JP6438772B2 - Resin molding equipment - Google Patents

Description

  The present invention relates to a technique effective when applied to a resin molding apparatus.

  Japanese Unexamined Patent Application Publication No. 2010-179507 (Patent Document 1) describes a technique in which molding is performed by compressing a resin in a cavity recess after reducing the pressure inside a mold.

JP 2010-179507 A

  In resin molding inside a reduced-pressure mold as described in Patent Document 1, a reduced-pressure space is formed by suction through a suction path with respect to a space surrounded by a shielding block. In this case, conventionally, only one or several suction paths are provided for the purpose of space limitation of the device configuration and cost reduction of the device, and a decompression space is formed by suction from that point. . However, due to the increase in the size of the workpiece W, there is a case where the decompressed state is not necessarily uniform in the space surrounded by the shielding block, and the problem that the resin filling state varies depending on the position of the workpiece is clear. It has become.

  For example, in a resin flow when resin-sealing a plurality of electronic components, a location where the resin easily flows (that is, the flow resistance is low) depending on the arrangement (presence / absence) of the electronic components, and a location where the flow is difficult (a flow resistance is high) May occur. For this reason, the place filled previously and the place filled later generate | occur | produce in a cavity recessed part, A void and an unfilled place generate | occur | produce depending on the case, and there exists a possibility of reducing the quality of a molded product.

  The objective of this invention is providing the technique which can improve the quality of a molded article. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. According to another aspect of the present invention, there is provided a resin molding apparatus comprising: a pair of molds having cavity recesses that can be opened and closed; and a pressure adjusting unit that adjusts pressure inside the mold including the cavity recesses. The mold has a plurality of communication passages that communicate between the mold exterior and the mold interior, and has a sealing material that surrounds the cavity recess and is disposed on the mold surface to seal the mold interior, In the plurality of communication paths, one end portion on the inner side of the mold opens around the opening of the cavity recess, and the other end portion on the outer side of the mold is connected to the pressure adjusting portion, and the pressure adjusting portion Is a decompression section for closing the mold through the plurality of communication paths and sucking the gas inside the mold surrounded by the sealing material, and reducing the pressure inside the mold, and each gas in the plurality of communication paths A flow rate adjusting unit that adjusts the flow rate, and the flow rate adjusting unit allows a plurality of communication While adjusting the gas flow to vacuum the inside of the mold, the pressure was reduced weakly the communication passage easy flow direction, and adjusting to reduced pressure strongly communication path hardly flow direction. According to this, for example, by weakly sucking (decompressing) the communication passages where resin is easy to flow and by strongly sucking (decompressing) communication passages where resin is difficult to flow, the occurrence of voids and unfilled points is prevented. Thus, the quality of the molded product can be improved .

  Further, in the resin molding apparatus according to the one solving means, the pressure adjusting unit includes a pressurizing unit that pressurizes the inside of the mold by injecting gas into the mold through the plurality of communication paths, More preferably, each of the plurality of communication paths includes a switching unit that switches connection between the pressure reducing unit and the pressure applying unit. According to this, for example, by suctioning (depressurizing) or compressing air (pressurizing) the communication path at the location where the resin easily flows in the cavity recess and the communication path at the location where the resin does not flow easily, It is possible to improve the quality of the molded product by preventing occurrence of unfilled portions.

  In the resin molding apparatus according to the one solving means, it is more preferable that the pressure adjusting unit includes a flow rate measuring unit that measures the flow rates of the plurality of communication paths. According to this, the result of the gas flow rate of each communication path can be confirmed, and the gas flow rate of the communication path can be adjusted by the flow rate control unit, and the generation of voids and unfilled portions can be prevented, and the quality of the molded product can be improved. Can be improved.

  In the resin molding apparatus according to the one solving means, it is more preferable that the apparatus includes a pressure measuring unit that measures a pressure inside the mold adjacent to the one end of the communication path. According to this, it is possible to confirm the result of the pressure at a plurality of locations inside the mold and adjust the gas flow rate of the communication passage by the flow rate adjusting portion of the pressure adjusting portion, thereby preventing the occurrence of voids and unfilled locations. The quality of the molded product can be improved.

  Further, in the resin molding apparatus according to the one solution, the pair of molds includes the cavity concave portion, and is provided so as to surround the molding portion that thermally cures the resin filled in the cavity concave portion. It is more preferable that the chamber includes a chamber part that partitions the outside of the mold and the inside of the mold, and the one end of the plurality of communication passages is provided around the opening of the cavity recess in the chamber part. . According to this, for example, even in a pair of molds having a molding part for performing transfer molding, the pressure adjusting part weakly sucks (reduces pressure) the communication path at a location where the resin easily flows in the cavity recess, and the resin It is easy to strongly suck (depressurize) the communication path in the difficult-to-flow location, prevent the generation of voids and unfilled locations, and improve the quality of the molded product.

  Moreover, in the resin molding apparatus according to the one solution, the pair of molds includes a pot and a plurality of cavity recesses communicating with the pot, and the one end of the plurality of communication paths includes the one end More preferably, the pot and the plurality of cavity recesses are opened around the whole. According to this, generation | occurrence | production of the void and unfilled location in each cavity recessed part can be prevented, and the quality variation of each molded product can be reduced.

  Further, in the resin molding apparatus according to the one solution, the pair of molds includes a pot and the cavity recess communicating with the pot, and the plurality of communication paths around the opening of the cavity recess. More preferably, the one end and the pot are provided. According to this, for example, when resin molding is performed on a large circular workpiece, after the resin is collected at the central portion of the workpiece by the pressure adjusting portion, the resin at the central portion is uniformly spread on the outer peripheral portion. The inside of the cavity recess can be filled. Therefore, generation | occurrence | production of a void and an unfilled location can be prevented and the quality of a molded product can be improved.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the resin molding apparatus according to one solution of the present invention, the quality of a molded product can be improved.

It is a figure for demonstrating the resin molding apparatus which concerns on Embodiment 1 of this invention. It is a principal part schematic sectional drawing of the resin molding apparatus in operation | movement shown in FIG. FIG. 3 is a schematic cross-sectional view of a main part of a resin molding apparatus in operation following FIG. 2. FIG. 4 is a schematic cross-sectional view of a main part of the resin molding apparatus in operation following FIG. 3. It is a figure for demonstrating the effect of the resin molding apparatus shown in FIG. It is a figure for demonstrating the effect of the resin molding apparatus shown in FIG. It is a figure for demonstrating the resin molding apparatus which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the effect of the resin molding apparatus shown in FIG. It is a figure for demonstrating the effect of the resin molding apparatus shown in FIG. It is a figure for demonstrating the resin molding apparatus which concerns on Embodiment 3 of this invention. It is principal part typical sectional drawing of the resin molding apparatus in operation | movement shown in FIG. It is a principal part schematic sectional drawing of the resin molding apparatus in operation | movement shown in FIG. It is principal part typical sectional drawing of the resin molding apparatus in operation | movement shown in FIG. It is principal part typical sectional drawing of the resin molding apparatus in operation | movement shown in FIG. It is a figure for demonstrating the resin molding apparatus which concerns on Embodiment 4 of this invention. FIG. 16 is a schematic plan view of a main part of the resin molding apparatus in operation shown in FIG. 15.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin molding apparatus 10 that performs compression molding according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a view for explaining a resin molding apparatus 10 according to the present embodiment. 2 to 4 are schematic cross-sectional views of the main part of the resin molding apparatus 10 in operation shown in FIG. 1, and only near the edge of the cavity recess 12 (cavity at the time of molding) (the right side on the paper corresponds to the center side). ) Is shown. 5 and 6 are diagrams for explaining the operational effects of the resin molding apparatus 10 shown in FIG. In the present embodiment, a resin molding apparatus 10 (manufacturing apparatus) that manufactures a WLP (Wafer Level Package) product by molding a resin molding portion (resin R) on a workpiece W will be described. A workpiece W (molded product) before molding includes a substrate S (for example, a wiring substrate) having a circular shape in plan view and a plurality of electronic components P (for example, semiconductor chips) mounted on the substrate S in a matrix arrangement. (See FIG. 2 and FIG. 5). The molded workpiece W (molded product) further has a resin molded portion (resin R) for sealing a plurality of electronic components P (see FIG. 4).

  The resin molding apparatus 10 includes a pair of molds 14 (see FIG. 2) having a cavity recess 12 having a size corresponding to a workpiece W such as a large wafer such as 8 inches or 12 inches. The pair of molds 14 includes an upper mold 16 (one mold) and a lower mold 17 (the other mold) that are disposed so that mold surfaces (also referred to as a clamp surface or a parting surface) face each other. Is done. In the present embodiment, the cavity recess 12 is provided in the lower mold 17. In addition, the resin molding apparatus 10 has a workpiece holding unit (not shown) that holds the workpiece W including a known suction mechanism and chuck mechanism in order to set (place) the workpiece W on the mold surface of the upper mold 16. Prepared). In addition, the resin molding apparatus 10 adsorbs and holds the release film F along the mold surface of the lower mold 17 including the cavity recess 12 in order to improve the mold releasability of the molded product after resin molding. The suction portions 18 and 19 (for example, vacuum pumps) for sucking the release film F are provided.

  The pair of molds 14 that can be opened and closed is configured such that when the upper mold 16 and the lower mold 17 are clamped and close, the mold is closed and the mold is opened and separated. In this embodiment, the upper mold 16 is a fixed mold and the lower mold 17 is a movable mold. The lower mold 17 is close to the upper mold 16 and the pair of molds 14 is closed. The mold 17 is separated and the pair of molds 14 are opened. As the mold opening / closing mechanism (not shown), for example, a drive source (servo motor or the like) and a drive transmission mechanism (ball screw or the like) are used, and the upper mold 16 assembled to the fixed platen is assembled to the movable platen. A known mechanism that guides the lower mold 17 to the tie bar and moves up and down is used. The pair of molds 14 includes a heater (not shown) in each of the upper mold 16 and the lower mold 17 and is configured to be heated to a predetermined temperature (for example, 180 ° C.).

  Further, the resin molding apparatus 10 includes a pressure adjusting unit 22 (see FIG. 1) that adjusts the pressure of the atmosphere (air) in the mold interior 20 (see FIG. 3) including the cavity recess 12, and a plurality of locations in the mold interior 20 And a pressure measurement unit 23 (see FIG. 1) for measuring the pressure. Further, as shown in FIG. 1, the resin molding apparatus 10 controls the pressure adjusting unit 22 or reads a measurement result from the pressure measuring unit 23, and a predetermined condition for the control unit 24. , And a display unit 26 for displaying predetermined conditions and displaying measurement results. As a result, the gas generated from the air or resin is discharged (primary pressure reduction), and the pressure in the mold is reduced to any pressure by discharging the gas in the mold (secondary pressure reduction), and the air or inert Switching to pressurization to the gas in the mold by introducing (press-fitting) gas or the like can be controlled according to a predetermined purpose. Further, it is configured to be controllable in accordance with a predetermined purpose such as a change in pressure reduction or pressurization strength.

  The lower mold 17 composed of a plurality of mold blocks includes a base 60, a cavity piece 62 having a circular shape in plan view (viewed from a mold surface) fixedly assembled to the base 60, and a plane through which the cavity piece 62 is inserted. And a clamper 64 in which a through-hole 64a having a circular shape is formed. The pair of molds 14 is a lower mold 17 having a cavity recess 12, and the bottom of the cavity recess 12 is formed by the upper end surface of the cavity piece 62, and the side of the cavity recess 12 is the inner surface of the clamper 64 (the through hole 64 a (Inner wall surface). For this reason, as shown by the alternate long and short dash line in FIG. 1, the opening of the cavity recess 12 has a circular shape in plan view. The clamper 64 surrounds the cavity piece 62 and is assembled to the base 60 through an elastic member 66 (for example, a spring) so as to be movable up and down (advance and retreat). In such a lower mold 17, the cavity piece 62 and the clamper 64 are relatively movable, and the depth (that is, volume) from the opening of the cavity recess 12 is variable. A gap is formed between the outer side surface of the cavity piece 62 and the inner side surface of the clamper 64, but the lower mold 17 seals the gap to form a sealed mold interior 20 (sealed space). A seal member 68 (for example, an O-ring) is provided.

  Further, the lower mold 17 has a plurality of communication passages 70 that connect the periphery of the cavity recess 12 (inside the mold) and the outside of the mold. For example, the communication path 70 is formed by perforating the clamper 64, one end portion on the opening side of the cavity recess 12 is opened at the mold surface (upper end surface) of the clamper 64, and the other end portion on the mold outer side is formed. It connects with the suction part 18 via a pipe line. Further, the lower mold 17 has a plurality of communication passages 72 that connect the periphery of the cavity recess 12 (inside the mold) and the outside of the mold. The communication path 72 is formed, for example, by drilling a clamper 64, and the inner surface of the clamper 64 around the bottom of the cavity recess 12 so that one end on the bottom side of the cavity recess 12 communicates with the corner of the cavity recess 12. And the other end portion on the outside of the mold is connected to the suction portion 19 through a pipe line. By the suction operation of the suction units 18 and 19 (for example, a vacuum pump) controlled by the control unit 24, the release film F can be adsorbed and held on the mold surface following the shape of the cavity recess 12.

  The upper mold 16 composed of a plurality of mold blocks surrounds the base 28, a circular center block 30 fixedly assembled to the base 28, and the center block 30, as seen in a plan view shown in FIG. The clamper 32 is assembled to the base 28 so as to be movable back and forth (up and down). A circular through hole 32a is formed in the clamper 32 surrounding the center block 30, and is assembled to the base 28 so that the center block 30 is inserted into the through hole 32a. Therefore, a gap is formed between the outer surface of the center block 30 and the inner surface of the clamper 32 (the inner wall surface of the through hole 32a) (see FIG. 2). In order to seal, it has the sealing member 31 (for example, O-ring) which seals the clearance gap. In addition, the upper die 16 is a seal member 33 (for example, O) that seals between the upper die 16 and the lower die 17 provided on the lower end surface of the clamper 32 in order to seal the inside 20 of the die when the die is closed. Ring).

  Further, as shown in FIG. 1, the upper mold 16 has a plurality of communication passages 34 (see FIG. 3) that communicate the mold exterior and the mold interior 20 (see FIG. 3) including the cavity recess 12 facing the center block 30. 1, the state seen through is indicated by a broken line). The plurality of communication passages 34 have one end portion on the cavity recess 12 (mold interior 20) side opened around the opening of the cavity recess 12, and the other end portion on the mold outer side is the pressure adjusting unit 22 or pressure measurement unit. 23. One ends of the plurality of communication passages 34 are opened at predetermined positions around the center of the opening of the cavity recess 12 (for example, the direction in which the resin R easily flows from the center to the outside or the direction in which the resin R does not easily flow).

  In the present embodiment, in the plan view shown in FIG. 1, the pressure adjuster 22 is connected to depressurize and pressurize the position of the clamper 32 at a predetermined angle along the center of the circular through hole 32a. A communication path 34 is provided. Moreover, the communication path 34 connected with the pressure measurement part 23 (pressure gauge 52) can be provided close to these communication paths 34. Further, the plurality of communication passages 34 are configured by, for example, perforating the clamper 32, one end portion is communicated with a gap between the center block 30 and the clamper 32, and the other end portion is a pressure adjusting portion via a pipe line. 22 and the pressure measuring unit 23 are connected in communication.

  The pressure adjusting unit 22 is controlled by the control unit 24 and sucks the gas in the mold interior 20 closed through the plurality of communication passages 34 to decompress the mold interior 20, and a plurality of communication units. And a flow rate adjusting unit 38 for adjusting the gas flow rate of each passage 34. The decompression unit 36 is constituted by, for example, a vacuum pump, and the vacuum pump is connected to the plurality of communication paths 34. In addition, the flow rate adjustment unit 38 is configured by, for example, a plurality of flow rate adjustment valves 40, and each of the plurality of flow rate adjustment valves 40 is connected to the plurality of communication paths 34. According to such a pressure adjusting unit 22, for example, the communication path 34 at a location where the resin R easily flows in the cavity recess 12 (in other words, a location where the resin R does not need to flow easily) is weakly sucked (depressurized). In addition, the communication path 34 at a place where the resin R is difficult to flow (in other words, a place where the resin R needs to flow easily) can be strongly sucked (depressurized).

  In addition, the pressure adjusting unit 22 is controlled by the control unit 24, and a pressurizing unit 42 that pressurizes the mold interior 20 by injecting gas into the mold interior 20 that is closed through a plurality of communication paths 34; You may have the switching part 44 which performs connection switching of the pressure reduction part 36 and the pressurization part 42 in each of the some communication path 34. FIG. The pressurizing unit 42 is composed of, for example, a compressor, and the compressor is connected to the plurality of communication paths 34. The pressurizing unit 42 may be configured to pressurize and introduce air, or may be configured to pressurize and pressurize air. The configuration may be such that an inert gas such as nitrogen is pressurized and press-fitted. The switching unit 44 includes, for example, a plurality of switching valves 46, and each of the plurality of switching valves 46 is connected to the plurality of communication paths 34. According to such a pressure adjusting unit 22, for example, the communication path 34 where the resin R easily flows in the cavity recess 12 and the communication path 34 where the resin R hardly flows are sucked or compressed. It is possible to reduce the pressure (negative pressure) or pressurize (positive pressure) or adjust the pressure for each predetermined portion of the mold interior 20. The pressurizing unit 42 is not necessarily provided, and the switching unit 44 may be omitted, and the flow rate adjusting unit 38 and the pressure reducing unit 36 may be directly connected.

  Moreover, it is preferable that the pressure adjusting unit 22 includes a flow rate measuring unit 48 that measures the flow rate of each of the plurality of communication passages 34 when the measurement result is read by the control unit 24. The flow rate measuring unit 48 includes, for example, a plurality of flow meters 50, and each of the plurality of flow meters 50 is connected to the plurality of communication paths 34. According to such a pressure adjusting unit 22, the result of the gas flow rate in each communication passage 34 can be confirmed, and the gas flow rate in the communication passage 34 can be adjusted by the flow rate adjustment unit 48.

  The pressure measuring unit 23 is connected to the pressure adjusting unit 22 so as to measure pressures at a plurality of locations in the mold interior 20 adjacent to one end of the communication path 34 connected to the pressure adjusting unit 22. The passage 34 is connected to a communication passage 34 different from the passage 34. The pressure measurement unit 23 includes, for example, a plurality of pressure gauges 52. According to such a pressure measurement unit 23, the gas flow rate of each communication passage 34 connected to the flow rate adjustment unit 48 of the pressure adjustment unit 22 is adjusted by confirming the pressure results at a plurality of locations in the mold interior 20. Can do. Specifically, the gas flow rates of the two communication passages 34 connected to the pressure adjusting unit 22 across the one communication passage 34 connected to the pressure measuring unit 23 can be adjusted.

  Next, an operation method of the resin molding apparatus 10 will be described, and a method for manufacturing a molded product (molding method) will be described. First, as shown in FIG. 2, in a state where the pair of molds 14 is opened, the workpiece W carried into the mold by a loader (not shown) in the upper mold 16 is transferred to a workpiece holding unit (not shown). 2) is sucked and held (set) on the mold surface of the upper mold 16. In the lower mold 17, first, the cavity piece 62 is moved relative to the clamper 64 so that the upper end surface of the cavity piece 62 comes to the standby position. Thus, the upper end surface of the cavity piece 62 is lower than the upper end surface of the clamper 64 with respect to the upper end surface of the base 60. Further, the release film F carried into the mold interior 20 by the film transport unit (not shown) is sucked and held (set) on the mold surface of the lower mold 17 including the cavity recess 12 by the suction units 18 and 19. As the release film F, a film material having heat resistance capable of withstanding the heating temperature of the pair of molds 14 and easily peeled off from the mold surface of the lower mold 17 and having flexibility and stretchability is used. Use. Specifically, as the release film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, or the like is used.

  Subsequently, the resin R is supplied to the center of the bottom of the cavity recess 12 through the release film F. Since the pair of molds 14 is heated to a predetermined temperature, the resin R is melted from a location where it contacts the bottom of the cavity recess 12 (the upper end surface of the cavity piece 62). As the resin R, for example, a liquid, granular, powdery, or sheet-like resin is used. For example, the resin R can be supplied by a dispenser equipped with a syringe that can be filled and injected with a liquid resin. The resin R can be supplied into the cavity recess 12 by placing the resin R on the center of the release film F outside the mold and carrying it into the mold together with the release film F.

  Subsequently, as shown in FIG. 3, the upper die 16 and the lower die 17 are brought close to each other from the state in which the pair of molds 14 are opened to the mold closed state, and a seal provided on the lower end surface of the clamper 32. The member 33 is brought into contact with the upper end surface of the clamper 64 (ie, seal ring touch). As a result, the mold interior 20 including the cavity recess 12 is sealed to form a sealed space. At this time, by operating the pressure reducing unit 36 of the pressure adjusting unit 22, the inside of the mold 20 is depressurized through the plurality of communication paths 34, and can be in any degassing state.

  In this case, for example, when it is desired to uniformly reduce the pressure in the sealed space, air (atmosphere) is sucked from all the communication paths 34 with a uniform strength. In this case, for example, assuming a configuration in which one communication path 34 is connected to the through hole 32 a of the clamper 32, suction from the communication path 34 causes the inner peripheral surface of the through hole 32 a of the clamper 32 and the center block 30. Air is sucked from the communication path 34 through a gap with the outer peripheral surface. At this time, air begins to be sucked immediately at a position close to the communication path 34, but air suction is delayed at a position away from the communication path 34. For this reason, the decompressed state at a position away from the position of the communication path 34 is insufficient, and unfilling and voids are likely to occur. In addition, the work W has been increased in size to improve productivity, resulting in a significant increase in the volume that must be sucked during decompression, which further reduces the state of air suction (decompression). It tends to be uniform. On the other hand, by providing a plurality of communication passages 34 as in the present embodiment, it is possible to ensure a uniform reduced pressure state even when the workpiece W is enlarged.

  Subsequently, as shown in FIG. 4, the upper die 16 and the lower die 17 are further brought closer to each other, and the workpiece W (through the release film F is interposed between the center block 30 of the upper die 16 and the clamper 64 of the lower die 17. Clamp the substrate S). Thereby, the cavity is formed by closing the opening of the cavity recess 12 with the workpiece W (substrate S), and the resin R is filled in the cavity and the resin pressure is applied. Further, the seal member 33 is pressed and compressed by the clamper 32 of the upper mold 16 and the clamper 64 of the lower mold 17, and the sealing performance of the mold interior 20 is improved. In addition, by forming an air vent groove (not shown) on the upper end surface of the clamper 64, the inside of the cavity recess 12 (cavity) can be decompressed even after the release film F is clamped.

  In this case, by bringing the upper die 16 and the lower die 17 closer to each other, the resin R supplied to the center of the bottom of the cavity recess 12 is pressed against the workpiece W, and the resin R is applied to the outer peripheral side of the bottom of the cavity recess 12. Start to spread. At this time, it is conceivable that in the cavity recess 12, there are places where the resin R easily flows (that is, the flow resistance is low) and places where the resin R is difficult to flow (the flow resistance is high) depending on the arrangement of the electronic component P. Even in such a case, according to the resin molding apparatus 10 including the pressure adjusting unit 22, for example, the communication path 34 where the resin R easily flows is sucked (reduced pressure) weakly, and the communication of the position where the resin R is difficult to flow is performed. The passage 34 can be strongly sucked (depressurized).

  Next, the upper mold 16 and the lower mold 17 are brought closer to each other (clamping is performed), and the resin R filled in the cavity recess 12 is compressed. Specifically, as the pair of molds 14 are clamped, the elastic member 66 is compressed and the clamper 64 moves toward the base 60 while being biased. The cavity piece 62 moves relative to the clamper 64. At this time, the position of the upper end surface of the cavity piece 62 in the cavity recess 12 changes from a deep standby position to a shallow molding position. Next, the resin R filled in the cavity recess 12 is thermally cured for a predetermined time in a state where the resin R is held (in a molding position).

  Here, with reference to FIG. 5 and FIG. 6, the adjustment operation of the pressure adjusting unit 22 according to the ease of flow of the resin R due to the shape of the workpiece W (arrangement with or without the electronic component P) or the like will be specifically described. To do. 5 and 6, the direction in which the resin R flows from the center of the workpiece W toward the outside in correspondence with the in-plane position of the workpiece W held by the upper die 16 is the direction D1 (electronic component P) that is most easily flowable. In the direction in which the flow of the resin R is not blocked), the direction D2 in which the flow of the resin R is most difficult (the direction in which the flow of the resin R is blocked by the electronic component P), and the direction D3 in which the flow is easy. 5 and 6, the resin R spreading position (outer position) in the upper end surface (bottom surface of the cavity recess 12) of the cavity piece 62 is made to correspond to the in-plane position of the workpiece W held by the upper mold 16. ) In the order of the initial position T0 (supply position), midway position T1, and midway position T2 (end stage position).

  For example, only the pressure reducing unit 36 of the pressure adjusting unit 22 is operated, and the inside 20 of the mold is depressurized from a plurality of communication passages 34 communicating with the pressure reducing unit 36 (Note that in FIG. 5 and FIG. The resin R is pressed against the workpiece W. Then, as shown in FIG. 5, the resin R flows most in the direction D1 and flows in the order of the direction D3 and the direction D2 at a certain time (for example, at the midway position T1 or the midway position T2). (Expand). Accordingly, a portion that is filled first and a portion that is filled later in the cavity recess 12 are generated, and in some cases, voids and unfilled portions are likely to occur at positions where filling is delayed, There is also a risk that the quality will deteriorate.

  Therefore, for example, the entire pressure adjusting unit 22 is operated, and the gas flow rate in the plurality of communication passages 34 communicating with the depressurizing unit 36 is adjusted by the flow rate adjusting unit 38 to depressurize the mold interior 20 and apply the resin R to the work W. As shown in FIG. 6, as shown in FIG. 6, the resin R flows evenly at a certain time (for example, at the midway position T1 or midway position T2) regardless of the directions D1, D2, and D3. Specifically, the pressure is reduced (smallest) from the communication path 34 in the direction D1 in which flow is the easiest, and the pressure is increased (strong) in the maximum (strong) from the communication path 34 in the direction D2 in which flow is the least. The pressure is reduced moderately from the communication path 34 in the direction D3. Thereby, in the cavity recessed part 12, resin R is filled substantially simultaneously. That is, it is possible to prevent the generation of voids and unfilled portions at positions where filling is delayed, and improve the quality of the molded product.

  Next, the pair of molds 14 are opened, the upper mold 16 and the lower mold 17 are separated, and the workpiece W is taken out (conveyed) outside the mold. Furthermore, as a post-processing, the resin molded portion of the workpiece W is thermally cured (post-cured) for a predetermined time, thereby completing a molded product in which the electronic component P of the workpiece W is resin-sealed with the resin R (resin molded portion).

  As described above, according to the present embodiment, a plurality of communication paths 34 connected to the sealed space including the cavity are provided, and a uniform reduced pressure state or a partially reduced pressure state is provided in the sealed space. With this configuration, for example, when resin molding is performed in a circle, it is possible to prevent the occurrence of problems such as unfilling and improve the quality of the molded product.

(Embodiment 2)
In the first embodiment, a case has been described in which the cavity concave portion 12 having an opening having a circular shape in plan view is used corresponding to the workpiece W having a circular shape in plan view. In the present embodiment, a resin molding apparatus 10 that includes a pair of molds 14 each having a cavity recess 12 whose opening has a rectangular shape in plan view corresponding to a rectangular workpiece W in plan view, and performs compression molding. A description will be given with reference to FIGS. FIG. 7 is a view for explaining the resin molding apparatus 10 according to the present embodiment. 8 and 9 are diagrams for explaining the operational effects of the resin molding apparatus 10 shown in FIG. Similarly to the first embodiment, the resin molding apparatus 10 according to the present embodiment also includes a pair of molds 14, a pressure adjusting unit 22, a control unit 24, an input unit 25, and a display unit 26. Further, the resin molding apparatus 10 may include the pressure measurement unit 23 described with reference to FIG. In the following description of the present embodiment, the same configuration as that of the first embodiment is basically omitted, and different points will be mainly described.

  7, the upper mold 16 surrounds the base 28, the rectangular center block 30 fixedly assembled to the base 28, and the center block 30, and moves forward and backward (up and down movement). And a clamper 32 assembled as possible. The clamper 32 surrounding the center block 30 is formed with a rectangular through hole 32a, and is assembled to the base 28 so that the center block 30 is inserted into the through hole 32a. Further, as shown in FIG. 7, the upper die 16 includes a cavity inside 12 that includes a cavity recess 12 that faces the outside of the die and the center block 30 (in FIG. 7, the facing position is indicated by a one-dot chain line) (FIG. 3). And a plurality of communication paths 34 (in FIG. 7, the state seen through is indicated by broken lines). The plurality of communication passages 34 have one end portion on the cavity recess 12 (mold interior 20) side opened around the opening of the cavity recess 12, and the other end portion on the mold outer side is the pressure adjusting unit 22 or pressure measurement unit. 23. One end portions of the plurality of communication passages 34 are opened at predetermined positions around the opening of the cavity recess 12 (for example, the direction in which the resin R easily flows from the center to the outside or the direction in which the resin R hardly flows). In the present embodiment, as an example, in the plan view shown in FIG. 7, one communication path 34 is provided at each of the side central part and the corner part of the rectangular through hole 32 a of the clamper 32, and connected to the pressure adjusting part 22. Is done. In addition, the communication path 34 can be arrange | positioned freely and can also be arrange | positioned only at a corner | angular part.

  Here, with reference to FIG. 8 and FIG. 9, the adjustment operation of the pressure adjusting unit 22 according to the ease of flow of the resin R due to the shape of the cavity recess 12 and the like will be specifically described. FIGS. 8 and 9 are explanatory views of the filling state when the liquid resin is supplied in an outer circular shape to the workpiece W having a rectangular shape in plan view as an example. The liquid resin is supplied at a single point with a predetermined amount of resin required in the center of the workpiece W in order to improve productivity. In this case, the liquid resin is expanded into a circular shape by being pushed out to the mold by closing the mold.

  In these drawings, the direction of the resin R flowing from the center of the workpiece W toward the outside in the direction corresponding to the in-plane position of the workpiece W held by the upper mold 16 is the direction D1 in which the flow distance is shortest and the distance through which the flow is the longest. Is shown as a long direction D2. 8 and 9, the resin R spreading position (outer position) in the upper end surface of the cavity piece 62 (bottom surface of the cavity recess 12) corresponding to the in-plane position of the workpiece W held by the upper mold 16. ) In the order of the initial position T0 (supply position), midway position T1, midway position T2, and midway position T3 (end stage position).

  For example, the pressure reducing unit 22 of the pressure adjusting unit 22 is operated, and the inside of the mold 20 is uniformly depressurized from a plurality of communication passages 34 communicating with the pressure reducing unit 36 (Note that in FIG. 8 and FIG. The resin R is filled while the size is indicated. At this time, the distance from the center of the cavity recess 12 to the outer side center (distance in the direction D1) and the distance from the center of the cavity recess 12 to the outer corner (distance in the direction D2) are different. As shown in FIG. 8, even when the resin R flowing in the direction D1 reaches the side portion, the filling of the resin R flowing in the direction D2 is delayed with respect to the corner portion (see position T2).

  Therefore, for example, when the entire pressure adjusting unit 22 is operated and the gas flow rate in the plurality of communication passages 34 communicating with the depressurizing unit 36 is adjusted by the flow rate adjusting unit 38, the resin R is filled while depressurizing the mold interior 20. As shown in FIG. 9, the resin R flows in the direction D2 with priority over the direction D1. Specifically, the pressure is weakest from the communication path 34 in the direction D1 with the shortest distance, and the pressure is reduced most strongly from the communication path 34 in the direction D2 with the longest distance. In other words, air is sucked and decompressed more strongly in the corner communication path 34 than in the side center communication path 34. As a result, the resin R easily flows toward the corner portion that is strongly decompressed, and the resin R is preferentially filled. Accordingly, in the cavity recess 12, the difference in filling state between the direction toward the center of the side and the direction toward the corner is reduced, and the liquid resin supplied in a circular shape is filled into the rectangular cavity recess 12. Even in this case, it is filled uniformly. That is, generation of voids and unfilled portions can be prevented, and the quality of the molded product can be improved.

  In addition, when air is sucked and reduced in pressure more strongly in the corner communication passage 34 than in the side center communication passage 34, air can be sucked and reduced only from the corner communication passage 34. The pressure may be reduced from the corner communication path 34 while air is pressurized from the communication path 34 of the corner.

(Embodiment 3)
In the embodiment, the case where the sealed space in the pair of molds 14 for compression molding is decompressed has been described. In this embodiment, a resin molding apparatus 10A including a pressure adjusting unit 22 that adjusts the gas flow rate of a plurality of communication passages 34 communicating with a mold interior 20 formed by a chamber unit 14B that surrounds a molding unit 14A is illustrated in FIGS. This will be described with reference to FIG. FIG. 10 is a view for explaining a resin molding apparatus 10A according to the present embodiment. FIGS. 11 to 14 are schematic cross-sectional views of the main part of the resin molding apparatus 10A in operation shown in FIG. 10, and the resin molding apparatus 10A is symmetrical with respect to the axis of the pot 84 (plunger 86). The left cavity recess 12 is shown extracted.

  The resin molding apparatus 10A according to the present embodiment manufactures a package product by transfer molding a resin molding portion (resin R) on a workpiece W, and a pair of molds 14 as in the first embodiment. (Upper die 16 and lower die 17), a pressure adjusting unit 22, a control unit 24, an input unit 25, and a display unit 26 are provided. Further, the resin molding apparatus 10A may include the pressure measuring unit 23 described with reference to FIG. Further, in the resin molding apparatus 10 </ b> A, the cavity recess 12 is provided in the upper die 16, and the workpiece holding portion 74 (recess) that holds the workpiece W is provided in the lower die 17. A workpiece W (molded product) before molding includes a substrate S (for example, a wiring substrate) having a rectangular shape in plan view and a plurality of electronic components P (for example, semiconductor chips) mounted on the substrate S in a matrix arrangement. (See FIG. 11). The molded workpiece W (molded product) further has a resin molded portion (resin R) for sealing a plurality of electronic components P (see FIG. 14).

  The upper mold 16 has a base 28 having a concave portion 28a whose opening is rectangular in plan view, and a center block 30 fixedly assembled to the base 28 in the concave portion 28a. In the present embodiment, the runner gate 78 and the cavity recess 12 are provided so as to communicate with each other around the cull 76 on the mold surface of the center block 30. As described above, the pair of molds 14 is the upper mold 16 and has the plurality of cavity recesses 12, and the opening is formed in the center block 30 so as to have, for example, a rectangular shape in plan view.

  Further, the upper mold 16 has a plurality of communication passages 70 that connect the periphery of the opening of the cavity recess 12 and the outside of the mold. For example, the communication path 70 is configured by perforating the center block 30, and one end portion on the opening side of the cavity recess 12 opens at the mold surface (lower end surface) of the center block 30, and the other end on the mold outer side. The part is connected to the suction part 18 via a pipe line. The suction part 18 here is for reducing pressure after mold closing.

  The lower mold 17 is assembled to the chase 80 in the recess 60a formed in the chase 80 formed in the chase 80 assembled to the base 60 in the recess 60a, the base 60 having the rectangular recess 60a in the plan view. And a plurality of pots 84 provided in a row at the center of the insert 82 and supplied with the resin R, and a plunger 86 provided in the pot 84. The plunger 86 is configured to be movable back and forth by a known drive source (not shown) provided in the resin molding apparatus 10A. The lower die 17 seals between the upper die 16 (base 28) and the lower die 17 (base 60) provided on the die surface (upper end surface) of the base 60 in order to seal the inside 20 of the die. A sealing member 33 (for example, an O-ring) is provided. The lower mold 17 is formed between the upper mold 16 (center block 30) and the lower mold 17 (chase 80) provided on the mold surface (upper end surface) of the chase 80 in order to seal the mold interior 20. It has the sealing member 90 (for example, O-ring) to seal.

  Further, as shown in FIG. 10, the lower mold 17 has a plurality of communication passages 34 (FIG. 10) communicating the mold exterior and the mold interior 20 (see FIG. 12) including the cavity recess 12 facing the insert 82. The transparent state is indicated by a broken line). The plurality of communication passages 34 have one end on the cavity recess 12 (die interior 20) side opened around the pot 84 and the plurality of cavity recesses 12 around the pot 84, and the other side outside the mold. The end is connected to the pressure adjusting unit 22. The plurality of communication passages 34 are configured, for example, by perforating the base 60, one end communicating with the inner wall surface of the recess 60a of the base 60, and the other end communicating with the pressure adjusting unit 22 via a conduit. Connected.

  Such a pair of molds 14 includes a cavity recess 12, and is provided so as to surround the molding portion 14 </ b> A for thermosetting the resin R filled in the cavity recess 12, and the mold exterior and the mold. And a chamber portion 14B for partitioning the inside. The molding part 14 </ b> A includes the center block 30 in the upper mold 16, and the chase 80, the insert 82, and the pot 84 in the lower mold 17. The chamber portion 14B includes a base 28 of the upper mold 16, a base 60 of the lower mold 17, and a seal member 33 clamped by them. Region) can be formed. In the present embodiment, one end portions of the plurality of communication passages 34 are opened around the opening portion of the cavity recess 12 in the chamber portion 14B (more specifically, the base 60 of the lower mold 17). According to this, for example, even in the pair of molds 14 having the molding part 14A for performing transfer molding, the pressure adjusting part 22 weakly sucks the communication path 34 at the location where the resin R easily flows in the cavity recess 12 ( It is easy to strongly suck (depressurize) the communication path 14 where the resin R does not flow easily.

  Next, an operation method of the resin molding apparatus 10A will be described, and a method for manufacturing a molded product (molding method) will be described. First, as shown in FIG. 11, in a state where the pair of molds 14 are opened, in the lower mold 17, the work W carried into the mold by a loader (not shown) is arranged in the work holding unit 74 ( set. Further, the resin R is supplied (set) into the pot 84 in which the plunger 86 is retracted. At this time, since the pair of molds 14 is heated to a predetermined temperature, the resin R supplied into the pot 84 is melted.

  Subsequently, as shown in FIG. 12, the upper mold 16 and the lower mold 17 are brought close to each other from the opened state of the pair of molds 14 to the closed state, and provided on the upper end surface of the base 60 of the lower mold 17. The seal member 33 is brought into contact with the lower end surface of the base 28 of the upper die 16 (that is, a seal ring touch). As a result, the mold interior 20 including the cavity recess 12 is sealed. At this time, by operating the pressure reducing unit 36 (see FIG. 1) of the pressure adjusting unit 22 in advance, the inside 20 of the mold is depressurized through the plurality of communication passages 34 to be in an arbitrary deaeration state. it can.

  Further, by bringing the upper die 16 and the lower die 17 closer to each other, the seal member 90 provided on the upper end surface of the chase 80 of the lower die 17 is brought into contact with the lower end surface of the center block 30 of the upper die 16 ( That is, the suction unit 18 starts the pressure reduction of the air in a narrower area inside the seal member 90 by performing a seal ring touch).

  Subsequently, by bringing the upper mold 16 and the lower mold 17 closer to each other, a release film (not shown) is formed between the center block 30 of the upper mold 16 and the insert 82 of the lower mold 16 as shown in FIG. The workpiece W (substrate S) is clamped via Thereby, the cavity is formed by closing the opening of the cavity recess 12 by the workpiece W (substrate S). In addition, clamping by the center block 30 of the upper die 16 and the insert 82 of the lower die 16 is provided by providing an air vent groove (not shown) for connecting the communication passage 70 and the cavity recess 12 on the lower end surface of the center block 30. Even after there is no gap between the mold surfaces, the cavity recess 12 (cavity) can be depressurized.

  Subsequently, as shown in FIG. 14, the plunger 86 in the pot 84 is advanced to push out the resin R, and the resin R is pumped to the cavity concave portion 12 through the cull 76 and the runner gate 78, so that the cavity concave portion 12 is moved to the resin R. Fill with. At this time, it is conceivable that in the cavity recess 12, there are places where the resin R easily flows (that is, the flow resistance is low) and places where the resin R is difficult to flow (the flow resistance is high) depending on the arrangement of the electronic component P. Even in such a case, for example, the pressure adjusting unit 22 weakly sucks (depressurizes) the communication path 34 where the resin R easily flows, and strongly sucks (depressurizes) the communication path 34 where the resin R hardly flows. ). Therefore, generation of voids and unfilled portions in each cavity recess 12 can be prevented, and quality variation of each molded product can be reduced.

  In this case, for example, for the portion where the resin R easily flows, the pressure adjusting unit 22 pressurizes the inside 20 of the mold through the communication passage 34 to make the filling state uniform or different. You can also.

  Next, the resin R filled in the cavity recess 12 is thermally cured for a predetermined time in a state where the pressure is maintained. Next, the pair of molds 14 are opened, the upper mold 16 and the lower mold 17 are separated, and the workpiece W is taken out (conveyed) outside the mold. Furthermore, as a post-processing, the resin molded portion of the workpiece W is thermally cured (post-cured) for a predetermined time, thereby completing a molded product in which the electronic component P of the workpiece W is resin-sealed with the resin R (resin molded portion).

  By the way, in the state shown in FIG. 11, the resin R supplied into the pot 84 generates a large amount of gas containing water vapor or the like when melted depending on its composition or manufacturing method. A component contained in the gas adheres to the opening of the cavity recess 12 or the like, so that the releasability is deteriorated and the molding quality may be adversely affected. In contrast, air is not sucked from the communication passage 34 located on the opposite side of the cavity recess 12 until the gas discharge is completed, and this gas is supplied from the communication passage 34 located near the pot 84. Can be discharged. Next, from the timing after the gas discharge is completed, air is also sucked from the communication path 34 located on the opposite side across the cavity recess 12. Thereby, the adverse effect on the mold surface (particularly the cavity recess 12) can be reduced. In this case, the air generated from the resin R is prevented from flowing toward the cavity recess 12 by press-fitting air or inert gas from the communication path 34 located on the opposite side of the cavity recess 12. Thus, gas contact with the cavity recess 12 can be prevented. By taking such a measure, it is effective from the viewpoint of preventing a decrease in releasability even for a low-adhesive mold material (including a base material or a surface treatment) containing, for example, yttrium oxide or zirconium oxide.

(Embodiment 4)
In the third embodiment, the case where the workpiece W is arranged with the plunger 86 interposed therebetween has been described. In the present embodiment, a resin molding apparatus 10 </ b> B in which one end portions of a plurality of communication passages 34 and pots 84 are provided around the opening of the cavity recess 12 will be described with reference to FIGS. 15 to 16. FIG. 15 is a view for explaining the resin molding apparatus 10B according to the present embodiment. FIG. 16 is a schematic plan view of a main part of the resin molding apparatus 10B in operation. From the pot 84 in the order of (A), (B), (C), (D), (E), and (F). The state in which the resin R pumped by the plunger 86 flows on the workpiece W in the cavity recess 12 is shown.

  The resin molding apparatus 10B manufactures a WLP product by transfer molding a resin molding portion (resin R) on a workpiece W. As in the first embodiment, a pair of molds 14 (upper mold 16 and The lower die 17), a pressure adjusting unit 22, a control unit 24, an input unit 25, and a display unit 26 are provided. In the present embodiment, the cavity recess 12 is provided in the upper die 16, and the workpiece holding portion 74 (recess) that holds the workpiece W is provided in the lower die 17. Further, the resin molding apparatus 10B includes a suction unit (not shown) that sucks the release film F so as to suck and hold the release film F along the mold surface of the upper mold 16 including the cavity recess 12. . A workpiece W (molded product) before molding includes a substrate S (for example, a carrier plate, a wafer, or a wiring substrate) having a circular shape in plan view, and a plurality of flip-chip mounted on the substrate S in a matrix arrangement via bumps. And an electronic component P (for example, a semiconductor chip). The molded workpiece W (molded product) further includes a resin molding portion (resin R) for sealing a plurality of electronic components P by mold underfilling, and the surface of the electronic component P (the surface on which the bumps are formed) Is exposed). In addition, the above-described resin molding apparatus 10B allows the resin molding (resin sealing) not to mold underfill in the workpiece W on which a plurality of electronic components P are mounted without using flip chip mounting in a matrix arrangement on the substrate S other than the circular shape in plan view. Stop) may be performed.

  The upper die 16 includes a base 60, a circular cavity piece 62 in a plan view that is assembled to the base 60 so as to be movable back and forth, and a clamper 64 in which a through hole 64a having a circular shape in a plan view into which the cavity piece 62 is inserted is formed. And have. The pair of molds 14 is an upper mold 16 having a cavity recess 12, and the bottom of the cavity recess 12 is formed by the lower end surface of the cavity piece 62, and the side of the cavity recess 12 is the inner surface of the clamper 64 (the through hole 64 a (Inner wall surface). For this reason, the opening part of the cavity recessed part 12 becomes a planar view circular shape. Further, a cull 76 and a runner gate 78 that communicate with the cavity recess 12 are formed on the lower end surface of the clamper 64 on the mold surface of the upper mold 16. The clamper 64 surrounds the cavity piece 62 and is assembled to the base 60 via an elastic member 66 (for example, a spring) so as to move up and down (advance and retreat). In such an upper mold 16, the cavity piece 62 and the clamper 64 are relatively movable, and the depth (that is, volume) from the opening of the cavity recess 12 is variable. A gap is formed between the outer surface of the cavity piece 62 and the inner surface of the clamper 64, but a suction path for adsorbing and holding the release film F along the mold surface of the upper mold 16 including the cavity recess 12. Used as When the workpiece W is clamped by the cavity piece 62 of the upper die 16 and the insert 82 of the lower die 17, the release film F adheres to the surface of the electronic component P, so that the surface of the electronic component P is exposed after release. It becomes.

  In the present embodiment, in the lower mold 17, one end portions of the plurality of communication passages 34 and pots 84 are provided around the opening of the cavity recess 12. In FIG. 16, the state of the resin R flowing on the workpiece W in the cavity recess 12 is shown, but one end portion of the communication path 34 is opened at a position with a white arrow around the workpiece W. Show. In addition, the direction of the hollow arrow indicates suction (decompression) and compressed air (pressurization) from the communication path 34 to the mold interior 20 including the cavity recess 12. According to such a resin molding apparatus 10B, the resin filling property of the cavity concave portion 12 can be improved by controlling the direction of the air flow of decompression or pressurization, the strength thereof, the operation timing, and the like. it can. It should be noted that the number of openings around the cavity recess 12 is not limited to one, and two may be provided at positions facing each other with the cavity recess 12 interposed therebetween, and a plurality of pots 84 (plungers 86) are arranged at a predetermined interval (for example, It may be provided at every 90 °.

  Next, an operation method of the resin molding apparatus 10B will be described, and a method for manufacturing a molded product (molding method) will be described. In the initial stage shown in FIG. 16A, for example, air in the cavity recess 12 is sucked from all the communication paths 34, and the inside 20 of the mold is decompressed. Subsequently, in the initial filling stage shown in FIG. 16B, air is sucked from the communication passage 34 on the side opposite to the pot 84, and compressed air is discharged from the other communication passage 34. As a result, the resin R from the pot 84 flows so as to pass through the center of the work W, and as shown in FIG. 16 (C), the resin R reaches the opposite side of the pot 84 so as to cross the work W in the diameter direction. R flows.

  When the air flow as described above is not made, the resin R is filled while flowing on the outer periphery of the workpiece W. This is because there is a wide area where the electronic component P (shielding object) is not mounted on the outer periphery of the work W, and it is easy to flow. Even in such a case, the resin R filled so as to surround the work W is filled in the center of the cavity recess 12 by preferentially filling the outer periphery of the work W with the resin R. It has been confirmed that voids and unfilling are likely to occur in the center of the cavity recess 12. On the other hand, by performing the control as in this embodiment, the resin R is first filled in the center of the cavity recess 12, so that generation of voids and unfilling in the center of the cavity recess 12 is reliably prevented. .

  As a result, the resin R spreads between the electronic components P mounted in the diameter direction of the workpiece W. Subsequently, as shown in FIG. 16D, switching is performed so that air is sucked from all the communication passages 34, and the center of the workpiece W is crossed as shown in FIGS. 16E and 16F. By pressing the resin R in a direction intersecting with the resin R, the cavity recess 12 is uniformly filled through the electronic components P in that direction.

  As described above, according to the resin molding apparatus 10B, for example, even when resin molding is performed on a large circular workpiece W, the workpiece W is adjusted by the pressure adjusting unit 22 connected to the plurality of communication paths 34. After the resin R is concentrated on the central portion of the resin, the cavity R 12 can be filled by uniformly spreading from the resin R at the central portion to the outer peripheral portion. Therefore, generation | occurrence | production of a void and an unfilled location can be prevented and the quality of a molded product can be improved.

  The present invention has been specifically described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof as follows. Nor.

  For example, in the first embodiment, a case has been described in which resin is supplied to the center of a work in which a plurality of electronic components are mounted on the entire substrate, and the cavity recess is filled with resin so as to spread the resin outward from the center. . Not limited to this, the resin can be supplied to the vacant space without mounting the electronic component at the center of the substrate, and the cavity recess can be filled with the resin so as to spread outward, thereby improving the filling property. .

  In the above-described embodiment, the communication passage 34 communicating with the mold interior 20 including the cavity recess 12 has been described with respect to the configuration capable of arbitrarily controlling the pressure reduction and pressurization of the air. However, the present invention is limited to this. Not. That is, a plurality of communication paths 70 and 72 arranged for adsorbing and holding the film F can be provided in the same manner as the communication path 34 and can be individually controlled. According to this, the imbalance of the adsorption strength of the film F due to the large plate surface can be prevented.

  In addition, a plurality of communication paths 70 and 72 arranged for adsorbing and holding the film F and a communication path 34 communicating with the mold interior 20 including the cavity recess 12 are provided, and can be individually controlled. By doing so, it is possible to obtain a synergistic effect by interlocking. According to such a configuration, the volume that must be sucked during decompression greatly increases due to the increase in the size of the workpiece W, and it is necessary to strongly depressurize in a short time. Even if this occurs, it is possible to reduce the pressure evenly without biasing the state of the pressure reduction by the passage 34. Thereby, the film F can be adsorbed uniformly uniformly. According to this, for example, it is possible to prevent the balance between decompression and adsorption in the cavity from being lost, and part of the film F to be drawn to the surface opposite to the adsorption surface and peeled off from the mold surface.

DESCRIPTION OF SYMBOLS 10 Resin shaping | molding apparatus 12 Cavity recessed part 14 A pair of metal mold | die 20 Inside a metal mold | die 22 Pressure regulation part 34 Communication path 36 Pressure reduction part 38 Flow volume regulation part

Claims (9)

A pair of molds having a cavity recess and capable of opening and closing;
A pressure adjusting part for adjusting the pressure inside the mold including the cavity recess,
The pair of molds has a plurality of communication passages that communicate the outside of the mold and the inside of the mold,
A sealing material is disposed on the mold surface surrounding the cavity recess and hermetically seals the interior of the mold. The plurality of communication paths have one end on the mold inner side around the opening of the cavity recess. Open, and the other end of the mold outside is connected to the pressure regulator,
The pressure adjusting unit is configured to close the mold via the plurality of communication passages, suck a gas inside the mold surrounded by the sealing material, and depressurize the inside of the mold, and the plurality of communication passages. A flow rate adjusting unit that adjusts each gas flow rate, while the flow rate adjusting unit adjusts the gas flow rate of the plurality of communication passages to depressurize the inside of the mold, and weakly depressurizes the communication passages in the direction of flow. The resin molding apparatus is characterized in that the communication path in a direction difficult to flow is adjusted to be strongly decompressed. The resin molding apparatus according to claim 1,
The pressure adjusting unit includes a pressurizing unit that pressurizes the inside of the mold by injecting gas into the mold through the plurality of communication passages, and the decompression unit and the pressurizing unit in each of the plurality of communication passages. A resin molding apparatus comprising: a switching unit that switches connection with the pressure unit. The resin molding apparatus according to claim 1 or 2,
The said pressure control part has a flow volume measurement part which measures each flow volume of these communication paths, The resin molding apparatus characterized by the above-mentioned. In the resin molding apparatus as described in any one of Claims 1-3,
A resin molding apparatus comprising: a pressure measuring unit that measures a pressure inside the mold adjacent to the one end of the communication path. In the resin molding apparatus as described in any one of Claims 1-4,
The pair of molds includes the cavity concave portion, and is provided so as to surround the molding portion, and a molding portion that thermally cures the resin filled in the cavity concave portion. A chamber part for partitioning,
In the chamber portion, the one end portion of the plurality of communication paths is provided around the opening of the cavity recess. In the resin molding apparatus as described in any one of Claims 1-5,
The pair of molds includes a pot and a plurality of the cavity recesses communicating with the pot,
The resin molding apparatus according to claim 1, wherein the one end portions of the plurality of communication passages are opened around the whole of the pot and the plurality of cavity concave portions. In the resin molding apparatus as described in any one of Claims 1-5,
The pair of molds includes a pot and the cavity recess communicating with the pot,
The resin molding apparatus, wherein the one end of the plurality of communication passages and the pot are provided around an opening of the cavity recess. In the resin molding apparatus as described in any one of Claims 1-7,
A release film adsorbed and held on the mold surface including the cavity recess;
A first suction part and a second suction part for sucking the release film;
The pair of molds has a plurality of first film communication paths and a plurality of second film communication paths that communicate the outside of the mold and the inside of the mold and suck the release film,
In the plurality of first film communication paths, one end portion on the inner side of the mold is around the opening of the cavity recess and opens on the mold surface, and the other end portion on the outer side of the mold is the first portion. Connected to one suction part,
The plurality of second film communication paths open around the bottom of the cavity recess so that one end on the mold inner side communicates with the corner of the cavity recess, and the other end on the mold outer side A resin molding apparatus connected to the second suction part. A pair of molds having a cavity recess and capable of opening and closing;
A release film adsorbed and held on the mold surface including the cavity recess;
A first suction part and a second suction part for sucking the release film;
The pair of molds has a plurality of first film communication paths and a plurality of second film communication paths that communicate the outside of the mold and the inside of the mold, and suck the release film,
In the plurality of first film communication paths, one end portion on the inner side of the mold is around the opening of the cavity recess and opens on the mold surface, and the other end portion on the outer side of the mold is the first portion. Connected to one suction part,
The plurality of second film communication paths open around the bottom of the cavity recess so that one end on the mold inner side communicates with the corner of the cavity recess, and the other end on the mold outer side A resin molding apparatus connected to the second suction unit, wherein the plurality of first film communication paths and the plurality of second film communication paths are individually suction controlled by providing strength.

Images