KR102430326B1 - Die bonding apparatus, detaching unit, collet, and manufacturing method of semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a technique capable of improving the rigidity of the die.
A die bonding apparatus includes: a collet for adsorbing a die on a dicing tape; a movable stage in contact with a portion of the dicing tape positioned below the die; and a portion of the dicing tape positioned outside the die and a peeling unit for peeling the die from the dicing tape. The movable stage has a concave portion for curved upwardly concave the die. The lower surface of the collet has a curved surface that fits with the upper surface of the curved die.

Description

DIE BONDING APPARATUS, DETACHING UNIT, COLLET, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonder handling thin dies.

Generally, in a die bonder in which a semiconductor chip called a die is mounted on the surface of a wiring board or a lead frame (hereinafter, generically referred to as a substrate), for example, a die using a suction nozzle such as a collet is used. The operation (work) of bonding is performed by conveying the substrate onto the substrate, applying a pressing force, and heating the bonding material.

Among the die bonding steps by a die bonding apparatus such as a die bonder, there is a peeling step of peeling a divided die from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling step, the die is pushed up from the back surface of the dicing tape with a push pin or block, and from the dicing tape held by the die supply unit, it is peeled one by one, and conveyed onto the substrate using a suction nozzle such as a collet. .

In recent years, for the purpose of promoting high-density packaging of semiconductor devices, thickness reduction of packages is progressing. For example, a laminate package in which a plurality of dies are three-dimensionally mounted on a wiring board has been put to practical use. When assembling such a laminated package, in order to prevent an increase in the package thickness, it is required to make the thickness of the die as thin as 30 µm or less.

Japanese Patent Laid-Open No. 2018-120938

When the die becomes thinner, the rigidity of the die becomes very low compared to the adhesive force of the dicing tape.

An object of the present disclosure is to provide a technique capable of improving the rigidity of a die.

Other problems and novel features will become apparent from the description of the present specification and the accompanying drawings.

A brief outline of representative ones of the present disclosure is as follows.

That is, the die bonding apparatus includes a collet for adsorbing a die on a dicing tape, a movable stage in contact with a location located below the die among the dicing tape, and a location outside the dicing tape outside the die and a fixing stage for adsorbing the die, and a peeling unit for peeling the die from the dicing tape. The movable stage has a concave portion for curved upwardly concave the die. The lower surface of the collet has a curved surface that fits with the upper surface of the curved die.

According to the present disclosure, it is possible to improve the rigidity of the die.

BRIEF DESCRIPTION OF THE DRAWINGS It is the conceptual diagram which looked at the die bonder which concerns on Example from above.
Fig. 2 is a view for explaining the operation of the pickup head and bonding head of Fig. 1;
Fig. 3 is a view showing an external perspective view of the die supply unit of Fig. 1;
Fig. 4 is a schematic cross-sectional view showing a main part of the die supply section of Fig. 1;
Fig. 5 is a view for explaining the peeling unit of Fig. 4;
Fig. 6 is a view for explaining the configuration and operation of the peeling unit of Fig. 4;
Fig. 7 is a view for explaining the collet of Fig. 2;
Fig. 8 is a flowchart for explaining a method of manufacturing a semiconductor device by the die bonder of Fig. 1;
It is a top view of the peeling unit in a 1st modified example.
Fig. 10 is a view for explaining the configuration and operation of the peeling unit of Fig. 9;
Fig. 11 is a view for explaining the configuration and operation of the peeling unit of Fig. 9;
Fig. 12 is a view for explaining the collet of Fig. 11;

EMBODIMENT OF THE INVENTION Hereinafter, an Example and a modification are demonstrated using drawings. However, in the following description, the same code|symbol is attached|subjected to the same component, and repeated description may be abbreviate|omitted. In addition, in order to make the description clearer, the drawings may be schematically expressed about the width, thickness, shape, etc. of each part compared to the actual aspect, but this is only an example and does not limit the interpretation of the present invention .

[Example]

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the outline of the die bonder which concerns on an Example. It is a figure explaining the operation|movement of a pickup head and a bonding head, when it sees from the arrow A direction in FIG.

The die bonder 10, which is an example of a die bonding apparatus, is broadly divided, and a die D for mounting a product area (hereinafter referred to as a package area P) that becomes one or a plurality of final packages on a printed board S is supplied. A supply unit (1), a pickup unit (2), an intermediate stage unit (3), a bonding unit (4), a transport unit (5), a substrate supply unit (6), a substrate transport unit (7), and each unit It has a control unit 8 that monitors and controls the operation. The Y-axis direction is the front-back direction of the die bonder 10, and the X-axis direction is the left-right direction. The die feed portion 1 is disposed on the front side of the die bonder 10 , and the bonding portion 4 is disposed on the rear side.

First, the die supply unit 1 supplies the die D to be mounted in the package area P of the substrate S. The die supply unit 1 includes a wafer holder 12 for holding the wafer 11 , and a peeling unit 13 indicated by a dotted line for pushing up the die D from the wafer 11 . The die supply unit 1 moves in the XY-axis direction by a driving means (not shown) to move the pick-up die D to the position of the peeling unit 13 .

The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y-axis direction, and lifts, rotates, and rotates the collet 22 and It has each drive part (not shown) which moves in the X-axis direction. The pickup head 21 has a collet 22 (see also FIG. 2 ) for adsorbing and holding the pushed up die D at its tip, and picks up the die D from the die supply unit 1 , and is placed on the intermediate stage 31 . load up The pick-up head 21 has each drive part (not shown) which moves the collet 22 in raising/lowering, rotation, and an X-axis direction.

The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily mounted, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31 .

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it on the package area P of the substrate S being conveyed, or laminates it on the die already bonded on the package area P of the substrate S. bonding in the form The bonding part 4 is a bonding head 41 provided with the collet 42 (refer FIG. 3 also) which adsorb|sucks and holds the die D at the front-end|tip similarly to the pick-up head 21, and the bonding head 41 Y. It has the Y drive part 43 which moves in an axial direction, and the board|substrate recognition camera 44 which images the position recognition mark (not shown) of the package area P of the board|substrate S, and recognizes a bonding position. With such a structure, the bonding head 41 correct|amends a pick-up position and attitude|position based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the board|substrate recognition camera 44 ), the die D is bonded to the substrate based on the imaging data.

The conveyance part 5 has the board|substrate conveyance claw 51 which hold|grips and conveys the board|substrate S, and the conveyance lane 52 through which the board|substrate S moves. The board|substrate S moves by driving the nut (not shown) of the board|substrate conveyance claw 51 provided in the conveyance lane 52 with the ball screw (not shown) provided along the conveyance lane 52. As shown in FIG. The substrate transport claw 51 may be driven by a belt. With such a structure, the board|substrate S moves from the board|substrate supply part 6 along the conveyance lane 52 to a bonding position, and after bonding, it moves to the board|substrate carrying-out part 7, and the board|substrate S is transferred to the board|substrate carrying-out part 7. hand over S.

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each of the above-described units of the die bonder 10, and a central processing unit (CPU) for executing the program stored in the memory.

Next, the structure of the die supply part 1 is demonstrated using FIG. 3, FIG. 3 is a view showing an external perspective view of the die supply unit of FIG. 1 . Fig. 4 is a schematic cross-sectional view showing a main part of the die supply section of Fig. 1;

The die supply unit 1 includes a wafer holder 12 moving in the horizontal direction (XY axis direction), and a peeling unit 13 moving in the vertical direction. The wafer holder 12 horizontally holds the expand ring 15 for holding the wafer ring 14 and the dicing tape 16 held by the wafer ring 14 and to which a plurality of dies D are adhered. It has a support ring 17 for positioning. The peeling unit 13 is disposed inside the support ring 17 .

The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is peeled off. As a result, the dicing tape 16 held by the wafer ring 14 is stretched, the distance between the die D is enlarged, and the peeling unit 13 acts on the die D from below the die D, so that the Pick-up is improved. In addition, the adhesive for adhering the die to the substrate is in the form of a film from a liquid, and a film-like adhesion called a Die Attach Film (DAF) 18 between the wafer 11 and the dicing tape 16 . The material is pasted. In the wafer 11 having the die attach film 18 , dicing is performed on the wafer 11 and the die attach film 18 . Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16 . In addition, although the die attach film 18 is affixed on the back surface of the die D, the peeling process may be demonstrated by abbreviate|omitting the die D.

Next, the collet 22 provided in the peeling unit 13 and the pick-up head 21 is demonstrated using FIGS. 5-7. Fig. 5 is a view for explaining the peeling unit of Fig. 4 , Fig. 5 (a) is a top view, and Fig. 5 (b) is a cross-sectional view of the movable stage along the line B-B in Fig. 5 (a). Fig. 6 is a view for explaining the configuration and operation of the peeling unit of Fig. 4, and Fig. 6 (a) is a cross-sectional view of the main part, the dicing tape, the die and the collet along the line B-B of Fig. 5 (a), Fig. 6(b) is a cross-sectional view of a main part, a dicing tape, a die and a collet taken along the line C-C in Fig. 5(a), and Fig. 6(c) is a movable stage moving from Fig. 6(a). It is a cross-sectional view of the main part in one state, the dicing tape, the die and the collet. FIG. 7 is a view for explaining the collet of FIG. 2 , FIG. 7 (a) is a B-direction side view of the collet and collet holder, and FIG. 7 (b) is a C-direction side view of the collet and collet holder.

The housing 131 of the peeling unit 13 has a cylindrical shape, and includes a groove portion 132a as an opening located in the center of the upper surface, a fixed stage 132 around it, and a movable stage 133 in the groove portion 132a. . The planar shape of the groove part 132a is comprised in the rectangle whose X-axis direction is longer than the Y-axis direction. The movable stage 133 is formed in a rectangular shape having a planar shape smaller than the groove portion 132a and having an X-axis direction longer than a Y-axis direction. The movable stage 133 is movable in the vertical direction (Z-axis direction) and the X-axis direction as the first horizontal direction.

A plurality of suction ports (not shown) are provided on the fixed stage 132 provided in the peripheral portion of the upper surface of the peeling unit 13 . Moreover, you may provide the some groove|channel which connects the said some suction port. Each inside of the said suction port and the said groove|channel is pressure-reduced by the suction mechanism (not shown) when raising the peeling unit 13 and making the upper surface contact the back surface of the dicing tape 16. As shown in FIG. At this time, the back surface of the dicing tape 16 is attracted|sucked downward, and is closely_contact|adhered to the upper surface of the peeling unit 13. As shown in FIG. The fixed stage 132 closely adheres the dicing tape 16 around the outer periphery of the die D to be picked up. In addition, the suction mechanism of the suction port 141 below the movable stage 133 and the suction mechanism of the fixed stage 132 are independent, and ON/OFF of suction may be possible individually. The peeling unit 13 includes a slider driving mechanism (not shown) that slides the movable stage 133 on the basis of a command from the control unit 8 .

Next, the detail of the peeling unit 13 and the movable stage 133 is demonstrated. On the upper surface of the housing 131 of the peeling unit 13, a fixed stage 132, a groove 132a recessed from the fixed stage 132 toward the inside of the housing 131 of the peeling unit 13, and a groove It is provided on the outer peripheral side of the peeling unit 13 of 132a, and is provided with the convex part 132b which protruded from the bottom surface of the groove part 132a. The side surface 132f of the groove part 132a extends linearly from the inner peripheral side toward the outer peripheral side of the peeling unit 13 in the same plane as the guide surfaces 132g on both sides of the convex part 132b. The convex portion 132b is a step between the guide surfaces 132g and has a flat surface, and the height thereof is smaller than the depth of the groove portion 132a. The bottom surface of the groove part 132a and the surface of the convex part 132b are connected by the inclined surface 132c extended toward the surface of the convex part 132b from the bottom surface of the convex part 132b. A suction port 141 as a hole communicating with the inside of the peeling unit 13 is provided on the bottom surface of the groove portion 132a.

The groove part 132a is provided with the movable stage 133 which has substantially the same width as the width between the faces of the groove part 132a and the side surface 132f, and slides along the direction of the groove part 132a from the groove part 132a. As for the movable stage 133, the side which faces the end surface 132e of the groove part 132a along the slide direction (X-axis direction) is the rear end 133a, and the edge part by the side of the convex part 132b is the front-end|tip 133c. The movable stage 133 has a concave surface and includes a mounting portion 133h on which the die D is mounted via a dicing tape 16, and a mounting portion 133h followed by an inclined portion 133g inclined downward from the mounting surface. are being prepared Since the length in the slide direction of the movable stage 133 is shorter than the length in the slide direction of the groove portion 132a, and the thickness of the mounting portion 133h of the movable stage 133 is greater than the depth of the groove portion 132a, the movable stage 133 ), the rear end 133a of the groove portion 132a has a gap with the end surface 132e of the groove portion 132a, and when the movable stage 133 is fitted into the groove portion 132a, the mounting portion 133h of the surface of the movable stage 133 is the fixed stage ( 132) higher than the upper surface. The side surface 133b of the movable stage 133 and the side surface 132f of the groove part 132a constitute a slide surface. Further, a gap formed by the rear end 133a of the movable stage 133 and the end surface 132e of the groove portion 132a extends vertically toward the inner surface of the peeling unit 13 to suck the dicing tape 16 . to form a vertical groove. In addition, the gap formed by the side surfaces 133b on both sides of the movable stage 133 and the side surfaces 132f on both sides of the groove portion 132a extends vertically toward the inner surface of the peeling unit 13 in the dicing tape 16 . ) to form a vertical groove that sucks in.

Since it is comprised as mentioned above, on the upper surface of the peeling unit 13, the inverted-C-shaped suction opening 140 surrounded by the side surface 132f of the groove part 132a, the end surface 132e, and the guide surface 132g. is formed, and communicates with the inside of the peeling unit 13 through the suction port 141 .

As shown in FIG. 5B , the mounting portion 133h on which the die D is mounted via the dicing tape 16 of the movable stage 133 has a thickness from a position near the rear end 133a to the tip ( It becomes thinner as it goes to the 133c side, and the rear end 133a is provided with the chamfer 133i. Further, there is provided an inclined portion 133g that inclines from the front surface (upper surface) side toward the rear surface (lower surface) side from the mounting portion 133h toward the tip 133c. The portion of the mounting portion 133h that is inclined downward from the rear end 133a side to the front end 133c side is more inclined than the inclined portion 133g. It is provided in an area not to be formed, and the length of the mounting portion 133h is shorter than the length of the die D. The back side of the movable stage 133 is flat. As shown in Fig. 6(b), when viewed in a cross-section from the X-axis direction (YZ plane orthogonal to the X-axis direction), the upper side of a rectangle whose Y-axis direction is longer than the Z-axis direction is formed as a curved downward concave curve, have. That is, the surface of the mounting portion 133h forms a curved surface concave upwards like the inner surface (R-shaped surface) of the circular tube. Thereby, the die D is curved. In addition, the bending by the die D by this bending is made into the same degree as the die|dye curved on the dicing tape 16 in the state before the peeling unit 13 and contact. For example, the height from the bottom of the valley of the curved die D to the end of the die D is greater than 0 μm and less than or equal to 20 μm.

In addition, the width of the groove portion 132a, that is, the width of the suction opening 140 is slightly larger than the width of the movable stage 133, the width of the movable stage 133 and the width of the die D are respectively approximately equal, and the groove portion 132a ) and each side surface 133b of the movable stage 133 face each other with a gap so as to slide.

As shown in FIG. 7 , the collet 22 is installed in a collet holder 25 provided in the pickup head 21 . As shown in FIGS. 6A and 7A , the collet 22 has an X-axis direction (slide direction) in the Z-axis direction when viewed from the side and cross-section from the Y-axis direction as the second direction. It is a rectangle longer than (in the vertical direction), and as shown in FIGS. 6(b) and 7(b), when viewed from the side and cross-section from the X-axis direction (in the YZ plane orthogonal to the X-axis direction) When viewed in cross-section), the lower side of a rectangle whose Y-axis direction is longer than the Z-axis direction is formed as a curved downward convex curve. That is, the adsorption|suction surface 22a which adsorb|sucks the die D of the collet 22 forms the same convex curved surface as the outer surface (R-shaped surface) of a circumference|surroundings. That is, the suction surface 22a of the collet 22 is formed in a convex curved surface to fit with the concave curved surface of the mounting portion 133h of the movable stage 133 with the die D and the dicing tape 16 interposed therebetween. . Thereby, the curvature of the die D is maintained.

Next, the pick-up operation|movement by the peeling unit 13 by the structure mentioned above is demonstrated using FIG. 3, FIG. 4, FIG.

First, ultraviolet rays are irradiated to the dicing tape 16 positioned on the wafer holder 12 shown in FIGS. 3 and 4 . Thereby, since the adhesive applied to the dicing tape 16 hardens and the adhesiveness falls, the interface of the dicing tape 16 and the die attach film 18 peels easily.

Next, the control unit 8 lowers the expand ring 15 of the wafer holder 12 to push down the wafer ring 14 adhered to the periphery of the dicing tape 16 downward. In this way, the dicing tape 16 is stretched in the horizontal direction without loosening by receiving a strong tension from the central portion toward the peripheral portion.

Next, as shown in Fig. 4, the control unit 8 horizontally moves (pitch shift) the wafer holder 12 so that the pick-up object die D is positioned directly above the peeling unit 13, and the dicing tape ( 16), the peeling unit 13 is moved upward so that the upper surface of the peeling unit 13 is in contact with the rear surface. At this time, as shown in FIG. 6A , the rear end 133a of the movable stage 133 is positioned to face the end surface 132e of the groove portion 132a with a gap, and the movable stage 133 ), the lower surface on the tip 133c side is mounted on the surface of the groove portion 132a, and is supported by the groove portion 132a. 6A and 6B , the mounting portion 133h of the front surface of the movable stage 133 is higher than the upper surface of the fixed stage 132 .

When the upper surfaces of the fixed stage 132 of the peeling unit 13 and the mounting portion 133h of the movable stage 133 are in close contact with the lower surface of the dicing tape 16 , the control unit 8 controls the lifting of the peeling unit 13 . stop At this time, the control part 8 adsorb|sucks the dicing tape 16 by the suction port and groove|channel of the fixed stage 132, and the clearance gap between the fixed stage 132 and the movable stage 133. At this time, as shown in FIG. 6B , the die D and the dicing tape 16 are curved in a shape along the concave curved surface of the upper surface of the mounting portion 133h of the movable stage 133 .

The control unit 8 lowers the pickup head 21 (collet 22), positions it on the pick-up die D, lands the collet 22, and a suction hole of the collet 22 (not shown) Die D is adsorbed by At this time, the convex curved surface of the lower surface of the collet 22 is fitted with the concave curved surface of the upper surface of the mounting portion 133h of the movable stage 133 via the die D and the dicing tape 16, so that the curved surface of the die D is maintained.

The control part 8 stops adsorption|suction of the dicing tape 16 by the fixed stage 132 and the suction port 141 (adsorption OFF), and slides the movable stage 133. In addition, as adsorption OFF, you may adsorb|suck lightly at the pressure close to atmospheric pressure.

When the movable stage 133 starts to slide toward the outer periphery of the peeling unit 13, the rear surface of the movable stage 133 is in contact with the inclined surface 132c connecting the convex portion 132b and the bottom surface of the groove portion 132a. . And when the movable stage 133 slides further, the back surface of the movable stage 133 rises along the inclined surface 132c. And when the movable stage 133 slides further, the front-end|tip 133c of the movable stage 133 exceeds the inclined surface 132c, and the back surface of the movable stage 133 comes into contact with the surface of the convex part 132b. Thereafter, the control unit 8 starts adsorption at a pressure close to vacuum by the fixed stage 132 and the suction port 141 (adsorption ON). Since the lower surface of the movable stage 133 is supported by the surface of the convex portion 131b shown in FIG. 6C , the lower surface of the movable stage 133 is spaced apart from the bottom surface of the groove portion 132a. Before this, the movable stage 133 slides in a state in which the back surface of the movable stage 133 is substantially parallel to the surface of the groove portion 132a. As a result, as shown in FIG. 6C , a part of the die D positioned above the suction port 141 is peeled off from the surface 16a of the dicing tape 16 .

When the movable stage 133 is slid, the die D is mostly peeled off from the dicing tape 16, so the control unit 8 raises the collet 22 to pick up the die D. When the die D is picked up, the control unit 8 returns the movable stage 133 to the initial position, returns the pressure of the suction port 141 and the suction pressure of the fixed stage 132 to atmospheric pressure, and ends the pickup operation.

Next, the manufacturing method of the semiconductor device using the die bonder in an Example is demonstrated using FIG. FIG. 8 is a flowchart illustrating a method of manufacturing a semiconductor device using the die bonder of FIG. 1 .

(Step S11: wafer/substrate loading process)

The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is affixed is stored in a wafer cassette (not shown), and loaded into the die bonder 10 . The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1 . Moreover, the board|substrate S is prepared, and it carries in the die bonder 10. The control part 8 attaches the board|substrate S to the board|substrate conveyance claw 51 in the board|substrate supply part 6 .

(Step S12: Pickup process)

The control unit 8 peels the die D as described above, and picks up the peeled die D from the wafer 11 . In this way, the die D peeled from the dicing tape 16 together with the die attach film 18 is adsorbed and held by the collet 22, and is conveyed to the next process (step S13). And when the collet 22 which conveyed the die D to the next process returns to the die supply part 1, according to the above-mentioned procedure, the next die D is peeled from the dicing tape 16, and thereafter, according to the same procedure Die D is peeled from the dicing tape 16 one by one.

(Step S13: bonding process)

The control unit 8 stacks the picked-up die on the die mounted on the substrate S or already bonded. The control unit 8 loads the die D picked up from the wafer 11 on the intermediate stage 31 , and picks up the die D again from the intermediate stage 31 with the bonding head 41 , and bonds to the transferred substrate S. do.

(Step S14: Substrate unloading process)

The control part 8 takes out the board|substrate S to which the die|dye D was bonded from the board|substrate carrying claw 51 in the board|substrate carrying-out part 7. As shown in FIG. The substrate S is taken out from the die bonder 10 .

As described above, the die D is mounted on the substrate S through the die attach film 18 and is carried out from the die bonder. Then, in the wire bonding process, it is electrically connected to the electrode of the substrate S through the Au wire. Subsequently, the substrate S on which the die D is mounted is loaded into the die bonder, the second die D is laminated on the die D mounted on the substrate S through the die attach film 18, and after being unloaded from the die bonder, In the wire bonding process, it is electrically connected to the electrode of the substrate S through the Au wire. After the second die D is peeled off from the dicing tape 16 by the method described above, it is conveyed to a die bonding process and laminated on the die D. After the above process is repeated a predetermined number of times, the substrate S is transferred to the mold process, and a plurality of dies D and Au wires are sealed with a mold resin (not shown), thereby completing a laminate package.

According to the embodiment, since the die is curved by providing an R (concave) shape on the sliding movable stage, the cross-sectional secondary moment of the die can be improved, the rigidity is improved, and it becomes possible to cope with the stress accompanying peeling. . As an easy analogy, if thin paper, for example, A4 size copy paper is leveled and the end of the thin paper is held with your finger, the end opposite to the gripped end will droop downward due to the weight of the thin paper. . On the other hand, if the thin paper is curved (deformed) so that the top is concave, and the end is gripped with a finger, the end opposite to the gripped end does not droop downward, and the thin paper maintains its shape.

As described above, when assembling a laminate package in which a plurality of dies are three-dimensionally mounted on a substrate, in order to prevent an increase in the package thickness, it is required to reduce the thickness of the dies to 30 µm or less. In addition, the thickness of the die is thicker than the thickness of the die attach film. On the other hand, since the thickness of a dicing tape is about 100 micrometers, the thickness of a dicing tape is 3 to 5 times the thickness of a die|dye.

If such a thin die is to be peeled from the dicing tape, the deformation of the die following the deformation of the dicing tape is more likely to occur more remarkably. deformation can be reduced. Thereby, it becomes possible to stabilize peeling from a dicing tape in the die|dye (referred to as a thin die) with a thickness of 30 micrometers or less. Thereby, it becomes possible to improve the quality and productivity of a thin die including 3D NAND (a NAND-type flash memory with a three-dimensional structure).

<Modified example>

Hereinafter, some representative modifications of the embodiment are exemplified. In the following description of the modified example, it is assumed that the same reference numerals as in the above-described embodiment can be used for parts having the same configuration and function as those described in the above-described embodiment. In addition, about the description of such a part, it shall be assumed that the description in the above-mentioned embodiment can be suitably used within the range which does not contradict technically. In addition, all or part of a part of the above-described embodiment and a plurality of modified examples may be appropriately or compositely applied within a technically inconsistent range.

(1st modification)

Next, the structure of the peeling unit of a 1st modification is demonstrated using FIGS. 9-11. It is a top view of the peeling unit in a 1st modification. Fig. 10 is a view for explaining the configuration and operation of the peeling unit of Fig. 9, Fig. 10 (a) is a cross-sectional view of the peeling unit along the line E-E in Fig. 9, Fig. 10 (b) is Fig. 9 F-F It is sectional drawing of the peeling unit in a line. Fig. 11 is a view for explaining the configuration and operation of the peeling unit of Fig. 9, Fig. 11 (a) is a cross-sectional view of the peeling unit and collet along the line E-E of Fig. 9, (b) is Fig. 9 It is sectional drawing of the peeling unit and collet in F-F line.

As shown in FIG. 9 , the housing 131 of the peeling unit 13 has a cylindrical shape, an opening 132o located in the center of the upper surface, a fixed stage 132 around it, and a movable stage in the opening 132o. (133) is provided. The opening 132o is provided with a movable stage 133 that moves up and down, and the fixed stage 132 is provided with a plurality of suction ports (not shown) and a plurality of grooves (not shown). The inside of each of the suction port and the groove is decompressed by a suction mechanism (not shown) when the peeling unit 13 is raised and the upper surface thereof is brought into contact with the back surface of the dicing tape 16 , and the dicing tape 16 . The back surface of the is adapted to be in close contact with the upper surface of the fixed stage 132 .

The movable stage 133 is composed of four blocks 102a to 102d that push the dicing tape 16 upward. In the four blocks 102a to 102d, the annular block 102b is arranged inside the outermost annular block 102a, and the annular block 102c is arranged inside it, and further inside the annular block 102c. A columnar block 102d is arranged.

A gap G is provided between the fixed stage 132 and the outer block 102a and between the four blocks 102a to 102d. The inside of these gaps G is pressure-reduced by a suction mechanism (not shown), and when the back surface of the dicing tape 16 comes into contact with the upper surface of the peeling unit 13, the dicing tape 16 is sucked downward. , in close contact with the upper surface of the blocks 102a to 102d.

The planar shape of the block 102a is rectangular like the die D to be peeled, and the size is slightly smaller than the size of the die D. The size of the frame-like block 102b arranged inside the block 102a is about 1 mm to 3 mm smaller than the size of the block 102a in plan view. In addition, the size of the block 102c arranged inside the block 102b is smaller than the block 102b by about 1 mm to 3 mm. In addition, the size of the block 102d arranged inside the block 102c is smaller than the block 102c by about 1 mm to 3 mm. In addition, the width of the block 102d is larger than the width (the length between the outer side and the inner side) of any of the blocks 102a to 102c. In the present embodiment, in consideration of easiness of processing, etc., the shapes of the blocks 102a to 102d are rectangular. However, the present embodiment is not limited thereto, and may be, for example, an elliptical shape.

As shown in Fig. 10, the heights of the respective upper surfaces of the four blocks 102a to 102d are different from each other in the initial state, and the push-up amount of the block 102a is larger than the push-up amount of the block 102b. , the pushing amount of the block 102b is larger than the pushing amount of the block 102c, the pushing amount of the block 102c is larger than the pushing amount of the block 102d, the inner block is about 0 to 20 μm than the outer side is set low That is, the heights of the blocks 102a to 102d are set so that the die D and the dicing tape adsorbed on the surface of the movable stage 133 form a curved upward concave surface such as a spherical surface (SR-shaped surface). Thereby, the die D is curved. In addition, the bending by the die D by this bending is made into the same degree as the die|dye curved on the dicing tape 16 in the state before the peeling unit 13 and contact. In addition, the block 102a is slightly lower than the height of the upper surface peripheral part (fixed stage 132) of the peeling unit 13. As shown in FIG.

Each of the blocks 102a to 102d can move up and down independently, and the amount of movement can also be changed by the control unit 8 .

Fig. 12 is a view for explaining the collet of Fig. 11, Fig. 12 (a) is a side view of the collet and the collet holder in the E direction, and Fig. 12 (b) is a side view of the collet and the collet holder in the F direction.

As shown in FIG. 12 , the collet 22 is installed in a collet holder 25 provided in the pickup head 21 . As shown in FIG. 12( a ), the collet 22 has a longer X-axis direction than the Z-axis direction (up-down direction) when viewed from the side and cross-section from the Y-axis direction (as viewed from the cross-section on the XZ plane). The lower side of the rectangle is formed as a convex curve downward, and as shown in Fig. 12(b), when viewed from the side and cross-section from the X-axis direction (a surface that intersects the X-axis direction, for example, a YZ plane orthogonal to The lower side of a rectangle whose Y-axis direction is longer than the Z-axis direction is formed as a curved line convex downward. That is, the adsorption|suction surface 22a which adsorb|sucks the die|dye D of the collet 22 forms the spherical surface (SR-shaped surface). That is, the suction surface 22a of the collet 22 is formed in a convex curved surface to fit with the concave curved surface of the dicing tape 16 and the die D formed on the blocks 102a to 102d of the movable stage 133, have. Thereby, the curvature of the die D is maintained.

Next, the pick-up operation by the peeling unit 13 by the structure mentioned above is demonstrated using FIG. 3, FIG. 4, FIG.

First, like the embodiment, the dicing tape 16 positioned on the wafer holder 12 shown in Figs. 3 and 4 is irradiated with ultraviolet rays. Thereby, since the adhesive applied to the dicing tape 16 hardens and the adhesiveness falls, the interface of the dicing tape 16 and the die attach film 18 peels easily.

Next, similarly to the embodiment, by lowering the expand ring 15 of the wafer holder 12 , the wafer ring 14 adhered to the periphery of the dicing tape 16 is pushed down. In this way, the dicing tape 16 is stretched in the horizontal direction without loosening by receiving a strong tension from the central portion toward the peripheral portion.

Next, as shown in FIG. 4 , the central portion (blocks 102a to 102d) of the peeling unit 13 just below one die D to be peeled (the die D located at the center of FIG. 4 ). While moving the wafer holder 12 so as to be positioned, the collet 22 is moved above the die D. On the bottom surface of the collet 22 supported by the pickup head 21, a suction port (not shown) through which the pressure is reduced is provided, so that only one die D to be peeled can be selectively absorbed and held. has been

Next, as shown in Fig. 10, the upper surfaces of the block 102a, block 102b, block 102c, and block 102d are set at different heights, and are slightly lower than the upper surface of the fixed stage 132 ( In the initial state described above), the peeling unit 13 is raised and its upper surface is brought into contact with the back surface of the dicing tape 16 , and the inside of the suction port, the groove and the gap G of the above-described fixed stage 132 . depressurize the Thereby, the dicing tape 16 under the other die D adjacent to the die D to be peeled is closely adhered to the fixed stage 132, and the dicing tape 16 below the die D to be peeled is in close contact with the dicing tape ( 16 is pressed against the upper surfaces of the blocks 102a to 102d to form a concave curved surface on the die D and the dicing tape 16 . On the other hand, the collet 22 is lowered almost simultaneously with the raising of the peeling unit 13, and the bottom surface is brought into contact with the upper surface of the die D to be peeled, thereby adsorbing the die D and lightly pressing it downward.

Next, as shown in Fig. 11, the four blocks 102a, 102b, block 102c, and block 102d are simultaneously pushed upward while maintaining the mutual positional relationship of the dicing tape ( A load is applied to the back surface of 16), and the die D is pushed up together with the dicing tape 16 to peel the periphery.

Next, when the outermost block 102a is pulled down, peeling of the die attach film 18 and the dicing tape 16 is started. At this time, peeling of the other die D can be prevented by sucking the dicing tape 16 under the other die D adjacent to the die D to be peeled downward and keeping it in close contact with the fixed stage 132 . have. When the block 102a is pulled down, the inside of the gap G of the block 102a, the block 102b, the block 102c, and the block 102d is depressurized to promote the peeling of the die D, so that the die D The dicing tape 16 below the Moreover, the inside of the groove|channel of the fixed stage 132 is pressure-reduced, and the dicing tape 16 which is in contact with the fixed stage 132 is brought into close contact with the upper surface of the fixed stage 132 .

Next, when the block 102b arranged second from the outermost side is pulled down, the die attach film 18 and the dicing tape 16 are peeled off in the direction of the center of the die D. At this time, the upper surface of the block 102a is positioned lower than the upper surface of the fixed stage 132 , but the upper surface of the block 102b is positioned higher than the upper surface of the fixed stage 132 .

Next, when the block 102c arranged thirdly from the outermost side is pulled down, the peeling of the die attach film 18 and the dicing tape 16 further proceeds in the center direction of the die D. As shown in FIG. At this time, the upper surfaces of the block 102a, the block 102b, and the block 102c are positioned lower than the upper surface of the fixed stage 132 .

And the die attach film 18 is completely peeled from the dicing tape 16 by pulling up the collet 22 upward while pulling down the block 102d downward.

According to the first modification, since a concave portion shape is provided by a plurality of blocks constituting the movable stage and the die is curved, as in the embodiment, the cross-sectional secondary moment of the die can be improved, the rigidity is improved, and the peeling is easy. It becomes possible to cope with the accompanying stress.

(Second Modification)

In the first modification, the die D may be peeled from the dicing tape 16 by sequentially pulling up from the outer block from the state shown in FIG. That is, first, the block 102d is pushed higher than the block 102a. Next, block 102c is pushed higher than block 102a but lower than block 102d. Next, push block 102b higher than block 102a but lower than block 102c. Next, the block 102a is pushed up lower than the block 102b.

In the above, the invention made by the present inventors has been described in detail based on Examples and Modifications, but the present invention is not limited to the above Examples and Modifications, and it is needless to say that various modifications are possible.

For example, in the embodiment, an example has been described in which a convex portion (step) for peeling is provided in front of the movable stage. However, the movable stage may be moved horizontally without providing the convex portion (step difference), and the movable stage is horizontal You may make it move up and down together with a movement.

In addition, although the example in which a movable stage is comprised by four blocks was demonstrated in a modified example, you may comprise five or more blocks even if it is less than four.

Further, seven rectangular blocks are arranged in parallel to constitute blocks 102a to 102d, one block in the center constitutes the inner block 102d, and three blocks on both sides of the blocks 102a to 102d in the middle 102c), and the two outermost blocks may constitute the outer block 102a. In this case, the collet 22 is rectangular as in the embodiment, the lower side of the long rectangle is formed in a downward convex curve, and the suction surface 22a for adsorbing the die D of the collet 22 is the outer surface of the circumference. You may make it form a convex curved surface like (R-shaped surface).

In addition, although the example in which the die attach film is used was described in the Example, it is not necessary to use a die attach film by providing the preform part which apply|coats an adhesive agent to a board|substrate.

Further, in the embodiment, a die bonder that picks up a die from the die supply unit with a pickup head, loads it on an intermediate stage, and bonds the die mounted on the intermediate stage to a substrate with a bonding head, has been described, but it is not limited thereto, It is applicable to a semiconductor manufacturing apparatus which picks up a die from a die supply part. For example, it is also applicable to a die bonder that does not have an intermediate stage and a pickup head, and bonds the die of the die supply unit to the substrate with the bonding head.

8: control unit
10: die bonder (die bonding device)
13: peeling unit
132: fixed stage
133: movable stage
16: dicing tape
22 : collet
D: die

Claims (20)

a collet for adsorbing the die held on the dicing tape;
a movable stage in contact with a portion of the dicing tape located below the die; and a fixed stage for adsorbing a portion of the dicing tape located at an outer periphery of the die than the die, wherein the die is removed from the dicing tape. A peeling unit for peeling is provided;
the movable stage has a concave portion for curving the die to be concave;
The lower surface of the collet has a curved surface that fits with the upper surface of the curved die,
The thickness of the movable stage becomes thinner from a position near the rear end toward the front end, and a chamfer is provided at the rear end,
The movable stage is slidable in a first horizontal direction with respect to the fixed stage,
When viewed in cross section in a plane perpendicular to the first direction, the lower surface of the collet forms a downwardly convex curve, and the upper surface of the movable stage forms an upwardly concave curve;
A die bonding apparatus in which a lower surface of the collet is linear and an upper surface of the movable stage is linear when viewed in a cross section in a plane orthogonal to a second direction orthogonal to the first direction in a horizontal direction. According to claim 1,
The peeling unit further has a mechanism for deforming the die through the dicing tape by adsorbing the dicing tape. According to claim 1,
a thickness of the die is 30 μm or less, and a height from the bottom of the curved valley of the die to an end of the die is greater than 0 μm and not more than 20 μm. delete delete delete delete It is a peeling unit used with a collet having a curved surface on its lower surface that fits with the upper surface of a curved die,
a movable stage in contact with a portion of the dicing tape located below the pick-up target die;
and a fixed stage for adsorbing a portion of the dicing tape located outside the pick-up target die,
the movable stage has a concave portion for curved upwardly concave the pick-up target die, and is slidable in a first horizontal direction with respect to the fixed stage;
When viewed in a cross section in a plane orthogonal to the first direction, the upper surface of the movable stage forms an upwardly concave curve,
The thickness of the movable stage becomes thinner from a position near the rear end toward the front end, and a chamfer is provided at the rear end,
A peeling unit in which the upper surface of the movable stage is linear when viewed in a cross section in a plane orthogonal to a second direction perpendicular to the first direction in a horizontal direction. A movable stage in contact with a portion of the dicing tape located below the die, and a fixed stage for adsorbing a portion of the dicing tape located at an outer periphery of the die than the die, wherein the movable stage has a concave upper portion of the die It has a concave portion for curving it, and is slidable in a first direction in a horizontal direction with respect to the fixed stage, and when viewed in a cross section in a plane orthogonal to the first direction, an upper surface of the movable stage forms a curved upwardly concave curve. and the thickness of the movable stage becomes thinner as it goes from a position near the rear end toward the front end, and a chamfer is provided at the rear end. When viewed in cross section, the upper surface of the movable stage is a collet used with a peeling unit having a linear shape,
The lower surface of the collet has a curved surface that fits with the upper surface of the curved die,
When viewed in a cross-section in a plane perpendicular to the first direction, the lower surface of the collet forms a downward convex curve,
When viewed in a cross section in a plane orthogonal to a second direction orthogonal to the first direction in a horizontal direction, the lower surface of the collet is linear;
A collet for adsorbing the curved die held on the dicing tape. 10. The method of claim 9,
The movable stage is slidable in a first horizontal direction with respect to the fixed stage,
A collet in which a lower surface of the collet forms a downwardly convex curve when viewed in a cross section in a plane orthogonal to the first direction. A collet for adsorbing a die held on a dicing tape, a movable stage in contact with a portion of the dicing tape positioned below the die, and a portion of the dicing tape positioned outside the die has a fixed stage, a peeling unit for peeling the die from the dicing tape, and a control unit for controlling the peeling unit; has a curved surface fitted with the curved upper surface of the die, the thickness of the movable stage becomes thinner from a position near the rear end toward the front end, and a chamfer is provided at the rear end, and the movable stage is It is slidable in a first direction in a horizontal direction with respect to the fixed stage, and when viewed in a cross-section in a plane perpendicular to the first direction, the lower surface of the collet forms a downward convex curve, and the upper surface of the movable stage is upward Die bonding in which a concave curve is formed and the lower surface of the collet is linear and the upper surface of the movable stage is linear when viewed in a cross-section in a plane orthogonal to a second direction orthogonal to the first direction in a horizontal direction. A wafer loading step of loading a wafer ring holding the dicing tape into the device;
a pickup step of peeling and picking up the die from the dicing tape with the peeling unit and the collet;
A bonding process of loading a die picked up from the dicing tape on a substrate
A method of manufacturing a semiconductor device comprising: 12. The method of claim 11,
The pick-up process is
deforming the die through the dicing tape by the peeling unit adsorbing the dicing tape;
adsorbing the die by the collet;
and sliding the movable stage in a first horizontal direction with respect to the fixed stage. delete 12. The method of claim 11,
The thickness of the die is 30 μm or less, and the height from the bottom of the curved valley of the die to the end of the die is more than 0 μm and 20 μm or less. delete 12. The method of claim 11,
A method of manufacturing a semiconductor device in which a lower surface of the collet is linear and an upper surface of the movable stage is linear when viewed in a cross-section in a direction along the first direction. delete 12. The method of claim 11,
wherein the die further includes a die attach film between the die and the dicing tape. 12. The method of claim 11,
The bonding step is a method of manufacturing a semiconductor device having a step of loading the die on an already bonded die. 20. The method of claim 19,
The pick-up process further includes a step of loading the picked-up die on an intermediate stage,
The bonding process further includes a step of picking up the die from the intermediate stage.

Images