertical dimensions, lateral dimensions), the frame temperature during the sprue step, and positioning accuracy, it is necessary to ensure a predetermined gap (margin dimension) for the product portion and remove the unnecessary resin portion. Therefore, in the previous sprue step, there is a limit to reducing the unnecessary resin portion (sprue residue) (hereinafter sometimes referred to as "sprue portion") formed at the position of the sprue adjacent to the cavity for folding.

Against this background, in recent years, products have been further miniaturized and highly precise (high-density mounting), and gate portions have been required to be removed with higher precision (that is, to further reduce the residual size). However, the gate portion formed in the resin sealing step causes warping of the frame, and this warping becomes a factor that prevents the gate portion from being removed with high accuracy. [Means to solve the problem]

The present invention is made in view of the above situation, and its purpose is to provide a resin sealing device and a resin sealing method that can remove the nozzle part with higher precision and realize the miniaturization and high-density mounting of the molded product.

The present invention solves the above-mentioned problem by the following solution described as one embodiment.

The resin sealing method of the present invention is a resin sealing method for processing a molded product by sealing a workpiece with a resin using a sealing mold including an upper mold and a lower mold, and the necessary conditions thereof are as follows: a resin sealing step, wherein the resin in tablet form is put into a tank arranged in the sealing mold and pressed by a plunger, and is pressed from a pick pool respectively arranged in the sealing mold to a mold cavity through a gutter, and the workpiece is sealed with the resin; and a guttering step, wherein the resin is pressed by a plunger, and ... The molded product after the resin sealing step is taken out from the sealing mold, and the unnecessary resin portion in the molded product is removed. In the gutter punching step, after the gutter breaking step of removing the unnecessary resin portion formed at the positions of the pick pool and the gutter, namely the pick pool portion and the gutter portion, is implemented, the gutter cutting step of removing the unnecessary resin portion formed at the position of the gutter between the gutter and the mold cavity, namely the gutter portion, is implemented.

According to this, since the material removal pool and the gutter can be removed in the previous step, the gutter can be removed in the subsequent step while the warp of the frame is eliminated (reduced). Therefore, the gutter can be removed with high precision, that is, the residual size can be reduced, so that a product with higher precision than before can be formed.

In addition, it is preferred that the gate cutting step includes a step of removing the gate portion while sequentially conveying the molded product in a state where the gate portion has been removed in the gate cutting step at a prescribed conveying distance. For example, the prescribed conveying distance is set to be the center distance between a plurality of groups of the cans and the reject pools arranged side by side in pairs in the upper and lower parts of the sealing mold. Accordingly, the gate cutting step can be performed in block units within the frame. Therefore, it is less susceptible to the influence of warping or the like generated in the frame due to heat during resin sealing, and therefore the gate portion can be removed with further high precision, that is, the residual size of the gate portion can be further reduced.

In addition, it is preferred that the guillotine cutting step includes a step of inserting a guide pin into a guide hole pre-formed in the base material of the workpiece to perform positioning and to transport the molded product. In the previous resin sealing method, positioning is generally performed by making the guide abut against the outer periphery of the molded product. Therefore, it is easily affected by the warp etc. generated in the molded product, and it is difficult to remove the guillotine portion with high precision. In contrast, according to the structure, the guide pin can be inserted into the guide hole pre-formed in the base material of the workpiece for positioning, so the positioning accuracy is significantly improved, thereby enabling the guillotine portion to be removed with high precision.

In addition, the resin sealing device of the present invention is a resin sealing device that uses a sealing mold including an upper mold and a lower mold to seal a workpiece with resin and process it into a molded product. A necessary condition for the resin sealing device is to include a tank disposed on the lower part. A mold for inputting the ingot-shaped resin; a picking pool provided on the upper mold to push the resin; a runner and a mold cavity provided on at least one of the upper mold and the lower mold , and press-feeds the resin from the reject pool; and a gating mechanism that removes unnecessary resin portions from the molded product sealed by the resin, the gating mechanism having: a runner break A punch is opened to remove the unnecessary resin portion formed at the position of the picking pool and the runner, that is, the picking pool portion and the runner portion; and a gate cutting punch is used to remove the picking The molded article in the state of the hopper part and the runner part has the gate part which is the unnecessary resin part formed at the position of the gate between the runner and the cavity removed.

In addition, it is preferred that the sealing mold has a plurality of upper and lower pairs of the cans and the pick pools arranged side by side, and the guillotine cutting punch has a punch blade, and the punch blade is formed into a shape that removes the guillotine portion formed corresponding to a group of the cans and the pick pool at one time. Accordingly, the guillotine cutting step can be performed with the block unit within the frame, so that the guillotine cutting punch can be miniaturized, and the guillotine mechanism can be miniaturized. [Effect of the invention]

According to the present invention, the nozzle portion can be removed with higher precision compared to the previous method, thereby achieving miniaturization and high-density mounting of the molded product, i.e., the finished product.

(Overall structure) Below, the embodiment of the present invention is described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of a resin seal device 1 of the embodiment of the present invention. Furthermore, for the convenience of explanation, the front and rear, left and right, and up and down directions of the resin seal device 1 are sometimes indicated by arrows in the figure. In addition, in all the figures used to illustrate each embodiment, the same symbols are sometimes marked for components with the same function, and their repeated descriptions are omitted.

The resin sealing device 1 of the present embodiment is a device for performing resin sealing on a workpiece (molded product) W using a sealing mold 202 including an upper mold 204 and a lower mold 206. Hereinafter, as the resin sealing device 1, a resin sealing device using a transfer molding method is cited as an example for explanation, wherein the resin sealing device holds the workpiece W using the lower mold 206, covers a mold cavity 208 (including a portion of the mold surface 204a) provided in the upper mold 204 in a corresponding configuration with a release film (hereinafter, sometimes referred to as a "film") Fm, performs a clamping action between the upper mold 204 (mold surface 204a) and the lower mold 206 (mold surface 206a), and seals the workpiece W with a resin R. Furthermore, in this embodiment, the following structure is cited as an example for explanation, that is, two cavities 208 are provided in one upper mold 204, and two workpieces W (for example, the long strip workpieces illustrated by the frame F) are arranged in one lower mold 206 and resin-sealed together to obtain a molded product Wp. However, it is not limited to this, and multiple sets of the above structures can also be arranged side by side (not shown). The film Fm is also not necessary, and the cavity 208 can also be provided in either or both of the upper mold 204 and the lower mold 206.

First, the workpiece W as a forming object includes the following structure: one or more electronic components Wb are mounted on a substrate Wa in a prescribed configuration. Examples of general substrates Wa include resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers, etc. formed into rectangular or circular plates, and examples of electronic components Wb include semiconductor chips, microelectromechanical systems (MEMS) chips, passive components, heat sinks, conductive components, spacers, etc. In addition, as examples of methods for mounting electronic components Wb on substrate Wa, there are mounting methods using wire bonding packaging, flip chip packaging, etc. In this embodiment, as a workpiece W, a frame F in which multiple electronic components Wb are mounted in a matrix on a continuous substrate Wa of a prescribed shape is cited as an example for explanation. However, it is not limited to this structure.

On the other hand, as an example of the resin R, a tablet-shaped (for example, a cylindrical-shaped) thermosetting resin (for example, an epoxy resin containing a filler, etc.) can be used. In addition, the resin R is not limited to the above-mentioned state, and may have a shape other than a cylindrical shape, and may be a resin other than an epoxy thermosetting resin.

In addition, as an example of the film Fm, a film material excellent in heat resistance, peelability, flexibility, and stretchability, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (Ethylene), can be preferably used. -Tetrafluoroethylene (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyethylene Vinylidene chloride, etc. In this embodiment, a roll-shaped film can be used as the film Fm. Furthermore, as another example, a structure using a long film (not shown) may be used.

Next, the outline of the resin sealing device 1 of this embodiment will be described. As shown in FIG. 1 , the resin sealing device 1 includes the following components as its main components: a supply unit 100A, which mainly supplies a workpiece W to be resin sealed and a resin R; and a pressing unit 100B, which mainly performs resin sealing and processing of the workpiece W. It is the molded product Wp; and the storage unit 100C mainly stores the resin-sealed molded product Wp.

In addition, the resin sealing device 1 includes a conveying mechanism 100D, which moves between the units to convey the workpiece W, the resin R, and the molded product Wp. As an example, the conveying mechanism 100D includes: an inloader 122, which carries the workpiece W and the resin R into the pressing unit 100B; an outloader 124, which carries the molded product Wp out of the pressing unit 100B; and a guide rail 126, which is shared by the inloader 122 and the outloader 124. Furthermore, the conveying mechanism 100D is not limited to the above structure, and can also be appropriately set to a structure that uses a known picker, etc. (not shown). In addition, it is also possible to replace the structure including the loader with a structure including a multi-joint robot (not shown).

Here, the loader 122 serves to receive the workpiece W and the resin R in the supply unit 100A and transport them to the pressing unit 100B. As a structural example of the loader 122, there are provided two rows of workpiece holding parts 122A and 122B that can hold one workpiece W in parallel in the left-right direction. In addition, a resin holding portion 122C is provided at a position between the two rows of workpiece holding portions 122A and 122B. The resin holding portion 122C can hold a plurality of resin holding portions 122C in the front-rear direction (for example, four in the case of Example, but is not limited to this, or may be a singular) resin R. In addition, for the workpiece holding part 122A, the workpiece holding part 122B, and the resin holding part 122C, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole communicating with a suction device for suction) may be used. structure, etc.) (not shown).

The loader 122 of the present embodiment is configured to move in the left-right direction and the front-back direction, carry the workpiece W and the resin R into the sealing mold 202, and place them at a predetermined position of the lower mold 206. However, the present invention is not limited thereto, and may be configured to include a loader that moves in the left-right direction to carry the workpieces between the units and a loader that moves in the front-back direction to carry the workpieces into the sealing mold 202 (not shown).

In addition, the unloader 124 plays the role of receiving the molded product Wp (including the unresin-free parts such as the pick-out pool and the gutter) in the pressing unit 100B and transporting it to the storage unit 100C. As a structural example of the unloader 124, a molded product holding part 124A capable of holding the molded product Wp (in this embodiment, including the unresin-free parts such as the pick-out pool and the gutter, through which the two frames F are connected) is provided. Furthermore, with respect to the molded product holding part 124A, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.

The unloader 124 of this embodiment is configured to move in the left-right direction and the front-rear direction, carry out the molded product Wp outside the sealing mold 202, and place it on the molded product table 114. However, the present invention is not limited to this, and a structure (not shown) may be provided that separately includes a loader that moves in the front-rear direction to carry out the self-sealing mold 202 and a loader that moves in the left-right direction to carry out inter-unit transportation. Transporting loader.

Furthermore, the resin sealing device 1 can change the overall structural form by changing the structure of the unit. For example, the structure shown in FIG. 1 is an example of configuring two pressing units 100B, but it can also be configured as a structure with only one pressing unit 100B or a structure with more than three pressing units 100B. In addition, it can also be configured as a structure with additional units (not shown).

(Supply unit) Next, the supply unit 100A included in the resin sealing device 1 is described.

As an example, the supply unit 100A includes a work stocker 102 for accommodating the workpiece W and a workpiece table 104 on which the workpiece W is placed. In addition, as the workpiece storage 102, a well-known stack magazine, a slit magazine, etc. can be used, and a plurality of workpieces W can be stored together. With the above structure, a known propeller or the like (not shown) is used to take out the workpiece W from the workpiece storage 102 and place it on the workpiece table 104 (as an example, a group of two workpieces W are arranged facing each other. loading). Next, the workpiece W placed on the workpiece table 104 is held by the loader 122 and transported to the pressing unit 100B.

In addition, the supply unit 100A (or other units) includes a resin supply mechanism 140, which supplies resin R at a side position of the workpiece table 104. As an example, the resin supply mechanism 140 includes: a supply part 142, which has a hopper, a feeder, etc., and supplies resin R; and a delivery part 144, which has a transfer mechanism such as an elevator to hold the plurality of resins R supplied from the supply part 142 at a predetermined position. With the above structure, the plurality of resins R held by the delivery part 144 are held by the loader 122 and transported to the pressing unit 100B.

(suppression unit) Next, the pressing unit 100B included in the resin sealing device 1 will be described. It includes a pressing device 250 that clamps the workpiece W and performs resin sealing by driving the sealing mold 202 to open and close. Here, FIG. 2 is a side cross-sectional view (schematic view) of the pressing device 250, and FIG. 3 is a front cross-sectional view (schematic view) of the sealing mold 202 (in addition, the release film is omitted to make the structure clear).

As shown in Figure 2, the pressing device 250 includes a sealing mold 202 having a lower mold 206 and an upper mold 204 and arranged between a pair of platens 252 and 254; a plurality of connecting mechanisms for erecting a pair of platens 252 and 254. 256; a driving source (such as an electric motor) 260 that moves (lifts and lowers) the template 254; and a drive transmission mechanism (such as a ball screw or toggle link mechanism) 262. Furthermore, in this embodiment, the upper mold 204 is assembled to the fixed mold plate 252 and the lower mold 206 is assembled to the movable mold plate 254. However, the structure is not limited to the above structure. The upper mold 204 may be assembled to the movable mold plate and the lower mold 206 may be assembled to the fixed mold plate, or both the upper mold 204 and the lower mold 206 may be assembled to the movable mold plate.

In addition, the pressing unit 100B includes a film supply mechanism 201 that conveys (feeds) a roll-shaped film Fm without openings (holes) on the sheet surface into the sealing mold 202 . The film supply mechanism 201 has a structure in which the unused film Fm is fed out from the unwinding part 201A and supplied to the opened sealing mold 202, and is used for resin sealing in the sealing mold 202 as a used film. The film Fm is wound up by the winding part 201B. Moreover, the unwinding part 201A and the winding part 201B may be arrange|positioned reversely in the front-back direction, or may be arrange|positioned so that one film Fm may be supplied in the left-right direction (both are not shown in figure). In addition, as mentioned above, a structure in which a strip-shaped film is used instead of the roll-shaped film may be used (not shown).

Next, the lower mold 206 of the sealing mold 202 is described in detail. As shown in FIG. 2 and FIG. 3, the lower mold 206 includes a lower mold base 212, a lower mold groove sleeve block 216, a lower mold clamping block 220, etc., and these are assembled to form a structure. As an example, the lower mold groove sleeve block 216 is fixed to the lower mold base 212, and the lower mold base 212 is fixed to the movable mold plate 254.

Here, a plurality of (four, as an example, but not limited to this, or an odd number) housing resins (in this case, ingot-shaped resins) are provided on the lower mold 206 along the front-to-back direction. R cylindrical tank 240. The tank 240 is formed as a through hole that is continuous with the lower mold groove cover block 216 and the lower mold clamping block 220 . Moreover, the plunger 242 pushed by a well-known conveyance drive mechanism (not shown) is arrange|positioned in the tank 240. With the above structure, the plunger 242 is pushed, and the resin R in the tank 240 is supplied into the mold cavity 208 (described later).

In addition, in the present embodiment, a workpiece holding portion 205 for holding one or more workpieces W is provided in a configuration surrounded by a lower mold clamping block 220 fixed to a lower mold groove sleeve block 216. More specifically, as shown in FIG. 3 , two workpiece holding portions 205 (a first workpiece holding portion 205A and a second workpiece holding portion 205B) are provided in a configuration for clamping the tank 240 in the left-right direction. As an example, the workpiece holding portion 205 is a structure that includes a suction path (not shown) connected to a suction device and absorbs and holds the workpiece W. Furthermore, a structure including a suction path may be substituted or provided together with a structure including holding claws for clamping the periphery of the workpiece W (not shown).

In addition, a lower mold heater (not shown) is provided on the lower mold base 212. Thus, heat can be conducted to the vicinity of the tank 240 via the lower mold groove sleeve block 216 and the like, and the resin R in the tank 240 can be efficiently heated to a predetermined temperature (about 180° C. in this embodiment) in a short time to be melted. As an example, a known electric heating wire heater, armored heater, etc. can be used for the lower mold heater.

Next, the upper mold 204 of the sealing mold 202 is described in detail. As shown in FIG. 2 and FIG. 3, the upper mold 204 includes an upper mold base 210, an upper mold groove sleeve block 214, an upper mold clamping block 218, etc., and these are assembled to form a structure. As an example, the upper mold groove sleeve block 214 is fixed to the lower surface of the upper mold base 210, and the upper mold base 210 is fixed to the lower surface of the fixed mold plate 252.

Here, the upper mold 204 is provided with a material removal pool block 244, which is fixed to the upper mold groove sleeve block 214 (here, including a component fixed to the upper mold groove sleeve block 214) at a position directly above the tank 240 of the lower mold 206 (here, it refers to an area of a specified width directly above), and a material removal pool 246 and a gutter 247 (a part) connected to the material removal pool 246 are provided through the lower surface. Furthermore, a mold cavity 208 is provided, which is connected to the gutter 247 and accommodates a specified portion of the workpiece W (a portion where the electronic component Wb is mounted). In addition, the boundary position (boundary area) between the gutter 247 and the mold cavity 208 becomes a portion called a gutter 248. Furthermore, the suction path for degassing or film adsorption in the cavity 208 is omitted from the diagram.

The mold cavity 208 of this embodiment is disposed through the lower surface of the mold cavity block 226 , and the mold cavity block 226 is surrounded and arranged by the upper mold clamping block 218 fixed under the upper mold groove cover block 214 . More specifically, corresponding to the positions of the two workpiece holding portions 205 (the first workpiece holding portion 205A and the second workpiece holding portion 205B) of the lower mold 206 , the two workpiece holding portions 205 are separated from each other in the left and right direction by the picking pool block 244 in a plan view. (or front and rear direction) are respectively provided with mold cavities 208 (first mold cavity 208A and second mold cavity 208B). The workpiece holding parts 205A and 205B and the mold cavities 208A and 208B become a set of structural units (hereinafter sometimes referred to as as a "block unit"). In this embodiment, a plurality of groups of the structural units are arranged side by side in the front-rear direction (or left-right direction). However, the structure is not limited to these structures, and the workpiece holding part 205 and the mold cavity 208 may be arranged on only one side in the left-right direction (or the front-rear direction) with respect to the reject tank block 244 (not shown in the drawings). icon). Alternatively, only one set of the structural units may be provided (not shown).

Furthermore, the mold cavity may also be provided in the lower mold 206. In this case, a structure may be adopted in which the resin R passes through holes extending through the upper and lower parts of the workpiece W, or a structure may be adopted in which the resin R passes through a flow path connecting the sump of the upper mold 204 to the gutter of the lower mold 206 (not shown).

In addition, the upper mold base 210 is provided with an upper mold heater (not shown). Thereby, heat can be conducted to the surroundings of the mold cavity 208 and the resin flow path (e.g., the reject pool 246, the runner 247, the gate 248, etc.) through the upper mold groove cover block 214, etc., thereby filling the mold cavity 208 and the resin flow. The molten resin R in the path 246, the resin flow path 247, and the resin flow path 248 is heated to a predetermined temperature. As an example, as an upper mold heater, a well-known electric heating wire heater, a sheath heater, etc. are used.

(storage unit) Next, the storage unit 100C included in the resin sealing device 1 will be described.

As an example, the storage unit 100C includes: a molded product workbench (also called a molded product loading tray) 114 for placing molded products Wp; a guillotine mechanism 116 for removing unnecessary resin portions from the molded products Wp; and a molded product storage 112 for storing molded products Wp from which unnecessary resin portions have been removed. In addition, the molded product storage 112 can use a known stacking cassette, a slit cassette, etc., so that a plurality of molded products Wp can be stored together. With the above structure, the molded products Wp (including the state of the unnecessary resin portions) transported from the pressing unit 100B using the unloader 124 or the like are placed on the molded product workbench 114. Then, it is transferred to the sprue mechanism 116 using a known picker or the like (not shown) and after removing the unnecessary resin part, it is stored in the molded product storage 112 using a known pusher or the like (not shown). Furthermore, the molded product table 114 itself can also move in the front-rear direction and move to the sprue mechanism 116 while the molded product Wp is placed thereon.

As mentioned above, the gutter mechanism 116 is a mechanism for removing unnecessary resin portions from the molded product Wp. The so-called unnecessary resin portions are specifically formed at the position of the pick pool 246, the "gutter portion" formed at the position of the gutter 247, and the "gutter portion" formed at the position of the gutter 248. In the present embodiment, as the workpiece W, an example of a frame F is cited in which a plurality of electronic components Wb are mounted in a matrix on a continuous substrate Wa of a predetermined shape. Therefore, the molded product Wp in which the workpiece W is resin-sealed includes unnecessary resin portions such as the pick pool portion, the gutter portion, and the gutter portion, and is formed in a state where two frames F are connected. As an example, when the molded product Wp includes the structure shown in FIG5A, the resin portion does not need to be the structure shown in FIG5B (an enlarged view of a material removal pool Rc and the gutter portion Rr and the gutter portion Rg connected thereto). As another example, when the molded product Wp includes the structure shown in FIG6A, the resin portion does not need to be the structure shown in FIG6B (an enlarged view of a material removal pool Rc and the gutter portion Rr and the gutter portion Rg connected thereto).

As an example, as shown in FIG. 4 , the gating mechanism 116 includes a sprue cutting punch 160 that removes the reject pool portion and the sprue portion. It further includes a gate cutting punch 170 that removes the gate portion from the molded product Wp in which the reject pool portion and the runner portion are removed (the steps will be described later). Specifically, the sprue cutting punch 160 includes a punch blade 162 , and the punch 164 (see FIG. 4 ) is provided upright on the punch blade 162 (disposed on the lower side of the punch blade 162 ). The hardened resin R formed on the runner 247 in the hole h (see FIG. 5A ) of the frame F is punched out (push-out process), and the self-formed product Wp pushes the reject pool and the runner. drop and remove; a driving mechanism (not shown) to move the punch blade 162 up and down; and a positioning mechanism to position the molded product Wp during processing. Similarly, the gate cutting punch 170 includes: a punch blade 172 for punching and removing the gate portion from the formed product Wp (a state in which the pick pool portion and the sprue portion are removed) by punching processing (stamping processing); and a drive. a mechanism (not shown) to move the punch blade 172 up and down; and a positioning mechanism to position the molded product Wp during processing. In addition, during any processing, the conveyance (movement) of the molded product Wp is performed using a pallet and a driving servo motor (both are not shown).

First, in the sprue cutting punch 160 of this embodiment, the punching range of the punch blade 162 is set (formed) to a range that will be formed in the group of structural units (block units) by one punch (Fig. (Part A of 5A) The shape in which the reject pool and sprue are removed. According to this, since the size of the punch blade 162 can be configured to be small, the gate cutting punch 160 can be miniaturized, and thus the gating mechanism 116 can be miniaturized. Alternatively, as a modified example, a structure (not shown) may be adopted in which the punching range of the punch blade 162 is set (formed) so that all the structural units in a plurality of groups of structural units (for example, the molded product Wp) can be combined with one punch. ) formed in the range (part B in Figure 5A), the shape in which the reject pool part and the sprue part are removed. Alternatively, the two connected molded products Wp mounted on the molded product table 114 may be twisted, and the reject pool part and the sprue part may be destroyed and separated from the gate part. According to this, the range of the reject pool part and the sprue part that can be removed by one punch can be enlarged, so the cycle time can be shortened.

In addition, the positioning mechanism of the molded product Wp when the punching blade 162 punches the pick pool and the gutter is configured to position the molded product Wp (in a state where two frames F are connected) at a predetermined position by causing the outer periphery of the molded product Wp to abut against a guide (not shown).

Next, in the grooving cutting punch 170 of the present embodiment, the punching range of the punch blade 172 is set (formed) to a shape that removes the grooving portion of the range (C portion of FIG. 5A ) formed in a group of structural units (block units) of each frame F by one punching. Accordingly, since the size of the punch blade 172 can be configured to be small, the grooving cutting punch 170 can be miniaturized, and the grooving mechanism 116 can be miniaturized. However, the present invention is not limited to this structure, and the punching range of the punch blade 172 can also be set (formed) to a shape (not shown) in which the removal pool portion and the gutter portion of the range (portion D in FIG. 5A ) formed in multiple groups of structural units in each frame F (for example, all structural units in the molded product Wp) are removed by a single punch.

In addition, the positioning mechanism of the molded product Wp when punching the reject pool portion and the sprue portion by the punch blade 172 is configured by placing the gate cutting punch 170 (which is provided below the punch blade 172 The guide pins 174 (see FIG. 4 ) are inserted into the guide holes gh previously formed in each frame F of the molded product Wp (that is, the base material Wa of the workpiece W) and positioned at a predetermined position. If a structure is adopted in which the guide is positioned in contact with the outer peripheral portion of the frame F, it is easily affected by deformation (warp, expansion, etc.) of the frame F, making it difficult to remove the gate portion with high accuracy. On the other hand, according to the structure of this embodiment, by inserting the guide pin 174 into the guide hole gh previously formed in the frame F (the base material Wa of the workpiece W) for positioning, the positioning accuracy is significantly improved, thereby enabling high Precisely remove the gate. Furthermore, the high-precision guide pin 174 is an expensive component, but only one set of structural units (block units) is enough, so the cost can be reduced compared with the conventional device. In the case of this embodiment, as illustrated in the reference drawing of FIG. 7 , it is preferable that the through-hole th is formed in advance in the gate portion Rg formation area on the frame F (cross-hatching in FIG. 7 indicates the punch blade). 172). Furthermore, as illustrated in the reference drawing of FIG. 8 , even if there is no through hole, the molded product Wp can be partially cut using the gate cutting punch 170 (specifically, the punch blade 172 ). Remove it (cross-hatched in Figure 8 indicates punch edge 172).

As described above, with the gating mechanism 116 of this embodiment, the reject pool portion and the runner portion, which are the main causes of warpage of the molded product Wp, can be removed in advance using the runner cutting punch 160. Therefore, the gate portion can be removed by inserting the guide pin 174 of the gate cutting punch 170 into the guide hole gh of the frame F and positioning it while the warpage of the molded product Wp is eliminated (reduced). . This allows the gate portion to be removed with high precision. In addition, the gate cutting step for removing the gate portion may be performed not in the state in which the two frames F are connected, but in the state in which the two frames F are separated. This further eliminates (reduces) the influence of warpage, so the gate portion can be removed with higher accuracy. Furthermore, the gate cutting step can be implemented by sequential conveying of a group of structural units (block units) and by positioning the guide holes gh of the frame F and the guide pins 174 of the gate cutting punch 170 . This can improve conveyance accuracy and positioning accuracy, so the gate portion can be removed with further high accuracy. Through these synergistic effects, it is possible to achieve high-precision machining of the gate portion that was extremely difficult to achieve with conventional methods (as a specific example, machining in which the remaining amount of the gate portion is 0.15 mm or less) can be achieved.

(Resin sealing action) Next, the operation of resin sealing using the resin sealing device 1 of this embodiment (ie, the resin sealing method of this embodiment) will be described. Here, the following structure is taken as an example, that is, two sets of mold cavities 208 are provided in an upper mold 204, and two workpieces W (for example, the frame F) are arranged side by side in a lower mold 206 to perform resin sealing together to obtain molding. Product Wp. However, the structure is not limited to the above-mentioned structure, and a structure in which one workpiece W or a plurality of workpieces W are arranged side by side in the front, rear, left, and right directions for resin sealing may be used.

As a preparation step, a heating step (upper mold heating step) of adjusting and heating the upper mold 204 to a predetermined temperature (for example, 100° C. to 200° C.) using an upper mold heater is performed. In addition, a heating step (lower mold heating step) is performed to adjust and heat the lower mold 206 to a predetermined temperature (for example, 100° C. to 200° C.) using the lower mold heater. Furthermore, a step (film feeding step) is performed in which the film Fm is conveyed (sent out) from the unwinding part 201A to the winding part 201B by the film feeding mechanism 201 to a predetermined position in the sealing mold 202 (the upper mold 204 and the upper mold 204). The position between the lower molds 206) supplies the film Fm.

Next, a step of unloading the workpieces W from the workpiece storage 102 one by one using a known pusher or the like (not shown) and placing them on the upper surface of the workpiece table 104 is performed (in addition, a known pick-up mechanism, etc. may also be used in combination. ). In addition, regulations are implemented to carry out the ingot-shaped resin R one by one from the supply part 142 using a known feeder, an elevator, etc. (not shown) and to hold a plurality (as an example, four) of the resin R in the transfer part 144 Location steps.

Then, the loader 122 is moved to directly above the workpiece workbench 104 (it can also wait in advance at the same position). At this position, the workpiece table 104 is raised (or the loader 122 is lowered) and the workpiece W is held by the workpiece holding portion 122A and the workpiece holding portion 122B (in the present embodiment, the workpiece holding portion 122A and the workpiece holding portion 122B are held by the workpiece holding portion 122A and the workpiece holding portion 122B. Each part 122B holds one workpiece W) step.

Next, the loader 122 is moved to the position directly above the interface 144. At the position, the interface 144 is raised (or the loader 122 is lowered) and the resin holding portion 122C holds the resin R (in the present embodiment, the resin holding portion 122C holds four resins R).

Next, the following steps are performed, that is, the loader 122 is used to transport a plurality of (two in this embodiment) workpieces W and a plurality of (four in this embodiment) resins R into the sealed mold 202 of the pressing unit 100B in one step, and the workpieces W are respectively placed on each workpiece holding portion 205 (in this embodiment, the workpiece holding portion 205A and the workpiece holding portion 205B) of the lower mold 206; and the plurality of (four in this embodiment) tanks 240 of the lower mold 206 are respectively accommodated with the resin R. Furthermore, a step of preheating the workpieces W or the resin R by a heater (not shown) provided in the loader 122 during the transport (preheating step) may also be performed.

Next, a step of closing the sealing mold 202 and sandwiching the workpiece W between the upper mold 204 and the lower mold 206 for resin sealing to form the molded product Wp (resin sealing step) is performed.

More specifically, first, the drive source 260 and the drive transmission mechanism 262 are driven to move the movable template 254 upward. Thereby, the lower mold 206 moves toward the upper mold 204 (that is, upward). If the lower mold 206 continues to move upward, the cavity block 226 of the upper mold 204 comes into contact with the workpiece W held by the workpiece holding part 205 of the lower mold 206, and the workpiece W is clamped. In the above state, the transmission driving mechanism is operated to push the plunger 242 in the direction of the upper mold 204 to push the molten resin R into the picking pool 246 of the upper mold 204 so that it can pass through the picking pool 246 connected to the picking pool 246 . The runner 247 and so on are pressed into the mold cavity 208 .

As described above, by heating and pressurizing the resin R with respect to the workpiece W, the resin R is thermally hardened to perform resin sealing, thereby forming a molded product Wp.

Next, the following steps are carried out, that is, the sealing mold 202 is opened, and the molded product Wp is taken out from the sealing mold 202 by the unloader 124 (in this embodiment, as illustrated in FIGS. 5A and 6A , including removing the material The resin parts such as the pool part and the sprue part are not required, and the two frames F are connected through these steps).

In parallel with (or after) this, the following step is performed, namely, the film supply mechanism 201 conveys the film Fm from the unwinding section 201A to the winding section 201B, thereby sending out the used film Fm.

Next, a step of placing the molded product Wp on the molded product workbench 114 by the unloader 124 is performed (in addition, a known pickup mechanism, etc. may also be used in combination). Next, a step of removing unnecessary resin portions such as the pick-up pool portion, the gutter portion, and the gutter portion from the molded product Wp by the gutter mechanism 116 (guttering step) is performed. Next, a step of moving the molded products Wp (with unnecessary resin portions removed) one by one into the molded product storage 112 is performed by a known pusher, etc. (not shown). In addition, before these steps, a step of post-curing the molded product Wp may also be performed.

Here, the gating step in this embodiment includes a runner disconnecting step of removing the reject pool part and the runner part from the molded product Wp, and a runner disconnecting step of removing the gate part from the molded product Wp. Gate cutting step.

According to the above structure, in the previous step (runner disconnection step), the reject pool portion and the runner portion, which are a major cause of warpage of the molded product Wp, can be removed. Therefore, in the subsequent step (gate cutting step), the gate portion can be removed in a state where the warpage of the molded product Wp is eliminated (reduced). Thereby, the gate part can be removed with high precision, that is, the remaining size of the gate part can be reduced.

In particular, in the case of a molded article Wp (see FIGS. 5A and 6A ) in which two frames F are sealed together in an arrangement sandwiching the reject pool 246 as in the present embodiment, since the previous step (runner) The frame units can be separated one by one in the cutting step), so each frame unit can be positioned and the gate portion can be removed in the subsequent step (gate cutting step). Therefore, the effect can be obtained more significantly.

In addition, in the gate cutting step of this embodiment, the molded product Wp is removed from the reject pool part and the runner part in the previous runner cutting step (as mentioned above, the separated one Frame F) The step of removing the gate portion while sequentially conveying frames F) at a predetermined conveyance distance. As an example, the conveyance distance is set to the center-to-center distance of a plurality of groups of cans 240 arranged side by side in pairs in an upper and lower position in the sealing mold 202 (that is, the center-to-center distance between one can 240 and other adjacent cans 240) (tick The distances between the centers of the material pools 246 are also the same). Accordingly, the gate cutting step can be performed in a block unit (a resin sealing area (unit) corresponding to a group of tanks 240 and a reject pool 246) within the frame F. Therefore, the frame F is less susceptible to deformation (warping, expansion, etc.) caused by the heat during resin sealing. Therefore, the gate portion can be removed with higher precision, and the size can be further reduced. The remaining dimensions of the gate area.

In addition, the grooving step is a step of inserting the guide pin 174 provided in the grooving punch 170 into the guide hole gh pre-formed in the base material Wa of the workpiece W and positioning it, thereby performing a step of conveying the formed product Wp. In the previous resin sealing method, the guide piece is generally positioned by abutting against the outer periphery of the frame F. Therefore, it is easily affected by the deformation (warping, expansion, etc.) generated in the frame F, making it difficult to remove the grooving part with high precision. In contrast, according to the above structure, the guide pin 174 can be inserted into the guide hole gh pre-formed in the frame F (base material Wa of the workpiece W) for positioning, so the positioning accuracy is significantly improved, thereby enabling the grooving part to be removed with high precision. Furthermore, the method of conveying the molded product Wp is also implemented by sequentially conveying a set of structural units (block units) using a servo motor, which helps to improve accuracy.

In this way, according to the gating step of this embodiment, by cooperatively obtaining the above-mentioned effects, it is possible to achieve high-precision processing of the gate portion that is extremely difficult to achieve with the conventional method. As a specific example, the remaining portion of the gate portion can be processed Processing where the amount is set to 0.15 mm or less.

The above is the main operation of resin sealing using the resin sealing device 1. However, the above step sequence is an example, and the sequence can be changed or performed in parallel as long as there is no problem. For example, in this embodiment, since it is a structure including two pressing units 100B, it is possible to efficiently form a molded product by performing the above operation in parallel.

As explained above, according to the resin sealing device and the resin sealing method of the present invention, the reject pool part and the sprue part can be removed in the previous step, so the warpage of the frame can be eliminated (reduced) in the subsequent step. Remove the gate part in the state. Therefore, the gate portion can be removed with high precision, that is, the residual size can be reduced, and a high-precision product that has been extremely difficult to achieve in the past can be formed.

In addition, the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. Specifically, in the above embodiment, the upper mold includes two mold cavities that pressure-feed resin through a tank and its corresponding reject pool and runner, and the lower mold includes two corresponding workpiece holding parts. The structure in which multiple groups of units are arranged side by side in the front-rear direction (or left-right direction) has been described as an example, but the structure is not limited to this.

In addition, in the above-mentioned embodiment, a frame in which a plurality of electronic components are mounted in a matrix on a continuous base material of a predetermined shape has been described as an example as a workpiece. However, the workpiece is not limited to this.

1: Resin sealing device 100A: Supply unit 100B: Pressing unit 100C: Storage unit 100D: Transport mechanism 102: Workpiece storage 104: Workpiece table 112: Molded product storage 114: Molded product table 116: Gushing mechanism 122: Loader 122A, 122B, 205: Workpiece holding section 122C: Resin holding section 124: Unloader 124A: Molded product holding section 126: Guide rail 140: Resin supply mechanism 142: Supply section 144: Handover section 160: Gushing channel breaking punch 162, 172: Punch blade 164: Ejector pin 170: Slot cutting punch 174: Guide pin 201: Film supply mechanism 201A: Roll-out section 201B: Roll-up section 202: Sealing mold 204: Upper mold 204a, 206a: Mold surface 205A: First workpiece holding section (workpiece holding section) 205B: Second workpiece holding section (workpiece holding section) 206: Lower mold 208: Mold cavity 208A: First mold cavity (mold cavity) 208B: Second mold cavity (mold cavity) 210: Upper mold base 212: Lower mold base 214: Upper mold groove sleeve block 216: Lower mold groove sleeve block 218: Upper mold clamping block 220: Lower mold clamping block 226: Cavity block 240: Tank 242: Plunger 244: Removal pool block 246: Removal pool (resin flow path) 247: Gutter (resin flow path) 248: Gutter (resin flow path) 250: Pressing device 252, 254: Template 256: Connection mechanism 260: Drive source 262: Drive transmission mechanism A, B, C, D: Part F: Frame Fm: Membrane (release membrane) gh: Guide hole h: Hole R: Resin Rc: Removal pool part Rg: Gutter part Rr: Gutter part th: Through hole W: workpiece (molded product) Wa: base material Wb: electronic parts Wp: molded product

FIG. 1 is a plan view showing an example of a resin sealing device according to an embodiment of the present invention. FIG. 2 is a side cross-sectional view showing an example of the pressing device of the resin sealing device of FIG. 1 . FIG. 3 is a front cross-sectional view showing an example of the sealing mold of the resin sealing device of FIG. 1 . FIG. 4 is a front view (partial cross-sectional view) showing an example of the gating mechanism of the resin sealing device of FIG. 1 . FIG. 5A is a plan view showing an example of a molded article formed in the embodiment of the present invention, and FIG. 5B is an enlarged view showing an example of an unnecessary resin portion in the molded article. 6A is a plan view showing another example of a molded article formed in the embodiment of the present invention, and FIG. 6B is an enlarged view showing an example of an unnecessary resin portion in the molded article. 7 is a reference diagram (plan view) for explaining an example of the device/molded product (frame) structure and steps in the gate cutting step using the resin sealing device according to the embodiment of the present invention. 8 is a reference diagram (plan view) for explaining another example of the device/molded product (frame) structure and steps in the gate cutting step using the resin sealing device according to the embodiment of the present invention.

202:Sealing mold

204: Upper mold

204a, 206a: Mold surface

205: Workpiece holding part

205A: First workpiece holding portion (workpiece holding portion)

205B: Second workpiece holding part (workpiece holding part)

206: Lower mold

208:Mold cavity

208A: First mold cavity (mold cavity)

208B: Second mold cavity (mold cavity)

214: Upper die groove sleeve block

216: Lower die groove cover block

218: Upper die clamping block

220: Lower mold clamping block

226:Mold cavity block

240:Cans

242: Plunger

244: Material removal pool area

246: Material removal pool (resin flow path)

247:Sprue (resin flow path)

248: Watering port (resin flow path)

R: Resin

W: Workpiece (formed product)

Wa: base material

Wb:Electronic parts

Claims (6)

A resin sealing method uses a sealing mold including an upper mold and a lower mold and seals a workpiece with a resin to form a molded product. The resin sealing method is characterized in that it includes: A resin sealing step, wherein the resin in tablet form is put into a tank disposed in the sealing mold and pressed by a plunger, and is pressed from a pick pool disposed in the sealing mold to a mold cavity through a gutter, and the workpiece is sealed with the resin; and A guttering step, wherein the molded product after the resin sealing step is taken out from the sealing mold, and the unnecessary resin portion of the molded product is removed, In the gushing step, after the gushing cutting step of removing the unnecessary resin portion formed at the positions of the gushing pool and the gushing channel, namely the gushing pool portion and the gushing channel portion, the gushing cutting step of removing the unnecessary resin portion formed at the gushing channel and the mold cavity, namely the gushing channel portion, is performed. The resin sealing method as described in claim 1, wherein the gate cutting step includes a step of removing the gate portion while sequentially conveying the molded product in a state where the gate portion is removed in the gate cutting step at a predetermined conveying distance. The resin sealing method as described in claim 2, wherein the specified conveying distance is set to be the center distance between the plurality of groups of the tanks and the material removal pools arranged side by side in a row in the upper and lower parts of the sealing mold. The resin sealing method according to any one of claims 1 to 3, wherein, The gate cutting step includes a step of inserting a guide pin into a guide hole preliminarily formed in the base material of the workpiece to position and transport the molded product. A resin sealing device uses a sealing mold including an upper mold and a lower mold and seals a workpiece with resin to form a molded product. The resin sealing device is characterized in that it includes: a tank, which is arranged on the lower mold, and is used to put the resin in tablet form; a material removal pool, which is arranged on the upper mold, and pushes the resin; a gutter and a mold cavity, which are arranged on at least one of the upper mold and the lower mold, and press the resin from the material removal pool; and a gutter mechanism, which removes unnecessary resin parts from the molded product sealed by the resin, The guillotine punching mechanism comprises: a guillotine cutting punch for removing the unnecessary resin portion formed at the positions of the guillotine and the guillotine, namely the guillotine portion and the guillotine portion; and a guillotine cutting punch for removing the unnecessary resin portion, namely the guillotine portion, formed at the position of the guillotine between the guillotine and the cavity from the molded product in a state where the guillotine portion and the guillotine portion are removed. The resin sealing device according to claim 5, wherein, The sealing mold is provided with multiple sets of upper and lower pairs of cans and reject pools side by side, The gate cutting punch has a punch blade formed into a shape that removes the gate portion formed corresponding to a set of the cans and the reject tank at once.

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