CN103035553A - Conveying arm for wafer manufacturing - Google Patents
Conveying arm for wafer manufacturing Download PDFInfo
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- CN103035553A CN103035553A CN 201110297456 CN201110297456A CN103035553A CN 103035553 A CN103035553 A CN 103035553A CN 201110297456 CN201110297456 CN 201110297456 CN 201110297456 A CN201110297456 A CN 201110297456A CN 103035553 A CN103035553 A CN 103035553A
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- arm
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- wafer
- suction nozzle
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Abstract
The invention provides a conveying arm for wafer manufacturing. The conveying arm comprises a Y-shaped mechanical arm and at least two suction nozzles arranged on the mechanical arm, and each suction nozzle is respectively communicated with an independent vacuum system through a vacuum channel. The conveying arm has the advantages that the suction nozzles on the conveying arm are communicated with the independent vacuum systems respectively so that vacuum loss is not prone to occur when the conveying arm sucks a wafer with large warping degrees, and the problem that the wafer is lost due to unfirm suction is solved.
Description
[technical field]
The present invention relates to integrated circuit (IC) chip manufacturing technology field, relate to particularly and be used for the wafer carrier arm that wafer is made in the chip manufacturing process.
[background technology]
Along with developing rapidly of modern integrated circuits technology, wafer is made towards large scale, the future development that integrated level is high, this type of wafer is in thinning process, because wafer area is larger, and line layer and abradant surface Stress non-homogeneity, silicon wafer warpage degree behind the attenuate is increasing, common arm easily causes loss of vacuum in transport process, even falls sheet, has a strong impact on the utilance of equipment and the quality of product.
Existing transmission arm for the wafer material loading all is the mechanical arm 1 that is designed to Y-shaped structure, transmit the structure chart of arm referring to accompanying drawing 1, be provided with three vacuum slots 2 on the Y shape mechanical arm 1, Y shape mechanical arm 1 inside is provided with three vacuum passages 3 that communicate with vacuum slot 2, each vacuum passage 3 all accesses same vacuum system 4, cut down the switch of control vacuum by a vacuum electromagnetic, reach the effect of adsorbing wafer when each vacuum slot 2 is contacted with wafer.This class transmits arm and is applicable to thicker wafer, vacuum is more stable in whole transport process, but angularity is larger for drawing, during the irregular wafer of warp direction, three suction nozzles are at sustained height, and the wafer rear of warpage is in same level, and three suction nozzles cut down control by same vacuum, are easy to cause loss of vacuum.
[summary of the invention]
The present invention solves the problems of the technologies described above to provide a kind of transmission arm for the wafer manufacturing.
The present invention realizes that the technical scheme that goal of the invention adopts is, a kind of transmission arm for the wafer manufacturing, comprise a Y-shaped mechanical arm and be arranged at least two suction nozzles on the mechanical arm, each described suction nozzle by vacuum passage respectively with one independently vacuum system be communicated with.
Preferably, described suction nozzle is set to three, and described three suction nozzles are communicated with respectively three independently vacuum systems by vacuum passage.
Better, described three suction nozzles are separately positioned on two minutes yokes and intermediate arm of mechanical arm of described Y shape.
Better, the suction nozzle on described minute yoke is arranged on the apical position of described minute yoke.
Better, the suction nozzle on the described intermediate arm is arranged on intermediate arm and the link position that divides yoke.
Better, described suction nozzle is disc-shaped, and the bottom centre of described disc-shaped suction nozzle is provided with the vacuum port that is communicated with described vacuum passage.
Better, the vacuum system that is communicated with suction nozzle on the described intermediate arm is provided with vacuum checking device,
During implementation, described suction nozzle is silastic material; Described mechanical arm adopts ceramic material.
The present invention is communicated with respectively independently vacuum system by the suction nozzle that will transmit on the arm, makes to transmit arm when drawing the larger wafer of warpage, is not easy to occur loss of vacuum, has solved wafer because adsorbing insecure problem of losing.
[description of drawings]
Fig. 1, the existing structure chart that transmits arm.
Fig. 2, the present invention transmit the structure chart of arm.
Fig. 3, the structure cutaway view of suction nozzle.
[embodiment]
The present invention is described in detail below in conjunction with drawings and Examples.
A kind of transmission arm for the wafer manufacturing, referring to accompanying drawing 2, comprise a Y-shaped mechanical arm, be arranged on three suction nozzles 21,22,23 on the mechanical arm, three suction nozzles by vacuum passage 31,32,33 respectively with three independently vacuum system 41,42,43 be communicated with, suction nozzle 21,22,23 all is designed to disc-shaped, and suction nozzle 21,22,23 bottom centre are provided with the vacuum port 51,52,53 that is communicated with vacuum passage 31,32,33; The mechanical arm of Y shape is comprised of two minutes yokes 11 and intermediate arm 12, suction nozzle 21,22 is separately positioned on the apical position of two minutes yokes 11 of mechanical arm, suction nozzle 23 is arranged on intermediate arm 12 and the link position that divides yoke 11, vacuum system 43 is provided with vacuum checking device, in order to detect the vacuum state of suction nozzle 23.For obtaining preferably adsorption effect, suction nozzle all adopts silastic material, and during implementation, mechanical arm adopts ceramic material.The structure cutaway view of suction nozzle is referring to accompanying drawing 3.
The present invention is designed to three independently passages by the vacuum passage 31,32,33 that Y shape is transmitted arm, connect respectively three independent vacuum systems 41,42,43, vacuum system 43 is connected with vacuum checking device simultaneously, vacuum system 41,42 can need not to connect vacuum checking device, suction nozzle is made as disc-shaped, make the suction nozzle surface that the radian that necessarily makes progress be arranged, can increase the absorption contact area, strengthen adsorption effect.
Have following advantage by technical scheme of the present invention:
1, three suction nozzles 21,22,23 have independent vacuum system 41,42,43, and when the back side of absorption wafer, vacuum values can not influenced each other, and when certain suction nozzle falls vacuum, can not have influence on the vacuum values of other two suction nozzles;
2, adopt the larger silicon rubber suction nozzle of surface area, silicon rubber itself is soft, can overcome the factor of silicon wafer warpage, suction nozzle vacuumize be adjacent to wafer rear after, there is larger frictional force between the whole upper surface of suction nozzle and the wafer rear, can overcomes the displacement of wafer in transport process;
3, during implementation, with the absorption position of suction nozzle 23 center near wafer, its adsorption effect is best, is not easy vacuum, simultaneously, detects the vacuum condition of whole transmission arm when drawing wafer with the vacuum values of this point;
4, can't reach same plane owing to transmitting three suction nozzles 21,22,23 of arm with wafer rear, there is to fall the risk of vacuum in the suction nozzles of two surveys, so need not install vacuum checking device additional, avoid the warning of equipment too many, affect utilization rate of equipment and installations.
In the above-described embodiments, only the present invention has been carried out exemplary description, but those skilled in the art are in the situation that can carry out various modifications to the present invention not breaking away from the spirit and scope of the present invention after reading present patent application.
Claims (10)
1. one kind is used for the transmission arm that wafer is made, and comprises a Y-shaped mechanical arm and is arranged at least two suction nozzles on the mechanical arm, it is characterized in that: each described suction nozzle by vacuum passage respectively with one independently vacuum system be communicated with.
2. the transmission arm of making for wafer according to claim 1, it is characterized in that: described suction nozzle is set to three, and described three suction nozzles are communicated with respectively three independently vacuum systems by vacuum passage.
3. the transmission arm of making for wafer according to claim 2 is characterized in that: described three suction nozzles are separately positioned on two minutes yokes and intermediate arm of mechanical arm of described Y shape.
4. the transmission arm of making for wafer according to claim 3 is characterized in that: the suction nozzle on described minute yoke is arranged on the apical position of described minute yoke.
5. the transmission arm of making for wafer according to claim 3 is characterized in that: the suction nozzle on the described intermediate arm is arranged on the link position of intermediate arm and minute yoke.
6. according to claim 1 to 5 each described transmission arms for the wafer manufacturing, it is characterized in that: described suction nozzle is disc-shaped.
7. the transmission arm of making for wafer according to claim 6, it is characterized in that: the bottom centre of described disc-shaped suction nozzle is provided with the vacuum port that is communicated with described vacuum passage.
8. it is characterized in that according to claim 3 or the 5 described transmission arms of making for wafer: the vacuum system that is communicated with suction nozzle on the described intermediate arm is provided with vacuum checking device.
9. the transmission arm of making for wafer according to claim 6, it is characterized in that: described suction nozzle is silastic material.
10. the transmission arm of making for wafer according to claim 6, it is characterized in that: described mechanical arm is ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110297456 CN103035553A (en) | 2011-09-30 | 2011-09-30 | Conveying arm for wafer manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110297456 CN103035553A (en) | 2011-09-30 | 2011-09-30 | Conveying arm for wafer manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103035553A true CN103035553A (en) | 2013-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110297456 Pending CN103035553A (en) | 2011-09-30 | 2011-09-30 | Conveying arm for wafer manufacturing |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465482A (en) * | 2013-09-13 | 2015-03-25 | 株式会社沛可科技 | Pick-up transfer collet for semiconductor chip |
| CN104511907A (en) * | 2013-09-28 | 2015-04-15 | 沈阳新松机器人自动化股份有限公司 | Finger-spacing adjustable mechanical arm and wafer conveying device |
| CN105226000A (en) * | 2015-10-14 | 2016-01-06 | 上海华力微电子有限公司 | A kind of system and method utilizing vacuum cup to fix wafer |
| CN105552016A (en) * | 2015-12-23 | 2016-05-04 | 苏州工业园区纳米产业技术研究院有限公司 | Structure transformation and transformation method for coating machine manipulator suitable for warped wafer |
| CN105575865A (en) * | 2015-12-23 | 2016-05-11 | 苏州工业园区纳米产业技术研究院有限公司 | Structural transformation of deep silicon machine arm for slices after deep silicon etching process and transformation method thereof |
| WO2018177341A1 (en) * | 2017-03-31 | 2018-10-04 | 上海微电子装备（集团）股份有限公司 | Silicon chip holding device, silicon chip conveying device, silicon chip delivery system and conveying method |
| CN110391170A (en) * | 2018-04-16 | 2019-10-29 | 上海新昇半导体科技有限公司 | A kind of method that wafer clamps mechanical arm and its cleaning wafer |
| CN114420623A (en) * | 2022-03-31 | 2022-04-29 | 三河建华高科有限责任公司 | Manipulator structure suitable for warpage wafer is got and is put |
| CN115139217A (en) * | 2022-07-05 | 2022-10-04 | 北京日扬弘创科技有限公司 | Intelligent feeding system suitable for wafer double-side polishing and grinding equipment |
-
2011
- 2011-09-30 CN CN 201110297456 patent/CN103035553A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465482A (en) * | 2013-09-13 | 2015-03-25 | 株式会社沛可科技 | Pick-up transfer collet for semiconductor chip |
| CN104465482B (en) * | 2013-09-13 | 2017-10-24 | 株式会社沛可科技 | Chuck for picking up and transmitting semiconductor chip |
| CN104511907B (en) * | 2013-09-28 | 2017-04-12 | 沈阳新松机器人自动化股份有限公司 | Finger-spacing adjustable mechanical arm and wafer conveying device |
| CN104511907A (en) * | 2013-09-28 | 2015-04-15 | 沈阳新松机器人自动化股份有限公司 | Finger-spacing adjustable mechanical arm and wafer conveying device |
| CN105226000A (en) * | 2015-10-14 | 2016-01-06 | 上海华力微电子有限公司 | A kind of system and method utilizing vacuum cup to fix wafer |
| CN105552016A (en) * | 2015-12-23 | 2016-05-04 | 苏州工业园区纳米产业技术研究院有限公司 | Structure transformation and transformation method for coating machine manipulator suitable for warped wafer |
| CN105575865A (en) * | 2015-12-23 | 2016-05-11 | 苏州工业园区纳米产业技术研究院有限公司 | Structural transformation of deep silicon machine arm for slices after deep silicon etching process and transformation method thereof |
| WO2018177341A1 (en) * | 2017-03-31 | 2018-10-04 | 上海微电子装备（集团）股份有限公司 | Silicon chip holding device, silicon chip conveying device, silicon chip delivery system and conveying method |
| CN108666251A (en) * | 2017-03-31 | 2018-10-16 | 上海微电子装备（集团）股份有限公司 | Silicon chip adsorbent equipment, silicon chip transmission device, silicon chip transmission system and transfer approach |
| JP2020516065A (en) * | 2017-03-31 | 2020-05-28 | シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド | Silicon wafer adsorption device, silicon wafer transfer device, silicon wafer transfer system, and transfer method |
| US11309209B2 (en) | 2017-03-31 | 2022-04-19 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Wafer holder and wafer transfer apparatus, system and method |
| CN110391170A (en) * | 2018-04-16 | 2019-10-29 | 上海新昇半导体科技有限公司 | A kind of method that wafer clamps mechanical arm and its cleaning wafer |
| CN110391170B (en) * | 2018-04-16 | 2021-10-01 | 上海新昇半导体科技有限公司 | Wafer clamping mechanical arm and wafer cleaning method thereof |
| CN114420623A (en) * | 2022-03-31 | 2022-04-29 | 三河建华高科有限责任公司 | Manipulator structure suitable for warpage wafer is got and is put |
| CN115139217A (en) * | 2022-07-05 | 2022-10-04 | 北京日扬弘创科技有限公司 | Intelligent feeding system suitable for wafer double-side polishing and grinding equipment |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN GUANGQI CHUANGZHI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Effective date: 20140620 Free format text: FORMER OWNER: SHENZHEN KUANG-CHI INNOVATION TECHNOLOGY CO., LTD. Effective date: 20140620 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20140620 Address after: 518000 Guangdong, Baoan District, Xixiang, Baoan street, the Internet industry base of the seaside village of, building two, building 18, 2003A Applicant after: Shenzhen Guangqi Powerise Technology Co. Ltd. Address before: 518000 Nanshan District City, Guangdong province high tech Zone in the middle of a high tech building, No. 9 software building Applicant before: Shenzhen Kuang-Chi Institute of Advanced Technology Applicant before: Shenzhen Kuang-Chi Innovation Technology Co., Ltd. |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |