KR101385444B1 - Collet for picking up and conveying semi conductor - Google Patents

Collet for picking up and conveying semi conductor Download PDF

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Publication number
KR101385444B1
KR101385444B1 KR1020130021753A KR20130021753A KR101385444B1 KR 101385444 B1 KR101385444 B1 KR 101385444B1 KR 1020130021753 A KR1020130021753 A KR 1020130021753A KR 20130021753 A KR20130021753 A KR 20130021753A KR 101385444 B1 KR101385444 B1 KR 101385444B1
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KR
South Korea
Prior art keywords
plate
rubber
collet
vacuum hole
coupling
Prior art date
Application number
KR1020130021753A
Other languages
Korean (ko)
Inventor
이향이
Original Assignee
이향이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이향이 filed Critical 이향이
Priority to KR1020130021753A priority Critical patent/KR101385444B1/en
Application granted granted Critical
Publication of KR101385444B1 publication Critical patent/KR101385444B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Abstract

The present invention relates to a collet for transferring a semiconductor chip used in the manufacture of a semiconductor package, and more particularly, a magnetic force in which a vacuum applying tube having a holder vacuum hole penetrated to the lower part is formed to protrude and a plate coupling groove is provided at the bottom thereof. And a collet holder having elasticity, a metal plate attached to the plate coupling groove by magnetism and magnetism, and provided with a plate vacuum hole at the center thereof, and a rubber suction hole formed at the center thereof with a rubber vacuum hole coupled to the bottom of the plate. In the collet for semiconductor chip pick-up transfer comprising a, in the plate, the periphery of the plate vacuum hole to the periphery of the plate around the outer periphery of the plate by turning one round along the shape of the plate to form a plurality of rubber coupling holes, but the rubber coupling When the plate and adsorption rubber are combined by a ball, the outer circumference of the adsorption rubber is long. By constructing tightly coupled,
In the process of joining the adsorption rubber and the plate, it has a close bonding force at the periphery thereof, resulting in an improved durability of the collet due to the excellent bonding force and a prolongation of its life. In particular, the stable operation of the collet ensures that A collet for semiconductor chip pick-up transfer for bringing improvement.

Description

Collet for picking up and conveying semi conductor

The present invention relates to a collet for transporting a semiconductor chip used in the manufacture of a semiconductor package, and more particularly, to a metal plate and an adsorption rubber applied as a medium for preventing flatness and deformation of an adsorption rubber for adsorption pickup of a semiconductor chip. The present invention relates to a collet for transferring semiconductor chips to enable a close and excellent bonding force.

The semiconductor package has a function of protecting the semiconductor chip from the external environment and physically bonding and electrically connecting the electronic chip to the electronic system. Today's packaging technology is becoming increasingly important as it affects the performance of semiconductor devices and the cost, performance, and reliability of end products.

In general, in the semiconductor package assembly process, an individual chip (or die) is separated from a wafer and attached to a substrate such as a lead frame or a printed circuit board (PCB) by using an epoxy adhesive. do. This is the first step of separately separating and commercializing chips that have been grouped on a wafer. Accordingly, in order to perform a chip attaching process, a process of cutting and separating wafers into individual chip units must be preceded.

As described above, the semiconductor chip package process cuts the wafer on which the plurality of chips are formed in units of individual chips, and picks up the individual chips that are cut to attach the cut individual chips to the package body. The transfer process is required. At this time, a part of the semiconductor chip transfer device that picks up and transfers the semiconductor chip from the wafer and directly picks up the chip is called a collet.

Thus, referring to a conventional collet, a collet is generally connected to a vacuum applying tube provided with a holder vacuum hole, a collet holder connected to a lower end of the vacuum applying tube and exposing the holder vacuum hole to a bottom surface thereof, and communicating with the vacuum hole. It is composed of a flexible suction rubber having a rubber vacuum hole and inserted into the bottom of the collet holder.

However, the collet as described above is to maintain the flatness of the bottom of the adsorption rubber for smooth adsorption of the semiconductor chip in the process of bonding the adsorption rubber to the collet holder. There was a problem that the change of the shape of the adsorption rubber is not easy and this problem has caused a problem of poor adsorption of the semiconductor chip and deterioration of adhesion between the transferred semiconductor chip and the package substrate.

Thus, in the process of coupling the adsorption rubber to the collet holder as in Utility Model Application Registration No. 20-0414775, the magnetic force is applied to the collet holder, the metal plate is coupled to the adsorption rubber, and the metal plate is fitted to the collet holder by A chip feeder has been proposed that is attached and coupled.

However, in the chip transfer device as described above, a fine gap occurred at the periphery of the coupling part in the process of combining the adsorption rubber and the plate. In case of severe, the adsorption rubber and plate are separated, resulting in product defects and deterioration of service life.

Korea Utility Model Registration Publication No. 20-0414775

The present invention has been made to solve the above problems, by having a close coupling force of the peripheral portion in the process of bonding the adsorption rubber and the plate, resulting in the extension of the lifespan according to the durability of the collet due to the excellent bonding force In particular, it is an object of the present invention to provide a collet for semiconductor chip pick-up transfer for bringing an improvement in quality in the manufacture of a semiconductor package by stable operation of the collet.

As a specific means for achieving the above object, a collet holder having a magnetic force is formed protruding and a plate engaging groove is provided on the bottom is provided with a vacuum applying tube provided with a holder vacuum hole penetrated to the lower portion, and the plate engaging groove On the semiconductor chip pickup transfer collet comprising a metal plate attached by the fitting and magnetic, while the plate vacuum hole is provided in the center, and a rubber suction hole coupled to the bottom of the plate and provided with a rubber vacuum hole in the center. In

In the plate, a plurality of rubber coupling holes are formed through the periphery of the plate vacuum hole by rounding along the shape of the plate at the edge close to the outer circumference of the plate,

When the plate and the adsorption rubber is coupled by the rubber coupling hole, the outer circumference of the adsorption rubber can be achieved by tightly coupling.

As described above, in the semiconductor chip pick-up transfer collet of the present invention, a plurality of coupling holes are formed in the vicinity of the plate outer circumference at the periphery of the plate vacuum hole of the plate, and when the plate and the adsorption rubber are thermally compressed, Therefore, even if the collet is used for a long time, the durability is further improved, such as preventing gaps and maintaining the flatness of the adsorption rubber. Especially, the quality of the semiconductor package and the life of the collet can be significantly extended. will be.

1 is an exploded perspective view of a collet for semiconductor chip pickup transfer of the present invention.
Figure 2 is a cross-sectional view of the plate and suction rubber coupling of the present invention semiconductor chip pickup transfer collet.
3 is an overall cross-sectional view of the collet for semiconductor chip pickup transfer of the present invention.
4 is another embodiment of the present invention semiconductor chip pickup transfer collet.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It should be understood that various equivalents and modifications may be present.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a collet for semiconductor chip pick-up transfer of the present invention, FIG. 2 is a cross-sectional view of the plate and adsorption rubber coupling of the semiconductor chip pick-up transfer collet of the present invention, and FIG. to be.

As shown in FIGS. 1 to 3, the semiconductor chip pickup transfer collet 1 of the present invention is composed of a collet holder 100, a plate 200, and a suction rubber 300.

Here, the collet holder 100 is formed in a block shape, the upper portion is provided with a vacuum applying tube 110 is connected to the device for picking up and transporting the semiconductor chip protruding, the plate coupling groove 120 is provided on the bottom will be.

In addition, a holder vacuum hole 111 is formed in the vacuum applying tube 110 to receive a vacuum from the outside, and the holder vacuum hole 111 passes through the plate coupling groove 120 of the collet holder 100. It is prepared.

In addition, the collet holder 100 is preferably configured to have a magnetic force, in order to impart the magnetic force, the collet holder 100 may be made of a material having magnetic properties, and alternatively the collet holder The magnet 101 may be embedded inside the 100 to run the magnetism, which may be selectively applied in the process of manufacturing the collet holder 100.

The plate 200 has a flat plate shape and is configured to be fitted into the bottom plate coupling groove 120 of the collet holder 100, and a holder vacuum hole 111 of the collet holder 100 is formed at the center thereof. Plate vacuum hole 210 is in communication with the provided.

In addition, the plate 200 is preferably configured of a metal material, wherein the metal material is the collet holder 100 having magnetic force, and the steel such that the collet holder 100 can be attached by magnetic force to the collet holder 100. It is preferable to construct.

That is, the plate 200 can maintain its flatness by being closely intimately contacted by the fitting coupling and the magnetic force when the plate 200 is coupled to the bottom plate coupling groove 120 of the collet holder 100.

Meanwhile, a plurality of rubber coupling holes 220 and 220 'are formed in the plate 200, and the rubber coupling holes 220 and 220' are formed at the periphery of the plate vacuum hole 210. When formed in the periphery of the plate 200 is formed by turning a round along the outer shape of the plate 200 at the position edge close to the outer circumference of the plate 200.

The adsorption rubber 300 is configured in the form of a flat plate having a predetermined thickness is coupled to the bottom of the plate 200, the center of the rubber vacuum communication with the plate vacuum hole 210 of the plate 200 The hole 310 is provided, and the outer circumference thereof may have the same or smaller size as that of the plate 200.

In addition, the adsorption rubber 300 is preferably made of a material having elasticity, such as rubber or silicon, and when combined with the plate 200, the plate prevents deformation and its flatness by the plate.

Here, the coupling between the plate 200 and the adsorption rubber 300 is made by thermocompression, and when the thermocompression is performed, the adsorption rubber 300 and the plate 200 are accommodated in a predetermined frame and then heated to the upper plate 200. It will be pressed by heat.

In detail, the heat transferred to the plate 200 in the process of thermal compression as described above is to be transferred to the upper portion of the adsorption rubber 300, the upper portion of the adsorption rubber 300 is a predetermined molten state by the heat. At this time, the upper portion of the adsorption rubber 300 to be melted is adhering to the bottom surface of the plate 200 and introduced into the rubber coupling holes 220, 220 'is given a strong bonding force.

Here, as described above, the rubber coupling holes 220 and 220 ′ provided in the plate 200 are provided at the edges thereof, and thus the outer circumferential surfaces of the rubber coupling holes 220 and 220 ′ may be closely coupled to the adsorption rubber 300. Coupling gap between the 200 and the adsorption rubber 300 will be minimized.

On the other hand, the plate 200 is coupled to the plate coupling groove 120 of the collet holder 100 in the state in which the adsorption rubber 300 is coupled to the plate 200 as described above, the plate 200 Insertion into the plate coupling groove 120 and the metal plate 200 is in close contact by the magnetic force by the magnetic force of the collet holder 100 is to maintain the flatness of the suction rubber 300.

Here, when the plate 200 and the adsorption rubber 300 is coupled to the collet holder 100, the adsorption rubber 300 is preferably protruded to the bottom of the collet holder 100, and the collet holder 100. The holder vacuum hole 111 and the plate vacuum hole 210 and the rubber vacuum hole 10 are in vertical communication when the plate 200 and the suction rubber 300 are coupled to each other.

On the other hand, in the process of coupling the plate 200 and the adsorption rubber 300 as described above to be able to have a more solid coupling force, which is, as shown in Figure 4 each of the rubber coupling holes 220 ( It is possible to further form an expansion groove 221 having an expanded diameter on the upper portion of the 220 ', the rubber coupling holes 220, 220' can be configured to form a "T" shape in cross section.

That is, when the rubber coupling holes 220 and 220 'are configured in the form of "T" in cross section as described above, the adsorption rubber 300 melted and introduced is held by the expansion groove 221 and thus is adsorbed even if used for a long time. The rubber 300 is prevented from being separated from the plate 200.

As described above, the semiconductor chip pick-up transfer collet of the present invention can be tightly and firmly coupled in the process of joining the plate and the adsorption rubber, thereby preventing gaps between the plate and the adsorption rubber and preventing separation between the plates and the adsorption rubber. Of course, the semiconductor package workability and quality is improved by the provision of a stable adsorptive force in the manufacture of the semiconductor package.

100: collet holder 101: magnet
110: vacuum application tube 111: holder vacuum hole
120: plate coupling groove 200: plate
210: plate vacuum hole 220,220 ': rubber coupling hole
221: expansion groove 300: adsorption rubber
310: rubber vacuum hole

Claims (3)

A vacuum applying tube 110 provided with a holder vacuum hole 111 penetrating downwards at an upper portion thereof is formed, and a collet holder 100 having magnetic force provided with a plate coupling groove 120 at a bottom thereof, and the plate coupling groove ( A metal plate 200 having a plate vacuum hole 210 in the center and a rubber vacuum hole 310 in the center, which are attached to the plate 120 by a fitting coupling and a magnet, and are attached to the bottom surface of the plate 200. In the semiconductor chip pick-up transfer collet comprising a suction rubber 300 of the material,
In the plate 200, a plurality of rubber coupling holes 220 and 220 ′ are rotated one turn along the shape of the plate 200 at an edge close to the outer circumference of the plate 200 to the periphery of the plate vacuum hole 210. Form through,
The upper portion of the adsorption rubber 300 is melted in the process of heat compression by configuring the plate 200 and the adsorption rubber 300 to be coupled to each other by thermal compression when the rubber coupling holes 220 and 220 'are combined. The collet for semiconductor chip pick-up transfer characterized in that the outer periphery of the adsorption rubber 300 is configured to be in close contact with the rubber coupling hole 220, 220 'of the plate 200 is configured to be in close contact.
delete The method according to claim 1,
The semiconductor is characterized in that the expansion groove 221 having an expanded diameter than the rubber coupling holes 220, 220 'is further formed on the rubber coupling holes 220, 220' of the plate 200. Collet for chip pick-up transfer.
KR1020130021753A 2013-02-28 2013-02-28 Collet for picking up and conveying semi conductor KR101385444B1 (en)

Priority Applications (1)

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KR1020130021753A KR101385444B1 (en) 2013-02-28 2013-02-28 Collet for picking up and conveying semi conductor

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101731932B1 (en) * 2017-01-18 2017-05-02 주식회사 대한테크 Collet for semiconductor chip pickup
CN108177975A (en) * 2018-01-24 2018-06-19 深圳市鼎达信装备有限公司 Vacuum absorption device
US10204962B2 (en) 2015-11-16 2019-02-12 Samsung Electronics Co., Ltd. Light source module and display apparatus having the same
KR20200018024A (en) * 2018-08-10 2020-02-19 문용규 Magnetic collet
CN111874623A (en) * 2020-07-17 2020-11-03 苏州精濑光电有限公司 Adsorption device and carrying device
KR20210001032A (en) 2019-06-26 2021-01-06 한철희 Semiconductor chip pick-up device
KR20220043696A (en) * 2020-09-29 2022-04-05 (주)마이크로컨텍솔루션 Collet for picking-up semiconductor chip

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4621705Y1 (en) * 1967-07-26 1971-07-27
JP2002210831A (en) * 2000-11-10 2002-07-31 Yokohama Rubber Co Ltd:The Method for manufacturing rubber laminate
KR200425068Y1 (en) * 2006-04-28 2006-09-01 한양정밀 (주) apparatus for transfering die
JP4530290B2 (en) * 2005-06-14 2010-08-25 富士高分子工業株式会社 Metal foil integrated conductive rubber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4621705Y1 (en) * 1967-07-26 1971-07-27
JP2002210831A (en) * 2000-11-10 2002-07-31 Yokohama Rubber Co Ltd:The Method for manufacturing rubber laminate
JP4530290B2 (en) * 2005-06-14 2010-08-25 富士高分子工業株式会社 Metal foil integrated conductive rubber
KR200425068Y1 (en) * 2006-04-28 2006-09-01 한양정밀 (주) apparatus for transfering die

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10204962B2 (en) 2015-11-16 2019-02-12 Samsung Electronics Co., Ltd. Light source module and display apparatus having the same
KR101731932B1 (en) * 2017-01-18 2017-05-02 주식회사 대한테크 Collet for semiconductor chip pickup
CN108177975A (en) * 2018-01-24 2018-06-19 深圳市鼎达信装备有限公司 Vacuum absorption device
KR20200018024A (en) * 2018-08-10 2020-02-19 문용규 Magnetic collet
KR102096019B1 (en) * 2018-08-10 2020-04-23 문용규 Magnetic collet
KR20210001032A (en) 2019-06-26 2021-01-06 한철희 Semiconductor chip pick-up device
CN111874623A (en) * 2020-07-17 2020-11-03 苏州精濑光电有限公司 Adsorption device and carrying device
KR20220043696A (en) * 2020-09-29 2022-04-05 (주)마이크로컨텍솔루션 Collet for picking-up semiconductor chip
KR102469766B1 (en) 2020-09-29 2022-11-23 (주)마이크로컨텍솔루션 Collet for picking-up semiconductor chip

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