JP2007005675A - Resin-sealing mold and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can resin-seal an electronic component mounted on a product to be formed without causing a void in a package to be resin-molded and has high reliability. <P>SOLUTION: In the semiconductor device resin-sealed using a resin-sealing mold, a cavity resin-seals a mounting area of the electronic component mounted on the product 20 to be formed, and a dummy cavity to trap the air communicating with the edge of the cavity. A package portion 12 where the mounting area of the electronic component is resin-sealed, and a dummy forming portion 16 communicating with the edge portion of the package portion 12, are located. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resin sealing mold and a semiconductor device manufactured using the resin sealing mold.

A resin-encapsulated semiconductor device is manufactured by clamping a molded product with a resin-encapsulated mold, filling a cavity with resin, and encapsulating a semiconductor chip. FIG. 6 shows an example of a semiconductor device formed by resin-sealing a molded product on which a semiconductor chip is mounted on a substrate 10, FIG. 6 (a) is a plan view of the semiconductor device, and FIG. FIG. In this semiconductor device, a package portion 12 in which a semiconductor chip is sealed with a resin is formed on one surface of a substrate 10.
In this way, when the product to be molded is clamped with a resin-sealing mold, and the resin is sealed by filling the cavity with resin, the resin is sealed so that the air trapped in the cavity does not enter the sealing resin. An air vent is provided in the mold, and the resin is sealed by discharging air from the cavity to the outside.

FIG. 6 illustrates a state in which the resin 14 a discharged together with air adheres to the substrate 10 outside the corner portion of the package portion 12 in an air vent portion provided in the resin-sealed mold. The air vent is formed so as to allow only air to pass by slightly grinding the clamp surface of the resin-sealed mold, and is formed so as to extend outward from the edge of the cavity. In the example shown in FIG. 6, one end of the air vent is connected to the corner portion of the cavity, and the other end of the air vent is formed to be pulled out to the outer edge position of the substrate 10. Thus, when the resin is filled in the cavity, the air in the cavity can be discharged from the air vent portion to the outside and sealed with the resin.
JP 2000-260795 A

  The semiconductor device shown in FIG. 6 is a single-sided resin-encapsulated product in which a semiconductor chip mounted on a substrate 10 is resin-encapsulated by a compression molding method. The present invention is not limited to the compression molding method and can be similarly applied when resin sealing is performed by a transfer molding method. Further, the present invention is not limited to a single-sided resin-encapsulated product, but is also applied to a double-sided resin-encapsulated product in which a semiconductor chip is mounted on a lead frame and resin-encapsulated.

  However, it is necessary to prevent the resin vent from being discharged from the cavity of the air vent provided in the resin-sealed mold. Actually, the clamp surface of the resin-sealed mold is formed by grinding an extremely thin depth of about 0.03 mm. is doing. When resin is filled in the cavity, the air is pressurized and compressed by the resin in the cavity, and the air in the cavity is discharged from the air vent. The discharge path has a large resistance, and air is not necessarily discharged reliably, and a void due to residual air may occur in the package part 12. In particular, since the air vent is provided on the substrate surface (clamp surface) of the molded product, there is a difference in the thickness of the package portion 12 and the depth of the air vent, so that air is easily trapped near the outer surface of the package portion 12 or in the corner portion. There was a problem that a void 12a was generated at the corner of the package part 12.

  The present invention has been made to solve these problems, and prevents the generation of voids in the body of the package part, and provides a resin-sealing mold that can be provided as a highly reliable product and the resin-sealing mold. The present invention relates to a semiconductor device manufactured using a mold.

The present invention has the following configuration in order to achieve the above object.
That is, in a resin-sealed mold that is mounted on a resin-sealing device and clamps the molded product and fills the cavity with resin to seal the molded product, the electronic component mounted on the molded product And a dummy cavity for trapping air, which is connected to the edge of the cavity. When the resin is sealed, the dummy cavity is trapped by trapping air when the resin is gradually filled into the cavity, thereby preventing voids from being generated in the cavity.

The cavity has a rectangular planar shape, and the dummy cavities are connected to the corners of the cavities so that air is trapped in the dummy cavities during resin sealing. Resin sealing can be performed without generating voids in the stopper.
In addition, since the air vent is provided in communication with the dummy cavity, the action of trapping air in the dummy cavity is more preferable, and the resin can be more preferably sealed without generating a void.

In addition, a cavity block formed in accordance with the planar shape of the cavity, and a clamper movably provided in the mold opening / closing direction in an arrangement surrounding the cavity block, the product to be molded is resin-sealed by a compression molding method. In the resin-sealed mold, a dummy cavity recess is provided on the clamp surface of the clamper so as to constitute the dummy cavity with one end facing the inner surface of the clamper.
In addition, a resin sealing region for clamping and molding the product to be molded is provided in an arrangement surrounded by a vacuum chamber, and a vacuum device for evacuating the inside of the vacuum chamber is provided. It is possible to perform suitable resin sealing while suppressing generation of voids in the resin sealing portion.

  In addition, a resin-sealing mold provided with a cavity for resin-sealing a mounting area of an electronic component mounted on a molded article, and a dummy cavity connected to the edge of the cavity and trapping air is used. A resin-sealed semiconductor device is characterized in that a mounting portion for mounting the electronic component is provided with a resin-sealed package portion, and a dummy molding portion is provided so as to be connected to an edge portion of the package portion.

  According to the resin-sealed mold according to the present invention, the air remaining in the cavity at the time of resin sealing is provided by connecting the mounting area of the electronic component of the molded product to the cavity for resin sealing and providing the dummy cavity. Can be encapsulated in the dummy cavity, and the dummy cavity can act as an air trap so that no voids are generated in the mounting area of the electronic component and the molded product is encapsulated. Can do. In addition, the semiconductor device according to the present invention can be provided as a highly reliable product.

Hereinafter, embodiments of a semiconductor device according to the present invention and a resin-sealed mold used for manufacturing the semiconductor device will be described in detail.
(Configuration of semiconductor device)
FIG. 1A is a plan view showing a configuration of an embodiment of a semiconductor device according to the present invention, and FIG. 1B is a cross-sectional view taken along the line BB of FIG.
In the semiconductor device 20 of the present embodiment, a package portion 12 is provided on one surface of the substrate 10 for resin-sealing a region where an electronic component such as a semiconductor chip is mounted, and dummy forming is performed at four corner portions of the package portion 12. The part 16 is formed by being connected. As shown in FIG. 1B, in the present embodiment, the dummy molding portion 16 is provided with a thickness of about ½ of the thickness of the package portion 12, and, like the package portion 12, one of the substrates 10 is provided. It is attached to the surface.

  As shown in FIG. 1A, the dummy molding portion 16 is formed to extend from the corner portion of the package portion 12 by a predetermined length in the diagonal direction. The dummy molding part 16 is resin-molded at the same time as the package part 12 is resin-molded, and includes a cavity for resin-molding the package part 12 and a resin-sealed mold including a dummy cavity for resin-molding the dummy molding part 16. It is obtained by resin molding using

  In the semiconductor device 20 of the present embodiment, the resin molding part is provided in a shape in which the dummy molding part 16 is extended outward from the corner part of the package part 12, so that air remaining in the cavity at the time of resin sealing can be obtained. It can be moved to the dummy molding part 16 side and the resin can be sealed by pushing the void into the dummy molding part 16, whereby at least a void is not generated in the package part 12 on which the semiconductor chip is mounted. Therefore, it is possible to provide a highly reliable semiconductor device.

(Configuration of resin sealing device)
2 to 4 show a configuration of a resin sealing mold which is a main component part of the resin sealing device used for manufacturing the semiconductor device 20 described above, and a process of resin sealing using the resin sealing mold. Show.
Below, first, the structure of the resin-sealed mold will be described with reference to FIGS.
The resin-sealed mold according to the present embodiment includes a lower mold 40 in which the product 30 is set, a cavity block 42 disposed on the upper mold side facing the lower mold 40, and an arrangement surrounding the cavity block 42. And a clamper 44 formed in a rectangular frame shape. The cavity block 42 is supported by the upper mold base 46, and the clamper 44 is supported by a resilient spring 48 supported by the upper mold base 46 so that the clamp surface protrudes from the end face of the cavity block 42 toward the lower mold 40. ing.

The cavity block 42 is formed in accordance with a planar arrangement of cavities for resin-sealing a mounting area of an electronic component such as a semiconductor chip mounted on the molded product 30.
In the present embodiment, the resin sealing region for clamping and molding the molded product 30 is provided in a form surrounded by the vacuum chamber 50, and the vacuum chamber 50 is connected to the vacuum device via the chamber exhaust path 52. 54.

A characteristic configuration of the resin-sealed mold of this embodiment is that a dummy cavity recess 45 a is formed on the clamp surface of the clamper 44. This dummy cavity recess 45a is for forming the dummy cavity 45 in communication with a cavity for resin-sealing the molded product 30 when the molded product 30 is clamped with the lower mold 40.
FIG. 3 shows a state in which the cavity block 42 and the clamper 44 are viewed from the lower mold 40 side. As described above, the clamper 44 is formed in a frame shape surrounding the cavity block 42, and the dummy cavity recess 45 a is provided at each corner portion of the cavity block 42 so that one end side faces the inner side surface of the clamper 44. It has been. The cavity block 42 is formed by chamfering the corner portion, and the dummy cavity concave portion 45a is formed by aligning one end side with this chamfering position.

An air suction hole 44a for air suction of the release film 60 is formed on the clamp surface of the clamper 44, and an air suction hole 44b is also formed on the inner surface of the dummy cavity recess 45a. These air suction holes 44 a and 44 b are provided in communication with an air flow path 44 c formed inside the clamper 44, and the air flow path 44 c is connected to an air suction mechanism 56.
In addition, a slit groove is provided on the outer surface of the cavity block 42, and a slit hole 42 a is formed between the inner surface of the clamper 44 in a state where the cavity block 42 is mounted so as to be in sliding contact with the inner surface of the clamper 44. The slit hole 42 a is provided so as to communicate with an air flow path 44 c formed inside the clamper 44.

  In the present embodiment, the air suction holes 44a and 44b and the slit hole 42a are communicated with a common air flow path 44c. However, the air suction holes 44a and 44b and the slit hole 42a are connected to different air flow paths. The air suction holes 44a and 44b and the slit hole 42a are separately connected to the air suction mechanism, and the air suction operation by the air suction holes 44a and 44b and the slit hole 42a is individually controlled. Is possible.

(Resin sealing process)
Then, the process of resin-sealing the to-be-molded product 30 with the resin sealing apparatus provided with the resin sealing metal mold | die mentioned above is demonstrated.
First, in a state where the resin-sealed mold is opened (FIG. 2), the molded product 30 is set on the lower mold 40, and the molding resin 32 is supplied onto the molded product 30. In this embodiment, the molded product 30 is resin-sealed by a compression molding method. Therefore, a required amount of resin 32 is weighed and supplied onto the product 30. As the resin 32, a liquid resin, a paste-like resin, or the like can be used. The resin 32 may be supplied after the molded product 30 is set in the lower mold 40, or the resin 32 is supplied in advance to the molded product 30 outside the mold, and the molded product 30 is placed in the mold together with the resin 32. You may set it in.

  FIG. 2 shows an example in which the molded product 30 is resin-sealed with a single cavity for the sake of simplification. However, a plurality of semiconductor chips mounted on a substrate or a group of semiconductor chips are resin-sealed. In such a case, a cavity is provided for each chip or for each group, and a predetermined amount of resin 32 is supplied for each cavity and resin sealing is performed.

On the other hand, on the upper mold, the release film 60 is supported by air suction on the clamp surface of the clamper 44 and the inner and inner bottom surfaces of the cavity recess. The release film 60 is air adsorbed to the clamp surface of the clamper 44 through the air adsorbing hole 44a, and the release film 60 is adsorbed into the dummy cavity recess 45a through the air adsorbing hole 44b. In the cavity recess, the release film 60 is air-sucked from the bottom surface side of the cavity recess by the slit hole 42 a located on the side surface of the cavity block 42, and the release film 60 is air adsorbed along the inner surface of the cavity recess.
The release film 60 is easily peeled off from the resin 32, has heat resistance sufficient to withstand the heating temperature of the mold, and can be easily adsorbed along the inner surface of the cavity recess by an air suction operation. What has flexibility and elasticity is used.

After setting the molded product 30 and the resin 32 on the lower mold 40 and supporting the release film 60 on the upper mold, the resin sealing area is set to a vacuum area (vacuum chamber) closed from the outside, and the vacuum device 54 is When operated, the inside of the vacuum chamber 50 is evacuated from the chamber exhaust passage 52.
FIG. 2 shows a state in which the inside of the vacuum chamber 50 is evacuated and the release film 60 is air adsorbed on the inner surface of the cavity recess. The degree of vacuum of the air suction mechanism 56 is set to be higher than the degree of vacuum of the vacuum chamber 50 so that the release film 60 can be securely adsorbed onto the inner surface of the cavity recess formed by the clamper 44 and the cavity block 42. .

When the inside of the vacuum chamber 50 reaches a predetermined degree of vacuum, the movable mold side of either the lower mold or the upper mold is moved to a position where the molded article 30 is clamped, and the molded article 30 is clamped by the lower mold and the upper mold. To do. FIG. 4 shows a state in which the clamp surface of the clamper 44 is in contact with the surface of the molded product 30.
A cavity 43 is formed by the clamper 44 coming into contact with the molded product 30, and a dummy cavity 45 is formed at a portion of the clamper 44 where the dummy cavity recess 45 a is formed. The resin 32 is accommodated in the cavity 43.
The vacuum chamber 50 is continuously evacuated by the vacuum device 54, and the release film 60 is also continuously sucked by the air suction mechanism 56.

Next, from the state shown in FIG. 4, the movable mold side is moved to the mold clamping position, the resin 43 is filled in the cavity 43 and the dummy cavity 45, and the molded product 30 is resin-sealed. FIG. 5 shows a state where the molded product 30 is sealed with resin.
By moving the movable mold side to the mold clamping position (resin sealing position), the cavity 43 and the dummy cavity 45 are filled with the resin 32, and the cavity 43 and the dummy cavity 45 are filled with the resin 32 to hold the pressure. The resin 32 is cured.

In the compression molding, the resin 32 is filled into the cavity 43 and the dummy cavity 45 as the movable mold is gradually moved to the mold clamping position. In this embodiment, since the resin sealing region is accommodated in the vacuum chamber 50 and the cavity 43 and the dummy cavity 45 are resin-sealed under reduced pressure, voids are generated in the sealing resin due to residual air in the cavity 43. Can be effectively suppressed.
However, even when resin sealing is performed under reduced pressure, a slight void is actually generated. In the case of the resin sealing operation of the present embodiment, when the movable mold is moved to the mold clamping position, the resin 32 moves from the cavity 43 side to the dummy cavity 45 side, and finally the resin 32 enters the dummy cavity 45. Is filled and resin-sealed. Accordingly, if the inside of the vacuum chamber 50 is evacuated until the resin 32 is completely cured, an action of sucking air from the dummy cavity 45 filled with the resin 32 lastly occurs, and the residual air in the cavity 43 is absorbed by the dummy cavity. 45 and the residual air is evacuated from the dummy cavity 45 to prevent the air from remaining in the cavity 43 and the dummy cavity 45 and trap the residual air in the dummy cavity 45. By the effect | action which makes it, it becomes possible to resin-seal so that a void may not be produced in the package part 12 which is the main body of a resin molding part.

  As described above, when the resin sealing region is depressurized and sealed with resin, the dummy cavity 45 is arranged outside the cavity 43 by communicating with the cavity 43. Although there is an effect of guiding, air vents are connected to the dummy cavities 45 as a method of more actively discharging the air trapped in the dummy cavities 45 to the outside of the cavities or a method of more actively guiding residual air to the dummy cavities 45. The method is effective.

  In FIG. 1, the example which provides the air vent 45b by connecting to the dummy shaping | molding part 16 is shown with the broken line. That is, a dummy cavity recess 45a is formed in the clamper 44, and an air vent 45b is provided on the clamp surface in an arrangement connected to the dummy cavity recess 45a. When the air vent 45b communicating with the dummy cavity recess 45a is provided on the clamp surface of the clamper 44 as described above, when the molded product 30 is clamped by the lower mold 40 and the clamper 44 under reduced pressure, the air vent 45b Air can be discharged from the cavity 43 through the cavity 45, and the action of driving the residual air into the dummy cavity 45 and the action of drawing the residual air into the dummy cavity 45 occur, and the air is effectively trapped by the dummy cavity 45. Thus, the residual air can be discharged from the dummy cavity 45. This can more effectively prevent voids from being generated in the sealing resin.

As in this embodiment, the dummy cavity 45 is connected to the outside of the cavity 43, and the air confined in the cavity during resin sealing is moved to the dummy cavity 45 side, and the air is trapped in the dummy cavity 45 to seal the resin. The method of stopping is not limited to the case of resin sealing using the above-described decompression operation.
As a method of moving the air in the cavity to the dummy cavity side and trapping it in the dummy cavity, for example, a method that can predict the resin flow direction (filling direction) in the cavity to some extent, such as the transfer molding method, is the final. A dummy cavity may be disposed on the side filled with resin and sealed with resin. Also in the case of compression molding, by providing a dummy cavity on the peripheral edge side of the cavity, the dummy cavity will be filled with resin at the end, so air is trapped in the dummy cavity and the semiconductor element is mounted. The package portion 12 can be sealed with resin without generating voids.

  Even when resin sealing is performed without using a decompression operation, when the dummy cavity is provided, air in the cavity is discharged from the air vent by arranging the air vent to communicate with the dummy cavity, as described above. As a result, the residual air in the cavity is guided to the dummy cavity, and it becomes possible to trap the air in the dummy cavity and seal the resin more effectively than when no air vent is provided.

  In addition, when connecting with the cavity provided in a resin sealing metal mold | die and providing a dummy cavity, as shown in FIG. 1, it is not restricted to the case where it connects with the corner part of a cavity, It is in the middle of the side part of a cavity. It is also possible to connect dummy cavities. Further, the number of dummy cavities arranged in connection with the cavities can also be selected as appropriate, and for example, some of the corners of the cavities can be selected and provided.

Further, the shape of the cavity may be a rectangular shape, a shape with a window, or an asymmetric shape in addition to a square shape as in the above-described embodiment, and the shape is particularly limited. It is not a thing.
The dummy molding part 16 formed corresponding to the mold dummy cavity remains in the final product integrally with the package part 12 formed corresponding to the mold cavity, and the dummy molding part 16 is manufactured. It is not removed in the process. Therefore, there is an advantage that the process of removing the dummy molding part 16 is not necessary.

In the embodiment described above, the example of resin sealing using the release film 60 has been described, but the present invention can of course be applied to a resin sealing method that does not use a release film.
Moreover, although the said embodiment is an example in which a semiconductor chip is mounted on one side of the substrate 10 and the one side of the substrate 10 is resin-sealed, the present invention is similarly applied to a product in which both sides of the substrate 10 are resin-sealed. It is possible. The same applies to products manufactured by the resin sealing method, such as products with semiconductor chips mounted on the wiring board, as well as products with semiconductor chips mounted on the lead frame, for molded products that are to be sealed with resin. Is possible.

It is the top view and sectional view which show the structure of one Embodiment of a semiconductor device. It is explanatory drawing which shows the structure of a resin sealing apparatus. It is an end view of a clamper and a cavity block. It is explanatory drawing which shows the resin sealing process using the resin sealing apparatus of FIG. It is explanatory drawing which shows the resin sealing process using the resin sealing apparatus of FIG. It is the top view and sectional drawing of the semiconductor device by the conventional resin sealing method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 12 Package part 12a Void 14a Resin 16 Dummy molding part 20 Semiconductor device 30 Molded product 32 Resin 40 Lower mold 42 Cavity block 42a Slit hole 43 Cavity 44 Clamper 44a, 44b Air adsorption hole 44c Air flow path 45 Dummy cavity 45a Dummy Cavity recess 45b Air vent 50 Vacuum chamber 54 Vacuum device 56 Air suction mechanism 60 Release film

Claims (6)

In a resin-sealing mold that is mounted on a resin sealing device and clamps the molded product and fills the cavity with resin, thereby sealing the molded product with resin,
A resin-sealing metal, comprising: a cavity for resin-sealing a mounting area of an electronic component mounted on the molded article; and a dummy cavity for trapping air connected to an edge of the cavity Type. The cavity has a rectangular planar shape,
3. The resin-sealed mold according to claim 1, wherein the dummy cavities are respectively connected to corner portions of the cavities.   The resin-sealed mold according to claim 1, wherein an air vent is provided in communication with the dummy cavity. A cavity block formed in accordance with the planar shape of the cavity;
A resin-sealing mold that includes a clamper that is movably provided in the mold opening and closing direction in an arrangement surrounding the cavity block, and that seals a molded product by a compression molding method,
The resin-sealed mold according to claim 1, wherein a dummy cavity recess is provided on the clamp surface of the clamper so as to constitute one of the dummy cavities with one end facing the inner side surface of the clamper. . A resin sealing area for clamping and molding the molded article with resin is provided in an arrangement surrounded by a vacuum chamber,
The resin sealing device according to claim 4, wherein a vacuum device for evacuating the inside of the vacuum chamber is provided. Resin sealing using a resin-sealing mold provided with a cavity for resin-sealing the mounting area of the electronic component mounted on the molded product and a dummy cavity connected to the edge of the cavity and trapping air A stopped semiconductor device,
A semiconductor device comprising: a package portion in which a mounting region of the electronic component is sealed with resin; and a dummy molding portion provided in connection with an edge portion of the package portion.

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