KR20210018755A - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

The present invention is to prevent a sheet-shaped resin from being bent, wrinkled, or damaged while supplying the sheet-shaped resin into a mold frame. An apparatus for molding a resin includes: a first mold frame (15) and a second mold frame (16) opposite to each other; a frame-coupling mechanism (17) to frame-couple the first mold frame (15) to the second mold frame (16); and a resin supply mechanism (2) to supply a sheet-shaped resin (J) to the first mold frame (15) or the second mold frame (16). The resin supply mechanism (2) includes a suctioning member (31) having a suction hole (311) to suction one surface of the sheet-shaped resin (J) having an opposite surface on which a protective film (PF) is provided.

Description

A resin molding apparatus and a manufacturing method of a resin molded product TECHNICAL FIELD [RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD]

The present invention relates to a resin molding apparatus and a method for producing a resin molded article.

As a conventional resin molding apparatus, as shown in Patent Document 1, it is considered to perform resin molding using a sheet-like resin.

This resin molding apparatus is configured to collectively carry a plurality of sheet-shaped resins, which have been optimally metered and cut according to the package in advance, into a plurality of cavities provided in the lower frame, and by using the sheet-shaped resin as the resin material, the measurement accuracy is improved. Increasingly, the amount of resin supplied to each cavity is uniform.

Japanese Unexamined Patent Application Publication No. 2003-133350

However, the sheet-shaped resin is provided with a protective film on one or both sides thereof, and the protective film must be peeled off from the sheet-shaped resin before being supplied to a molding frame such as a lower frame. Since the sheet-like resin is so soft and soft that it cannot maintain its shape, the sheet-like resin is easily bent (broken and bent) when peeling off or after the protective film is peeled off, it is easy to be wrinkled (wrinkled), and is easily broken. In particular, the larger the substrate or the wafer as the object to be molded, the larger the sheet-shaped resin, so these problems become remarkable. For this reason, it is difficult to supply the sheet-like resin from which the protective film has been peeled off to the molding mold in an appropriate state, and as a result, it becomes a cause of molding failure.

Therefore, the present invention has been made in order to solve the above problems, and its main object is to supply the sheet-shaped resin to the molding mold by suppressing the bending, wrinkle, or breakage of the sheet-shaped resin.

That is, the resin molding apparatus according to the present invention comprises a first molding frame and a second molding frame facing each other, and the first molding frame and the second molding frame, which are frame-fastened (die-clamping). ) A frame fastening mechanism and a resin supply mechanism for supplying a sheet-shaped resin to the first or second molding mold, wherein the resin supply mechanism includes the sheet-shaped resin provided with a protective film on one side. And an adsorption member provided with adsorption holes for adsorbing the other side of the device.

Advantageous Effects of Invention According to the present invention, the sheet-shaped resin can be supplied to a molding mold by suppressing bending, wrinkle, or breakage of the sheet-shaped resin.

1 is a plan view schematically showing a configuration of a resin molding apparatus according to the present embodiment.
2 is a cross-sectional view schematically showing a configuration of a resin molding module according to the same embodiment.
Fig. 3 is a perspective view schematically showing a state of sheet-like resin (a) before peeling off the protective film and (b) crumpled (wrinkled) state by peeling off the protective film.
4 is a perspective view schematically showing a configuration of an adsorption mechanism of the same embodiment.
Fig. 5 is a plan view schematically showing a configuration of an adsorption mechanism of the same embodiment.
6 is a cross-sectional view schematically showing a configuration of an adsorption mechanism of the same embodiment.
Fig. 7 is a partially enlarged cross-sectional view schematically showing irregularities on the surface of the adsorption member of the same embodiment.
8 is a schematic diagram showing the operation of resin molding in the same embodiment.
9 is a cross-sectional view schematically showing a state in which the suction member of the same embodiment is positioned on the lower frame.
10 is a cross-sectional view schematically showing a configuration of an adsorption mechanism according to a modified embodiment.

Next, the present invention will be described in more detail by way of example. However, the present invention is not limited by the following description.

The resin molding apparatus of the present invention, as described above, includes a first molding frame and a second molding frame facing each other, and a frame fastening mechanism for clamping the first and second molding frames, And a resin supply mechanism for supplying a sheet-shaped resin to the first molding frame or the second molding frame, and the resin supplying mechanism is the other side of the sheet-shaped resin having a protective film provided on one side thereof. It characterized in that it comprises an adsorption member formed with adsorption holes for adsorbing.

In the case of the resin molding apparatus configured as described above, since the protective film can be peeled off from the sheet-shaped resin while the other surface of the sheet-shaped resin with the protective film on one side is adsorbed to the adsorption member, the protective film can be peeled off or after The shape of the sheet-like resin can be maintained. Thereby, the sheet-like resin can be supplied to the molding mold by suppressing the bending, wrinkle, or breakage of the sheet-like resin. As a result, it is possible to reduce molding defects in resin molding using a sheet-like resin.

In addition, since sheet-shaped resin is used as the resin material, the supply amount of the resin material into the mold can be made uniform compared to the case of using a liquid resin or a granular resin. It can also respond to demands such as wanting to be thinner.

In order to reliably adsorb the sheet-like resin to the adsorption member, it is preferable that a plurality of unevenness is formed on the surface of the adsorption member on which the adsorption holes are formed.

In this configuration, a gap is created between the adsorption member and the sheet-like resin by a plurality of irregularities, and air is sucked through the adsorption hole also from the gap. As a result, the sheet-like resin is adsorbed not only from the adsorption hole but also from the concave portion, so that the hydraulic pressure area of the sheet-like resin increases, and the sheet-like resin can be reliably adsorbed to the adsorption member. In addition, since the pressure applied to the sheet-like resin is dispersed, it is possible to reduce the deformation or damage of the sheet-like resin, and at the same time, it is possible to suppress the trouble that the sheet-like resin is difficult to be peeled off (by penetrating) into the suction hole. I can.

It is preferable that a plurality of the adsorption holes are formed in the adsorption member.

By forming a plurality of adsorption holes in the adsorption member in this way, the pressure that the sheet-like resin receives from each adsorption hole can be reduced. As a result, it is possible to reduce the deformation and damage of the sheet-like resin, and at the same time, it is possible to suppress a trouble that the sheet-like resin gets stuck in the suction hole and becomes difficult to peel off.

When one suction passage is connected to the plurality of suction passages, the suction force varies in the suction hole located near the suction passage and the suction hole located far from the suction passage. In order to solve this problem and suppress variations in the adsorption force of the plurality of adsorption holes, it is preferable that the resin supply mechanism has a plurality of suction flow paths communicating with the plurality of adsorption holes.

When supplying the adsorbed sheet-like resin to the molding mold, it is assumed that the sheet-like resin cannot be reliably separated by simply releasing the adsorption. In addition, when the sheet-like resin is separated from (moved away) from the adsorption member, the sheet-like resin is partially curled (wasted), and the sheet-like resin supplied to the mold may be bent or wrinkled.

In order to solve these problems, it is preferable that the adsorption member is configured to be capable of ejecting gas onto the other side of the adsorbed sheet-like resin.

With this configuration, since gas is sprayed on the other side of the adsorbed sheet-like resin, the sheet-like resin can be reliably separated from the adsorption member, and the sheet-like resin after the fall is partially curled (wet) and bent. It can be suppressed from becoming wrinkled or wrinkled.

As a specific embodiment of enabling gas to be ejected from the adsorption member, it is conceivable that the adsorption member has a gas ejection hole formed on the other side of the adsorbed sheet-like resin to eject gas.

At this time, in order to simplify the configuration of the adsorption member, it is preferable that the adsorption hole is used as the gas ejection hole. In addition, since the portion of the sheet-like resin pinched into the adsorption hole is directly pushed by the gas, the sheet-like resin can be surely separated from the adsorption member.

In order to accurately supply the sheet-shaped resin to the molding die, it is preferable to first adsorb the sheet-shaped resin in a position aligned with the adsorption member. In order to facilitate this alignment, it is preferable that the suction member has a mark portion for aligning the sheet-like resin.

In addition, the method for manufacturing a resin molded article according to the present invention is a method for manufacturing a resin molded article in which a first mold and a second mold are joined to each other, and a protective film is provided on one side. An adsorption preservation step of adsorbing the other side of the sheet-like resin to the adsorption member and preserving and retaining the sheet-like resin, and peeling off the protective film from the sheet-like resin adsorbed and retained by the adsorption member A resin supply step of supplying the sheet-shaped resin from which the protective film has been peeled off to the first molding frame or the second molding frame, and the first and second molding frames It is characterized in that it comprises a resin molding step of fastening and performing resin molding using the sheet-like resin.

In the case of such a method for manufacturing a resin molded article, as in the resin molding apparatus described above, the protective film can be peeled off from the sheet-shaped resin in a state where the other side of the sheet-shaped resin having a protective film on one side is adsorbed to the adsorption member. The shape of the sheet-like resin can be maintained when peeling off or after peeling off the protective film. Thereby, the sheet-like resin can be supplied to the molding mold by suppressing the bending, wrinkle, or breakage of the sheet-like resin. As a result, it is possible to reduce molding defects in resin molding using a sheet-like resin.

In order to accurately supply the sheet-shaped resin to the molding mold, in the resin supply step, it is preferable to position the suction member with respect to the first molding mold or the second molding mold.

The adsorption member is configured to be capable of ejecting gas onto the other side of the adsorbed sheet-like resin, and releases adsorption in the adsorption storage and maintenance step in the resin supply step, and the other side It is preferable that gas is blown out to supply the sheet-shaped resin to the first molding mold or the second molding mold.

With this configuration, gas is injected onto the other side of the adsorbed sheet-like resin, so that the sheet-like resin can be reliably separated from the adsorption member, and the sheet-like resin is partially curled and bent or wrinkled. I can do it.

<One embodiment of the present invention>

Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. In addition, in order to make it easy to understand, any drawings shown below are appropriately omitted or exaggerated and schematically illustrated. For the same constituent elements, the same reference numerals are attached and descriptions thereof are appropriately omitted.

<Overall configuration of resin molding apparatus 100>

The resin molding apparatus 100 of the present embodiment manufactures a resin molded article P by sealing the component mounting surface on which the electronic component is mounted with a resin to the substrate W on which the electronic component is mounted. Further, examples of the substrate include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, and a lead frame.

As shown in Fig. 1, the resin molding apparatus 100 includes a substrate supply/storage module A, two resin molding modules B, and a resin supply module C as constituent elements, respectively. do. Each component (each module (A to C)) is detachable and replaceable for each component.

The operation control of the resin molding apparatus 100 including each of the modules A to C shown below is performed by, for example, a control unit CTL provided in the substrate supply/storage module A. This control unit CTL may be provided in modules B and C other than the substrate supply/storage module A. Further, the control unit CTL may be divided into a plurality and provided in at least two modules of the substrate supply/storage module A, the resin molding module B, and the resin supply module C.

<Substrate supply and storage module (A)>

As shown in Fig. 1, the substrate supply/storage module A includes a substrate supply unit 11 for supplying a pre-sealing substrate W, and a sealed substrate W (resin molded product). P)), a substrate storage unit 13 for exchanging (receiving and handing over) the pre-sealing substrate W and the resin molded product P, and the pre-sealing It has a board|substrate conveyance mechanism 14 which conveys the board|substrate W and the resin molded article P. The substrate mounting unit 13 moves in the Y direction between a position corresponding to the substrate supply unit 11 and a position corresponding to the substrate storage unit 12 in the substrate supply/storage module A. The substrate transfer mechanism 14 moves in the X direction and the Y direction in the substrate supply/storage module A and each of the resin molding modules B.

<Resin Molding Module (B)>

Each resin molding module (B), as shown in Figs. 1 and 2, the lower frame 15, which is the first molding frame in which the cavity 15C is formed, and the second frame for storing and maintaining the substrate W. It has an upper frame 16, which is a forming frame, and a frame fastening mechanism 17 for clamping the lower frame 15 and the upper frame 16.

The frame fastening mechanism 17 includes a movable panel 171 on which the lower frame 15 is mounted, an upper fixed panel 172 on which the upper frame 16 is mounted, and a movable panel ( It has a drive mechanism 173 for moving the 171 up and down.

The movable panel 171 is one on which the lower frame 15 is mounted on its upper surface, and is supported so as to be moved up and down by a plurality of support portions 175 erected on the lower fixed panel 174.

The upper fixed plate 172 is one on which the upper frame 16 is mounted on its lower surface, and is fixed so as to face the movable plate 171 at the upper end of the plurality of support portions 175.

The driving mechanism 173 is provided between the movable panel 171 and the lower fixed panel 174, and the lower frame 15 and the upper frame 16 are frame-fastened by lifting and moving the movable panel 171 At the same time, a predetermined molding pressure is applied. The drive mechanism 173 of the present embodiment is of a linear motion method that transmits the rotation of a servomotor to the movable panel 171 using a ball screw mechanism that converts rotation into linear motion, but a power source such as a servo motor is used as an example. It may be of a link system transmitted to the movable panel 171 using a link mechanism such as a toggle link.

In addition, between the lower frame 15 and the movable panel 171, a lower frame storage and holding unit 176 is provided. The lower frame storage and holding unit 176 includes a heater plate 176a for heating the lower frame 15, a heat insulating member 176b provided on the lower surface of the heater plate 176a, and an upper surface of the heater plate 176a. It has a side wall member 176c which is provided in and surrounds the periphery of the lower frame 15, and a seal member 176d provided at the upper end of the said side wall member 176c.

Between the upper frame 16 and the upper fixing plate 172, an upper frame preserving and holding part 177 is provided. The upper frame storage and holding unit 177 includes a heater plate 177a for heating the upper frame 16, a heat insulating member 177b provided on the upper surface of the heater plate 177a, and a lower surface of the heater plate 177a. It has a side wall member 177c provided in the upper frame 16 and surrounds the periphery of the upper frame 16, and a seal member 177d provided at the lower end of the side wall member 177c. Then, when the frame is fastened by the drive mechanism 173, the seal member 176d of the side wall member 176c and the seal member 177d of the side wall member 177c are in close contact with each other, so that the lower frame 15 and the upper frame ( The space to accommodate 16) is blocked from outside air. Moreover, it is good also as a structure which does not provide either the seal member 176d or the seal member 177d.

The upper frame 16 adsorbs and holds the back surface of the substrate W. A suction hole (not shown) is formed on the lower surface of the upper frame 16, and a suction flow path (not shown) is formed inside the upper frame 16. This suction passage is connected to an external suction device (not shown).

In the lower frame 15, as shown in Fig. 2, a cavity 15C for accommodating an electronic component and a resin material mounted on the substrate W is formed. Specifically, the lower frame 15 includes a bottom member 151 that is a single member that forms a bottom surface of the cavity 15C, and a side member 152 surrounding the bottom member 151. A cavity 15C is formed by the upper surface of the bottom member 151 and the inner peripheral surface of the side member 152. The bottom member 151 of the present embodiment is a flat plate forming a rectangular shape when viewed in a plan view, and the side member 152 forms a rectangular frame shape when viewed in a plan view. Further, the side member 152 is provided so as to be able to move up and down relative to the bottom member 151. Specifically, the base plate 153 of the lower frame 15 is supported by a plurality of elastic members 154 such as coil springs.

<Resin supply module (C)>

As shown in FIG. 1, the resin supply module C has a resin supply mechanism 2 for supplying a sheet-shaped resin J as a resin material to the lower frame 15.

Here, if the sheet-shaped resin (J) is described, as shown in Fig. 3(a), the sheet-shaped resin (J) is protected from dirt or damage on one or both sides of the sheet-shaped resin (J). A protective film PF is provided for the purpose, and it is necessary to peel off the protective film PF before supplying it to the lower frame 15. In addition, in FIG. 3(a), what is provided with the protective film PF on one surface of the sheet-shaped resin J is illustrated. The sheet-shaped resin (J) has a thickness or flexibility that cannot maintain its shape, and when the protective film (PF) is peeled off, as shown in Fig. 3(b), it is bent and wrinkled (wrinkled). It is easy to lose.

Specifically, the resin supply mechanism 2, as shown in Fig. 1, the adsorption mechanism 3 for adsorbing the other side of the sheet-shaped resin (J) provided with a protective film (PF) on one side, and the adsorption It has a moving mechanism 4 for moving the mechanism 3.

In addition, the other surface of the sheet-shaped resin J is an exposed surface on which the protective film PF is not provided, and in the following description, the other surface of the sheet-shaped resin J is referred to as an exposed surface.

The adsorption mechanism 3 is provided with an adsorption member 31 in which adsorption holes 311 are formed as shown in FIGS. 4 to 6. The adsorption member 31 is formed with a plurality of adsorption holes 311 for adsorbing the exposed surface of the sheet-like resin J. Specifically, the adsorption member 31 has a planar adsorption storage surface 31X for adsorbing and holding the sheet-shaped resin J, and a plurality of adsorption holes 311 in the adsorption storage surface 31X. ) Is open. The plurality of adsorption holes 311 are formed, for example, in the same opening shape (for example, a circular shape). The adsorption member 31 of the present embodiment has a flat plate shape (plate shape), and one surface (upper surface) thereof serves as the adsorption storage surface 31X. In this adsorption storage surface 31X, the plurality of adsorption holes 311 are regularly disposed, for example, in plan view, and are disposed at equal intervals along each of the directions (vertical and horizontal) perpendicular to each other. Yes (see Fig. 5).

And, on the surface (lower surface) of the suction member 31 on the opposite side to the suction storage surface 31X, a space-forming member for forming an inner space 3S communicating with the plurality of suction holes 311 ( 32) is provided. The space forming member 32 is connected to a vacuum generator 33 including a vacuum ejector for exerting a suction force on the exposed surface of the sheet-shaped resin J from the suction hole 311 via the inner space 3S. . Moreover, this space-forming member 32 is connected to the rotation shaft member 37 and the support member 38 mentioned later. In addition, the vacuum generator 33 is provided so as to be movable together with the suction member 31.

Further, the vacuum generator 33 and the internal space 3S are connected by a suction flow path 34. In this embodiment, a plurality of suction passages 34 communicating with the plurality of suction holes 311 are provided. Each suction flow path 34 communicates with the internal space 3S by being connected to the space forming member 32. In addition, each suction passage 34 is connected to correspond to a plurality of suction regions set on the suction storage surface 31X. For example, on the adsorption storage surface 31X, a central area set at the center and a plurality of surrounding areas set around the center area are set, and the suction flow path 34 is connected to each of these areas. I think. Thereby, compared with the case where suction is performed by one suction flow path 34, the suction force of the whole suction storage surface 31X can be made uniform. Further, the plurality of suction flow paths 34 may be configured by pipes, some of which are common pipes and connected to the vacuum generator 33. Further, the inner space 3S formed by the space forming member 32 may be partitioned (division) into a plurality of spaces corresponding to a plurality of adsorption regions.

In addition, as shown in FIG. 7, a plurality of irregularities 35 are formed on the surface of the suction member 31 on which the suction hole 311 is formed (the suction storage surface 31X). The plurality of irregularities 35 are formed by blasting, for example. By forming the unevenness 35 as described above, a gap S communicating with the suction hole 311 is formed between the concave portion and the exposed surface of the sheet-like resin J. As a result, the adsorption force from the adsorption hole 311 acts on a portion of the exposed surface that does not face the adsorption hole 311 via the gap S. As a result, the sheet-like resin J is adsorbed not only from the adsorption hole 311 but also from the recess, so that the pressure-receiving area of the sheet-like resin J increases, and the sheet-like resin with respect to the adsorption member 31 ( J) can be reliably adsorbed. In addition, the plurality of irregularities 35 are not limited to those formed by blast processing, but may be formed by other surface processing, and by using a material having a large surface roughness (roughness), the plurality of irregularities 35 A plurality of irregularities may be formed.

Further, the adsorption member 31 is configured to be capable of ejecting gas (for example, air) onto the exposed surface of the adsorbed sheet-like resin J. Specifically, in the adsorption member 31, a gas ejection hole for ejecting gas is formed on the exposed surface of the adsorbed sheet-like resin J. In this embodiment, the plurality of adsorption holes 311 are used as gas ejection holes. Then, by switching a switching valve (not shown) provided in the suction flow path 34, the gas is blown from the plurality of suction holes 311 using the vacuum generator 33. For example, the suction fluid circuit in which the suction port of the vacuum ejector in the vacuum generator 33 is connected to the inner space 3S by a piping configuration consisting of a suction flow path 34 and a switching valve provided in the suction flow path 34 Wow, the fluid circuit for jetting in which the exhaust port of the vacuum ejector in the vacuum generator 33 is connected to the inner space 3S is configured to be switched. By injecting gas onto the exposed surface of the sheet-like resin J adsorbed in this way, the sheet-like resin J can be reliably separated from the adsorption member 31, and the sheet-like shape after being separated (distant). It is possible to suppress the resin (J) from being partially curled (dipped) and bent or wrinkled. In addition, a compressed air supply for ejecting gas may be connected to the vacuum generator 33 separately from the vacuum ejector. As the compressed air supply unit, it is conceivable to use a compressor, compressed air piped in a factory, or the like.

Further, the adsorption member 31 is provided with an eye face portion 36 for aligning the sheet-like resin J as shown in FIGS. 4 and 5. The eye face portion 36 of the present embodiment is a plurality of scales provided on the above-described suction storage surface 31X, and is provided along directions perpendicular to each other on the suction storage surface 31X. In addition, as for the eye surface part 36, if it is an eye mark (target) for aligning the sheet-shaped resin J, it does not necessarily have to be a scale, and for example, a mark provided at a certain distance apart. You may use various things, such as.

The above-described adsorption member 31 is configured so that the adsorption storage surface 31X can be vertically reversed. Specifically, the adsorption member 31 is rotatably supported by the support member 38 by a rotation shaft member 37 parallel to the adsorption storage surface 31X, as shown in FIGS. 4 to 6, The rotation shaft member 37 can be vertically reversed. Here, the rotation shaft member 37 is provided so as to pass through the center of the suction storage surface 31X when viewed from the plane of the suction storage surface 31X. The rotation shaft member 37 of the present embodiment is configured to support the adsorption member 31 by being connected to the space forming member 32, but may be connected to the adsorption member 31. Further, the vertical reversing operation of the suction member 31 is configured to be manually performed by the handle 37H provided on the rotary shaft member 37, but may be configured to be automatically reversed using a motor or the like.

As shown in FIG. 1, the moving mechanism 4 of the adsorption mechanism 3 includes the adsorption mechanism 3, a receiving position where the adsorption member 31 receives the sheet-shaped resin J, and the adsorption member ( 31) from the sheet-shaped resin (J) to the lower frame (15) is to move between the delivery (hand over) position and, in the resin supply module (C) and each resin molding module (B), It is configured to move in at least the X and Y directions. The moving mechanism 4 of the present embodiment is configured to move the suction member 31 having the sheet-shaped resin J adsorbed and held therein to a delivery position set above the lower frame 15. This receiving position is set above the lower frame 15 that is open, and the position where the adsorbed sheet-shaped resin J is directly above the cavity 15C of the lower frame 15 to be. In addition, in FIG. 1, for convenience of explanation, the movement path of the movement mechanism 4 and the movement path of the substrate transfer mechanism 14 are partly common, but are not limited thereto.

<Operation of the resin molding apparatus 100>

The operation of resin molding (resin sealing) in the resin molding apparatus 100 will be described with reference to FIG. 8.

First, in the substrate supply/storage module A, the substrate W before sealing is delivered from the substrate supply unit 11 to the substrate mounting unit 13. Next, the substrate transfer mechanism 14 in a predetermined standby position is moved to receive the pre-sealing substrate W from the substrate mounting portion 13. Then, the substrate transfer mechanism 14 is moved to the resin molding module B, and the pre-sealing substrate W is stored and held in the open upper frame 16. After that, the substrate transfer mechanism 14 is returned to a predetermined standby position.

In the resin supply module C, the adsorption mechanism 3 is placed on standby at a predetermined receiving position. Then, the sheet-shaped resin J provided with the protective film PF on one side is placed so that the exposed surface thereof contacts the adsorption storage surface 31X of the adsorption member 31 (<placement step in FIG. 8>). ). At this time, the sheet-shaped resin J is positioned at a desired position on the adsorption storage surface 31X while looking at the eye surface 36 such as a scale provided on the adsorption storage surface 31X. Here, since the protective film PF is provided on one side of the sheet-shaped resin J, the sheet-shaped resin J is hardly deformed and its handling is easy. In addition, when the protective film PF is provided on both surfaces of the sheet-like resin J, after peeling off the protective film PF on one side, the exposed surface thereof is placed in contact with the adsorption storage surface 31X.

Next, the suction operation by the vacuum generator 33 is started, the exposed surface of the sheet-like resin J is adsorbed to the adsorption member 31, and the sheet-like resin J is adsorbed and held (Fig. 8). <Adsorption preservation maintenance step>). At this time, since the adsorption force from the plurality of adsorption holes 311 acts on the exposed surface of the sheet-shaped resin J, and the unevenness 35 is provided on the adsorption storage surface 31X, its adsorption force It is transmitted to the exposed surface of the sheet-shaped resin J through the gap S between the concave portion and the sheet-shaped resin J, and the entire exposed surface is adsorbed on the adsorption storage surface 31X.

In this way, in the state where the sheet-like resin J is adsorbed and held by the adsorption member 31, the protective film PF provided on one side (upper surface) of the sheet-like resin J is manually or automatically peeled off ( <Peeling step> in FIG. 8). Thereby, the protective film PF is removed from the sheet-like resin J.

Subsequently, the adsorption member 31 having the sheet-shaped resin J adsorbed therein is rotated 180 degrees around the rotation shaft member 37 so as to be vertically inverted so that the sheet-shaped resin J is placed downward. After making this state, the adsorption mechanism 3 is moved from the resin supply module C to the resin molding module B by the movement mechanism 4 (<moving step> in FIG. 8).

In this moving step, the suction mechanism 3 is moved by the moving mechanism 4 to a delivery position where the sheet-shaped resin J is transferred to the open lower frame 15. Here, in this embodiment, in order to position the suction member 31 with respect to the lower frame 15, the positioning part 39 is provided in the suction member 31 (see Fig. 4 and the like). The positioning part 39 is, for example, a convex part, and as shown in FIG. 9, the lower frame 15 or the lower frame 15 is configured to be engaged with the concave part 15M provided in an integral member. Has been. For this reason, the moving mechanism 4 lowers the suction mechanism 3 in the Z direction above the lower frame 15 where the frame is opened, and engages the positioning portion 39 with the recessed portion 15M. , The suction member 31 is positioned relative to the lower frame 15. This positioned state is a delivery position where the suction member 31 passes the sheet-shaped resin J. Further, the lower frame 15 may be raised in the Z-direction so that the positioning portion 39 may be engaged with the recessed portion 15M. Further, the support member 38 may be provided with a guide portion, and the guide portion may be positioned so as to contact and slide with respect to a partial surface of the lower frame 15.

After that, the suction operation by the vacuum generator 33 is stopped, and the adsorption of the sheet-like resin J is released. In addition, after the adsorption is released, the exhaust port of the vacuum generator 33 is communicated with the internal space 3S to start the discharge operation by the vacuum generator 33, and the sheet-shaped resin from the adsorption hole 311 Gas (air) is ejected on the exposed surface of (J). Thereby, the sheet-shaped resin J is peeled off from the adsorption storage surface 31X and falls, and the sheet-shaped resin J is supplied to the cavity 15C of the lower frame 15 (Fig. 8, <resin supply Step>). Further, before supplying the sheet-shaped resin J to the cavity 15C of the lower frame 15, a release film may be provided on the lower frame 15.

After the sheet-shaped resin J is supplied, the adsorption mechanism 3 moves to the resin supply module C by the movement mechanism 4 and returns to the above-described receiving position. The adsorption member 31 of the adsorption mechanism 3 that has returned to the receiving position is reversed up and down again so that the adsorption storage surface 31X faces upward.

After the above process, in the resin molding module (B), by raising the movable panel 171 by the drive mechanism 173, the seal member 177d of the upper frame storage and holding unit 177 and the lower frame storage and holding unit A sealed space is formed by bringing the sealing member 176d of 176 into close contact. In this state, the sealed space is made into a vacuum state by an exhaust mechanism (not shown).

Further, the movable panel 171 is further raised by the driving mechanism 173, so that the side member 152 is pressed against the upper frame 16 to compress and deform the elastic member 154, and at the same time, the electronic component of the substrate W This resin material is immersed in the sheet-shaped resin J, and the component mounting surface of the substrate W is coated with the sheet-shaped resin J. In this state, the lower frame 15 and the upper frame 16 are clamped by a predetermined molding pressure (<resin molding step> in Fig. 8). After a predetermined time has elapsed, the lower frame 15 is lowered by the frame fastening mechanism 17 to open the lower frame 15 and the upper frame 16. In addition, during the fastening of the frame, the sealed space may be returned to atmospheric pressure.

Next, the substrate transfer mechanism 14 of the substrate supply/storage module A is moved to receive the sealed substrate W from the open upper frame 16. The substrate transfer mechanism 14 is moved to the substrate mounting portion 13 and the sealed substrate W is handed over to the substrate mounting portion 13. The encapsulated substrate W is accommodated in the substrate storage unit 12 from the substrate mounting unit 13. In this way, the resin sealing using the sheet-like resin (J) is completed.

<Effect of this embodiment>

According to the resin molding apparatus 100 of the present embodiment, from the sheet-shaped resin J in a state where the exposed surface of the sheet-shaped resin J provided with the protective film PF on one side is adsorbed by the adsorption member 31. Since the protective film PF can be peeled off, the shape of the sheet-like resin J can be maintained when peeling off or after peeling off the protective film PF. Thereby, the sheet-like resin J can be supplied to the lower frame 15 by suppressing the bending, wrinkle, or breakage of the sheet-like resin J. As a result, it is possible to reduce molding defects in resin molding using the sheet-like resin (J).

In addition, since the sheet-shaped resin (J) is used as the resin material, the amount of the resin material supplied into the cavity 15C of the lower frame 15 can be made uniform compared to the case where a liquid resin or a granular resin is used. It can also meet demands such as wanting to make resin molded products thinner.

<Other modified embodiments>

In addition, this invention is not limited to the said embodiment.

For example, the adsorption member 31 of the above embodiment has a flat plate shape having an adsorption hole 311 for adsorbing the sheet-like resin J, but may have other shapes. Further, as the adsorption member 31, a material made of a porous material (porous material) may be used, and in this case, the plurality of pores of the porous material serve as adsorption holes 311.

In addition, in the above embodiment, the adsorption mechanism 3 is automatically moved to the resin molding module B by the moving mechanism 4, but the adsorption mechanism 3 is manually moved to the resin molding module B. In the case of a configuration in which the adsorption mechanism 3 is moved, a configuration without the moving mechanism 4 for moving the suction mechanism 3 may be used.

In the case of a configuration in which the adsorbed sheet-like resin J is supplied to the lower frame 15 by natural dropping, the adsorption member 31 may not be configured to be capable of ejecting gas (air). In addition, the adsorption mechanism 3 mechanically presses the adsorbed sheet-like resin J with a pressing member (not shown), so that the sheet-like resin J is removed from the adsorption member 31. A separating configuration may be provided.

The resin supply mechanism 2 of the above embodiment was to supply the sheet-shaped resin J to the lower frame 15, but may be supplied to the upper frame 16, and the pair of molding frames is different from the vertical direction. If they are arranged opposite to each other in the direction, they may be supplied to at least one of the molds.

In addition, the size, arrangement, and shape of the plurality of adsorption holes 311 are not limited to the above embodiment. For example, the size of the adsorption holes 311 may be different depending on the different areas (for example, the center area and the surrounding area) of the adsorption storage surface 31X, and the number (density) per unit area may be different. You can do it. In addition, the plurality of adsorption holes 311 need not necessarily be arranged along a direction orthogonal to each other. For example, they may be arranged in a columnar shape or a vortex shape, and may be irregularly arranged. It may be arranged. In addition, the suction hole 311 is not limited to a circular shape, and may be suitably changed to a long hole shape, an ellipse shape, a square shape, a polygonal shape, or the like.

In the above embodiment, the adsorption member 31 has a configuration having a plurality of adsorption holes 311, but may have one adsorption hole 311. In this case, for example, the sheet-shaped resin J can be adsorbed over a wide range by making the suction hole 311 a sinuous long hole or a spiral long hole.

In the above embodiment, the space forming member 32 is provided in the suction member 31 to form the inner space 3S. However, without providing the space forming member 32, the suction member 31 is adsorbed. It may be configured to connect the suction flow path 34 to the hole 311.

In the above embodiment, the suction hole 311 is also used as a gas blowing hole, but a gas blowing hole may be provided separately from the suction hole 311.

Further, in the above embodiment, the vacuum generator 33 including a vacuum ejector is used as a suction source for sucking air from the suction hole 311, but a vacuum pump may be used. In the case of using a vacuum pump, it is conceivable that the suction flow path 34 connected to the vacuum pump is constituted by a flexible pipe so that the pump is not moved together with the suction mechanism.

In addition, in addition to the configuration of supplying gas to the gas ejection hole (suction hole 311) using the vacuum generator 33, gas is supplied to the gas ejection hole (suction hole 311) as shown in FIG. A gas supply unit 5 may be provided. This gas supply unit 5 supplies gas to the adsorption hole 311 via the inner space 3S of the adsorption member 31, and the air source 51, the air source 51 and the inner space ( It has a supply flow path 52 connecting 3S). As the air source 51, it is conceivable to use a vacuum ejector, a compressor, or compressed air piped in a factory. Further, the air source 51 may be provided so as to be movable together with the adsorption mechanism 3 or may be provided so as to move together with the adsorption mechanism 3. In addition, the gas supply unit 5 may have a configuration having a plurality of supply passages 52 communicating with a plurality of gas ejection holes, similarly to the suction passage 34.

In the above embodiment, immediately after adsorbing the sheet-like resin J to the adsorption member 31 in the resin supply module C, the adsorption member 31 is inverted up and down, but the adsorption member 31 is inverted up and down. The timing may be appropriately changed as long as the sheet-like resin (J) is adsorbed and held and the protective film (PF) is peeled off, and then the sheet-like resin (J) is supplied to the molding mold. In addition, in the case of supplying the sheet-like resin J to the upper frame 16, for example, it is not necessary to rotate the adsorption member 31.

In addition, in order to accurately supply the sheet-like resin J retained by the adsorption member 31 to the lower frame 15, before releasing the adsorption of the sheet-like resin J, the adsorption member 31 or After at least one of the lower frame 15 is moved up and down in the Z direction to reduce their distance, it is considered to release the adsorption of the sheet-like resin J.

In the case of a configuration in which a release film is provided in the lower frame 15, at least one of the release film or the adsorption member 31 is moved up and down to reduce their distance, and then the sheet-shaped resin J is adsorbed. It is thought to release. The sheet-shaped resin J can be accurately supplied to the lower frame 15 by lowering the release film onto the lower frame 15 after placing the sheet-shaped resin J on the release film.

In the above embodiment, two resin molding modules (B) are connected between the substrate supply and storage module (A) and the resin supply module (C), but the substrate supply and storage module (A) and the resin supply module (C) may be a single module, and the resin molding module (B) may be connected to the module. In addition, the resin molding apparatus does not have to be modularized into each module as in the above embodiment.

In addition, it goes without saying that the present invention is not limited to the above embodiments, and various modifications are possible within a range not departing from the gist.

100… Resin molding equipment
15... The first molding frame (lower frame)
16... 2nd molding frame (upper frame)
17... Frame fastening mechanism
2… Resin supply mechanism
J... Sheet-shaped resin
PF… Protective film
31... Adsorption member
311... Adsorption hole (gas ejection hole)
34... Suction flow path
35... Irregularities
36... Eye surface

Claims (10)

A first molding frame and a second molding frame facing each other,
A frame fastening mechanism for fastening the first and second molding frames,
A resin supply mechanism for supplying the sheet-shaped resin to the first molding mold or the second molding mold,
The resin forming apparatus includes an adsorption member provided with an adsorption hole for adsorbing the other side of the sheet-like resin in which the resin supply mechanism is provided with a protective film on one side. The method of claim 1,
A resin molding apparatus, wherein a plurality of irregularities are formed on a surface of the suction member on which the suction hole is formed. The method of claim 1,
A resin molding apparatus in which a plurality of the adsorption holes are formed in the adsorption member. The method of claim 3,
The resin molding apparatus, wherein the resin supply mechanism has a plurality of suction passages communicating with the plurality of suction holes. The method of claim 1,
The resin molding apparatus, wherein the adsorption member is configured to be capable of blowing gas onto the other side of the adsorbed sheet-like resin. The method of claim 5,
A resin molding apparatus, wherein a gas ejection hole for ejecting gas is formed on the other surface of the adsorbed sheet-like resin in the adsorption member. The method of claim 6,
The resin molding apparatus, wherein the adsorption hole is used as the gas ejection hole. The method of claim 1,
The resin molding apparatus, wherein the adsorption member has an eyelet portion for aligning the sheet-shaped resin. A method for manufacturing a resin molded article for manufacturing a resin molded article by frame-fastening a first mold and a second mold facing each other,
An adsorption preservation step of adsorbing the other side of the sheet-like resin on which a protective film is provided on one side to the adsorption member, and preserving and retaining the sheet-like resin;
A peeling step of peeling off the protective film from the sheet-like resin retained by adsorption storage on the adsorption member,
A resin supply step of supplying the sheet-shaped resin from which the protective film has been peeled off to the first molding frame or the second molding frame,
A method for producing a resin molded article, comprising: a resin molding step of performing resin molding using the sheet-shaped resin by clamping the first molding frame and the second molding frame. The method of claim 9,
The adsorption member is configured to be capable of ejecting gas onto the other side of the adsorbed sheet-like resin,
In the resin supply step, the adsorption in the adsorption storage and maintenance step is released, gas is blown out to the other side, and the sheet-shaped resin is supplied to the first molding frame or the second molding frame. A method of manufacturing a resin molded article.

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