KR101385443B1 - Pick-up transfer collet for semiconductor chip - Google Patents

Pick-up transfer collet for semiconductor chip Download PDF

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KR101385443B1
KR101385443B1 KR1020130110227A KR20130110227A KR101385443B1 KR 101385443 B1 KR101385443 B1 KR 101385443B1 KR 1020130110227 A KR1020130110227 A KR 1020130110227A KR 20130110227 A KR20130110227 A KR 20130110227A KR 101385443 B1 KR101385443 B1 KR 101385443B1
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plate
semiconductor chip
collet
vacuum
adsorption
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KR1020130110227A
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Korean (ko)
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이향이
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이향이
주식회사 페코텍
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Publication of KR101385443B1 publication Critical patent/KR101385443B1/en
Priority to CN201410415237.6A priority patent/CN104465482B/en
Priority to TW103128890A priority patent/TWI534944B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Abstract

The present invention relates to a collet for the pick-up transfer of a semiconductor chip. More specifically, a plate can be gripped on the outside of a collet holder, thereby facilitating the separation and exchange of an absorption rubber, and a stable absorptive power is assigned on the entire surface of a semiconductor chip which is adsorbed to the absorption rubber. A contact surface void between the semiconductor chip and a lead frame can be prevented, in order to enhance the absorptive power and, in addition, the generation of static electricity during the absorption and separation process of the semiconductor chip is prevented. Thereby, the defect rate of the semiconductor chip during the absorption process can be minimized.

Description

반도체 칩 픽업 이송용 콜렛{Pick-up transfer collet for semiconductor chip}Pick-up transfer collet for semiconductor chip

본 발명은 반도체 패키지 제조시 사용되는 반도체 칩 이송용 콜렛에 관한 것으로, 더욱 상세하게는 콜렛홀더로부터 플레이트 및 흡착러버의 분리 및 교환이 매우 용이하고, 흡착러버에 흡착되는 반도체 칩의 흡착성능이 향상 및 이에 따른 추후 반도체 칩과 리드프레임 과의 접착면 보이드(Void) 발생을 방지하며, 특히 흡착러버와 반도체 칩과의 흡착과정에서 발생되는 정전기를 방지하여 반도체 칩의 불량률을 최소화하기 위한 반도체 칩 픽업 이송용 콜렛에 관한 것이다.
The present invention relates to a collet for transporting a semiconductor chip used in the manufacture of a semiconductor package. More particularly, the separation and exchange of plates and adsorption rubber from the collet holder is very easy, and the adsorption performance of the semiconductor chip adsorbed to the adsorption rubber is improved. And thus prevents the occurrence of adhesion surface voids between the semiconductor chip and the lead frame, and prevents static electricity generated during the adsorption process between the adsorption rubber and the semiconductor chip, thereby minimizing the defect rate of the semiconductor chip. It relates to a transport collet.

반도체 패키지는 반도체 칩을 외부 환경으로부터 보호하며 전자 시스템에 물리적으로 접합하고 전기적으로 접속시키는 기능을 가진다. 오늘날의 패키지 기술은 반도체 소자의 성능과 최종 제품의 가격, 성능, 신뢰성 등을 좌우할 만큼 그 중요성이 매우 커지고 있다.The semiconductor package has a function of protecting the semiconductor chip from the external environment and physically bonding and electrically connecting the electronic chip to the electronic system. Today's packaging technology is becoming increasingly important as it affects the performance of semiconductor devices and the cost, performance, and reliability of end products.

일반적으로 반도체 패키지 조립 공정 중에서 개별 칩(또는 다이, die)을 웨이퍼(Wafer)에서 분리하여 리드프레임 또는 인쇄회로기판(PCB)과 같은 기판에 에폭시 접착제를 이용하여 붙이는 공정을 칩 부착 공정이라 한다. 이는 웨이퍼상에 그룹으로 있던 칩들을 개별적으로 분리하여 제품화하는 첫 단계이며, 이에 따라 칩 부착 공정을 수행하기 위해서는 웨이퍼를 개별 칩 단위로 절단하여 분리시키는 공정이 선행되어야 한다.In general, a process of attaching an individual chip (or die) from a wafer to a substrate such as a lead frame or a printed circuit board (PCB) using an epoxy adhesive in a semiconductor package assembly process is called a chip attaching process. This is the first step of separately separating and commercializing chips that have been grouped on a wafer. Accordingly, in order to perform a chip attaching process, a process of cutting and separating wafers into individual chip units must be preceded.

이와 같이 반도체 칩 패키지 공정은 복수 개의 칩이 형성된 웨이퍼를 개별 칩 단위로 절단하고, 절단된 개별 칩을 패키지 본체에 접착하는 칩 부착 공정을 위해, 절단된 개별 칩을 픽업하여 패키지 본체의 실장부에 이송하는 공정이 요구된다. 이때 웨이퍼로부터 반도체 칩을 픽업(Pick-up)하여 이송하는 반도체 칩 이송장치 중 칩과 직접 접하여 픽업하는 부분을 바로 콜렛(collet)이라고 한다.As described above, the semiconductor chip package process cuts the wafer on which the plurality of chips are formed in units of individual chips, and picks up the individual chips that are cut to attach the cut individual chips to the package body. The transfer process is required. At this time, a part of the semiconductor chip transfer device that picks up and transfers the semiconductor chip from the wafer and directly picks up the chip is called a collet.

이에, 종래 일반적인 콜렛을 살펴보면, 콜렛은 일반적으로 홀더 진공홀이 마련된 진공 인가관과, 상기 진공 인가관의 하단과 연결되며 저면으로 상기 홀더 진공홀이 노출되는 콜렛홀더와, 상기 진공홀과 연통되는 러버 진공홀을 가지며 상기 콜렛홀더의 저면에 삽입 결합되는 신축성 흡착러버로 구성된다.Thus, referring to a conventional collet, a collet is generally connected to a vacuum applying tube provided with a holder vacuum hole, a collet holder connected to a lower end of the vacuum applying tube and exposing the holder vacuum hole to a bottom surface thereof, and communicating with the vacuum hole. It is composed of a flexible suction rubber having a rubber vacuum hole and inserted into the bottom of the collet holder.

그러나 상기와 같은 콜렛은 콜렛홀더에 흡착러버를 결합하는 과정에서 반도체 칩의 원활한 흡착을 위해 흡착러버 저면의 평평함 유지시켜주어야 하는 것인데, 고무재 등 신축성 재질로 구성된 특성상 결합과정에서 그 평평함의 조절이 용이하지 못한 문제점과 흡착러버의 형태변화가 발생 되는 문제점이 있었으며, 이러한 문제점은 반도체 칩 흡착불량과 이송된 반도체 칩과 패키지 기판의 접착력이 저하되는 문제점까지 불러왔다.However, the collet as described above is to maintain the flatness of the bottom of the adsorption rubber for smooth adsorption of the semiconductor chip in the process of bonding the adsorption rubber to the collet holder. There was a problem that the change of the shape of the adsorption rubber is not easy and this problem has caused a problem of poor adsorption of the semiconductor chip and deterioration of adhesion between the transferred semiconductor chip and the package substrate.

이에, 실용신안출원등록 제20-0414775와 같이 흡착러버를 콜렛홀더에 결합하는 과정에서 상기 콜렛홀더에 자성력을 부여하고, 흡착러버에 금속재 플레이트를 결합 및 그 금속재 플레이트에 의해 콜렛홀더에 끼움 및 부착 결합되게 한 칩 이송장치가 제안된 바 있다.Thus, in the process of coupling the adsorption rubber to the collet holder as in Utility Model Application Registration No. 20-0414775, the magnetic force is applied to the collet holder, the metal plate is coupled to the adsorption rubber, and the metal plate is fitted to the collet holder by A chip feeder has been proposed that is attached and coupled.

그러나, 상기와 같은 칩 이송장치는 흡착러버와 플레이트를 결합하는 과정에서 결합부 주변부에 미세한 틈새가 발생하였으며, 이러한 틈새로 인해 콜렛을 장기간 사용시 부분적인 틈새로 인해 흡착러버의 평평함이 저하되는 문제점과, 심할경우 흡착러버와 플레이트가 분리되는 등 제품 불량 발생과 수명의 저하를 가져오는 문제점이 있었다.However, in the chip transfer device as described above, a fine gap occurred at the periphery of the coupling part in the process of combining the adsorption rubber and the plate, and the flatness of the adsorption rubber is deteriorated due to the partial gap when the collet is used for a long time. In case of severe, the adsorption rubber and plate are separated, resulting in product defects and deterioration of service life.

이에, 본 발명 출원인은 상기와 같은 제반 문제점을 해결하기 위해 특허등록출원제 10-2013-21754호와 같이 흡착러버와 플레이트를 결합하는 과정에서 접착층에 의해 전체면에 긴밀한 접착 결합력을 가지게 함으로써, 우수한 결합력으로 인한 콜렛의 내구성 향상과 이에 따른 수명의 연장을 가져오게 하며, 특히, 반도체 패키지 제조시 품질의 향상을 가져오게 한 반도체 칩 픽업 이송용 콜렛을 제안한 바 있다.Thus, the present inventors have a close adhesive bonding force on the entire surface by the adhesive layer in the process of bonding the adsorption rubber and the plate as in Patent Registration Application No. 10-2013-21754 to solve the above problems, excellent It has been proposed a collet for semiconductor chip pick-up transfer, which leads to improved durability of the collet due to the bonding force and thus an extension of the service life, and in particular, an improvement in quality in manufacturing a semiconductor package.

그러나, 상기와 같은 반도체 칩 픽업 이송용 콜렛은, 플레이트가 콜렛홀더의 플레이트 결합홈에 밀폐 결합되는 구조를 가지고 있는 것인바, 흡착러버의 분리 교환시 그 탈거가 매우 불편한 문제점이 있었다.However, the above-mentioned collet for semiconductor chip pick-up transfer has a structure in which the plate is hermetically coupled to the plate coupling groove of the collet holder, so that the removal of the adsorption rubber is very inconvenient.

또한, 흡착러버에 형성되어 진공력을 부여하는 러버 진공홀이 중앙에 단일개로 구성되어 있는 것인바, 반도체 칩을 흡착시 전체면에 고른 흡착력이 부여되지 못하는 문제점이 있었으며, 이로 인해 반도체 칩을 리드프레임에 접착시 보이드가 발생하는 등 긴밀한 접착이 이루어지지 못하는 문제점이 있었다.In addition, since a single rubber vacuum hole formed in the adsorption rubber to impart a vacuum force is composed of a single in the center, there is a problem that evenly adsorbing force is not applied to the entire surface when the semiconductor chip is adsorbed, thereby leading to the semiconductor chip. There was a problem in that the close adhesion is not made, such as voids generated when bonding to the frame.

또한, 반도체 칩을 흡착하는 과정에서 흡착러버의 표면과 반도체 칩의 표면 사이에 정전기가 발생하여 반도체 칩의 불량을 초래하는 심각한 문제점이 있었다.
In addition, there is a serious problem in that static electricity is generated between the surface of the adsorption rubber and the surface of the semiconductor chip in the process of adsorbing the semiconductor chip, resulting in a defect of the semiconductor chip.

대한민국실용신안등록 제20-0414775호.Korea Utility Model Registration No. 20-0414775. 대한민국특허등록출원 제10-2013-21754호.Korean Patent Registration Application No. 10-2013-21754.

본 발명은 상기와 같은 제반 문제점을 해결하기 위해 창안된 것으로, 콜렛홀더의 외부에서 플레이트의 파지가 가능하게 하여 흡착러버의 분리 및 교환이 매우 용이하게 하고, 흡착러버에 흡착되는 반도체 칩의 고른면에 안정된 흡착력이 부여되게 하는 등 추후 반도체 칩과 리드프레임 과의 접착면 보이드 발생이 방지되게 하여 그 접착력이 향상되게 하기 위한 반도체 칩 픽업 이송용 콜렛을 제공함에 본 발명의 목적이 있는 것이다.The present invention was devised to solve the above problems, and it is possible to grip the plate from the outside of the collet holder to facilitate the separation and exchange of the adsorption rubber, even surface of the semiconductor chip adsorbed on the adsorption rubber SUMMARY OF THE INVENTION An object of the present invention is to provide a collet for semiconductor chip pick-up and transfer to prevent adhesion surface voids between a semiconductor chip and a lead frame to be prevented, such that stable adsorption force is imparted thereto.

또한, 반도체 칩의 흡착 및 이송 분리 과정에서 발생되는 정전기 발생이 방지되게 하여 반도체 칩 흡착과정에서 발생되는 반도체 칩의 불량률을 최소화하기 위한 반도체 칩 픽업 이송용 콜렛을 제공함에 본 발명의 다른 목적이 있는 것이다.In addition, to prevent the generation of static electricity generated during the adsorption and transfer separation process of the semiconductor chip to provide a semiconductor chip pickup transfer collet for minimizing the defective rate of the semiconductor chip generated during the semiconductor chip adsorption process has another object of the present invention will be.

또한, 비교적 얇은 반도체 칩의 경우에도 안정된 흡착력이 부여되게 함은 물론 리드프레임에 접착시 안정된 접착에 따른 보이드 발생이 방지되게 하기 위한 칩 픽업 이송용 콜렛을 제공함에 본 발명의 또 다른 목적이 있는 것이다.
Another object of the present invention is to provide a chip pick-up transfer collet for stably adhering force even in the case of a relatively thin semiconductor chip, and to prevent void generation due to stable adhesion when the lead frame is bonded to the lead frame. .

상기 목적을 달성하기 위한 구체적인 수단으로는, 상부에 하부로 관통되는 홀더 진공홀이 마련된 진공 인가관이 돌출 형성되고 저면에 직사각형 형태의 플레이트 결합홈이 마련된 자성력을 갖는 직사각형 블럭 형태의 콜렛홀더와, 상기 플레이트 결합홈에 끼움 결합 및 자성에 의해 부착되는 금속재 플레이트와, 상기 플레이트의 저면에 접착 결합되는 신축 재질의 흡착러버를 포함하여 된 반도체 칩 픽업 이송용 콜렛에 있어서,As a specific means for achieving the above object, the collet holder having a rectangular block shape having a magnetic force is formed protruding and the plate engaging groove of the rectangular shape formed on the bottom of the vacuum application tube provided with a holder vacuum hole penetrated to the bottom and In the semiconductor chip pickup transfer collet comprising a metal plate attached to the plate coupling groove and attached by magnetism, and a suction rubber of elastic material adhesively bonded to the bottom surface of the plate,

상기 콜렛홀더에는, 대각선상으로 대항되는 모서리부를 상기 플레이트 결합홈이 개방되도록 모따기 절단하여 플레이트 인출부를 형성하고, 플레이트 결합홈에는 진공 유도공간을 형성하며,In the collet holder, the plate portion is formed by chamfering the diagonally opposed corner portions to open the plate coupling groove, and a vacuum induction space is formed in the plate coupling groove.

플레이트에는, 상기 플레이트 결합홈에 결합시 상기 진공 유도공간과 연통되는 한편 진공 흡입력이 부여시 그 진공 흡입력이 분산되도록 관통형 플레이트 진공홀을 가로세로 일정 간격으로 다수 배열 형성하며,In the plate, a plurality of through-hole plate vacuum holes are formed at regular intervals horizontally and horizontally so as to be in communication with the vacuum induction space when coupled to the plate coupling groove and to disperse the vacuum suction force when the vacuum suction force is applied.

상기 흡착러버는, 상기 플레이트와 결합되는 상부의 결합부와, 상기 결합부의 저면으로 그 결합부보다 작은 외둘레를 갖도록 흡착부를 일체로 돌출 형성하는 한편, 상기 각각의 플레이트 진공홀과 동일 수직선상을 이루도록 관통형 러버 진공홀을 가로세로 일정 간격으로 다수 배열 형성하며,The adsorption rubber integrally protrudes the adsorption unit so as to have an upper engaging portion coupled to the plate and an outer circumference smaller than the engaging portion to the bottom of the engaging portion, and has the same vertical line as each of the plate vacuum holes. To form a plurality of through-rubber vacuum holes at regular intervals vertically and horizontally,

또한, 상기 진공 유도공간은,In addition, the vacuum induction space,

상기 콜렛홀더의 플레이트 결합홈의 상부면 중앙에 함몰 형성되게 구성하되, 진공 유도공간은, 상기 플레이트 진공홀의 배열된 전체 범위보다 크게 구성하며,It is configured to be recessed in the center of the upper surface of the plate engaging groove of the collet holder, the vacuum induction space is configured to be larger than the entire range of the plate vacuum holes arranged,

또한, 상기 진공 유도공간은,In addition, the vacuum induction space,

상기 콜렛홀더의 플레이트 결합홈의 상부면에 "링" 형상을 이루는 씰링재 결합홈을 형성하고, 상기 씰링재 결합홈에는 신축성 재질의 씰링재가 끼움 및 하부로 돌출되게 구성하되, 상기 씰링재의 돌출부의 사이에 형성되며, 진공 유도공간은, 상기 플레이트 진공홀의 배열된 전체 범위보다 크게 구성하며,A sealing material coupling groove forming a "ring" shape is formed on the upper surface of the plate coupling groove of the collet holder, and the sealing material coupling groove is configured to be fitted with a sealing material of elastic material and protrudes downward, between the protrusions of the sealing material. It is formed, the vacuum induction space is configured to be larger than the entire range of the arrangement of the plate vacuum hole,

또한, 상기 흡착러버의 흡착부는, 그 저면이 만곡한 곡률을 가지며 하방으로 볼록한 형태를 이루게 구성하며,In addition, the adsorption portion of the adsorption rubber, the bottom surface has a curved curvature is configured to form a convex downward,

또한, 흡착러버는,In addition, the adsorption rubber,

전도성을 가지게 구성하되,Configured to be conductive,

고무 또는 실리콘 중 어느 하나의 주성분 70~80중량%와, 대전 방지제 3~15중량%와, 카본블랙 또는 케첸블랙 또는 흑연 중 어느 하나로 된 탄소기재 2~20중량%와, 탄소나노튜브 0.5~10 중량%를 가온 압축 성형하여 10^5 ~ 10^12/sq의 표면 저항을 가지게 구성함으로 달성할 수 있는 것이다.
70 to 80% by weight of the main component of either rubber or silicone, 3 to 15% by weight of antistatic agent, 2 to 20% by weight of carbon based one of carbon black, ketjen black or graphite, and 0.5 to 10 carbon nanotubes It can be achieved by heating the compression molding by weight% to have a surface resistance of 10 ^ 5 ~ 10 ^ 12 / sq.

이상과 같이 본 발명 반도체 칩 픽업 이송용 콜렛은, 콜렛홀더의 대항되는 모서리부가 모따기 절단 형성되어 있어 플레이트 및 흡착러버가 노출되는바, 흡착러버의 분리 및 교환이 매우 용이하고, 플레이트 결합홈과 플레이트 사이에 형성되는 진공 유도공간 및 플레이트와 흡착러버에 형성된 다수의 진공홀에 의해 그 흡착력 부여 범위가 분산되는 것인바, 반도체 칩의 안정된 흡착력의 부여와 이에 따른 반도체 칩을 리드프레임에 접착시 보이드 없는 긴밀한 접착이 가능한 효과를 얻을 수 있는 것이다.As described above, the semiconductor chip pick-up transfer collet of the present invention has a chamfered cut formed at the opposite edges of the collet holder, and thus the plate and the adsorption rubber are exposed, so that the adsorption rubber can be easily removed and replaced. The range of adsorption force is dispersed by the vacuum induction space formed between the plate and the plurality of vacuum holes formed in the plate and the adsorption rubber. The close adhesion can be obtained.

또한, 흡착러버에 전도성이 부여되어 흡착러버를 이용한 반도체 칩의 흡착 및 이송 분리하는 과정에서 정전기가 발생하지 않아 반도체 칩의 불량이 방지되는 효과를 얻을 수 있는 것이다.In addition, since conductivity is provided to the adsorption rubber, static electricity is not generated in the process of adsorption and transport separation of the semiconductor chip using the adsorption rubber, thereby preventing the defect of the semiconductor chip.

또한, 흡착부의 저면이 볼록한 형상을 이루고 있어, 비교적 얇은 반도체 칩의 흡착시 흡착부의 저면과 동일한 흡착력이 부여되어 추후, 리드프레임에 접착시 반도체 칩의 중앙으로부터 방상으로의 접착 및 이에 따른 보이드 발생이 방지되는 효과를 얻을 수 있는 것이다.
In addition, the bottom surface of the adsorption part is convex, and the same adsorption force as the bottom surface of the adsorption part is applied when the relatively thin semiconductor chip is adsorbed. The effect is to be prevented.

도 1은 본 발명 반도체 칩 픽업 이송용 콜렛의 분해 사시도.
도 2는 본 발명 반도체 칩 픽업 이송용 콜렛의 결합상태 저면도.
도 3은 본 발명 반도체 칩 픽업 이송용 콜렛의 결합 단면도.
도 4는 본 발명 반도체 칩 픽업 이송용 콜렛의 콜렛홀더 다른 실시예도.
도 5은 본 발명 반도체 칩 픽업 이송용 콜렛의 흡착러버 다른 실시예도.1 is an exploded perspective view of a collet for semiconductor chip pickup transfer of the present invention.
Figure 2 is a bottom view of the bonded state of the present invention semiconductor chip pickup transfer collet.
Figure 3 is a cross-sectional view of the combination of the present invention semiconductor chip pickup transfer collet.
Figure 4 is another embodiment of the collet holder of the present invention semiconductor chip pickup transfer collet.
Figure 5 is another embodiment of the adsorption rubber of the semiconductor chip pickup transfer collet.

본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.
Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It should be understood that various equivalents and modifications may be present.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명 반도체 칩 픽업 이송용 콜렛의 분해 사시도이고, 도 2는 본 발명 반도체 칩 픽업 이송용 콜렛의 결합상태 저면도이며, 도 3은 본 발명 반도체 칩 픽업 이송용 콜렛의 결합 단면도이다.1 is an exploded perspective view of a collet for semiconductor chip pick-up transfer of the present invention, FIG. 2 is a bottom view of the bonded state of the collet for semiconductor chip pick-up transfer of the present invention, and FIG.

도 1 내지 도 3의 도시와 같이 본 발명 반도체 칩 픽업 이송용 콜렛(1)은, 콜렛홀더(100)와, 플레이트(200)와, 흡착러버(300)로 구성된다.As shown in FIGS. 1 to 3, the present invention semiconductor chip pick-up transfer collet 1 includes a collet holder 100, a plate 200, and a suction rubber 300.

여기서, 상기 콜렛홀더(100)는, 직사각형 블럭 형태로 구성된 것으로, 상부에는 통상의 반도체 칩을 픽업하여 이송하는 한편, 진공 흡입력을 부여하는 장치(도면중 미도시함)에 연결되며 외부로부터 진공 흡입력을 공급받기 위한 홀더 진공홀(111)이 관통 형성된 진공 인가관(110)이 돌출 형성되고, 저면에는 상기 홀더 진공홀(111)과 연통되는 직사각형 형태의 플레이트 결합홈(120)이 함몰 마련된다.Here, the collet holder 100 is configured in the form of a rectangular block, and is connected to a device (not shown in the drawing) that provides a vacuum suction force while picking up and transferring a conventional semiconductor chip on the upper side and vacuum suction force from the outside. A vacuum applying tube 110 is formed through which a holder vacuum hole 111 for receiving the supply is protruded, and a plate coupling groove 120 having a rectangular shape communicating with the holder vacuum hole 111 is provided in the bottom.

또한, 상기 콜렛홀더(100)는, 자성력을 가지게 구성된 것으로, 그 자성력을 부여하기 위해서는 그 콜렛홀더(100)를 자성을 갖는 재질로 구성할 수 있으며, 또 다르게는 그 콜렛홀더(100) 내부에 자석(101)을 내장하여 자성을 뛰도록 할 수 있는 것으로, 이는 콜렛홀더(100)를 제작하는 과정에서 선택적으로 적용할 수 있다.In addition, the collet holder 100 is configured to have a magnetic force, and in order to impart the magnetic force, the collet holder 100 may be made of a material having magnetic properties, and alternatively the collet holder 100 The magnet 101 may be embedded therein so as to run the magnetism, which may be selectively applied in the process of manufacturing the collet holder 100.

한편, 콜렛홀더(100)에는, 하기하는 플레이트(200)의 모서리가 외부로 인출될 수 있도록 플레이트 인출부(130)가 더 마련된 것인데, 플레이트 인출부(130)는, 콜렛홀더(100)를 평면상 대각선상으로 대항되는 모서리부를 상기 플레이트 결합홈(120)이 노출되도록 45°모따기 절단하여 구성된다.On the other hand, the collet holder 100, the plate withdrawal unit 130 is further provided so that the edge of the plate 200 to be drawn out to the outside, the plate withdrawal unit 130, the collet holder 100 45 ° chamfered cutting is performed so that the plate engaging groove 120 is exposed at an edge portion opposed to the upper diagonal line.

또한, 플레이트 결합홈(120)에는, 상기 홀더 진공홀(111)과 연통되도록 공간 형태의 진공 유도공간(121)이 마련된다.In addition, the plate coupling groove 120 is provided with a vacuum guide space 121 of a space form so as to communicate with the holder vacuum hole 111.

이때, 진공 유도공간(121)은, 플레이트 결합홈(120)의 상부면 중앙이 함몰되는 홈 형태로 구성할 수 있다.In this case, the vacuum induction space 121 may be configured in the shape of a groove in which the center of the upper surface of the plate coupling groove 120 is recessed.

또한, 진공 유도공간(121)은, 도 4의 도시와 같이 상기 플레이트 결합홈(120)의 상부면에 사각 "링" 형상을 이루게 씰링재 결합홈(141)을 형성하고, 그 씰링재 결합홈(141)에 신축성 재질의 씰링재(140)를 끼움 및 그 씰링재(140)가 하부로 소정 돌출되게 구성할 수 있는 것으로, 이때, 상기 돌출 형성되는 씰링재(140)의 사이에 공간 형태의 진공 유도공간(121)이 마련된다.In addition, the vacuum induction space 121, as shown in Figure 4, forming a sealing material coupling groove 141 to form a square "ring" shape on the upper surface of the plate coupling groove 120, the sealing material coupling groove 141 Fit the sealing material 140 of the elastic material and the sealing material 140 can be configured to protrude to the lower portion, in this case, the vacuum induction space 121 in the form of space between the protruding sealing material 140 is formed ) Is provided.

여기서, 돌출 형성되는 씰링재(140)는 플레이트 결합홈(120)을 벗어나지 않아야 함이 바람직하다.Here, it is preferable that the sealing member 140 protruding from the plate coupling groove 120 does not leave.

상기 플레이트(200)는, 자력에 의해 부착될 수 있도록 강철 재질로 된 직사각형 평판 형태를 이루는 것이며, 상기 콜렛홀더(100)의 저면 플레이트 결합홈(120)에 끼움 결합되게 구성된 것으로, 끼움 결합시 그 대각선상으로 대항되는 모서리부가 상기 플레이트 인출부(130)를 통해 외부로 돌출 되게 구성된다.The plate 200 forms a rectangular flat plate made of steel so as to be attached by magnetic force, and is configured to be fitted into the bottom plate coupling groove 120 of the collet holder 100. The diagonally opposed corner portion is configured to protrude outward through the plate withdrawal portion 130.

또한, 플레이트(200)에는, 상기 콜렛홀더(100)의 플레이트 결합홈(120)에 형성된 진공 유도공간(121)과 연통되도록 다수의 플레이트 진공홀(211)(211')이 마련된 것으로, 플레이트 진공홀(211)(211')은 가로세로 일정 간격을 두고 다수 배열형성되게 구성하되, 배열되는 플레이트 진공홀(211)(211')의 전체에 해당하는 범위는 진공 유도공간(121)을 벗어나지 않게 구성함이 바람직하다.In addition, the plate 200 is provided with a plurality of plate vacuum holes 211 and 211 'are provided to communicate with the vacuum induction space 121 formed in the plate coupling groove 120 of the collet holder 100, plate vacuum The holes 211 and 211 'are configured to be arranged in a plurality of spaced apart at regular intervals vertically and horizontally, so that the range corresponding to the whole of the plate vacuum holes 211 and 211' is arranged so as not to deviate from the vacuum induction space 121. It is preferable to construct.

즉, 플레이트(200)는, 콜렛홀더(100)의 저면 플레이트 결합홈(120)에 결합시 끼움 결합 및 자력에 의해 긴밀하게 결합되는 것이며, 홀더 진공홀(111)을 통해 진공 유도공간(121)에 진공 흡입력이 작용시 그 진공 흡입력이 다수의 플레이트 진공홀(211)(211')을 통해 분산되게 구성된다.That is, the plate 200 is tightly coupled by fitting and magnetic force when the plate 200 is coupled to the bottom plate coupling groove 120 of the collet holder 100, and the vacuum induction space 121 through the holder vacuum hole 111. When the vacuum suction force is applied to the vacuum suction force is configured to be dispersed through a plurality of plate vacuum holes 211, 211 '.

상기 흡착러버(300)는, 고무나 실리콘 등 신축성을 갖는 재질로 구성된 것이며, 상기 플레이트(200)의 저면에 접착제 등을 이용하여 접착 결합되는 상부의 결합부(310)와, 상기 결합부(310)의 저면으로 돌출되는 한편 반도체 칩(도면중 미도시함)을 흡착하는 흡착부(320)가 일체로 구성된다.The adsorption rubber 300 is made of a material having elasticity, such as rubber or silicon, the upper coupling portion 310 and the coupling portion 310 is adhesively bonded to the bottom of the plate 200 using an adhesive or the like. The adsorption part 320 which protrudes to the bottom of () and adsorb | sucks a semiconductor chip (not shown in figure) is comprised integrally.

이때, 흡착러버(300)에는, 상기 플레이트(200)에 형성된 다수의 플레이트 진공홀(211)(211')과 동일 수직선상을 이루게 수직 관통되며 가로세로 일정 간격을 두고 다수 배열형성된 러버 진공홀(311)(311')이 수직 관통되게 구성된다.At this time, in the suction rubber 300, the plurality of plate vacuum holes (211, 211 ') formed in the plate 200 vertically penetrates in the same vertical line, and a plurality of rubber vacuum holes are formed at regular intervals horizontally ( 311 and 311 'are configured to penetrate vertically.

또한, 흡착부(320)는, 상기 결합부(310)보다 작은 외둘레를 갖도록 구성함이 바람직한 하다.In addition, the adsorption portion 320 is preferably configured to have a smaller outer circumference than the coupling portion 310.

또한, 흡착러버(300)의 흡착부(320)는, 도 5의 도시와 같이 그 저면이 중앙으로부터 만곡한 곡률을 가지며 하방으로 볼록한 형태를 이루게 구성할 수 있다.In addition, the adsorption unit 320 of the adsorption rubber 300, as shown in Figure 5 can be configured to form a convex shape downwardly has a curvature curved from the center.

또한, 흡착러버(300)는, 반도체 칩과 접촉시 정전기를 방지하기 위해 전도성을 가지게 구성함이 바람직한 것으로,In addition, the adsorption rubber 300 is preferably configured to have a conductivity to prevent static electricity when in contact with the semiconductor chip,

전도성을 부여하기 위해 고무 또는 실리콘 중 어느 하나의 주성분 70~80중량%와, 대전 방지제 3~15중량%와, 카본블랙 또는 케첸블랙 또는 흑연 중 어느 하나로 된 탄소기재 2~20중량%와, 탄소나노튜브 0.5~10 중량%를 가온 압축 성형하여 10^5 ~ 10^12/sq의 표면 저항을 가지게 구성할 수 있다.
70 to 80% by weight of the main component of any one of rubber or silicone, 3 to 15% by weight of antistatic agent, 2 to 20% by weight of carbon based material of any one of carbon black, Ketjen black or graphite, and carbon 0.5 ~ 10% by weight of the nanotubes by heating and compression molding can be configured to have a surface resistance of 10 ^ 5 ~ 10 ^ 12 / sq.

이하, 상기와 같은 구성을 갖는 본 발명 반도체 칩 픽업 이송용 콜렛의 작용을 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, the operation of the semiconductor chip pickup transfer collet having the above configuration will be described in detail with reference to the accompanying drawings.

먼저, 도 1 내지 도 3의 도시와 같이 본 발명 반도체 칩 픽업 이송용 콜렛(1)은, 콜렛홀더(100)와 흡착러버(300)가 결합된 플레이트(200)의 착탈이 편리하게 하기 위한 것으로, 콜렛홀더(100)와 플레이트(200)와의 결합관계를 살펴보면,First, as shown in FIGS. 1 to 3, the present invention the semiconductor chip pick-up transfer collet 1 is to facilitate the detachment of the plate 200 to which the collet holder 100 and the adsorption rubber 300 are coupled. Looking at the coupling relationship between the collet holder 100 and the plate 200,

플레이트(200)는, 콜렛홀더(100)의 저면에 형성된 플레이트 결합홈(120)에 끼움 및 콜렛홀더(100)의 자성력에 의해 부착 결합된다.The plate 200 is fitted into the plate coupling groove 120 formed on the bottom of the collet holder 100 and attached and coupled by the magnetic force of the collet holder 100.

이때, 플레이트(200)의 어느 한 대각선상 대항되는 모서리부는 플레이트 결합홈(120) 내의 대각선상 모서리부에 끼움 결합되고, 다른 대각선상 대항되는 모서리부는 콜렛홀더(100)의 모따기 형성된 플레이트 인출부(130)에 수용 및 콜렛홀더(100)의 외부로 돌출되게 된다.At this time, any one of the diagonally opposed edge portion of the plate 200 is fitted into the diagonal edge portion in the plate coupling groove 120, the other diagonally opposite edge portion of the plate withdrawal formed chamfered of the collet holder 100 ( 130 is accommodated in and protrudes out of the collet holder 100.

한편, 상기와 같이 결합된 플레이트(200)와 함께 결합된 흡착러버(300)는 일정시간 사용 후 새로운 흡착러버(300)로 교체 사용하여야 하는 것으로, 플레이트(200)와 함께 콜렛홀더(100)로부터 탈거 하여야 하는 것인바, 이때 본 발명에서는 콜렛홀더(100)의 플레이트 인출부(130)를 통해 돌출된 플레이트(200)의 모서리부를 파지 후 당김 외력을 가해 플레이트 결합홈(120)으로부터 탈거하면 되는 것으로, 매우 편리하게 분리 및 교환이 가능하다.Meanwhile, the adsorption rubber 300 coupled with the plate 200 coupled as described above should be replaced with a new adsorption rubber 300 after a certain time of use, from the collet holder 100 together with the plate 200. Bar to be removed, in the present invention is to be removed from the plate coupling groove 120 by applying a pull external force after gripping the edge of the plate 200 protruding through the plate withdrawal 130 of the collet holder 100. It can be removed and exchanged very conveniently.

또한, 본 발명은 흡착러버(300)에 의해 반도체 칩을 흡착하는 과정에서 안정된 흡착력의 부여가 가능한 것으로, 이는 콜렛홀더(100)의 플레이트 결합홈(120)에 형성된 진공 유도공간(121)과 플레이트(200)에 형성된 다수의 플레이트 진공홀(211)(211') 및 흡착러버(300)에 형성된 다수의 러버 진공홀(311)(311')에 의해 가능하다.In addition, the present invention is to provide a stable adsorption force in the process of adsorbing the semiconductor chip by the adsorption rubber 300, which is the vacuum guide space 121 and the plate formed in the plate coupling groove 120 of the collet holder 100 A plurality of plate vacuum holes 211 and 211 ′ formed in the 200 and a plurality of rubber vacuum holes 311 and 311 ′ formed in the suction rubber 300 are possible.

즉, 도 3 및 도 4의 도시와 같이 진공 인가관(110)의 홀더 진공홀(111)에 진공 흡입력이 발생하게 되면, 그 진공 흡입력은 진공 유도공간(121)으로 전달되고, 이후, 다수로 분산 형성된 플레이트 진공홀(211)(211') 및 러버 진공홀(311)(311')로 전달되게 된다.That is, when the vacuum suction force is generated in the holder vacuum hole 111 of the vacuum applying tube 110 as shown in FIGS. 3 and 4, the vacuum suction force is transmitted to the vacuum induction space 121, and then, The plate vacuum holes 211 and 211 ′ and the rubber vacuum holes 311 and 311 ′ are formed to be distributed.

이에, 흡착러버(300)의 흡착부(320)는 반도체 칩의 상부면에 고른 흡착력을 부여함으로 반도체 칩의 흡착부가 오목하게 휘는 현상과 같은 흡착 변형이 방지되는 것이며, 이에 따른 이송 후 리드프레임과 접착시 고른 접착에 따른 보이드 발생이 방지되게 된다.Thus, the adsorption portion 320 of the adsorption rubber 300 is to provide an even adsorption force to the upper surface of the semiconductor chip to prevent the adsorption deformation, such as the phenomenon that the adsorption portion of the semiconductor chip bent concave, according to the lead frame and In the case of adhesion, voids caused by even adhesion are prevented.

한편, 도 4의 도시와 같이 플레이트 결합홈(120)의 내부에 씰링재(140)를 이용한 진공 유도공간(121)을 구성시에는 씰링재(140)에 의해 진공 유도공간(121)으로 이물질 등이 진입되는 것이 방지되고, 콜렛홀더(100)나 플레이트 결합홈(120)에 이물질이 부착되었을 경우에 진공누설이 발생되는 것이 방지되어 흡착성능을 더욱 향상시킬 수 있게 된다.On the other hand, when configuring the vacuum induction space 121 using the sealing material 140 in the inside of the plate coupling groove 120, as shown in FIG. 4, foreign substances, etc. enter the vacuum induction space 121 by the sealing material 140. When the foreign matter is attached to the collet holder 100 or the plate coupling groove 120 is prevented that the vacuum leakage is generated it is possible to further improve the adsorption performance.

또한, 도 5의 도시와 같이 흡착러버(300)의 흡착부(320) 저면 즉, 반도체 칩과의 접촉면을 볼록한 형태로 구성시에는, 이 또한 반도체 칩의 안정된 흡착 및 리드프레임과의 접착이 용이하게 할 수 있는 것이데,In addition, when the bottom surface of the adsorption portion 320, that is, the contact surface with the semiconductor chip, of the adsorption rubber 300 is convex, as shown in FIG. 5, the adsorption of the semiconductor chip and the adhesion to the lead frame are easy. I can do it,

이는, 비교적 두께가 얇은 반도체 칩의 경우 흡착력에 의해 변형이 발생하는 것인바, 흡착부(320)에 반도체 칩이 흡착시 그 흡착부(320)의 곡률을 따라 반도체 칩이 중앙이 볼록한 형태를 이루면서 흡착되는 것이며, 이후 리드프레임에 접착시 그 반도체 칩의 중앙부터 접촉되고, 흡착력을 제거시 반도체 칩의 복원력에 의해 중앙으로부터 방사상으로 자연스럽게 접착되게 된다.When the semiconductor chip is relatively thin, deformation occurs due to adsorption force. When the semiconductor chip is adsorbed to the adsorption unit 320, the semiconductor chip is convex in the center along the curvature of the adsorption unit 320. It is to be adsorbed, and then contacted from the center of the semiconductor chip when adhering to the lead frame, it is naturally bonded radially from the center by the restoring force of the semiconductor chip when removing the adsorbing force.

즉, 상기와 같이 중앙으로부터 방사상으로 자연스럽게 접착이 이루어지게 되면 반도체 칩을 리드프레임에 접착하기 위한 접착제 내부에 잔존하는 기포가 완전히 제거되어 접착시 보이드 발생을 완전히 방지할 수 있게 된다.That is, when the adhesion is naturally performed radially from the center as described above, bubbles remaining in the adhesive for bonding the semiconductor chip to the lead frame are completely removed, thereby completely preventing voids during adhesion.

또한, 흡착러버(300)의 흡착부(320)를 전도성을 가지게 하는 한편, 10^5 ~ 10^12/sq의 표면 저항을 가지게 구성함은, 반도체 칩을 흡착 이송중에는 정전기가 끊임없이 발생하게 되는 것인바, 이때 정전기에 의한 전기적 충격을 제거하여 전기적 충격에 매우 취약한 반도체 칩의 불량을 방지하게 된다.In addition, the adsorption portion 320 of the adsorption rubber 300 to have a conductivity, while having a surface resistance of 10 ^ 5 ~ 10 ^ 12 / sq, the static electricity is generated constantly during the adsorption transfer of the semiconductor chip At this time, the electrical shock caused by static electricity is eliminated to prevent a defect of the semiconductor chip which is very vulnerable to electrical shock.

한편, 흡착부(320)를 고무 또는 실리콘 중 어느 하나의 주성분 70~80중량%와, 대전 방지제 3~15중량%와, 카본블랙 또는 케첸블랙 또는 흑연 중 어느 하나로 된 탄소기재 2~20중량%와, 탄소나노튜브 0.5~10 중량%를 가온 압축 성형하여 10^5 ~ 10^12/sq의 표면 저항을 가지게 함은,On the other hand, the adsorption portion 320 is 70 to 80% by weight of the main component of any one of rubber or silicon, 3 to 15% by weight of the antistatic agent, and 2 to 20% by weight of the carbon substrate of any one of carbon black, Ketjen black or graphite And, by heating and compression molding 0.5 ~ 10% by weight of carbon nanotubes to have a surface resistance of 10 ^ 5 ~ 10 ^ 12 / sq,

흡착부(320)를, 표면 저항이 10^12/sq 이상의 종래의 비전도성 고무재질로 구성시에는 고무재질의 전기적 특성이 부도체인 관계로 반도체 칩을 흡착 및 이송 분리하는 과정에서 발생되는 정전기 발생시의 대전 전류 이동을 제한하여 흡착러버(300)가 설치되어 있는 설비의 접지 상태에 무관하게 정전기에 의하여 반도체 칩이 손상을 받게되며 이는 반도체 칩의 불량으로 연결된다.When the adsorption part 320 is composed of a conventional non-conductive rubber material having a surface resistance of 10 ^ 12 / sq or more, when the static electricity generated in the process of adsorbing and transporting the semiconductor chip due to the electrical properties of the rubber material is insulator By limiting the charging current movement of the semiconductor chip is damaged by the static electricity regardless of the grounding state of the equipment in which the adsorption rubber 300 is installed, which leads to a defect of the semiconductor chip.

또한, 표면 저항이 10^5/sq 이하인 경우에는 전도성을 부여하기 위해 첨가된 첨가물들이 흡착러버(300)를 장기간 사용하는 과정에 그 흡착부(320)로부터 이물질 형태로 분리되어 이것들이 제거되지 아니하고 반도체 조립이 완료된 경우 흡착부(320)를 통하여 흡착 및 이송 분리하고 리드프레임에 접착 후, 와이어 본딩을 실시하게 되는데, 이때 인접하는 와이어의 사이가 매우 미세하여 흡착부(320)의 표면으로부터 분리된 도전 첨가물 이물질이 와이어에 붙어 인접와이어와 합선을 초래하는 불량이 발생하게 된다.In addition, when the surface resistance is 10 ^ 5 / sq or less, additives added to impart conductivity are separated from the adsorption unit 320 in the form of foreign matter in the process of using the adsorption rubber 300 for a long time, and these are not removed. When the semiconductor assembly is completed, the adsorption and transport separation through the adsorption unit 320 and after adhering to the lead frame, the wire bonding is performed, wherein the adjacent wires are very fine and separated from the surface of the adsorption unit 320 The conductive additive foreign matter may stick to the wire, causing a defect that causes a short circuit with the adjacent wire.

이상과 같이 본 발명 반도체 칩 픽업 이송용 콜렛은, 콜렛홀더로부터 플레이트 및 흡착러버의 분리 및 교환이 매우 용이하고, 반도체 칩을 흡착하는 과정에서 안정된 흡착력의 부여가 가능하며, 반도체 칩을 흡착 및 이송 분리하는 과정에서 발생되는 불량률을 최소화할 수 있다.
As described above, the semiconductor chip pick-up transfer collet of the present invention is very easy to separate and exchange the plate and the adsorption rubber from the collet holder, and to provide a stable adsorption force in the process of adsorbing the semiconductor chip, and to adsorb and transfer the semiconductor chip. It is possible to minimize the defective rate generated during the separation process.

100 : 콜렛홀더 111 : 홀더 진공홀
110 : 진공 인가관 120 : 플레이트 결합홈
121 : 진공 유도공간 130 : 플레이트 인출부
140 : 씰링재 141 : 씰링재 결합홈
200 : 플레이트 211,211' : 플레이트 진공홀
300 : 흡착러버 310 : 결합부
311,311' : 러버 진공홀 320 : 흡착부100: collet holder 111: holder vacuum hole
110: vacuum inlet tube 120: plate coupling groove
121: vacuum induction space 130: plate withdrawal unit
140: sealing material 141: sealing material coupling groove
200: plate 211,211 ': plate vacuum hole
300: adsorption rubber 310: coupling portion
311,311 ': Rubber vacuum hole 320: Suction part

Claims (5)

상부에 하부로 관통되는 홀더 진공홀(111)이 마련된 진공 인가관(110)이 돌출 형성되고 저면에 직사각형 형태의 플레이트 결합홈(120)이 마련된 자성력을 갖는 직사각형 블럭 형태의 콜렛홀더(100)와, 상기 플레이트 결합홈(120)에 에 끼움 결합 및 자성에 의해 부착되는 금속재 플레이트(200)와, 상기 플레이트(200)의 저면에 접착 결합되는 신축 재질의 흡착러버(300)를 포함하여 된 반도체 칩 픽업 이송용 콜렛에 있어서,
상기 콜렛홀더(100)에는, 대각선상으로 대항되는 모서리부를 상기 플레이트 결합홈(120)이 개방되도록 모따기 절단하여 플레이트 인출부(130)를 형성하고, 플레이트 결합홈(120)의 상부면에 진공 유도공간(121)을 함몰형성하며,
상기플레이트(200)와 흡착러버(300)에는 동일 수직선상에 플레이트 진공홀(211)(211')과 러버 진공홀(311)(311')을 가로 세로 일정 간격으로 관통되게 배열 형성함을 특징으로 하는 반도체 칩 픽업 이송용 콜렛.
A collet holder 100 having a rectangular block shape having a magnetic force provided with a vacuum applying tube 110 provided with a holder vacuum hole 111 penetrating to a lower portion thereof and a plate coupling groove 120 having a rectangular shape formed on a bottom thereof. And a metal plate 200 attached to the plate coupling groove 120 by magnetic coupling and magnetism, and a suction rubber 300 made of a stretchable material adhesively bonded to the bottom surface of the plate 200. In the chip pick-up transport collet,
In the collet holder 100, the edge portion opposed to the diagonally chamfered cut so that the plate coupling groove 120 is opened to form a plate lead-out portion 130, vacuum induction on the upper surface of the plate coupling groove 120 Recess the space 121,
The plate 200 and the suction rubber 300 are arranged to pass through the plate vacuum holes 211 and 211 'and the rubber vacuum holes 311 and 311' on the same vertical line at regular intervals. A collet for semiconductor chip pickup transfer.
삭제delete 제 1항에 있어서,
상기 진공 유도공간(121)은,
상기 콜렛홀더(100)의 플레이트 결합홈(120)의 상부면에 "링" 형상을 이루는 씰링재 결합홈(141)을 형성하고, 상기 씰링재 결합홈(141)에는 신축성 재질의 씰링재(140)가 끼움 및 하부로 돌출되게 구성하되,
상기 씰링재(140)의 돌출부의 사이에 형성되며, 진공 유도공간(121)은, 상기 플레이트 진공홀(211)(211')의 배열된 전체 범위보다 크게 구성함을 특징으로 하는 반도체 칩 픽업 이송용 콜렛.
The method according to claim 1,
The vacuum induction space 121,
A sealing material coupling groove 141 having a “ring” shape is formed on an upper surface of the plate coupling groove 120 of the collet holder 100, and the sealing material 140 of an elastic material is fitted into the sealing material coupling groove 141. And configured to protrude to the bottom,
It is formed between the protrusions of the sealing material 140, the vacuum induction space 121, the semiconductor chip pick-up transfer, characterized in that configured to be larger than the entire range of the arrangement of the plate vacuum holes 211, 211 ' Collet.
제 1항에 있어서,
상기 흡착러버(300)의 흡착부(320)는,
그 저면이 만곡한 곡률을 가지며 하방으로 볼록한 형태를 이루게 구성함을 특징으로 하는 반도체 칩 픽업 이송용 콜렛.
The method according to claim 1,
Adsorption unit 320 of the adsorption rubber 300,
A collet for semiconductor chip pick-up and transfer, characterized in that its bottom surface has a curved curvature and is configured to be convex downward.
삭제delete
KR1020130110227A 2013-09-13 2013-09-13 Pick-up transfer collet for semiconductor chip KR101385443B1 (en)

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