TWI811101B - Resin sealing device and sealing mold - Google Patents

Abstract

The present invention provides a sealing mold and a resin sealing device capable of absorbing any one of variation in workpiece thickness and variation in resin amount, and easily adjusting workpiece clamping force and molding pressure. In the sealed mold of the present invention, one of the upper mold and the lower mold is provided with a workpiece holding part for holding a plurality of workpieces, and the other is provided with a plurality of clampers and cavity inserts. The clamper has a mutually divided structure for individually clamping a plurality of workpieces held by one workpiece holding portion, and the cavity insert is separated from the clamper at a center position of each of the plurality of clampers in plan view. The sealed mold is movable up and down in conjunction with a clamper spring that urges the clamper toward the workpiece holding portion, and a cavity insert spring that urges the cavity insert toward the workpiece holding portion.

Description

Resin sealing device and sealing mold

The invention relates to a resin sealing device and a sealing mold.

As an example of a resin sealing device that processes a molded product by sealing a workpiece with electronic components mounted on a base material with a sealing resin (hereinafter, sometimes simply referred to as "resin"), a compression molding method is known.

The compression molding method is a technology of resin sealing by the following operation (refer to Patent Document 1: Japanese Patent Laid-Open No. 2019-136942 ): sealing A specified amount of resin is supplied to the area (cavity), and the workpiece is placed in the sealed area, and clamped by the upper mold and the lower mold. As an example, when using a sealed mold in which an upper mold has a cavity, a technique is known in which resin is collectively supplied to a center position on a workpiece for molding. On the other hand, when using a sealed mold having a cavity in a lower mold, a technique is known in which a film and a resin covering the surface of the mold including the cavity are supplied for molding. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2019-136942

[Problem to be Solved by the Invention]

In order to improve production efficiency when forming by compression molding, research and development is underway in which multiple workpieces are held in one workpiece holding part of a sealed mold and resin-sealed together to form a molded product (so-called "multi-row pick-up"). forming").

Regarding the above-mentioned multi-row picking and forming, the inventors of the present application first studied a structure in which a single (ie integrated) clamper clamps a plurality of workpieces held by one workpiece holding portion. According to the above configuration, since only one clamper (integrated structure) is required for a plurality of workpieces, the structure of the device can be simplified. On the other hand, however, even if the clamper is configured to be able to move up and down, it cannot (or is difficult to) absorb the thickness variation of the workpiece. As a result, problems such as damage to thick workpieces, insufficient clamping force for thin workpieces, and inability to obtain flatness of molded products due to inclination of the sealing mold arise. Furthermore, variations in the amount of resin cannot (or are difficult to) absorb.

In view of the above-mentioned problems, the inventors of the present application have studied a structure that absorbs variations in workpiece thickness and resin amount by including a mechanism that enables a workpiece holding portion to move up and down for each workpiece. However, according to such a structure, there arises a problem that the vertical movement mechanism (for example, the vertical movement mechanism of the gripper) of the biasing member is used on one of the molds (for example, the upper mold) side and the other mold (for example, the upper mold) side. Lower mold) side interacts with the vertical movement mechanism of the force applying member (for example, the vertical movement mechanism of the workpiece holding part), and the force at the time of resin sealing, specifically, the adjustment of the workpiece clamping force and molding pressure becomes extremely It is complex and requires a lot of labor and time to adjust to the optimum force. [Means to solve the problem]

The present invention is made in view of the above circumstances, and an object of the present invention is to provide a sealing mold capable of absorbing variations in workpiece thickness and resin amount with a simple device structure, and a resin sealing device including the sealing mold. Either one, and the setting of the workpiece clamping force and molding pressure at the time of resin sealing can be easily and quickly performed by adjusting only one of the molds.

This invention solves the said subject by the solution means described as one embodiment below.

The sealed mold of the present invention is a sealed mold that includes an upper mold and a lower mold, and is processed into a molded product by sealing a workpiece with a resin. The necessary condition is that the upper mold and the lower mold include any of the following structures: A structure: one of them is provided with a workpiece holding part for holding a plurality of workpieces, and the other is provided with a plurality of holders and cavity inserts, and the plurality of holders have a pair of The plurality of workpieces held by one workpiece holder is divided into two structures, and the cavity insert does not move with the plurality of grippers at the central positions of the plurality of grippers in plan view. The ground can move up and down, or one of them is provided with a workpiece holding part for holding one or more of the workpieces. Among the workpieces, a plurality of electronic components are mounted on one base material, and the other is provided with a plurality of clampers and mold cavity inserts, the plurality of clampers have mutually divided structures for individually clamping a plurality of the electronic parts in one of the workpieces, and the mold cavity inserts are Each of the plurality of grippers can move up and down without interlocking with the grippers at the central positions in plan view, and the sealing mold includes a gripper spring that urges the grippers toward the workpiece holding portion, and a cavity insert spring that urges the cavity insert toward the workpiece holding portion.

Thereby, since a plurality of workpieces can be individually and vertically movable clamped by the divided clamper, thickness variations of the workpieces can be absorbed, thereby preventing the damage of the workpieces and the occurrence of insufficient clamping force. Furthermore, since the cavity insert can be moved up and down individually with respect to the plurality of workpieces, it is also possible to absorb variations in the amount of resin.

In addition, when there is a step difference (difference in thickness) in one base material, or in the case where there is a dimensional difference in thickness for each of a plurality of electronic components mounted on one base material, and for each electronic component mounted on the In the case where there is variation in the amount of resin on one side, either the size difference or the variation in the amount of resin can be absorbed.

In addition, the workpiece clamping force can be set by the gripper spring, and the forming pressure can be set by the cavity insert spring. Thereby, the workpiece clamping force and the molding pressure can be individually set/adjusted, and thus the sealing conditions can be finely changed for each workpiece (for each product). Furthermore, since the acting force can be accomplished by setting/adjusting only one of the molds, it is possible to change the conditions extremely easily.

In addition, it is preferable that the plurality of grippers are arranged in parallel in one predetermined direction, or arranged in a matrix in a horizontal plane. Thereby, a plurality of grippers and cavities can be arranged in parallel or in a matrix, and the workpiece clamping force and molding pressure can be adjusted for each of the grippers and cavities. Therefore, for example, after a small amount of trial production is carried out, when the mass production of increasing the number of operations is carried out, the assembly setting of the trial production type can also be directly transferred to the mass production type.

In addition, it is preferable that the clamper spring is composed of one spring arranged to coincide with the center of the cavity insert spring in plan view, or a plurality of springs arranged to surround the cavity insert spring. Thereby, a simple and compact device can be achieved if the gripper spring is constituted by one spring for one cavity insert spring. On the other hand, if the clamper spring is composed of a plurality of springs arranged to surround the cavity insert spring for one cavity insert spring, no force will be generated for a large workpiece ( In particular, unbalanced workpiece clamping force) can be uniformly clamped, thereby preventing damage to the workpiece or insufficient clamping force.

In addition, it is preferable to further include a clamper support portion for supporting the clamper; and a movable pin penetrating through the clamper support portion and arranged so as to be movable up and down; The applied force of the retainer spring is transferred to the structure of the cavity insert. Thereby, a structure in which force is applied to the clamper by the clamper spring and force is applied to the cavity insert by the cavity insert spring can be achieved.

In addition, it is preferable that the clamper spring has a structure in which multiple types of springs with different spring constants are provided, and one corresponding to the resin sealing condition is selected to be detachably fixed to the upper mold or the lower mold. the other of said. In addition, it is preferable that the cavity insert spring has a structure in which multiple types of springs with different spring constants are provided, and one corresponding to the resin sealing condition is selected, and is detachably fixed to the upper mold or the lower mold. The other of the . Thereby, the conditions of the workpiece clamping force and the forming pressure can be individually and extremely easily changed so as to form appropriate acting forces according to the workpiece, that is, according to the type of product.

In addition, the resin sealing device of the present invention is required to include the sealing mold. [Effect of the invention]

According to the present invention, any one of variation in workpiece thickness, variation in thickness of electronic parts, and variation in resin amount can be absorbed by a simple device structure, thereby improving molding quality. In addition, it is possible to easily and quickly set the workpiece clamping force and molding pressure during resin sealing by adjusting only one of the dies, thereby improving production efficiency.

[first embodiment] (the whole frame) Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of a sealing mold 202 and a resin sealing device 1 including the sealing mold 202 according to the present embodiment. In addition, for convenience of description, the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction) of the resin sealing device 1 are shown by arrows in the drawing. In addition, in all the drawings for explaining the respective embodiments, members having the same functions may be assigned the same reference numerals, and repeated descriptions thereof will be omitted.

The resin sealing apparatus 1 of the present embodiment is an apparatus for resin-sealing a workpiece (molded article) W using a sealing mold 202 including an upper mold 204 and a lower mold 206 . Hereinafter, as the resin sealing device 1 , a compression molding device that holds a plurality of workpieces W by using a lower die 206 and uses a release film (hereinafter, sometimes simply referred to as "film") F A plurality of cavities 208 (including a part of the mold surface 204 a ) provided in a corresponding arrangement on the upper mold 204 are covered, and the clamping operation of the upper mold 204 and the lower mold 206 is performed to seal a plurality of workpieces W together with the resin R.

First, the workpiece W to be molded has a structure in which a plurality of electronic components Wb are mounted on the base material Wa in a matrix form. More specifically, examples of the substrate Wa include plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers formed in rectangular shapes or circular shapes. . In addition, examples of the electronic component Wb include semiconductor wafers, micro-electromechanical system (Micro Electromechanical System, MEMS) wafers, passive elements, heat sinks, conductive members, spacers, and the like. However, it is not limited to these.

As an example of the method of mounting the electronic component Wb on the base material Wa, there are mounting methods by wire bonding packaging, flip-chip packaging, or the like. Alternatively, in the case of a structure in which the substrate (glass or metal pallet) Wa is peeled off from the molded product Wp after resin sealing, there is also a method of using a heat-peelable adhesive tape or by irradiating ultraviolet rays. The electronic component Wb is pasted with cured ultraviolet curable resin.

On the other hand, as an example of the resin R, a granular thermosetting resin (for example, a filler-containing epoxy-based resin, etc.) (used as a generic term for granular, pulverized, powdered, etc.) can be used. In addition, the resin R is not limited to the said state, It may be other states (shape) such as liquid, plate-like, and sheet-like, and may be resin other than epoxy-type thermosetting resin.

In addition, as an example of the film F, a film material excellent in heat resistance, ease of peeling, flexibility, and stretchability, such as polytetrafluoroethylene (polytetrafluoroethylene, PTFE), ethylene-tetrafluoroethylene copolymer (ethylene -tetrafluoroethylene, ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (polyethylene terephthalate, PET), fluorinated ethylene propylene (fluorinated ethylene propylene, FEP), fluorine impregnated glass cloth, polypropylene, polypropylene Vinylidene chloride, etc. In this embodiment, a roll-shaped film can be used as the film F. In addition, as another example, a structure using a long film (not shown) may also be employed.

Next, an outline of the resin sealing device 1 of this embodiment will be described. As shown in FIG. 1 , the resin sealing device 1 includes the following components as main structures: a supply unit 100A, which mainly supplies the workpiece W and resin R; a pressing unit 100B, which mainly performs resin sealing on the workpiece W and processes it into a molded product Wp; And the storage unit 100C mainly stores the resin-sealed molded article Wp.

Moreover, the resin sealing apparatus 1 is provided with the conveyance mechanism 100D which moves between each unit, and conveys the workpiece W, the resin R, and the molded product Wp. As an example, the transfer mechanism 100D includes: a workpiece loader 122 for carrying the workpiece W and the resin R into the press unit 100B; a molded product loader 124 for unloading the molded product Wp from the press unit 100B; and the molded product loader 124 are shared. In addition, the transfer mechanism 100D is not limited to a structure including a loader, and a structure including an articulated robot (not shown) may also be employed.

Here, the workpiece loader 122 plays a role of receiving the workpiece W (the state where the resin R is placed) in the supply unit 100A and conveying it to the pressing unit 100B. As a structural example, a workpiece holding part 122A and a workpiece holding part 122B arranged in two rows along the X direction and each capable of holding one workpiece W are provided. Furthermore, for the workpiece holding part 122A and the workpiece holding part 122B, known holding mechanisms (for example, a structure having holding claws for clamping, a structure having a suction hole communicating with a suction device for suction, etc.) (not shown) icon).

The workpiece loader 122 of the present embodiment is configured to move in the X direction and the Y direction, carry the workpiece W (state on which the resin R is mounted) into the sealed mold 202 and place it on the lower mold 206 . However, the present invention is not limited thereto, and a structure (not shown) may be employed that includes separately a loader that moves in the X direction to carry out inter-unit transfer and a loader that moves in the Y direction to carry in the sealing mold 202 . loader.

In addition, the molded product loader 124 plays a role of receiving the molded product Wp in the press unit 100B and conveying it to the storage unit 100C. As a structural example, two rows of molded product holding parts 124A and 124B are provided along the X direction and each can hold one molded product Wp. In addition, for the molded product holding part 124A and the molded product holding part 124B, a known holding mechanism (for example, a structure having holding claws for clamping, a structure having a suction hole communicating with a suction device for suction, etc.) (not shown).

The molded article loader 124 of the present embodiment is configured to move in the X direction and the Y direction, carry out the molded article Wp out of the sealed mold 202 , and place it on the storage table 114 . However, the present invention is not limited thereto, and a structure (not shown) may be employed that includes separately a loader that moves in the Y direction to carry out from the sealing mold 202 and a loader that moves in the X direction to carry out inter-unit transfer. loader.

Furthermore, the resin sealing device 1 can change the overall structure by changing the structure of the unit. For example, the structure shown in FIG. 1 is an example in which two press units 100B are provided, but only one press unit 100B or a structure in which three or more press units 100B are provided may also be used. In addition, it is also possible to have a configuration in which other units are additionally provided (none of them are shown).

(supply unit) Next, the supply unit 100A included in the resin sealing device 1 will be described.

The supply unit 100A includes a work stocker (work stocker) 102 for accommodating the workpiece W. As shown in FIG. As an example, a known stack magazine, slit magazine, or the like can be used for the workpiece stocker 102 , and a plurality of workpieces W can be stored together. Here, the workpiece W taken out from the workpiece stocker 102 is placed on the supply table 104 .

In addition, the supply unit 100A includes a dispenser 106 that supplies the resin R to the upper surface of the workpiece W placed on the supply table 104 . The workpiece W is conveyed to the sealing mold 202 by the workpiece loader 122 in a state where the resin R is placed on the upper surface. However, the present invention is not limited thereto, and a resin loader (not shown) including a resin loader (not shown) that directly carries the resin R into the sealing mold 202 differently from the workpiece W may be employed.

In addition, in 100 A of supply units etc., the structure including the inspection mechanism which performs the visual inspection of the workpiece|work W, or the workpiece|work heater which preheats the workpiece|work W etc. may be employ|adopted (neither is shown in figure).

(press unit) Next, the press unit 100B included in the resin sealing device 1 will be described. Here, FIG. 2 shows a front sectional view (schematic view) of the mold opening and closing mechanism 250 of the resin sealing device 1 . In addition, FIG. 3 shows a front sectional view (schematic view) of the sealing mold 202 of the resin sealing device 1 .

The pressing unit 100B includes: a sealed mold 202 , a pair of molds with opening and closing (for example, a plurality of blocks, plates, columns, etc., or other components assembled). In this embodiment, a pair of dies includes an upper die 204 on the upper side in the vertical direction and a lower die 206 on the lower side. The upper mold 204 and the lower mold 206 are closed and opened as the upper mold 204 and the lower mold 206 approach and separate from each other. That is, the vertical direction (vertical direction) becomes the mold opening and closing direction.

In addition, the sealed mold 202 is opened and closed by a known mold opening and closing mechanism 250 . As an example, as shown in FIG. 2 , the mold opening and closing mechanism 250 includes the following components, such as a pair of templates (platen) 252, 254, a plurality of connecting mechanisms 256 for erecting the pair of templates 252, 254, and making the templates 254 a movable (lifting) driving source (such as an electric motor) 260 and a drive transmission mechanism (such as a ball screw or a toggle link mechanism) 262 .

Here, the sealed mold 202 is disposed between a pair of die plates 252 and 254 of the die opening and closing mechanism 250 . In this embodiment, the upper die 204 is assembled to the fixed die plate (the die plate fixed to the link mechanism 256 ) 252 and the lower die 206 is assembled to the movable die plate (the die plate raised and lowered along the link mechanism 256 ) 254 . However, the structure is not limited to the above, and the upper mold 204 may be assembled to the movable formwork and the lower mold 206 may be assembled to the fixed formwork, or both the upper mold 204 and the lower mold 206 may be assembled to the movable formwork.

Next, the upper mold 204 that seals the mold 202 will be described in detail. As shown in FIG. 3 , the upper mold 204 includes a plurality of clampers 228 capable of individually clamping a plurality of workpieces W held by one workpiece holding portion 205 of the lower mold 206 described later. separate structures. Moreover, the cavity insert 226 which can move up and down independently of the said clamper 228 is included at the center position of each planar view of the some clamper 228. That is, each cavity insert 226 forms the inner portion (bottom) of the cavity 208 , and each holder 228 around it forms the side portion of the cavity 208 . Note that the degassing mechanism and the film adsorption mechanism of the cavity 208 are omitted from illustration. In the present embodiment, the structure is such that two sets of cavities 208 (208A, 208B in FIG. The workpiece W is resin-sealed together. However, it is not limited to the structure described above, and a structure (not shown) including one or more than three sets of cavities may also be employed.

In addition, the upper die 204 includes a clamper spring 232 as a urging member for urging the clamper 228 toward the workpiece holding portion 205; Cavity insert spring 230 . As an example, the clamper 228 is held by the cavity block 240 so as to be able to move up and down while being biased by the clamper spring 232 . In addition, the cavity insert 226 is held by the clamper 228 so as to be able to move up and down while being biased by the cavity insert spring 230 . The workpiece clamping force at the time of resin sealing is set by the clamper spring 232 . In addition, the molding pressure at the time of resin sealing is set by the cavity insert spring 230 .

According to the above structure, since the plurality of workpieces W can be individually and vertically movable clamped by the divided clamper 228, the thickness deviation of the workpieces W can be absorbed, and the damage or clamping of the workpieces W can be prevented. Insufficiency occurs. Furthermore, since the cavity insert 226 can be moved up and down individually with respect to the plurality of works W, variations in the amount of the resin R placed on the works W can also be absorbed. In addition, the clamper spring 232 can be used to set the workpiece clamping force during resin sealing, and the cavity insert spring 230 can set the molding pressure during resin sealing. That is, since each acting force can be grasped individually and individually adjusted, it is possible to finely change the sealing condition for each workpiece W (for each product). Furthermore, since the acting force can be completed by adjusting only one of the molds (upper mold 204 as an example), the conditions can be changed extremely easily.

As described above, in this embodiment, as shown in the explanatory diagram of FIG. 4 (the IV-IV line sectional view in FIG. 3 ), it becomes a structure in which a plurality of sets are arranged side by side in the X direction on one upper mold 204 (as One example is two sets of cavities 208 (208A, 208B), and correspondingly, a plurality of (two as an example) clampers 228 are arranged in parallel in the X direction. Or, as a modified example, as shown in the explanatory diagram of FIG. 5 (shown at the same position as FIG. 4), the following structure can also be adopted: one upper mold 204 is arranged side by side in a matrix in the X-Y plane with multiple groups ( As an example, four sets of cavities 208 (208A, 208B, 208C, 208D) consisting of two columns x two rows, correspondingly, a plurality of (as an example, two columns × two rows of four) holders 228. However, it is not limited to these number of groups (number).

As described above, in this embodiment, as shown in the explanatory diagram of FIG. 4 (the IV-IV line sectional view in FIG. 3 ), it becomes a structure in which a plurality of sets are arranged side by side in the X direction on one upper mold 204 (as One example is two sets of cavities 208 (208A, 208B), and correspondingly, a plurality of (two as an example) clampers 228 are arranged in parallel in the X direction. Or, as a modified example, as shown in the explanatory diagram of FIG. 5 (shown at the same position as FIG. 4), the following structure can also be adopted: one upper mold 204 is arranged side by side in a matrix in the X-Y plane with multiple groups ( As an example, four sets of cavities 208 (208A, 208B, 208C, 208D) consisting of two columns x two rows, correspondingly, a plurality of (as an example, two columns × two rows of four) holders 228. However, it is not limited to these number of groups (number).

According to the above configuration, a plurality of grippers 228 and cavities 208 can be arranged in parallel or in a matrix, and the workpiece clamping force and molding pressure can be adjusted for each of the grippers 228 and cavities 208 . Therefore, for example, after a small amount of trial production is carried out, when the mass production of increasing the number of operations is carried out, the assembly setting of the trial production type can also be directly transferred to the mass production type.

In addition, as shown in the explanatory diagram of FIG. 4 , each of the clamper spring 232 and the cavity insert spring 230 of this embodiment is composed of one spring (as an example) that is arranged so that the center coincides with the center of each cavity 208 when viewed from above. for coil springs). According to the structure, a simple and compact device can be achieved. Alternatively, as a modified example, as shown in the explanatory diagrams of FIGS. 6A and 6B (shown at the same position as FIG. 4 ), a plurality of springs ( As an example, a coil spring). In this case, an arrangement example such as that shown in FIG. 6A or FIG. 6B can be considered. According to the above structure, uniform clamping can be performed without unbalanced force (particularly workpiece clamping force) for a relatively large workpiece W, thereby preventing damage to the workpiece W or insufficient clamping force. occur.

Furthermore, as a characteristic structure of the upper die 204 of the present embodiment, it includes: a clamper support part 234 that supports the clamper 228; . The biasing force of the cavity insert spring 230 is transmitted to the cavity insert 226 via the movable pin 236 . In addition, a clamper support portion 234 is inserted between the clamper 228 and the clamper spring 232 . Thus, a structure in which the clamper 228 is urged by the clamper spring 232 and the cavity insert 226 is urged by the cavity insert spring 230 can be achieved.

In addition, in this embodiment, the clamper spring 232 has a structure in which multiple types of springs (coil springs as an example) with different spring constants are provided, and one of them corresponding to the resin sealing condition is selected and detachably fixed to the spring. Upper mold 204. Because of this, the workpiece clamping force can be set/adjusted individually, so that conditions can be changed extremely easily so that an appropriate workpiece clamping force can be formed for each workpiece W.

Similarly, the cavity insert spring 230 has a structure in which various types of springs (coil springs as an example) with different spring constants are provided, and one corresponding to the resin sealing condition is selected from among them to be detachably fixed to the upper mold. 204. Due to this, the forming pressure can be set/adjusted individually, so that conditions can be changed extremely easily so that an appropriate forming pressure is formed for each workpiece W.

In addition, in this embodiment, an upper die heating mechanism for heating the upper die 204 to a predetermined temperature is provided. The upper mold heating mechanism includes a heater (such as an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control unit (none of which are shown in the figure). As an example, the heater is built in the upper plate 222 or a mold base (not shown) that accommodates them (not shown), and mainly applies heat to the entire upper mold 204 and the resin R (described later). Thereby, the upper mold 204 is adjusted and heated to a predetermined temperature (for example, 100° C. to 200° C.).

Moreover, in this embodiment, the film supply mechanism 110 which conveys (supplies) the roll-shaped film F which has no opening (hole) in the sheet surface to the inside of the sealing mold 202 is provided. The film supply mechanism 110 has a structure such that the unused film F is sent out from the unwinding unit 111 and supplied to the mold-opened sealing mold 202, and after being used for resin sealing in the sealing mold 202, it is used as the used film F. And it is wound up by the winding part 112. In addition, the unwinding part 111 and the winding part 112 may be arrange|positioned opposite to the Y direction, or may be arrange|positioned so that one film F may be supplied to the X direction (both are not shown in figure). In addition, as above-mentioned, instead of the roll-shaped film, the structure (not shown) using the elongated film may be employ|adopted.

Next, the lower mold 206 that seals the mold 202 will be described in detail. As shown in FIG. 3 , the lower die 206 includes a lower plate 224 , a holding plate 238 , and the like, and is constructed by assembling these. Here, the holding plate 238 is fixedly attached to the upper surface (surface on the upper die 204 side) of the lower plate 224 .

In addition, in this embodiment, one lower mold 206 is provided with one workpiece holding portion 205 for holding a plurality of workpieces W at predetermined positions on the upper surface of the holding plate 238 (a configuration in which a plurality of workpieces are provided (not shown in the figure) may also be adopted. Show)). A suction path (not shown) passing through the holding plate 238 and the lower plate 224 and communicating with a suction device is provided in the workpiece holding portion 205 as a mechanism for holding the workpiece W. Thereby, the workpiece W can be sucked and held on the mold surface 206 a (here, the upper surface of the holding plate 238 ). In addition, as a modified example, a structure (not shown) including holding claws for clamping the outer periphery of the workpiece W may be used in place of the above-described suction mechanism or in combination.

Here, in this embodiment, the structure of one upper mold 204 shown in FIG. 4 described above, that is, the structure in which multiple sets (two sets as an example) of cavities 208 are arranged side by side in the X direction (in FIG. 4 208A, 208B), one lower die 206 is provided with one workpiece holding portion 205 (see FIG. 1 ) capable of holding a plurality of (two, for example) workpieces W. Or, as a modified example, the structure of one upper mold 204 shown in FIG. 5 , that is, a structure in which multiple sets (four sets as an example) of mold cavities 208 are arranged side by side in a matrix on the X-Y plane (the structure of the mold cavity 208 in FIG. 5 208A, 208B, 208C, 208D) Correspondingly, one lower mold 206 is provided with a workpiece holding part 205 (not shown) capable of holding a plurality of (for example, four consisting of two columns x two rows) workpieces W ). In addition, it is not limited to the said structure, The structure (not shown) provided with the workpiece|work holding part which can hold several workpiece|work W in multiple numbers may be employ|adopted.

In addition, in this embodiment, a lower mold heating mechanism for heating the lower mold 206 to a predetermined temperature is provided. The lower mold heating mechanism includes a heater (such as an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control unit (none of which are shown in the figure). As an example, the heater is built into the lower plate 224 or a mold base (not shown) that accommodates them, and mainly applies heat to the entire lower mold 206 and the workpiece W. Thereby, the lower mold 206 is adjusted and heated to a predetermined temperature (for example, 100° C. to 200° C.).

As described above, according to the sealed mold 202 of this embodiment, "multi-row taking and molding" can be realized, that is, the number of molded products Wp for each set of sealed molds 202 can be set to multiple (two as an example). , four, etc.). Therefore, compared with the conventional apparatus in which the number of molded products operated is one, the number of times of supplying materials (work W, resin R, film F) to the sealing mold 202 can be reduced, thereby improving productivity. In addition, since the number of times of pressing (ie, the number of times the resin sealing step is performed) can be reduced, manufacturing costs can be reduced. In addition, it is possible to reduce the cost of the device by downsizing the entire device and simplifying the configuration.

(Molded product storage unit) Next, the storage unit 100C included in the resin sealing device 1 will be described.

The storage unit 100C includes a molded product storage 108 for housing the molded product Wp. As an example, a well-known stack cassette, a slot cassette, etc. can be used for the molded product storage 108, and can store a plurality of molded products Wp together. Here, the molded product Wp is conveyed by the molded product loader 124 , temporarily placed on the storage table 114 , and then loaded into the molded product stocker 108 .

In addition, in 100 C of storage units etc., the structure (not shown) provided with the inspection mechanism etc. which performs the visual inspection of the molded product Wp can also be employ|adopted.

(resin sealing action) Next, the operation of resin sealing using the sealing mold 202 of this embodiment and the resin sealing device 1 including the sealing mold 202 will be described. Here, an example is given of a structure in which two sets of cavities 208 are provided on one upper mold 204, and two workpieces W (e.g., elongated workpieces) are arranged side by side on one lower mold 206 to perform resin sealing together, Two molded products Wp are simultaneously obtained. However, it is not limited to the above-described configuration, and a configuration may be adopted in which one workpiece W is arranged, three or more workpieces W are arranged in parallel, or a plurality of workpieces W are arranged in a matrix and resin-sealed.

As a preparatory step, a heating step of adjusting and heating the upper mold 204 to a predetermined temperature (for example, 100° C. to 200° C.) by the upper mold heating mechanism (upper mold heating step) is carried out. In addition, a heating step (lower die heating step) of adjusting and heating the lower die 206 to a predetermined temperature (for example, 100° C. to 200° C.) by the lower die heating mechanism is performed. Furthermore, a step (film supply step) is carried out in which the film F is conveyed (sent out) from the unwinding portion 111 to the winding portion 112 by the film supply mechanism 110 to a predetermined position in the sealing mold 202 (upper mold 204 and position between the lower dies 206) to supply the film F.

Next, a step of unloading the workpieces W from the workpiece stocker 102 one by one by a known pusher (not shown) and placing them on the supply table 104 is carried out (a known pick-up mechanism or the like may also be used in combination).

Next, a step of supplying and placing a predetermined amount of resin R from the dispenser 106 onto the upper surface of the workpiece W placed on the supply table 104 is implemented. In addition, in the said process, you may implement the process of preheating at the temperature which does not harden resin R.

Next, a step is carried out in which a plurality of (two, for example) workpieces W (in a state where the resin R is placed on each upper surface) are loaded into the sealing mold 202 of the pressing unit 100B by the workpiece loader 122 in one step. The plurality of workpieces W are transported inside and placed on one workpiece holding portion 205 of one lower die 206 . In this step, a step of preheating the workpiece W with a heater provided on the workpiece loader 122 (preheating step) is performed. Furthermore, the preheating step may also be omitted.

Next, a step of closing the sealing mold 202 to clamp the workpiece W by the upper mold 204 and the lower mold 206 to perform resin sealing (resin sealing step) is carried out. At this time, in the cavity 208 , the cavity insert 226 is relatively lowered, and the resin R is heated and pressurized with respect to the workpiece W. As shown in FIG. Thereby, the resin R is thermally cured and resin-sealed (compression molding) is performed, and the molded article Wp is formed.

Next, the mold opening of the sealed mold 202 is carried out, and the molded product Wp is taken out from the sealed mold 202 by the molded product loader 124 . In this step, the molded product Wp taken out is heated by a heater provided on the molded product loader 124 (post-molding heating step).

Parallel to (or after) this, a step of sending the film F from the unwinding unit 111 to the winding unit 112 by the film supply mechanism 110 to send out the used film F is carried out.

Next, a step of placing the molded product Wp on the storage table 114 by the molded product loader 124 is carried out (in addition, a known pick-up mechanism or the like may be used in combination). Next, a step of carrying the molded products Wp into the molded product stocker 108 one by one by a known pusher or the like (not shown) is carried out. In addition, before these steps, the step of post-curing the molded article Wp may be implemented.

The above are the main operations of resin sealing performed using the resin sealing device 1 . However, the order of the steps described above is an example, and the order can be changed or implemented in parallel unless there is a hindrance. For example, in this embodiment, since it is a structure including two press units 100B, by performing the said operation|movement in parallel, a molded article can be formed efficiently.

[Second Embodiment] Next, a second embodiment of the present invention will be described. Compared with the first embodiment described above, the present embodiment has a structure to cope with a workpiece W having a different structure. Hereinafter, the difference will be mainly explained. Here, FIG. 7 shows a front sectional view (schematic view) of a sealing mold 202 according to the second embodiment.

The workpiece W to be molded in the present embodiment is characterized by having a structure in which a plurality of electronic components Wb are mounted on one base material Wa. Therefore, the workpiece holding unit 205 has a structure for holding one workpiece W. As shown in FIG. In addition, a structure (not shown) that holds a plurality of the workpieces W may also be employed.

At the same time, the clamper 228 is provided with a plurality of mutually divided structures for individually clamping a plurality of electronic components Wb of one workpiece W. As shown in FIG.

According to the above structure, the plurality of electronic components Wb can be individually and vertically movable by the divided clamper 228 . Therefore, when there is a step difference (difference in thickness) in one substrate Wa, or in the case where there is a difference in thickness for each of the plurality of electronic components Wb mounted on one substrate Wa, and the electronic components Wb mounted on the electronic If there is variation in the amount of resin R on each part Wb, either the size difference or the variation in the amount of resin can be absorbed, so resin sealing can be performed in an appropriate clamping state.

In addition, other configurations of this embodiment are the same as those of the first embodiment, and redundant descriptions are omitted.

As described above, according to the sealing mold and the resin sealing device including the sealing mold of the present invention, any one of variation in workpiece thickness, variation in electronic component thickness, and variation in resin amount can be absorbed with a simple device structure. Therefore, failures such as breakage of a thick workpiece or insufficient clamping force of a thin workpiece can be prevented, thereby improving molding quality. In addition, it is possible to easily and quickly set the workpiece clamping force and molding pressure during resin sealing by adjusting only one of the dies, thereby improving production efficiency.

In addition, this invention is not limited to the said embodiment, Various changes are possible in the range which does not deviate from this invention. In particular, the sealed mold including the cavity in the upper mold and the compression molding apparatus including the sealed mold have been described as examples, but it can also be applied to the sealed mold including the cavity in the lower mold and the compression molding apparatus including the sealed mold. .

1: Resin sealing device 100A: supply unit 100B: pressing unit 100C: storage unit 100D: Transfer mechanism 102: workpiece storage 104:Supply Workbench 106: Dispenser 108: Formed product storage 110: Membrane supply mechanism 111: roll out department 112:Coiling Department 114: storage workbench 122: Workpiece loader 122A: Workpiece holding part 122B: Workpiece holding part 124: Formed product loader 124A: Molded product holding part 124B: Molded product holding part 126: guide rail 202: sealing mold 204: upper mold 204a: mold surface 205: Workpiece holding part 206: Lower mold 206a: mold surface 208, 208A, 208B, 208C, 208D: cavity 222: upper board 224: lower board 226: Mold cavity insert 228: Holder 230: mold cavity insert spring 232: Gripper spring 234: Holder support part 236: movable pin 238: holding plate 240: cavity block 250: Die opening and closing mechanism 252: Fixed template (template) 254: Movable template (template) 256: Link mechanism 260: Drive source (electric motor) 262: Drive transmission mechanism (ball screw or toggle linkage) F: Release film (membrane) R: Resin W: workpiece (formed product) Wa: Substrate (glass or metal pallet) Wb: electronic parts Wp: molded product IV-IV: line X, Y, Z: directions

FIG. 1 is a plan view showing an example of a sealing mold and a resin sealing device according to a first embodiment of the present invention. Fig. 2 is a front sectional view showing an example of a mold opening and closing mechanism of the resin sealing device of Fig. 1 . Fig. 3 is a front sectional view showing an example of a sealing mold of the resin sealing device of Fig. 1 . FIG. 4 is an explanatory plan view showing an example of an upper mold of the resin sealing device shown in FIG. 1 . FIG. 5 is an explanatory plan view showing another example of the upper mold of the resin sealing device in FIG. 1 . 6A and 6B are explanatory plan views showing another example of the upper mold of the resin sealing device of FIG. 1 . Fig. 7 is a front sectional view showing an example of a sealed mold according to a second embodiment of the present invention.

202: sealing mold 204: upper mold 204a: mold surface 205: Workpiece holding part 206: Lower mold 206a: mold surface 208, 208A, 208B: cavity 222: upper board 224: lower board 226: Mold cavity insert 228: Holder 230: mold cavity insert spring 232: Gripper spring 234: Holder support part 236: movable pin 238: holding plate 240: cavity block F: Release film (membrane) R: Resin W: workpiece (formed product) Wa: Substrate (glass or metal pallet) Wb: electronic parts IV-IV: line X, Y, Z: direction

Claims (8)

A sealed mold includes an upper mold and a lower mold, and processes a molded product by sealing a workpiece with a resin, wherein the sealed mold is characterized in that the upper mold and the lower mold include any one of the following structures : One of them is provided with a workpiece holding part for holding a plurality of workpieces, and the other is provided with a plurality of clampers and cavity inserts, and the plurality of clampers have a pair of one of the workpieces. The plurality of workpieces held by the workpiece holding part are separated from each other, and the cavity insert is not linked to the gripper at the central position of each of the plurality of grippers in plan view. Can move up and down, or one of them is provided with a workpiece holding part that holds one or more of the workpieces. Among the workpieces, a plurality of electronic components are mounted on one base material, and the other is provided with multiple electronic components. a clamper and a mold cavity insert, the plurality of clampers have mutually divided structures for individually clamping a plurality of the electronic parts in one of the workpieces, and the mold cavity insert is used in multiple mold cavity inserts Each of the grippers can be moved up and down without interlocking with the grippers at their central positions in plan view, and the sealing mold includes a gripper spring that urges the grippers toward the workpiece holding portion; a cavity insert spring that urges the cavity insert toward the workpiece holding portion; and a movable pin that passes through the clamper spring and is disposed so as to be movable up and down, and moves the cavity insert via the movable pin. The applied force of the cavity insert spring is transmitted to the cavity insert The structure of the piece. The sealed mold according to claim 1, wherein the plurality of holders are arranged in parallel in one predetermined direction, or arranged in a matrix in a horizontal plane. The sealed mold according to claim 1, wherein the clamper spring consists of one spring arranged in line with the center of the mold cavity insert spring in plan view or multiple springs arranged in such a way as to surround the mold cavity insert spring composed of springs. The sealing mold according to claim 1 further includes a clamper supporting portion that supports the clamper, and the movable pin that penetrates the clamper supporting portion and is disposed so as to be movable up and down. The sealing mold according to claim 1 has the following structure: the clamping force of the workpiece during resin sealing is set by the clamper spring, and the molding during resin sealing is set by the cavity insert spring pressure. The sealing mold according to claim 5, wherein the clamper spring has a structure in which various springs with different spring constants are provided, and one corresponding to the resin sealing condition is selected to be detachably fixed to the upper mold or the other of the lower dies. The sealed mold according to claim 5, wherein the mold cavity insert spring has the following structure: a variety of springs with different spring constants are provided, and one corresponding to the resin sealing condition is selected to be detachably fixed on the other of the upper mold or the lower mold. A resin sealing device, comprising the sealing mold according to any one of Claim 1 to Claim 7.