CN106653672A - Wafer transmission apparatus - Google Patents
Wafer transmission apparatus Download PDFInfo
- Publication number
- CN106653672A CN106653672A CN201510731158.0A CN201510731158A CN106653672A CN 106653672 A CN106653672 A CN 106653672A CN 201510731158 A CN201510731158 A CN 201510731158A CN 106653672 A CN106653672 A CN 106653672A
- Authority
- CN
- China
- Prior art keywords
- arm body
- groove
- block
- arm
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The invention belongs to the field of integrated circuit chip manufacture and specifically relates to a wafer transmission apparatus used for wafer manufacture in chip manufacturing processes. The wafer transmission apparatus comprises a block, organic silica gel columns, an arm body, a reflective optical fiber sensor and a sensor pressure plate; the block used for preventing wafers from sliding out during transmission processes is mounted on a front face of the arm body in a movable manner, a plurality of the organic silica gel columns are uniformly arranged on the arm body, the organic silica gel columns are used for preventing the wafers from slipping or deflection during the transmission processes via frictional force, a back face of the arm body is provided with a groove, the reflective optical fiber sensor which is used for monitoring whether the wafers slip or deflect during the transmission processes is arranged in the groove, the reflective optical fiber sensor is fixed via the sensor pressure plate mounted on the back face of the arm body, a front end of the groove penetrates the arm body, and a slit via which laser can be emitted onto back sides of edges of the wafers by the reflective optical fiber sensor is formed. According to the wafer transmission apparatus, the plurality of organic silica gel columns are arranged on the arm body, and the wafers can be effectively prevented from slipping or falling off during the transmission processes via the block.
Description
Technical field
The invention belongs to IC chip manufacture field, specifically a kind of chip manufacturing work
It is used for the wafer transferring devices of chip manufacture in skill.
Background technology
At present, in semiconductor wafer process, need to frequently transmit, carry chip.With
The fast development of integrated circuit technique, chip integrated level is gradually stepped up, and thickness is gradually thinning.
In thickness thinning process, stress distribution is not after the bonding of figure layer and abradant surface for such large-sized wafer
Uniformly, cause it is thinning after chip warpage degree it is increasing.Conventional vacuum absorbent-type arm is being passed
Pass, in carry process, because chip is unable to effective contact behind vacuum hole site and warpage, hold very much
Loss of vacuum is easily caused, or even chip skids off arm, has a strong impact on the work shape of semiconductor equipment
State and production efficiency.
The content of the invention
For existing vacuum adsorption arm in wafer process is carried because being unable to effective contact
Loss of vacuum, even chip is caused to skid off the problem of arm, it is an object of the invention to provide brilliant
Piece transfer device.
The purpose of the present invention is achieved through the following technical solutions：
The present invention include block, organic silica gel post, arm body, reflective optical sensor and
Sensor pressing plate, the front of wherein arm body is movably installed with and prevents chip in transmittance process
The block for skidding off, and be evenly equipped with the arm body it is multiple by frictional force hinder chip exist
There is the organic silica gel post of sliding or deflection in transmittance process；The back side of the arm body is provided with
Groove, is equipped with whether monitoring wafer occurs sliding or deflection in transmittance process in the groove
Reflective optical sensor, the reflective optical sensor is by installed in the arm body back side
Sensor pressing plate fix, the front end of the groove penetrates arm body, is formed and supplies the reflection
Type Fibre Optical Sensor irradiates laser to the gap at the Waffer edge back side.
Wherein：The rear portion through-thickness of the arm body extends, and forms extension, described
Block is arranged on the front of the extension；The half of the groove is opened on the extension,
Second half is opened in the part that arm body does not extend, and the reflective optical sensor holds completely
It is placed in the groove, the gap is located at second half front end of groove；
The block is curved, and bar hole is provided with thereon, is provided with the bar hole and the arm
The bolt of body connection, the block can be with respect to bolt along arm body length side by bar hole
Move back and forth to center line；
The arm body is in Y-shaped, and the end of two diverging arms of the arm body portion sets
There is boss, the boss prevents chip from arm sheet is skidded off in transmittance process jointly with the block
Body；Hand in two diverging arms of the arm body portion and between the block and diverging arms
Uniformly it is provided with multiple hole slots, each hole slot to be nested with arm body and hinders brilliant by frictional force
There is the organic silica gel post of sliding or deflection in transmittance process in piece；The organic silica gel post is with hand
Arm body length direction center line is axial symmetry distribution；
The groove is strip, the center line in the groove length direction and the arm body length
The centerline collineation in direction.
Advantages of the present invention is with good effect：
1. the present invention is provided with multiple organic silica gel posts on arm body, and can by installing
Mobile block effectively prevent chip be there is sliding in transmittance process or even comes off.
2. arm body tail section of the present invention is provided with extension, when chip occur large-size or
Person in a big way sliding when, the extension can play a part of hinder chip skid off；And, should
Extension has deepened the groove depth of groove again, reflective optical sensor is contained in completely in groove
And do not expose.
3. the block of the present invention can move adjustment on arm body, to install and use
It is convenient.
4. arm body front end of the present invention is provided with boss, can with block collective effect, effectively
Prevent chip from skidding off under abnormal condition, have remarkable effect to reducing chip fragment rate.
5. the present invention can be real positioned at the reflective optical sensor of arm section in the middle of arm body
When state of the monitoring wafer on ceramic manual arm body, there is micro sliding or deflection for chip
Effective detection and warning can be provided.
6. the organic silica gel post on arm body of the present invention is nested in arm body in cylinder
In hole slot, and ensure that chip is brought into close contact with organic silica gel post and contact on being distributed.
7. because organic silica gel post quantity is more, after warpage type chip is positioned on arm body,
Even if due to buckling deformation has part silicone glue post could not be with chip effective contact, remaining has
Machine silicagel column can still pass through higher frictional resistance and ensure chip with ceramic manual arm body
Geo-stationary is motionless.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the present invention；
Fig. 2 is the structural front view of the present invention；
Fig. 3 A are the structure top view of the present invention；
Fig. 3 B are the partial enlarged drawing in Fig. 3 A at A；
Fig. 4 A are the structure rearview of the present invention；
Fig. 4 B are the partial enlarged drawing in Fig. 4 A at B；
Wherein：1 is block, and 2 is organic silica gel post, and 3 is arm body, and 4 is reflection type optical
Fiber sensor, 5 is sensor pressing plate, and 6 is boss, and 7 is extension, and 8 is groove, and 9 are
Gap, 10 is bar hole.
Specific embodiment
Below in conjunction with the accompanying drawings the invention will be further described.
As shown in Figure 1, Figure 2, shown in Fig. 3 A, Fig. 3 B and Fig. 4 A, the present invention include block 1,
Organic silica gel post 2, arm body 3, reflective optical sensor 4 and sensor pressing plate 5,
Wherein arm body 3 is in Y-shaped, is divided into two diverging arms, intermediate arm and the rear portion of front portion,
Multiple hole slots are provided with two diverging arms and on intermediate arm, have been nested with each hole slot
Machine silicagel column 2；Each organic silica gel post 2 is with the length direction center line of arm body 3 as axial symmetry
Distribution, and ensures that chip is positioned over after arm body 3, can uniformly effectively with organic silica gel
Post 2 is brought into close contact contact.The organic silica gel post 2 of the present invention is cylinder, by each cylinder
Frictional resistance between organic silica gel post 2 and chip hinders chip to produce in transmission, carry process
Raw sliding or deflection, organic silica gel post material is organic silica gel, the frictional resistance of the material surface
Coefficient is higher, made of soft, and high temperature resistant is corrosion-resistant, can effectively adapt to different operating modes, difference
The transmission of the chip of warpage degree, carrying work.
Block 1 is arranged on the positive afterbody of intermediate arm, is fixed by the screwed hole of arm body 3
On the intermediate arm of arm body 3.Block 1 is curved, and respectively there is a bar shaped at the two ends of arc
The spiral shell being connected with the intermediate arm upper screwed hole of arm body 3 is provided with hole 10, the bar hole 10
Bolt, block 1 can be with respect to bolt along the length direction center line of arm body 3 by bar hole 10
Move back and forth, so as to easy to install, it is to be moved adjust after tighten it is fixed by bolt.
The end of two diverging arms of the front portion of arm body 3 is provided with boss 6, and the boss 6 is total to block 1
It is same to be used to prevent chip sliding or even the arm body 3 that comes off in transmittance process.
The afterbody front through-thickness of arm body 3 extends, and forms extension 7, block 1
Installed in the front of the extension 7.As shown in Figure 4 B, the back side of arm body 3 is provided with recessed
Groove 8, the groove 8 is strip, the center line of the length direction of groove 8 and the length of arm body 3
The centerline collineation in direction.The half of groove 8 is opened on extension 7, and second half is opened in
The middle arm section that arm body 3 does not extend, reflective optical sensor 4 is placed in completely recessed
In groove 8.The back side of arm body 3 is provided with sensor pressing plate 5, to fixation reflex type light
Fiber sensor 4, it is ensured that the stability of real-time monitoring.The front end of groove 8 penetrates arm body 3,
Gap 9 is formed, the gap 9 is located at second half the front end of groove 8.Reflective optical sensor
4 are installed in the back side groove 8 of the middle arm section of arm body 3, by optical fiber and end
Reflection type optical fiber amplifier is connected.Reflective optical sensor 4 is common with reflection type optical fiber amplifier
With using, the laser for being excited by reflection type optical fiber amplifier and being amplified is by fiber optic conduction to reflection
The front end of type Fibre Optical Sensor 4, laser is irradiated to Waffer edge by the gap 9 of the front end of groove 8
The back side, the laser for reflecting detects reception by reflective optical sensor 4 again, for reality
When monitoring wafer transmittance process in whether there is sliding or deflection.
The material of the arm body 3 of the present invention is ceramics.
The present invention operation principle be：
When using present invention transmission, delivery chip, because abnormal condition causes chip to occur
When sliding or deflection situation occur, positioned at the reflection-type optical fiber of the middle arm section of arm body 3
Sensor 4 can real-time monitor the generation of above-mentioned abnormal conditions, and and alarm, with after an action of the bowels
It is continuous to dispose.Meanwhile, it is installed on the block 1 and arm body of the middle arm section of arm body 3
The boss 6 of two diverging arms front ends chip can be prevented to skid off arm body 3, effectively reduce chip
Fragment rate in production process.
(skid off suddenly very big if large-size or large range of sliding occurs in chip
Distance, when being completely out of the scope of boss 6 and block 1), the extension 7 can be with
Play a part of to hinder to skid off.In addition, the front end of reflective optical sensor 4 is thinner, rear end
It is relatively thick, do not expose in order to reflective optical sensor 4 can be all contained in groove 8
Come, the design of extension 7 increased the groove depth of the half of groove 8；Can so reflection type optical be made
The thicker rear end of fiber sensor 4 is contained in completely in groove 8.
The present invention can solve existing vacuum adsorption arm and can not transmit to have with relatively reasonable
The problems such as chip of larger amount of warpage deformation, the transmission of vacuum adsorption arm, delivery can be avoided brilliant
During piece frequently vacuum abnormal alarm the problems such as.
Claims (7)
1. a kind of wafer transferring devices, it is characterised in that：Including block (1), organic silica gel
Post (2), arm body (3), reflective optical sensor (4) and sensor pressing plate (5),
The front of wherein arm body (3) is movably installed with and prevents what chip from skidding off in transmittance process
Block (1), and be evenly equipped with the arm body (3) multiple brilliant by frictional force obstruction
There is the organic silica gel post (2) of sliding or deflection in transmittance process in piece；The arm body (3)
The back side be provided with groove (8), be equipped with monitoring wafer in the groove (8) in transmittance process
Whether the reflective optical sensor (4) of sliding or deflection, the reflection-type optical fiber sensing there is
Device (4) is fixed by the sensor pressing plate (5) installed in arm body (3) back side, institute
The front end for stating groove (8) penetrates arm body (3), is formed for reflection-type optical fiber sensing
Device (4) irradiates laser to the gap (9) at the Waffer edge back side.
2. wafer transferring devices as described in claim 1, it is characterised in that：The arm
The rear portion through-thickness of body (3) extends, and forms extension (7), the block (1)
Installed in the front of the extension (7)；The half of the groove (8) is opened in the extension
In portion (7), second half is opened in the part that arm body (3) does not extend, the reflection-type
Fibre Optical Sensor (4) is placed in completely in the groove (8), and the gap (9) is positioned at recessed
Groove (8) second half front end.
3. wafer transferring devices as described in claim 1 or 2, it is characterised in that：It is described
Block (1) is curved, and bar hole (10) is provided with thereon, be provided with the bar hole (10) with
The bolt of arm body (3) connection, the block (1) can by bar hole (10)
Move back and forth along arm body (3) length direction center line with respect to bolt.
4. wafer transferring devices as described in claim 1 or 2, it is characterised in that：It is described
Arm body (3) is in Y-shaped, the end of two anterior diverging arms of the arm body (3)
Boss (6) is provided with, the boss (6) prevents chip from transmitting jointly with the block (1)
Arm body (3) is skidded off in journey.
5. wafer transferring devices as described in claim 4, it is characterised in that：The arm
In two anterior diverging arms of body (3) and arm of the block (1) and diverging arms between
Body is uniformly provided with multiple hole slots on (3), is nested with each hole slot by the mechanical resistance that rubs
Hinder chip that the organic silica gel post (2) of sliding or deflection occurs in transmittance process.
6. wafer transferring devices as described in claim 5, it is characterised in that：It is described organic
Silicagel column (2) is distributed by axial symmetry of arm body (3) length direction center line.
7. wafer transferring devices as described in claim 1 or 2, it is characterised in that：It is described
Groove (8) is strip, the center line of groove (8) length direction and the arm body (3)
The centerline collineation of length direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731158.0A CN106653672A (en) | 2015-11-02 | 2015-11-02 | Wafer transmission apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731158.0A CN106653672A (en) | 2015-11-02 | 2015-11-02 | Wafer transmission apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106653672A true CN106653672A (en) | 2017-05-10 |
Family
ID=58809943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510731158.0A Pending CN106653672A (en) | 2015-11-02 | 2015-11-02 | Wafer transmission apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106653672A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065478A (en) * | 2018-07-27 | 2018-12-21 | 上海华力集成电路制造有限公司 | Chip arrangement for detecting and method |
| CN112109095A (en) * | 2020-09-21 | 2020-12-22 | 芯导精密(北京)设备有限公司 | Novel mechanical arm |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070000280A (en) * | 2005-06-27 | 2007-01-02 | 삼성전자주식회사 | Wafer transfer apparatus of semiconductor manufacturing equipment |
| CN101779282A (en) * | 2007-06-29 | 2010-07-14 | 株式会社爱发科 | Substrate transfer robot and vacuum processing apparatus provided with the same |
| CN103227129A (en) * | 2012-01-26 | 2013-07-31 | 株式会社安川电机 | Robot hand and robot |
| US20150217456A1 (en) * | 2014-02-04 | 2015-08-06 | Asm Ip Holding B.V. | Anti-slip end-effector for transporting workpiece |
-
2015
- 2015-11-02 CN CN201510731158.0A patent/CN106653672A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070000280A (en) * | 2005-06-27 | 2007-01-02 | 삼성전자주식회사 | Wafer transfer apparatus of semiconductor manufacturing equipment |
| CN101779282A (en) * | 2007-06-29 | 2010-07-14 | 株式会社爱发科 | Substrate transfer robot and vacuum processing apparatus provided with the same |
| CN103227129A (en) * | 2012-01-26 | 2013-07-31 | 株式会社安川电机 | Robot hand and robot |
| US20150217456A1 (en) * | 2014-02-04 | 2015-08-06 | Asm Ip Holding B.V. | Anti-slip end-effector for transporting workpiece |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065478A (en) * | 2018-07-27 | 2018-12-21 | 上海华力集成电路制造有限公司 | Chip arrangement for detecting and method |
| CN109065478B (en) * | 2018-07-27 | 2021-06-15 | 上海华力集成电路制造有限公司 | Chip detection device and method |
| CN112109095A (en) * | 2020-09-21 | 2020-12-22 | 芯导精密(北京)设备有限公司 | Novel mechanical arm |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |