KR20100006154A - Collet for transferring a semiconductor chip and apparatus including the same - Google Patents

Collet for transferring a semiconductor chip and apparatus including the same Download PDF

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Publication number
KR20100006154A
KR20100006154A KR1020090124479A KR20090124479A KR20100006154A KR 20100006154 A KR20100006154 A KR 20100006154A KR 1020090124479 A KR1020090124479 A KR 1020090124479A KR 20090124479 A KR20090124479 A KR 20090124479A KR 20100006154 A KR20100006154 A KR 20100006154A
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South Korea
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collet
semiconductor chip
porous
suction
plate
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KR1020090124479A
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Korean (ko)
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조원준
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조원준
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Publication of KR20100006154A publication Critical patent/KR20100006154A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Abstract

PURPOSE: A collet for transferring semiconductor chips and a semiconductor chip transferring apparatus with the same are provided to prevent stain from being generated on the surface of a product due to bending, damage, and non-absorption. CONSTITUTION: A semiconductor chip transferring apparatus with a collet comprises a collet, a porous adsorption plate(20), and adsorption plate holder(10). The porous adsorption plate is formed by sintering synthetic resin through contacting the upper side of the semiconductor chip to adsorb a chip. An adsorption hole is formed on the adsorption plate holder to generate adsorption force on the lower side of the porous adsorption plate due to the adsorption of air.

Description

반도체 칩 이송용 콜렛 및 이를 포함하는 반도체 칩 이송장치{COLLET FOR TRANSFERRING A SEMICONDUCTOR CHIP AND APPARATUS INCLUDING THE SAME}Collet for semiconductor chip transfer and semiconductor chip transfer apparatus including same {COLLET FOR TRANSFERRING A SEMICONDUCTOR CHIP AND APPARATUS INCLUDING THE SAME}

본 발명은 반도체 패키지 제조시 사용되는 반도체 칩 이송용 콜렛 및 이를 포함하는 반도체 칩 이송장치에 관한 것이다.The present invention relates to a semiconductor chip transfer collet used in the manufacture of a semiconductor package and a semiconductor chip transfer apparatus including the same.

반도체 패키지는 반도체 칩을 외부 환경으로부터 보호하며 전자 시스템에 물리적으로 접합하고 전기적으로 접속시키는 기능을 가진다. 오늘날의 패키지 기술은 반도체 소자의 성능과 최종 제품의 가격, 성능, 신뢰성 등을 좌우할 만큼 그 중요성이 매우 커지고 있다.The semiconductor package protects the semiconductor chip from the external environment and has a function of physically bonding and electrically connecting to the electronic system. Today's packaging technologies are becoming increasingly important to determine the performance of semiconductor devices and the price, performance and reliability of the final product.

일반적으로 반도체 패키지 조립 공정 중에서 개별 칩(또는 ‘다이’, die)을 웨이퍼에서 분리하여 리드 프레임 또는 인쇄회로기판(PCB)과 같은 기판에 에폭시 접착제를 이용하여 붙이는 공정을 칩 부착 공정이라 한다. 이는 웨이퍼상에 그룹으로 있던 칩들을 개별적으로 분리하여 제품화하는 첫 단계이며, 이에 따라 칩 부착 공정을 수행하기 위해서는 웨이퍼를 개별 칩 단위로 절단하여 분리시키는 공정이 선행되어야 한다.In general, a process of attaching an individual chip (or die) to a substrate such as a lead frame or a printed circuit board (PCB) using an epoxy adhesive in a semiconductor package assembly process is called a chip attaching process. This is the first step of separately separating and commercializing chips that have been grouped on a wafer. Accordingly, in order to perform a chip attaching process, a process of cutting and separating wafers into individual chip units must be preceded.

이와 같이 반도체 칩 패키지 공정은 복수 개의 칩이 형성된 웨이퍼를 개별 칩 단위로 절단하고, 절단된 개별 칩을 패키지 본체에 접착하는 칩 부착 공정을 위해, 절단된 개별 칩을 픽업하여 패키지 본체의 실장부에 이송하는 공정이 요구된다. 이 때 웨이퍼로부터 반도체 칩을 픽업하여 이송하는 반도체 칩 이송장치 중 칩과 직접 접하는 부분을 바로 콜렛(collet)이라고 칭한다.As described above, the semiconductor chip package process cuts the wafer on which the plurality of chips are formed in units of individual chips, and picks up the individual chips that are cut to attach the cut individual chips to the package body. The transfer process is required. At this time, a portion of the semiconductor chip transfer device that picks up and transfers the semiconductor chip from the wafer and directly contacts the chip is called a collet.

도 1은 종래의 반도체 칩 이송장치를 보여주는 도면으로서, 종래의 장치는 하부에 내측공간(210)이 형성된 콜렛 홀더(200)와, 상기 콜렛 홀더(200)의 상부에서 내측공간(210)으로 진공구멍(220)이 관통된 진공인가관(230)이 연결되고, 상기 진공구멍(220)과 대응되게 흡착구멍이 형성되며 상기 콜렛 홀더(200)의 내측공간(210)에 부착되는 러버 콜렛(100)으로 이루어져 있으며, 상기 진공인가관(230)의 진공구멍(220)을 통하여 공기의 흡입하거나 또는 흡입을 중지하는 것에 의해 러버 콜렛(100)의 하부면에 흡착력을 발생시켜 반도체 칩을 부착하여 옮기고자 하는 곳에 위치시키게 된다. FIG. 1 is a view illustrating a conventional semiconductor chip transfer apparatus, and the conventional apparatus includes a collet holder 200 having an inner space 210 formed at a lower portion thereof, and a vacuum from an upper portion of the collet holder 200 to an inner space 210. The vacuum application tube 230 through which the hole 220 penetrates is connected, and a suction hole is formed to correspond to the vacuum hole 220, and the rubber collet 100 is attached to the inner space 210 of the collet holder 200. The suction force is generated on the lower surface of the rubber collet 100 by the suction or stop of the air through the vacuum hole 220 of the vacuum applying tube 230 to attach and transfer the semiconductor chip. It will be located where it is.

이와 같은 종래 칩 이송장치의 러버 콜렛은 일반적으로 고무 등의 재질로 되어 있으므로 재질 특성상 제조과정에서 하부면의 편평도를 잡아주거나 유지하는데 어려움이 있으며, 운반, 적재시 또는 콜렛 홀더에 러버 콜렛을 결합하는 과정에서도 편평도에 변형이 초래되는 문제점이 있었다.Since the rubber collet of the conventional chip feeder is generally made of rubber or the like, it is difficult to hold or maintain the flatness of the lower surface during the manufacturing process due to the nature of the material. Even in the process, there was a problem that the deformation caused to flatness.

도 2는 종래의 다른 반도체 칩 이송장치를 보여주는 도면으로서, 상기한 종래의 반도체 칩 이송장치의 문제점을 개선하기 위해, 러버 콜렛(10)의 상면에 부착됨과 아울러 상기 콜렛 홀더(20)의 내측공간(21)에 부착되고, 상기 흡착구멍(12)과 상기 진공구멍(22)에 대응되게 개구부(31)가 형성된 플레이트(30)를 더 포함하여 구성되는 반도체 칩 이송장치이다. 즉, 고무 재질의 러버 콜렛(10)이 변형되지 않도록 하고 편평도를 확보하기 위하여 러버 콜렛(10)의 상면에 금속제 플레이트(30)를 부착한 것이다. FIG. 2 is a view showing another conventional semiconductor chip transfer device. In order to improve the problems of the conventional semiconductor chip transfer device, the inner space of the collet holder 20 is attached to the upper surface of the rubber collet 10. And a plate (30) attached to (21) and having an opening (31) formed corresponding to the suction hole (12) and the vacuum hole (22). That is, the rubber plate 10 of the rubber material is attached to the metal plate 30 on the upper surface of the rubber collet 10 in order not to deform and secure the flatness.

그러나, 이러한 종래의 반도체 칩 이송장치에 사용되는 고무나 실리콘 또는 우레탄 재질의 러버 콜렛은 그 재질의 특성상 반도체 패키지의 제조에서 요구되는 콜렛의 편평도를 확보하는데 한계가 있었다.However, rubber collets made of rubber, silicon, or urethane, which are used in the conventional semiconductor chip transfer device, have limitations in securing the flatness of the collets required in the manufacture of semiconductor packages due to the characteristics of the materials.

또한, 콜렛의 흡착력이 부분적으로 집중되어 종래 러버 콜렛으로 칩을 픽업하는 경우 제품 자체가 휘게 되어 파손되거나 미흡착이 발생할 수 있고, 또한 러버 콜렛의 진공홀 크기에 따른 자국이 제품표면에 생기게 되는 문제점이 있었다.In addition, since the adsorption force of the collet is partially concentrated, when the chip is picked up by the conventional rubber collet, the product itself may be bent, which may cause breakage or non-adsorption. Also, the marks according to the vacuum hole size of the rubber collet may occur on the product surface. There was this.

본 발명은 반도체 칩과 직접 접촉하는 콜렛 접촉면의 흡착력이 고르고 우수하여 종래 러버 콜렛의 단점인 흡착력의 부분적 집중으로 인한 제품의 휨 발생이나 파손, 미흡착, 진공홀 크기에 따른 제품표면에의 자국 발생 등의 문제를 해소할 수 있는 새로운 반도체 칩 이송용 콜렛 및 이를 포함하는 반도체 칩 이송장치를 제공하는 것을 목적으로 한다.According to the present invention, the adsorption force of the collet contact surface which is in direct contact with the semiconductor chip is even and excellent, resulting in warpage or damage of the product due to partial concentration of the adsorption force, which is a disadvantage of the conventional rubber collet, and generation of marks on the product surface according to the vacuum hole size. An object of the present invention is to provide a new semiconductor chip transfer collet and a semiconductor chip transfer apparatus including the same, which can solve such problems.

또한, 본 발명은 종래 러버 콜렛의 단점인 편평도를 잡을 수 없었던 문제를 해결하기 위하여 연삭가공을 통하여 콜렛 접촉면의 편평도를 향상시킬 있어 반도체 패키지의 제조에서 요구되는 콜렛의 편평도를 확보할 수 있는 새로운 반도체 칩 이송용 콜렛 및 이를 포함하는 반도체 칩 이송장치를 제공하는 것을 목적으로 한다. In addition, the present invention improves the flatness of the collet contact surface through the grinding process to solve the problem that the flatness, which is a disadvantage of the conventional rubber collet can not be caught, a new semiconductor capable of securing the flatness of the collet required in the manufacture of a semiconductor package An object of the present invention is to provide a chip transport collet and a semiconductor chip transport device including the same.

상기한 목적을 과제를 해결하기 위하여, 본 발명은, 웨이퍼로부터 반도체 칩을 흡착하여 이송하는 반도체 칩 이송용 콜렛에 있어서, 상기 콜렛은, 반도체 칩의 상면에 직접 접촉하여 칩을 흡착하는 것으로 합성수지를 소결하여 형성한 평판형의 다공성 흡착판; 및 상기 다공성 흡착판의 상부면에 결합되는 것으로 공기의 흡입에 의해 다공성 흡착판의 하부면에 흡착력을 발생시키기 위한 흡착홀이 관통하여 형되어 있는 흡착판 홀더;로 이루어지는 것을 특징으로 하는 반도체 칩 이송용 콜렛을 제공한다.MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the present invention is a semiconductor chip transfer collet which adsorbs and transfers a semiconductor chip from a wafer, Comprising: The said collet adsorb | sucks a chip by directly contacting the upper surface of a semiconductor chip. A plate-type porous suction plate formed by sintering; And an adsorption plate holder coupled to an upper surface of the porous adsorption plate and having an adsorption hole penetrating through the adsorption hole for generating adsorption force on the lower surface of the porous adsorption plate by suction of air. to provide.

본 발명의 바람직한 일 실시예에 따르면, 상기 다공성 흡착판은 합성수지 분 말을 형틀에 충진시킨 후 상온에서 3~30Mpa의 압력으로 가압하여 예비 소결체를 성형하고, 15~80℃의 온도에서 소결하여 성형할 수 있다.According to a preferred embodiment of the present invention, the porous adsorption plate is filled with a synthetic resin powder to the mold and pressurized at a pressure of 3 ~ 30Mpa at room temperature to form a pre-sintered body, and to be molded by sintering at a temperature of 15 ~ 80 ℃ Can be.

또한, 상기 다공성 흡착판은 기공률이 0.5~45%인 것이 바람직하다.In addition, the porous adsorption plate preferably has a porosity of 0.5 to 45%.

또한, 상기 다공성 흡착판은 상부면 및 하부면을 제외한 측면이 공기가 투과하지 못하는 재료로 막음처리되어 있을 수 있다. In addition, the porous adsorption plate may be blocked with a material that does not penetrate the air side surface except the upper surface and the lower surface.

또한, 상기 다공성 흡착판은, 상부면 및 하부면을 제외한 측면에 대해 열처리를 하여 측면에 형성된 기공을 모두 밀폐하는 방식으로 막음처리되어 있을 수 있다. In addition, the porous adsorption plate, the heat treatment for the side surface except the upper surface and the lower surface may be blocked in such a way to seal all the pores formed on the side.

또한, 상기 흡착판 홀더는, 금속판 또는 불투기성 재질로 이루어진 판을 포켓처리하여 하부에 내측공간을 형성하고, 상기 다공성 흡착판의 측면으로 공기가 투과하지 못하도록 상기 흡착판 홀더의 하부 내측공간에 상기 다공성 흡착판을 압입하여 결합시킬 수 있다. In addition, the adsorption plate holder is pocketed with a metal plate or an impermeable material to form an inner space at the bottom, and the porous adsorption plate in the lower inner space of the adsorption plate holder to prevent air from penetrating the side of the porous adsorption plate. It can be press fit.

또한, 상기 흡착판 홀더의 상부면에는 상부면과 단차를 이루는 함몰부가 형성되어 있고, 상기 흡착홀은 상기 함몰부에 형성되어 있을 수 있다.In addition, the upper surface of the suction plate holder is formed with a depression forming a step with the upper surface, the suction hole may be formed in the depression.

또한, 상기 다공성 흡착판의 성형에 이용되는 합성수지는, 폴리에틸렌(PE), 폴리프로필렌(PP), 폴리카보네이트(PC), 폴리우레탄(PU) 및 폴리아미드(PA)로 이루어지는 군으로부터 선택되는 어느 하나인 것이 바람직하다.In addition, the synthetic resin used for forming the porous suction plate is any one selected from the group consisting of polyethylene (PE), polypropylene (PP), polycarbonate (PC), polyurethane (PU), and polyamide (PA). It is preferable.

또한, 본 발명은 상기한 반도체 칩 이송용 콜렛 중 어느 하나와, 상기 반도체 칩 이송용 콜렛이 삽입 부착될 수 있도록 하부에 내측공간이 형성되어 있으며, 상부로부터 내측공간으로 관통된 진공홀을 갖는 진공인가관이 연결되어 있고, 상기 진공홀은 상기 흡착판 홀더의 홉착홀과 대응되도록 형성되어 있는 콜렛 홀더로 이루어지는 반도체 칩 이송장치를 제공한다.In addition, the present invention is a vacuum having any one of the above-described semiconductor chip transfer collet, and the inner space is formed in the lower portion so that the semiconductor chip transfer collet can be attached, the vacuum hole penetrated from the upper to the inner space An application tube is connected, and the vacuum hole provides a semiconductor chip transfer device including a collet holder formed to correspond to the adhesion hole of the suction plate holder.

본 발명에 따르면, 다공성 재질의 흡착판을 사용하므로 반도체 칩과 직접 접촉하는 콜렛 접촉면의 흡착력이 고르고 매우 우수하여 종래 러버 콜렛의 단점인 흡착력의 부분적 집중으로 인한 제품의 휨 발생이나 파손, 미흡착, 진공홀 크기에 따른 제품표면에의 자국 발생 등의 문제를 해소할 수 있어 반도체 패키지 제조시 불량률을 줄이고 생산성을 향상시킬 수 있는 우수한 효과가 있다.According to the present invention, since the adsorption plate of the porous material is used, the adsorption force of the collet contact surface which is in direct contact with the semiconductor chip is even and very excellent, resulting in warpage or damage, non-adsorption, vacuum of the product due to partial concentration of the adsorption force, which is a disadvantage of the conventional rubber collet. It is possible to solve the problem such as the occurrence of marks on the product surface according to the hole size, there is an excellent effect that can reduce the defect rate and improve productivity in the manufacturing of semiconductor packages.

또한, 다공성 흡착판을 합성수지를 소결 성형하여 제작함으로써 경도가 일반 플라스틱 수준으로 증가하므로 연삭가공을 통하여 콜렛 접촉면의 편평도를 향상시킬 있어 종래 러버 콜렛의 단점인 편평도를 잡을 수 없었던 문제를 미연에 방지할 수 있는 우수한 효과가 있다.In addition, since the hardness is increased to the level of general plastics by sintering and molding the synthetic resin of the porous adsorption plate, the flatness of the collet contact surface can be improved through grinding, thereby preventing the problem that the flatness, which is a disadvantage of the conventional rubber collet, cannot be caught in advance. That has an excellent effect.

이하, 첨부한 도 3 내지 도 6을 참고로 하여 본 발명의 바람직한 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예들에 한정되지 않는다. 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 붙이도록 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying FIGS. 3 to 6 so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification.

도 3은 본 발명의 일실시예에 따른 반도체 칩 이송용 콜렛의 분리 사시도이 고, 도 4는 콜렛을 포함하는 반도체 칩 이송장치의 일실시예를 보여주는 저면 분리 사시도이다.3 is an exploded perspective view of a semiconductor chip transfer collet according to an embodiment of the present invention, and FIG. 4 is a bottom separated perspective view showing an embodiment of a semiconductor chip transfer apparatus including a collet.

도 3에 도시한 바와 같이, 본 발명에 따른 반도체 칩 이송용 콜렛은 웨이퍼로부터 분리된 개별 반도체 칩(die)을 흡착하여 이송하는 칩 이송장치에 사용되는 것으로, 다공성 흡착판(20) 및 흡착판 홀더(10)으로 구성된다. As shown in FIG. 3, the semiconductor chip transfer collet according to the present invention is used in a chip transfer apparatus that absorbs and transfers individual semiconductor chips separated from a wafer, and includes a porous adsorption plate 20 and an adsorption plate holder ( 10).

상기 다공성 흡착판(20)은 그 하부면이 반도체 칩의 상면에 직접 접촉하여 칩을 흡착하는 것으로 합성수지를 소결하여 평판형으로 성형한다.The porous adsorption plate 20 is formed in a flat plate shape by sintering the synthetic resin by adsorbing the chip by its lower surface directly contacting the upper surface of the semiconductor chip.

상기 흡착판 홀더(10)는 상기 다공성 흡착판(20)의 상부면에 결합되는 것으로 공기의 흡입에 의해 다공성 흡착판(20)의 하부면에 흡착력을 발생시키기 위한 흡착홀(12)이 적어도 1개 이상 관통하여 형성된다. The adsorption plate holder 10 is coupled to the upper surface of the porous adsorption plate 20 and penetrates at least one or more adsorption holes 12 for generating adsorption force on the lower surface of the porous adsorption plate 20 by suction of air. Is formed.

도 4에 도시한 바와 같이, 콜렛 홀더(30)은 상기 반도체 칩 이송용 콜렛이 삽입 부착될 수 있도록 하부에 내측공간이 형성되어 있으며, 상부로부터 내측공간으로 관통된 진공홀(31)을 갖는 진공인가관(32)이 연결되어 있고, 상기 진공홀(31)은 상기 흡착판 홀더(10)의 흡착홀(12)과 대응되도록 형된다. As shown in FIG. 4, the collet holder 30 has an inner space formed at a lower portion thereof to allow the semiconductor chip transfer collet to be inserted therein, and has a vacuum having a vacuum hole 31 penetrated from the upper portion to the inner space. An application tube 32 is connected, and the vacuum hole 31 is formed to correspond to the suction hole 12 of the suction plate holder 10.

상기 흡착홀(12)은, 콜렛 홀더(30)에 구비된 진공인가관(32)의 진공홀(31)을 통하여 공기를 흡입하거나 또는 흡입을 중단함에 의해 콜렛(1)의 하부면(다공성 흡착판의 하부면)에 흡착력을 발생시키거나 흡착력을 제거함으로서 웨이퍼로부터 분리된 개별 반도체 칩을 픽업하거나 픽업된 칩을 필요한 위치에 내려놓는 기능을 하게 된다.The suction hole 12 sucks air or stops suction through the vacuum hole 31 of the vacuum application tube 32 provided in the collet holder 30 (porous suction plate). By generating the suction force or removing the suction force on the lower surface of the bottom surface, the individual semiconductor chips separated from the wafer are picked up or the picked-up chip is lowered to the required position.

상기 흡착판 홀더(10)에 구비되는 흡착홀(12)은 진공홀(31)의 크기와 동일하 게 형성할 수도 있고, 콜렛(1)의 흡착력을 고르게 분산시키기 위한 필요에 따라 그 크기, 위치 및 개수를 달리하여 형성할 수도 있다. The adsorption hole 12 provided in the adsorption plate holder 10 may be formed to have the same size as that of the vacuum hole 31, and its size, position, and the like, as necessary to evenly distribute the adsorption force of the collet 1. It may be formed by varying the number.

한편, 흡착판 홀더(10)의 상부면에는 상부면과 단차를 이루는 함몰부(11) 즉, 흡착판 홀더(10)의 중앙부 상부면으로부터 아래쪽으로 일정한 깊이와 면적으로 함몰된 함몰부(11)를 형성함으로써 콜렛 홀더(30)와 흡착판 홀더(10)가 결합하여 접촉하는 면에 진공압이 고르게 분산되도록 할 수 있다. 이 경우 상기 함몰부(11)에 2개 이상의 복수의 흡착홀(12)을 균일한 간격으로 형성함으로써 진공인가관(32)을 통하여 공기를 흡입하는 경우 발생하는 진공압이 콜렛(1) 하부면(다공성 흡착판의 하부면)에 고르게 분산하여 발생하도록 할 수 있고, 이에 따라 콜렛(1) 하부 전면적의 흡착력이 균일해지고 콜렛(1) 접촉면의 전면으로 칩을 흡착할 수 있게 되므로 흡착력도 우수할 뿐만 아니라 제품 표면에 자국이 발생하지도 않게 된다. On the other hand, the upper surface of the suction plate holder 10 is formed with a depression 11 forming a step with the upper surface, that is, the depression 11 recessed in a predetermined depth and area downward from the upper surface of the central portion of the suction plate holder 10. By doing so, the collet holder 30 and the adsorption plate holder 10 may be coupled so that the vacuum pressure is evenly distributed on the contact surface. In this case, by forming two or more suction holes 12 in the depression 11 at uniform intervals, the vacuum pressure generated when the air is sucked through the vacuum application tube 32 is lower surface of the collet 1. (The lower surface of the porous adsorption plate) can be evenly distributed to occur, accordingly, the adsorption force of the entire surface of the lower surface of the collet (1) becomes uniform, and the chip can be adsorbed to the front surface of the contact surface of the collet (1) as well as excellent adsorption power It also prevents marks on the surface of the product.

이와 같은 구성에 의해, 종래 러버 콜렛을 이용하는 장치의 단점인 흡착력의 부분적 집중으로 인한 제품 휨 발생이나 진공홀의 크기에 따른 제품 표면에의 자국 발생 등의 문제점을 미연에 방지할 수 있게 되는 것이다. By such a configuration, it is possible to prevent problems such as warpage of the product due to partial concentration of the adsorption force, which is a disadvantage of the apparatus using the conventional rubber collet, and marks on the product surface according to the size of the vacuum hole.

상기 다공성 흡착판(20)의 성형에 이용되는 재질로는 폴리에틸렌(polyetylene, PE), 폴리프로필렌(polypropylene, PP), 폴리카보네이트(polycarbonate, PC), 폴리우레탄(polyurethane, PU), 폴리아미드(polyamide, PA) 등과 같은 합성수지를 사용할 수 있다. The material used for molding the porous adsorption plate 20 is polyethylene (PE), polypropylene (PP), polycarbonate (PC), polyurethane (PU), polyamide (polyamide) Synthetic resins such as PA).

다공성 흡착판(20)은 다음과 같은 방법으로 제작하게 된다. 먼저, 상기한 합성수지의 종류 중 어느 하나를 선택하여 해당 합성수지 분말을 성형틀에 충진시 킨 후 상온에서 3~30Mpa의 압력으로 가압하여 예비 소결체를 성형한다. 예비 소결체를 성형한 후에는 15~80℃의 온도에서 소결함으로써 다공성의 흡착판(20)을 얻게 된다. Porous adsorption plate 20 is to be produced in the following way. First, any one of the above kinds of synthetic resin is selected to fill the synthetic resin powder in the molding die and pressurized at a pressure of 3 ~ 30Mpa at room temperature to form a pre-sintered body. After molding the presintered body, a porous adsorption plate 20 is obtained by sintering at a temperature of 15 to 80 ° C.

한편, 흡착판 홀더(10)와 다공성 흡착판(20)은 접착체를 사용하여 화학적으로 결합시키거나 다공성 흡착판(20)을 소결할 때 흡착판 홀더(10)를 틀에 같이 넣어 압입 결합시켜 제작할 수도 있다.Meanwhile, the adsorption plate holder 10 and the porous adsorption plate 20 may be manufactured by chemically bonding using an adhesive or by inserting the adsorption plate holder 10 into a mold together when sintering the porous adsorption plate 20.

흡착판 홀더(10)가 결합된 다공성 흡착판(20)은 반도체 칩과 직접 접촉하는 하부면의 편평도를 잡고 이물질이 묻지 않도록 하기 위해 표면 연삭가공을 한다. The porous adsorption plate 20 to which the adsorption plate holder 10 is coupled is subjected to surface grinding in order to hold the flatness of the lower surface in direct contact with the semiconductor chip and to prevent foreign matter.

종래 칩 이송장치의 경우는 고무재질의 연성 러버 콜렛을 사용하는 관계로 반도체 칩과 접촉하는 콜렛 하부면의 편평도(반도체 패키지 제조에서 요구되는 수준의 편평도)를 확보하는 것이 매우 어려웠으나, 본 발명에 따른 콜렛(1)은 합성수지를 소결하여 성형함에 따라 다공성 흡착판(20)의 경도가 일반 플라스틱과 대등한 수준까지 증가하므로 연삭 가공에 의해 칩 접촉면의 편평도를 요구되는 수준까지 향상, 확보할 수 있게 되는 것이다. In the case of the conventional chip transfer apparatus, it is very difficult to secure the flatness (a level of flatness required in the manufacture of semiconductor packages) of the lower surface of the collet in contact with the semiconductor chip due to the use of a soft rubber collet made of rubber material. According to the collet (1), the hardness of the porous adsorptive plate 20 increases to a level comparable to that of general plastics as the synthetic resin is sintered and molded, thereby improving and securing the flatness of the chip contact surface to a required level by grinding. will be.

또한, 다공성 흡착판(20)에 형성되는 홀의 크기가 마이크로 단위의 초소경이므로 콜렛과 직접 접촉하는 제품 표면에 홀 자국이 발생하는 문제점을 근본적으로 해결할 수 있게 된다. In addition, since the size of the hole formed in the porous adsorption plate 20 is a micro diameter of a micro unit, it is possible to fundamentally solve the problem that hole marks are generated on the surface of the product in direct contact with the collet.

다공성 흡착판(20)의 기공률(다공질 재료에서 비어 있는 부분이 그 전체 부피에서 차지하는 비율)은 0.5~45%의 범위 값을 갖는 것이 바람직하다. 기공률이 0.5% 미만인 경우에는 콜렛의 흡착력이 약해 웨이퍼로부터 칩을 제대로 픽업할 수 없게 되고, 기공률이 45%를 초과하는 경우에는 흡착력이 다공성 흡착판(20)의 하부면에 고르게 분포되기 어렵고 공극의 지름이 증가하여 칩 픽업시 제품 표면에 자국이 생길 수 있다. The porosity of the porous adsorption plate 20 (the ratio of the empty portion in the porous material to the total volume) preferably has a range of 0.5 to 45%. If the porosity is less than 0.5%, the adsorption force of the collet is weak so that chips cannot be properly picked up from the wafer. If the porosity is more than 45%, the adsorption force is difficult to distribute evenly on the lower surface of the porous adsorption plate 20, and the diameter of the pores. This increase can cause marks on the product surface during chip pick-up.

한편, 상기 다공성 흡착판(20)은 6면을 갖는 평판형(육면체)으로 성형하는데, 칩 흡착력이 다공성 흡착판(20)의 하부면에만 고르게 분포하도록 하기 위해 상부면 및 하부면을 제외한 측면을 막음처리하는 것이 바람직하다. On the other hand, the porous adsorption plate 20 is formed into a flat plate (hexahedron) having six sides, in order to ensure that chip adsorption force is evenly distributed only on the lower surface of the porous adsorption plate 20, except for the upper surface and the lower surface. It is desirable to.

다공성 흡착판(20)의 측면 막음처리는 도 5에 도시한 바와 같이, 공기가 투과하지 못하는 재료 즉, 불투기성(不透氣性) 재질을 이용하여 다공성 흡착판(20)의 측면(상부면 및 하부면을 제외한 측 4면)을 코팅하거나 도포할 수 있다. As shown in FIG. 5, the side-blocking treatment of the porous adsorption plate 20 is performed by using a material that does not permeate air, that is, an impermeable material, to the side surfaces (upper and lower surfaces) of the porous adsorption plate 20. 4 sides except for) may be coated or applied.

또한, 다공성 흡착판(20) 측면의 막음처리는 고무, 실리콘 또는 고화되면 불투기성 막을 형성하는 물질(예를 들어, 바니시 등)을 도포하거나, 기타 불투기성 필름이나 시트 등의 테이핑 처리에 의해서도 달성할 수 있으며, 다공성 흡착판(20)의 상부면 및 하부면을 제외한 측면(측 4면)에 대해 열처리를 하여 측면에 형성된 기공을 모두 밀폐하는 방식으로 막음처리를 할 수도 있다.In addition, the blocking treatment on the side of the porous adsorption plate 20 may be achieved by applying rubber, silicone, or a material (for example, varnish, etc.) to form an impermeable membrane when solidified, or by taping treatment of other impermeable films or sheets. The heat treatment may be performed on the side surfaces (four sides) except for the upper and lower surfaces of the porous adsorption plate 20 to seal all pores formed on the side surfaces.

한편, 상기와 같이 불투기성 재료를 이용하여 코팅, 도포, 테이핑 또는 열처리를 하는 대신에 도 6에 도시한 바와 같이, 금속판 또는 불투기성 재질로 이루어진 판(plate) 형상의 흡착판 홀더(10)를 포켓처리하여 하부에 다공성 흡착판(20)과 동일한 크기를 갖는 내측공간을 형성하고, 상기 흡착판 홀더(10)의 하부 내측공간에 다공성 흡착판(20)을 압입하여 결합시킴으로써 다공성 흡착판(20)의 측 4면으로는 공기가 새지 않도록 구성할 수도 있다. On the other hand, instead of coating, applying, taping or heat-treating using an impermeable material as described above, as shown in Figure 6, the plate-shaped adsorption plate holder 10 made of a metal plate or an impermeable material pockets Treatment to form an inner space having the same size as the porous adsorption plate 20 at the bottom, and by pressing the porous adsorption plate 20 into the lower inner space of the adsorption plate holder 10 to be bonded to the four sides of the porous adsorption plate 20 It can also be configured to prevent air leakage.

도 4 내지 도 6은 상기한 콜렛을 포함하는 반도체 칩 이송장치의 일실시예를 보여주는 분리 사시도이다. 본 발명에 따른 바람직한 반도체 칩 이송장치(2)는 상기한 반도체 칩 이송용 콜렛(1)과, 상기 반도체 칩 이송용 콜렛(1)이 삽입 부착될 수 있도록 하부에 내측공간이 형성되어 있으며, 상부로부터 내측공간으로 관통된 진공홀(31)을 갖는 진공인가관(32)이 연결되어 있고, 상기 진공홀(31)은 상기 흡착판 홀더(10)의 홉착홀(12)과 대응되도록 형성되어 있는 콜렛 홀더(30)로 이루어지는 것을 특징으로 한다. 4 to 6 is an exploded perspective view showing an embodiment of a semiconductor chip transfer apparatus including the above collet. In the preferred semiconductor chip transfer device 2 according to the present invention, the semiconductor chip transfer collet 1 and the semiconductor chip transfer collet 1 are provided with an inner space formed at the bottom thereof so as to be attached thereto. A vacuum applying tube 32 having a vacuum hole 31 penetrated from the inner space to the inner space is connected, and the vacuum hole 31 is formed to correspond to the adhesion hole 12 of the suction plate holder 10. Characterized in that consisting of a holder (30).

비록 본 발명의 몇몇 실시예들이 도시되고 설명되었지만, 본 발명이 속하는 기술분야의 통상의 지식을 가진 당업자라면 본 발명의 원칙이나 정신에서 벗어나지 않으면서 본 실시예를 변형할 수 있음을 알 수 있을 것이다. 발명의 범위는 첨부된 청구항과 그 균등물에 의해 정해질 것이다. Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

도 1 및 도 2는 종래의 반도체 칩 이송장치를 보여주는 도면,1 and 2 is a view showing a conventional semiconductor chip transfer device,

도 3은 본 발명의 일실시예에 따른 반도체 칩 이송용 콜렛의 분리 사시도, 3 is an exploded perspective view of a collet for transferring semiconductor chips according to an embodiment of the present invention;

도 4는 본 발명의 일실시예에 따른 반도체 칩 이송장치의 저면 분리 사시도, Figure 4 is a bottom separated perspective view of the semiconductor chip transfer device according to an embodiment of the present invention,

도 5 및 도 6은 본 발명의 일실시예에 따른 반도체 칩 이송장치의 분리 사시도이다. 5 and 6 are an exploded perspective view of a semiconductor chip transfer apparatus according to an embodiment of the present invention.

<도면의 주요부에 관한 부호의 설명><Explanation of symbols about main parts of the drawings>

1: 콜렛 2: 반도체 칩 이송장치1: collet 2: semiconductor chip feeder

10: 흡착판 홀더 11: 함볼부10: Suction plate holder 11: Hamball part

12: 흡착홀 12: adsorption hole

20: 다공성 흡착판20: porous adsorption plate

30: 콜렛 홀더 31: 진공홀30: collet holder 31: vacuum hole

32: 진공인가관32: vacuum inlet tube

40: 코팅제40: coating agent

Claims (9)

웨이퍼로부터 반도체 칩을 흡착하여 이송하는 반도체 칩 이송용 콜렛에 있어서, In the semiconductor chip transfer collet which sucks and transfers a semiconductor chip from a wafer, 상기 콜렛은, The collet is, 반도체 칩의 상면에 직접 접촉하여 칩을 흡착하는 것으로 합성수지를 소결하여 형성한 평판형의 다공성 흡착판; 및A flat porous adsorbent plate formed by sintering a synthetic resin by adsorbing the chip by directly contacting the upper surface of the semiconductor chip; And 상기 다공성 흡착판의 상부면에 결합되는 것으로 공기의 흡입에 의해 다공성 흡착판의 하부면에 흡착력을 발생시키기 위한 흡착홀이 관통하여 형되어 있는 흡착판 홀더;로 이루어지는 것을 특징으로 하는 반도체 칩 이송용 콜렛.And a suction plate holder coupled to an upper surface of the porous suction plate, the suction hole holder penetrating through the suction hole for generating suction force on the lower surface of the porous suction plate by suction of air. 청구항 1에 있어서,The method according to claim 1, 상기 다공성 흡착판은 합성수지 분말을 형틀에 충진시킨 후 상온에서 3~30Mpa의 압력으로 가압하여 예비 소결체를 성형하고, 15~80℃의 온도에서 소결하여 성형하는 것을 특징으로 반도체 칩 이송용 콜렛.The porous adsorptive plate is filled with a synthetic resin powder in the mold and pressurized at a pressure of 3 ~ 30Mpa at room temperature to form a pre-sintered body, and sintered at a temperature of 15 ~ 80 ℃ to form a collet for transporting semiconductor chips. 청구항 1에 있어서,The method according to claim 1, 상기 다공성 흡착판은 기공률이 0.5~45%인 것을 특징으로 하는 반도체 칩 이송용 콜렛.The porous adsorption plate is a semiconductor chip transfer collet, characterized in that the porosity is 0.5 ~ 45%. 청구항 1에 있어서,The method according to claim 1, 상기 다공성 흡착판은, 상부면 및 하부면을 제외한 측면이 공기가 투과하지 못하는 재료로 막음처리되어 있는 것을 특징으로 하는 반도체 칩 이송용 콜렛.The porous suction plate is a collet for transporting a semiconductor chip, characterized in that the side surface except for the upper surface and the lower surface is blocked with a material through which air cannot penetrate. 청구항 1에 있어서,The method according to claim 1, 상기 다공성 흡착판은, 상부면 및 하부면을 제외한 측면에 대해 열처리를 하여 측면에 형성된 기공을 모두 밀폐하는 방식으로 막음처리되어 있는 것을 특징으로 하는 반도체 칩 이송용 콜렛.The porous adsorptive plate is heat-treated to the side surface except the upper surface and the lower surface is blocked by a method of sealing all the pores formed in the side surface in a manner of sealing. 청구항 1에 있어서,The method according to claim 1, 상기 흡착판 홀더는, 금속판 또는 불투기성 재질로 이루어진 판을 포켓처리하여 하부에 내측공간을 형성하고, 상기 다공성 흡착판의 측면으로 공기가 투과하지 못하도록 상기 흡착판 홀더의 하부 내측공간에 상기 다공성 흡착판을 압입하여 결합시킨 것을 특징으로 하는 반도체 칩 이송용 콜렛. The suction plate holder pockets a plate made of a metal plate or an impermeable material to form an inner space at the bottom, and press-fits the porous suction plate into the lower inner space of the suction plate holder to prevent air from penetrating into the side of the porous suction plate. A collet for transferring semiconductor chips, characterized in that bonded. 청구항 1에 있어서,The method according to claim 1, 상기 흡착판 홀더의 상부면에는 상부면과 단차를 이루는 함몰부가 형성되어 있고, 상기 흡착홀은 상기 함몰부에 형성되어 있는 것을 특징으로 하는 반도체 칩 이송용 콜렛.The upper surface of the suction plate holder is formed with a recess forming a step with the upper surface, the adsorption hole is formed in the recessed portion, the semiconductor chip transfer collet. 청구항 1에 있어서, The method according to claim 1, 상기 다공성 흡착판의 성형에 이용되는 합성수지는, 폴리에틸렌(PE), 폴리프로필렌(PP), 폴리카보네이트(PC), 폴리우레탄(PU) 및 폴리아미드(PA)로 이루어지는 군으로부터 선택되는 어느 하나인 것을 특징으로 하는 반도체 칩 이송용 콜렛. The synthetic resin used for forming the porous suction plate is any one selected from the group consisting of polyethylene (PE), polypropylene (PP), polycarbonate (PC), polyurethane (PU), and polyamide (PA). A collet for semiconductor chip transfer. 청구항 1 내지 청구항 8 중 어느 한 항의 반도체 칩 이송용 콜렛과,The collet for semiconductor chip transfer of any one of Claims 1-8, 상기 반도체 칩 이송용 콜렛이 삽입 부착될 수 있도록 하부에 내측공간이 형성되어 있으며, 상부로부터 내측공간으로 관통된 진공홀을 갖는 진공인가관이 연결되어 있고, 상기 진공홀은 상기 흡착판 홀더의 홉착홀과 대응되도록 형성되어 있는 콜렛 홀더로 이루어지는 것을 특징으로 하는 반도체 칩 이송장치.An inner space is formed at the bottom to insert and attach the collet for transferring the semiconductor chip, and a vacuum applying tube having a vacuum hole penetrated from the top to the inner space is connected, and the vacuum hole is a suction hole of the suction plate holder. And a collet holder formed to correspond to the semiconductor chip transfer device.
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101385443B1 (en) * 2013-09-13 2014-04-16 이향이 Pick-up transfer collet for semiconductor chip
KR101577958B1 (en) 2015-03-31 2015-12-28 주식회사 케이앤에스 Chip transfer collet and manufacturing mathod thereof
WO2020166886A1 (en) * 2019-02-13 2020-08-20 (주)포인트엔지니어링 Micro led adsorption body
WO2020204394A1 (en) * 2019-03-29 2020-10-08 (주)포인트엔지니어링 Microelement adsorption picker
CN112743564A (en) * 2021-01-12 2021-05-04 南京迪海智科精密机械有限公司 Chip grabbing robot and grabbing method
US20210233789A1 (en) * 2020-01-23 2021-07-29 Okins Electronics Co., Ltd Magnetic collet
US11127609B2 (en) 2019-06-24 2021-09-21 Samsung Electronics Co., Ltd. Collet apparatus and method for fabricating a semiconductor device using the same
KR102348437B1 (en) * 2021-07-19 2022-01-07 시대테크 주식회사 A pickup device capable of uniformly sucking a semiconductor chip with bumpers by using a plurality of micro-holes and method for manufacturing the same
KR20220050382A (en) * 2020-10-16 2022-04-25 이동환 Semiconductor chip pick up apparatus and method for manufacturing lower pick up assembly of semiconductor chip pick up apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101385443B1 (en) * 2013-09-13 2014-04-16 이향이 Pick-up transfer collet for semiconductor chip
KR101577958B1 (en) 2015-03-31 2015-12-28 주식회사 케이앤에스 Chip transfer collet and manufacturing mathod thereof
WO2020166886A1 (en) * 2019-02-13 2020-08-20 (주)포인트엔지니어링 Micro led adsorption body
WO2020204394A1 (en) * 2019-03-29 2020-10-08 (주)포인트엔지니어링 Microelement adsorption picker
US11127609B2 (en) 2019-06-24 2021-09-21 Samsung Electronics Co., Ltd. Collet apparatus and method for fabricating a semiconductor device using the same
US20210233789A1 (en) * 2020-01-23 2021-07-29 Okins Electronics Co., Ltd Magnetic collet
US20230395413A1 (en) * 2020-01-23 2023-12-07 Okins Electronics Co., Ltd Magnetic collet
KR20220050382A (en) * 2020-10-16 2022-04-25 이동환 Semiconductor chip pick up apparatus and method for manufacturing lower pick up assembly of semiconductor chip pick up apparatus
CN112743564A (en) * 2021-01-12 2021-05-04 南京迪海智科精密机械有限公司 Chip grabbing robot and grabbing method
KR102348437B1 (en) * 2021-07-19 2022-01-07 시대테크 주식회사 A pickup device capable of uniformly sucking a semiconductor chip with bumpers by using a plurality of micro-holes and method for manufacturing the same

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