JP5382693B2 - Compression molding method - Google Patents

Description

  The present invention relates to a compression molding method in which compression molding is performed using a workpiece having a small resin thickness and a wide resin sealing area.

  For example, when a semiconductor mounting board in which a plurality of semiconductor elements are mounted on a large board is loaded into a mold as a workpiece and sealed together with resin, the resin is thermally entrained in the middle of the entrainment of bubbles or resin paths The compression molding method is preferably used because it has less harmful effects such as. In this case, it is possible to use a liquid resin as the sealing resin, but the liquid resin is expensive, requires a supply device, and requires maintenance. Therefore, it is necessary to reduce the cost. On the other hand, when a sheet resin suitable for the cavity capacity is used, there is an advantage that it can be molded at a lower cost than a liquid resin, but it is necessary to apply a certain amount of pressure to seal the resin in order to eliminate the unfilled region. For this reason, there exists a subject that a workpiece | work may be damaged and it becomes easy to be cracked, and handling becomes difficult when sheet resin becomes thin (refer patent document 1).

JP 2007-307843 A

  When forming the sheet resin, it is necessary to mold it into a semi-cured state (B stage) using a pulverized resin or a granule resin at a predetermined temperature lower than the molding temperature to stop the curing reaction at a predetermined progress. However, for example, the thickness is 0.30 mm at 110 ° C. and 0.25 mm at 120 ° C., and a sheet resin having a thickness of 0.20 mm cannot be formed.

  For example, when molding a large sheet resin of about 80 mm × 150 mm, it is difficult to form a sheet. When the sheet is peeled off from the mount (metal plate, film, etc.), it is easy to stretch and deform at 40 ° C. and easily crack at 30 ° C. Therefore, a sheet resin of 0.3 mm or less cannot be made at present. Further, a large sheet resin of about 80 mm × 150 mm is difficult to convey even if it is 0.5 mm thick.

  An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a compression molding method that improves the molding quality of a workpiece having a small resin thickness and a wide resin-sealed area and is easy to handle a sheet resin.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, a board formed in a predetermined size is carried into a first mold, and a sealing resin is supplied onto the carried board and clamped to heat it at a first temperature lower than the molding temperature. A step of forming a sheet resin with a mount in a semi-cured state by pressing, a step of rapidly cooling to room temperature while taking out the sheet resin with a mount from the first mold and pressing with a cooling surface plate, and the cooling Carrying the sheet resin with mount into the second mold, clamping it together with the work, and heating and pressurizing it at a second temperature higher than the first temperature to perform compression molding. And
The method further includes a step of removing the molded product from the second mold, removing the mount and cleaning it, and then carrying it into the first mold and reusing it.
Further, the sheet resin with mount carried into the second mold is separated from the bottom surface of the cavity by a separating means and clamped while reducing the progress of heat exchange.

  In addition, a sealing resin is supplied and clamped to a first mold in which a release film is adsorbed and held on a mold clamping surface including a cavity recess, and is heated and pressed at a first temperature lower than the molding temperature to be semi-cured. Forming a sheet resin with a film in a state, and rapidly cooling to normal temperature while taking out both sides of the sheet resin with a film from the first mold while being covered with a release film and pressing it with a cooling platen; The release resin on the workpiece facing surface side of the cooled sheet resin with film is carried into the second mold, clamped with the workpiece, and heated and pressed at a second temperature higher than the first temperature. And a step of performing compression molding after being cured.

The second mold may include a step of forming a reduced pressure space between the upper mold and the lower mold before clamping the workpiece.
Further, the sheet resin with film carried into the second mold is separated from the bottom surface of the cavity by a separating means and clamped while reducing the progress of heat exchange.

If the compression molding method according to the present invention is used, a sheet with a mount that is semi-cured by heating at a first temperature lower than the molding temperature by supplying and clamping a sealing resin onto the mount in the first mold Resin is formed, the sheet resin with mount is taken out of the first mold and rapidly cooled to room temperature while being pressed by a cooling platen. Accordingly, even a sheet resin having a thin resin thickness of 0.2 mm or less can be molded in a semi-cured state without being cracked or deformed.
Further, since the sheet resin is molded on the mount, even a sheet resin having a relatively large area has good peelability, facilitates handling during conveyance, and facilitates positioning within the mold.
Therefore, the sheet resin with mount is carried into the second mold, clamped together with the workpiece, heated and pressurized at a second temperature higher than the first temperature, and cured to perform compression molding, thereby reducing the thickness. The molding quality of a package with a large area can be improved.

  In addition, after the molded product is taken out from the second mold, and the mount is peeled off and cleaned, it is carried into the first mold and reused, so that the mount can be used without waste.

In addition, the sealing resin is supplied to the first mold having the release film adsorbed and held on the mold clamping surface including the cavity recess, and the film is attached in a semi-cured state by heating and pressing at a first temperature lower than the molding temperature. A sheet resin is formed and cooled to room temperature while being pressed by a cooling platen. Thereby, sheet resin with a film which is easy to handle can be manufactured.
Also, the release film on the workpiece facing surface side of the cooled sheet resin with film is carried into the second mold while being peeled off, clamped together with the workpiece, and heated and pressurized at a second temperature higher than the first temperature. It is cured and compression molded. Thereby, mold maintenance can be simplified compared with the sheet resin with mount.

In addition, by forming a decompression space between the upper and lower molds of the second mold before clamping the workpiece, it is possible to prevent bubbles from entering the sheet resin with a small thickness and a large area. High quality compression molding can be performed.
Also, the sheet resin with mount and the sheet resin with film carried into the second mold are separated from the bottom surface of the cavity by the separating means and clamped while reducing the progress of heat exchange, so that the semi-cured state is obtained before clamping. The workpiece can be clamped in a state where the curing reaction of a certain sheet resin is stopped. Therefore, there is no possibility that the workpiece is damaged.

FIG. 6 is a cross-sectional explanatory view illustrating a manufacturing process of a sheet resin with a mount using the first mold according to Example 1; It is explanatory drawing which shows the cooling process of sheet resin with mount. It is sectional explanatory drawing which shows the process of carrying in and carrying out compression molding of sheet | seat resin with mount and a workpiece | work to a 2nd shaping | molding die. It is sectional explanatory drawing which shows the manufacturing process of sheet resin with a film with the 1st shaping | molding die which concerns on Example 2, explanatory drawing which shows the cooling process of sheet resin with film, and explanatory drawing of a sheet resin conveyance apparatus. It is sectional explanatory drawing which shows the process of carrying in and carrying out compression molding of sheet | seat resin with mount and a workpiece | work to a 2nd shaping | molding die.

  Hereinafter, preferred embodiments of a compression molding method according to the present invention will be described in detail with reference to the accompanying drawings.

An example of the compression molding method will be described together with the apparatus configuration with reference to FIGS.
FIG. 1 shows a first mold P. In the right half view of FIG. 1, the upper mold 1 has a pressure block 3 fixed to an upper mold base 2. A heater 4 is built in the pressure block 3, and a release film 5 is sucked and held on the clamp surface of the pressure block 3.

  The release film 5 has heat resistance that can withstand the heating temperature of the mold, and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, and PET. , FEP film, fluorine-impregnated glass cloth, polypropylene film, polyvinyl chloride, etc. are preferably used. The release film 5 may be a long one that is continuously supplied to the mold by a release film supply mechanism (not shown), or one that has been cut into a strip shape in advance. Either is fine.

  In the lower die 6, the movable block 8 is floatingly supported by a coil spring 9 on the outer peripheral side stepped surface 7 b of the lower die base 7 formed so that the central upper surface 7 a is a convex surface and the outer peripheral side is a stepped surface 7 b. . A space surrounded by the upper surface 7a at the center of the lower mold base 7 and the inner surface of the movable block 8 is used as the cavity recess 6a. A heater 10 is built in the lower mold base 7.

  In the left half view of FIG. 1, when the first mold P is in the open state, the mount 11 formed in a predetermined size corresponding to the package size is carried into the cavity recess 6 a of the lower mold 6. The mount 11 is made of, for example, a steel plate made of stainless steel with hard chrome plating or dry chrome plating on at least a resin laminated surface, a steel plate with nickel plating or fluorine coating, a stainless steel plate formed on a satin surface, or the like. It is done.

  Then, a sealing resin (granular resin or pulverized resin) 12 such as an epoxy resin is supplied by the hopper 13 onto the mount 11 carried into the lower mold 6. The hopper 13 accommodates an amount of the sealing resin 12 necessary for one resin sealing in advance. A slit hole 13a is provided at the bottom of the hopper 13, and a shutter 13b with a slit for opening and closing the slit hole 13a is provided overlapping the bottom. By opening and closing the shutter 13b, a granular resin having a uniform particle diameter through the slit hole 13a or a pulverized resin mixed with powder for cost reduction is supplied onto the mount 11 as the sealing resin 12. It has become.

  After the sealing resin 12 is supplied onto the mount 11 by the hopper 13, the mold is clamped as shown in the right half of FIG. 1, and the movable block 8 is clamped to the pressure block 3 via the release film 5. At this time, the sheet resin with a mount in a semi-cured state (B stage) by heating and pressurizing at a first temperature (for example, around 110 ° C.) lower than the molding temperature by the heaters 4 and 10 while the resin pressure is applied to the sealing resin 12. 14 is formed. Thereby, the sealing resin 12 of the sheet resin 14 with the mount is in a state where the curing reaction has progressed to the extent necessary for conveyance. For example, in the case of a granular or pulverized epoxy resin, the molding quality is impaired while being extremely thin sealing resin 12 having a thickness of 0.2 mm or less, for example, by heating and pressing within a range of 80 ° C. to 120 ° C. It is possible to form a sheet resin 14 with a suitable semi-cured state that is easy to handle.

Next, the first mold P is opened, and the sheet resin 14 with the mount is taken out from the first mold P and carried into the cooling surface plate 15 shown in FIG. The mount-attached sheet resin 14 is placed on the lower surface plate 15a and rapidly cooled to room temperature (for example, about 5 ° C. to 25 ° C.) while pressing the sheet resin with the upper surface plate 15b. In this case, since the heat is rapidly taken away by the cooling platen 15, it can be cooled much faster than natural cooling in the atmosphere, and more than necessary after the curing reaction has progressed to the extent necessary for transportation. Curing progress can be stopped. Therefore, the cured state can be easily controlled by suppressing the shortening of the gel time here (the time required for gelation to lose fluidity and the viscosity to rapidly increase). In addition, by providing a cooling means such as a Peltier element, the cooling platen 15 can be lowered to a temperature lower than the outside air temperature, and the sheet resin 14 with mount can be cooled to a temperature lower than the outside air temperature.
Further, a satin-like pattern may be formed on the upper mold plate surface or the lower mold plate surface or both surfaces of the cooling surface plate 15, or a position corresponding to a chip or a capacitor component mounted on the substrate surface. May be imprinted on the resin surface by providing irregularities with an appropriate shape. In this case, since the uneven shape of the upper mold plate surface of the cooling surface plate 15 is transferred to the sheet resin 14 with mount, the flow amount of the resin during compression molding is reduced, and the fluidity of the resin during compression molding is controlled. As a result, it becomes possible to mold products with stable quality.

  By rapidly cooling using the cooling platen 15 in this way, the curing reaction of the thermosetting resin proceeds to prevent the adhesive force with the work from being insufficient, and a hard plate-like acetone insoluble matter grows rapidly. When compression molding is performed with the second mold Q, it is possible to avoid problems such as damage to the circuit surface of the semiconductor chip or deformation of the wire.

  Next, the release film 5 is peeled from the cooled sheet resin 14 with mount. In FIG. 3, the mount-attached sheet resin 14 from which the release film 5 has been peeled is carried into the second mold Q. In the upper mold 17, an upper mold block 19 is fixed to an upper mold base 18. The upper mold block 19 is configured to suck and hold the semiconductor mounting substrate 20 as a work on the clamp surface. The upper mold block 19 has a built-in heater 19 a, and an upper mold shielding block 46 is provided so as to surround the upper mold block 19. The semiconductor mounting substrate 20 is assumed to have a plurality of semiconductor elements mounted on the substrate. The semiconductor mounting substrate 20 is not limited to the case where the semiconductor mounting substrate 20 is attracted to the upper mold block 19, and may be pressed onto the clamp surface by a pressing jig or the like.

  In the lower mold 21, a lower mold block 25 is supported by a lower mold base 22, a center block 23 is supported by the lower mold block 25, and a movable block 24 is floatingly supported by a coil spring 26 around the center block 23. A space surrounded by the upper surface of the center block 23 and the inner surface of the movable block 24 is used as the cavity recess 21a. The lower mold block 25 includes a heater 25a.

  The center block 23 includes a plurality of pins 45 (separating means) biased by springs 44, and the tips of the pins 45 slightly protrude from the upper surface of the center block 23 (for example, about 0.5 mm). (Refer to the left half of FIG. 3). When the sheet resin 14 with mount is put into the cavity recess 21a, direct heat exchange due to contact with the sheet resin in a semi-cured state separated from the cavity bottom is prevented, and the curing reaction proceeds before compression molding. And the shortening of the gel time of the sheet resin 14 with mount is suppressed. For example, if the sealing resin 12 is very thin, for example, having a thickness of 0.2 mm or less, the temperature can be sufficiently raised by radiant heat from the lower block 25. The gel time due to heat exchange (the time until gelling causes loss of fluidity and the viscosity rapidly increases) is delayed. Each pin 45 is pushed down toward the center block 23 by the clamping pressure acting through the mount 11 when the second molding die Q is in the clamped state.

  The lower mold base 22 is provided with a lower mold shielding block 47 surrounding the lower mold block 25. A sealing material (O-ring) 48 is provided on the upper surface of the lower mold shielding block 47. By clamping the sealing material 48 with the upper mold block 46, a space shielded from the outside can be formed in the second mold Q. A suction path 49 is formed in a part of the lower shielding block 47 and is connected to the suction device S. In a state where the sealing material 48 is clamped by the upper mold shielding block 46 and the lower mold shielding block 46, a suction operation is performed by the suction device S so as to form a decompression space in the shielding space of the upper mold 17 and the lower mold 21. It has become.

  In the left half view of FIG. 3, the sheet resin 14 with mount is carried into the lower mold 21 of the second mold Q opened. The sheet resin 14 with mount is accommodated in the cavity recess 21a with the mount 11 as the bottom. A semiconductor mounting substrate 20 is supplied to the upper mold block 19 of the upper mold 17 and is held by suction on the clamp surface.

  3, the second molding die Q is clamped, and the coil spring 26 is pressed and compressed while the movable block 24 clamps the semiconductor mounting substrate 20 to melt the semiconductor element. 12 soak. At this time, the sheet resin 14 with the mount is clamped together with the semiconductor mounting substrate 20. Next, the sheet resin 14 with mount is pushed down by the semiconductor mounting substrate 20, and the mount 11 comes into contact with the center block 23. In this state, compression molding is performed by heating and pressurizing at a second temperature (for example, 150 ° C. to 175 ° C.) higher than the first temperature and corresponding to the molding temperature in the present embodiment.

  After the compression molding, the second molding die Q is opened and the mount 11 is peeled off from the molded product. Since the above-described plating or coated surface or matte surface is formed on the resin laminate surface of the mount 11, it can be easily peeled off from the sealing resin 12. This mount 11 is cleaned, then carried into the first mold P and reused.

According to the above compression molding method, the sealing resin 12 is supplied and clamped on the mount 11 in the first mold P, so that it is heated at the first temperature lower than the molding temperature and attached with a semi-cured mount. A sheet resin 14 is formed, and the sheet resin 14 with mount is taken out of the first mold P and cooled to near normal temperature while being pressed by a cooling platen 15, whereby the resin thickness is 0.2 mm or less. Even a resin can be molded into the mount 11 in a semi-cured state. In addition, since the sheet resin is molded on the mount 11, even when the sheet resin has a large area, damage at the time of release does not occur, handling during transportation is easy, and positioning in the mold is easy. become.
Further, the sheet resin 14 with mount is carried into the second molding die Q, clamped together with the workpiece, cured by heating and pressing at a second temperature higher than the first temperature, and compression molding is performed. However, it is possible to improve the molding quality of a thin and wide package.

Next, another example of the compression molding method will be described with reference to FIGS. 4 and 5 together with the apparatus configuration. The same members as those in the first embodiment are denoted by the same reference numerals, and the description is incorporated.
4A shows the first mold P. FIG. In the right half view of FIG. 1, the upper mold 1 has a pressure block 3 fixed to an upper mold base 2. A heater 4 is built in the pressure block 3, and a release film 5 a is attracted and held on the clamp surface of the pressure block 3.

  In the lower die 6, the movable block 8 is floatingly supported by a coil spring 9 on a stepped surface 7 b on the outer peripheral side of the lower die base 7 formed so that the central portion is a convex surface and the outer peripheral side is a stepped surface. A space surrounded by the upper surface 7a at the center of the lower mold base 7 and the inner surface of the movable block 8 is used as the cavity recess 6a. A heater 10 is built in the lower mold base 7.

  The lower mold clamping surface including the cavity recess 6a of the lower mold 6 holds the release film 5b by suction. A sealing material (O-ring) 27 is provided between the movable block 8 and the stepped surface 7b. The release film 5b is sucked and held following the cavity recess 6a by being sucked by the suction device R through the gap between the movable block 8 sealed by the sealing material 27 and the lower mold base 7. As the release films 5a and 5b, those which have been cut into strips in advance may be used, but films which are continuous in a long shape may be used. In this case, in order to form and convey the sheet resin to be sealed every time, it is necessary to cut it into strips.

  4A, the sealing resin (resin tablet, granule resin or pulverized resin, liquid resin, etc.) 12 required for one-time resin sealing when the first mold P is in the open state. Is supplied to the lower mold 6 from the hopper 13 shown in FIG. The sealing resin 12 is supplied onto the release film 5 b that covers the cavity recess 6 a of the lower mold 6.

  After the sealing resin 12 is supplied, the movable block 8 is clamped to the pressure block 3 via the release films 5a and 5b by performing mold clamping as shown in the right half of FIG. At this time, the film is applied in a semi-cured state (B stage) by applying heat and pressure at a first temperature lower than the molding temperature (for example, a predetermined temperature of 120 ° C. or lower) by the heaters 4 and 10 while the resin pressure is applied to the sealing resin 12 The attached sheet resin 28 is formed.

  Next, in FIG. 4B, the first molding die P is opened, and the sheet resin 28 with film is taken out from the first molding die P and carried into the cooling platen 15. The sheet resin with film 28 is placed on the lower surface plate 15b and rapidly cooled to room temperature while pressing the sheet resin through the release films 5a and 5b by the upper surface plate 15a.

  Next, in FIG. 4C, the release film 5a on the upper surface side is peeled off from the cooled sheet resin 28 with film, and the sheet resin 28 with film is adsorbed and held by the sheet resin transport device 29. Carry into the mold Q. The sheet resin 28 with a film is conveyed by adsorbing and holding the entire resin surface exposed by peeling the release film 5a by the sheet resin conveying device 29 with a flat adsorption surface.

  In FIG. 5, the structure of the 2nd shaping | molding die Q is demonstrated. In the upper mold 30, an upper mold block 32 is fixed to an upper mold base 31. The upper mold block 32 sucks and holds the semiconductor mounting substrate 20 as a work on the clamp surface. The upper mold base 31 incorporates a heater 31a, and an upper mold shielding block 33 is provided so as to surround the upper mold block 32.

  In the lower mold 34, a lower mold block 36 is fixed to a lower mold base 35. The lower mold block 36 has a central upper surface 36a formed on a flat surface and a stepped surface 36b formed on the outer peripheral side. A movable block 37 is floatingly supported on the stepped surface 36b by a coil spring 38. A space surrounded by the center upper surface 36a of the lower mold base 7 and the inner surface of the movable block 37 is used as the cavity recess 34a. A heater 39 is built in the lower mold base 35. A suction groove 37b is formed on the clamp surface 37a of the movable block 37 and communicates with the suction device R that sucks the release film 5b.

  The lower mold base 35 is provided with a lower mold shielding block 40 surrounding the lower mold block 36. A sealing material (O-ring) 41 is provided on the upper surface of the lower mold shielding block 40. By clamping the sealing material 41 to the upper mold shielding block 33, a space shielded from the outside can be formed in the second mold Q. A suction path 42 is formed in a part of the lower shielding block 40 and is connected to the suction device S. In a state where the sealing material 41 is clamped by the upper mold shielding block 33 and the lower mold shielding block 40, a suction operation is performed by the suction device S so as to form a decompression space in the shielding space of the upper mold 30 and the lower mold 34. It has become.

  In the left half view of FIG. 5, the sheet resin 28 with film adsorbed and held by the sheet resin conveying device 29 is carried into the lower mold 34 of the second mold Q opened. The sheet resin 28 with a film is accommodated in the cavity recess 34a with the release film 5b at the bottom. In the sheet resin 28 with film, the release film 5b is sucked and held on the clamp surface 37a of the movable block 37 by the suction operation of the suction device R (separation means). At this time, the sheet resin 28 with a film is held away from the cavity recess 34a (cavity bottom), and the shortening of the gel time due to heat exchange with the semi-cured sheet resin is suppressed. Further, the semiconductor mounting substrate 20 is supplied to the upper mold block 32 of the upper mold 30 and is sucked and held on the clamp surface. The lower mold block 36 may include a plurality of pins 45 (separating means) biased by a spring 44 (see FIG. 3).

  In the right half of FIG. 5, the second forming die Q is clamped, and the sealing material 41 is first clamped by the upper die shielding block 33 and the lower die shielding block 40, and the suction device S performs the suction operation. Thus, a decompression space is formed in the shielding space between the upper mold 30 and the lower mold 34. Next, while the semiconductor element mounted on the semiconductor mounting substrate 20 is immersed in the molten sealing resin 12, the movable block 37 clamps the semiconductor mounting substrate 20 via the release film 5b, and the coil spring 38 is By being compressed, the semiconductor element is completely immersed in the molten sealing resin 12. At this time, the sheet resin 28 with a film is clamped together with the semiconductor mounting substrate 20 and heated at a second temperature higher than the first temperature (for example, 180 ° C. with powdered mold epoxy resin (EMC (epoxy molding compound) resin)). After the compression molding, the second molding die Q is opened, and the release film 5b is peeled off from the molded product.

As described above, the sheet resin 28 with a film is molded in the first mold P using the release films 5a and 5b in advance, and the sheet resin 28 is carried into the second mold Q and compression-molded. The same operational effects as the attached sheet resin can be achieved, and the mold maintenance can be simplified as compared with the sheet resin with mount.
In addition, by forming a reduced pressure space between the upper mold 30 and the lower mold 34 of the second mold Q before clamping the workpiece, bubbles can be mixed into the sheet resin having a small thickness and a large area. Therefore, compression molding with high molding quality can be performed.

  In addition, although embodiment mentioned above demonstrated the example which forms sheet resin using a granular mold resin, this invention is not limited to this, A liquid epoxy resin can also be used. In this case, since the temperature suitable for the compression molding of the liquid resin is 120 ° C. to 150 ° C., the sheet resin is molded at a temperature sufficiently lower than the molding temperature (for example, 70 ° C. to 90 ° C.) It is possible to form a suitable semi-cured sheet resin by cooling. Moreover, although the shaping | molding method using an epoxy resin was demonstrated, you may use a silicone resin.

P First mold 1, 17, 30 Upper mold 2, 18, 31 Upper mold base 3 Pressure block 4, 10, 25a, 31a, 39 Heater 5, 5a, 5b Release film 6, 21, 34 Lower mold 6a , 21a, 34a Cavity recess 7, 22, 35 Lower mold base 7a, 36a Center upper surface 7b, 36b Stepped surface 8, 24, 37 Movable block 9, 26, 38 Coil spring 11 Mount 12 Sealing resin 13 Hopper 13a Slit Hole 13b Shutter 14 Sheet resin with mount 15 Cooling surface plate 15a Upper surface plate 15b Lower surface plate Q Second molding die 19, 32 Upper die block 20 Semiconductor mounting substrate 23 Center block 27, 41, 43, 48 Seal material 28 Film Sheet resin 29 Sheet resin conveying device 33, 46 Upper mold shielding block 25, 36 Lower mold block 3 a clamping surface 37b suction grooves
40, 47 Lower mold shielding block 42, 49 Suction path 44 Spring 45 Pin R Suction device S Suction device

Claims (6)

A board formed in a predetermined size is carried into a first mold, and a sealing resin is supplied onto the carried board and clamped to heat and press at a first temperature lower than the molding temperature. Forming a sheet resin with a mount in a semi-cured state;
Removing the sheet resin with mount from the first mold and rapidly cooling to room temperature while pressing with a cooling surface plate;
A step of carrying the compression molding by carrying the cooled sheet resin with mount into a second mold, clamping it together with a work, and curing it by heating and pressing at a second temperature higher than the first temperature; A compression molding method comprising:   The compression molding method according to claim 1, further comprising a step of removing the molded product from the second molding die, peeling off the mount and cleaning it, and then carrying it into the first molding die for reuse.   The compression molding method according to claim 1 or 2, wherein the sheet resin with mount carried into the second mold is separated from the bottom surface of the cavity by a separating means and clamped while reducing the progress of heat exchange. In a semi-cured state by heating and pressing at a first temperature lower than the molding temperature by supplying a sealing resin to the first mold having a release film adsorbed and held on the mold clamping surface including the cavity recess and clamping it Forming a sheet resin with a film;
A step of rapidly cooling to room temperature while taking out both sides of the sheet resin with a film while being covered with a release film from the first mold and pressing with a cooling platen;
The cooled sheet resin with film is carried into the second mold while the release film on the workpiece facing surface side is peeled off, clamped together with the workpiece, and heated and pressurized at a second temperature higher than the first temperature. And a step of performing compression molding after curing.   5. The compression molding method according to claim 4, further comprising the step of forming a reduced pressure space between the upper mold and the lower mold before the workpiece is clamped in the second mold.   The compression molding method according to claim 4 or 5, wherein the sheet resin with film carried into the second molding die is separated from the bottom surface of the cavity by a separating means and clamped while reducing the progress of heat exchange.

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