KR101395536B1 - Collet module for pick-up semiconductor die - Google Patents

Collet module for pick-up semiconductor die Download PDF

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Publication number
KR101395536B1
KR101395536B1 KR1020120097654A KR20120097654A KR101395536B1 KR 101395536 B1 KR101395536 B1 KR 101395536B1 KR 1020120097654 A KR1020120097654 A KR 1020120097654A KR 20120097654 A KR20120097654 A KR 20120097654A KR 101395536 B1 KR101395536 B1 KR 101395536B1
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South Korea
Prior art keywords
semiconductor die
collet
picked
module
semiconductor
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KR1020120097654A
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Korean (ko)
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KR20140030906A (en
Inventor
이상훈
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에스티에스반도체통신 주식회사
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Priority to KR1020120097654A priority Critical patent/KR101395536B1/en
Publication of KR20140030906A publication Critical patent/KR20140030906A/en
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Publication of KR101395536B1 publication Critical patent/KR101395536B1/en

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Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet module for semiconductor die pick-up, and more particularly to a collet module for picking up a semiconductor die and a collet module for picking up a semiconductor die, will be.

Description

[0001] COLLET MODULE FOR PICK-UP SEMICONDUCTOR DIE [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet module for semiconductor die pick-up, and more particularly to a collet module for picking up a semiconductor die and a collet module for picking up a semiconductor die, will be.

The semiconductor package has a function of protecting the semiconductor chip from the external environment and physically bonding and electrically connecting the electronic chip to the electronic system. Today's packaging technology is becoming increasingly important as it affects the performance of semiconductor devices and the cost, performance, and reliability of end products.

In general, a process of separating an individual semiconductor die from a wafer in a semiconductor package assembling process and attaching the semiconductor die to a substrate such as a lead frame or a printed circuit board (PCB) using an epoxy adhesive is referred to as a semiconductor die attach process. This is the first step in separating the semiconductor dies that were grouped on the wafer and commercializing them, and in order to perform the semiconductor die attach process (D / A), a process of cutting and separating the wafer into individual chip units Should be preceded.

As described above, in the semiconductor die package process, wafers having a plurality of chips are cut into individual semiconductor die units, and the individual semiconductor dies that are cut are picked up for bonding the individual semiconductor die to the package body, And a step of transferring it to a mounting portion is required. A portion of the semiconductor die transfer apparatus that picks up the semiconductor die from the wafer and transfers the semiconductor die directly to the semiconductor die is called a collet.

10 is a view showing a conventional semiconductor die transfer apparatus. The conventional apparatus includes a collet holder 200 having an inner space 210 formed at a lower portion thereof, A rubber collet 100 attached to the inner space 210 of the collet holder 200 is provided with a suction hole corresponding to the vacuum hole 220 and connected to a vacuum applying pipe 230 through which the hole 220 penetrates, The suction force is generated on the lower surface of the rubber collet 100 by sucking air or stopping suction through the vacuum hole 220 of the vacuum applying pipe 230 so that the semiconductor die is attached and transferred And places it where you want it. The rubber collet of such a semiconductor die transfer device has a problem in flatness.

11 is a view showing another conventional semiconductor die transfer apparatus. In order to solve the problem of the conventional semiconductor die transfer apparatus described above, it is attached to the upper surface of the rubber collet 10 and the inner side of the collet holder 20 And a plate 30 attached to the space 21 and having an opening 31 corresponding to the suction hole 12 and the vacuum hole 22. That is, a metal plate 30 is attached to the upper surface of the rubber collet 10 in order to prevent deformation of the rubber collet 10 and to ensure flatness.

However, these conventional semiconductor die transfer devices are not suitable for semiconductor die transfer devices because the semiconductor die to be picked up and the neighboring semiconductor dies are attracted together or are influenced by the vacuum suction force and are subjected to double die, die flying, tape burr, There has been a problem that defects such as die rotation often occur in the die attaching process (D / A, die attach), and the yield deteriorates due to such defects.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor die pickup apparatus capable of eliminating defects in a die attaching process by forming a compression rod for fixing a semiconductor die to be picked up and neighboring semiconductor dies Collet module.

Another object of the present invention is to provide a collet module for picking up a semiconductor die which can be detachably attached to a compression plate or a compression rod to be easily replaced at the time of wear or breakage.

To this end, the collet module for semiconductor die pick-up according to the present invention is characterized in that the collet module for semiconductor die pick-up includes a plurality of semiconductor dies fixed to the adhesive tape on the vacuum stage using the vacuum suction force of the vacuum applying tube, A collet including a suction portion for contacting the semiconductor die and a suction hole communicating with the vacuum applying tube, and a flat plate-like supporting portion located above the suction portion; And a compression plate including a plurality of compression rods for pressing and fixing the semiconductor die adjacent to the semiconductor die to be picked up.

Further, the collet, the pressing rod and the compression plate of the collet module for semiconductor die pick-up according to the present invention are characterized by being made of any one material of rubber, silicon and urethane.

Further, the compression plate of the collet module for semiconductor die pick-up according to the present invention is detachably coupled to the collet.

The pressing rod of the collet module for semiconductor die-up according to the present invention is characterized in that four pieces are formed at positions where the semiconductor die adjacent to each of the four sides of the quadrangular-shaped pickup target semiconductor die can be pressed.

The collet module for semiconductor die pick-up according to the present invention further comprises a collet including a suction part which is in contact with the semiconductor die and which is in communication with the vacuum applying tube, and a plate-like support part which is located above the suction part, And a compression rod for compressing the semiconductor die adjacent to the semiconductor die to be picked up.

In addition, a fitting groove is formed in the support portion of the collet module for semiconductor die-pickup according to the present invention so that the pressing rod is detachably fitted, and one end of the pressing rod is formed with a step so as to be fitted and fixed in the fitting groove .

The collet and the pressing rod of the collet module for semiconductor die pick-up according to the present invention are characterized by being made of any one material of rubber, silicon and urethane elastic material.

The pressing rod of the collet module for semiconductor die-up according to the present invention is characterized in that four pieces are formed at positions where the semiconductor die adjacent to each of the four sides of the quadrangular-shaped pickup target semiconductor die can be pressed.

According to the collet module for semiconductor die pick-up according to the present invention having the above-described structure, it is possible to eliminate the defect in the die attaching process by forming the compression rod for fixing the semiconductor die to be picked up and the neighboring semiconductor dies.

In addition, according to the collet module for picking up semiconductor die according to the present invention, the compression plate or the compression rod can be attached and detached, so that the collet module can be easily replaced when it is worn or damaged.

1 is a perspective view showing an embodiment of a collet module for semiconductor die pick-up according to the present invention.
2 is an exploded perspective view showing an embodiment of a collet module for semiconductor die pick-up according to the present invention.
3 is a perspective view showing a position where the compression rod of the compression plate according to the present invention is in contact with the semiconductor die.
4 and 5 are cross-sectional views showing a collet module for semiconductor die pick-up according to the present invention.
FIG. 6A is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up according to the present invention is lowered, and FIG. 6B shows a state in which a semiconductor die to be picked up is attracted to a collet of a collet module for semiconductor die pick- And Fig. 6C is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up rises.
7 is a perspective view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.
8 is an exploded perspective view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.
9 is a cross-sectional view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.
10 and 11 are views showing a conventional semiconductor die transfer apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, the terms described below are defined in consideration of the functions of the present invention, and these may vary depending on the intention of the user, the operator, or the precedent. Therefore, the definition should be based on the contents throughout this specification.

FIG. 1 is a perspective view showing one embodiment of a collet module for semiconductor die pick-up according to the present invention, and FIG. 2 is an exploded perspective view showing an embodiment of a collet module for semiconductor die pick-up according to the present invention.

FIG. 3 is a perspective view showing a position where the compression rod of the compression plate according to the present invention is in contact with the semiconductor die, and FIGS. 4 and 5 are sectional views showing the collet module for picking up semiconductor die according to the present invention.

1 to 5, the collet module 10 for picking up a semiconductor die according to the present embodiment includes a plurality of semiconductors (not shown) fixed to an adhesive tape 40 on a vacuum stage by using a vacuum suction force of a vacuum applying tube 20, Only the semiconductor die 30 to be picked out from among the dies 30, 31, 32, 33, 34 ... is selectively picked up.

The collet module 10 for semiconductor die pick-up according to the present invention includes a collet 11 connected to a vacuum application tube 20 and a collet 11 connected to the semiconductor die 30 to be picked up and the neighboring semiconductor dies 31, And 34, respectively.

The collet module 10 for semiconductor die pick-up according to the present invention includes a suction part 110 in contact with the semiconductor die 30 and forming a suction hole 111 communicating with the vacuum applying tube 20, And a flat support portion 115 positioned on the upper portion of the adsorption portion 110.

The suction unit 110 according to the present invention is a portion directly contacting the semiconductor die 30 to be picked up and the suction hole 111 is communicated with the vacuum application tube 20 to be picked up by the vacuum suction force, From the tape (40).

The suction unit 110 is preferably made of an elastic material made of elastic rubber, silicone, or urethane so as to prevent damages to the semiconductor die and to sufficiently transmit a vacuum suction force.

Meanwhile, although the adsorption unit 110 is illustrated as having a rectangular tube shape in this specification, it is needless to say that the adsorption unit 110 may be formed of a cylindrical or polygonal tube.

The supporting part 115 according to the present invention is located on the upper part of the adsorption part 110 and may be formed integrally with the adsorption part 110.

A collet 11 made of an elastic material may be attached to the upper surface of the support part 115 so as to secure the flatness of the collet 11 required for manufacturing a semiconductor package.

The pressing plate 13 according to the present invention is used to fix the semiconductor die 30 adjacent to the semiconductor die 30 to be picked up to form a die such as a double die, a die flying or a tape burr, And performs the function of improving defects generated during the attaching process (D / A, die attach).

Specifically, the compression plate 13 includes a hollow hole 135 penetratingly formed in a central region so as to insert the adsorption unit 110, and a semiconductor die 31, 32 adjacent to the semiconductor die 30 to be picked up , 33, and 34, and a plurality of pressing rods 130 for pressing and fixing the pressing rods.

The thickness of the compression plate 13 is made thinner than that of the absorption unit 110 fitted in the hollow hole, so that the absorption unit 110 protrudes downward.

The lower surface of the compression rod 130 is preferably positioned lower than the lower surface of the adsorption unit 110.

This is because when the semiconductor die 30 is picked up and the collet module 10 is lowered, the semiconductor die 31, 32, 33, 34 adjacent to the semiconductor die 30 to be picked up with the compression rod 130 is first pressed The semiconductor die 30 to be picked up is vacuum-sucked.

3, the compression rod 130 according to the present invention is disposed at a position capable of compressing the semiconductor dies 31, 32, 33, and 34 adjacent to four sides of the quadrangular pickup semiconductor die 30, It is preferable that four are formed.

This is because, among the semiconductor dies adjacent to the semiconductor die 30 to be picked up, a double die, a die flying or a tape This is because tape burrs occur frequently. However, it is needless to say that the number of the pressing rods 130 is not necessarily limited to four as described above, and the number of the pressing rods can be increased or decreased in consideration of various conditions.

The compression plate 13 and the compression rod 130 are preferably made of an elastic material such as rubber, silicone, or urethane, like the collet 11.

Referring to FIG. 4, the compression plate 13 is attached to the collet 11.

Meanwhile, referring to FIG. 5, the compression plate 13a is detachably coupled to the collet 11a.

This is because it is possible to replace the compression plate 13a, particularly when the compression rod 130 is worn or damaged by long-term use.

As described above, the compression plate insertion groove 117 is formed in the support portion 115a of the collet 11a to detachably attach the compression plate 13a, and the compression plate end portion 133 is formed in the compression plate insertion groove 117 It is possible to exemplify the construction to be fitted. Since the pressing plate 13a and the pressing plate fitting groove 117 are both made of an elastic material when the pressing plate 13a is fitted in this way, the pressing plate 13a can be easily combined only by pressing the end of the pressing plate toward the fitting groove .

FIG. 6A is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up according to the present invention is lowered, and FIG. 6B shows a state in which a semiconductor die to be picked up is attracted to a collet of a collet module for semiconductor die pick- And Fig. 6C is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up rises.

6A to 6C, when the collet module 10 for semiconductor die pick-up according to the present invention is used, it is possible to selectively pick up only the semiconductor die 30 to be picked up, It is possible to eliminate the defective product in the tape burr and increase the yield.

Hereinafter, another embodiment of a collet module for semiconductor die pick-up according to the present invention will be described in detail with reference to the accompanying drawings. In the description of the present invention, the same or similar reference numerals are given to the same or similar elements, and a detailed description thereof will be omitted.

8 is an exploded perspective view showing another embodiment of a collet module for picking up semiconductor die according to the present invention, and Fig. 9 is an exploded perspective view showing the collet module for picking up semiconductor die according to the present invention. Fig. 7 is a perspective view showing another embodiment of a collet module for semiconductor die- Sectional view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.

The collet module 10b for semiconductor die pick-up according to the present invention includes a suction part 110 in contact with the semiconductor die 30 and forming a suction hole 111 communicating with the vacuum applying tube 20, A collet 11b including a plate-like support portion 115b positioned at the upper portion of the semiconductor die 30 and a semiconductor die 30 adjacent to the semiconductor die 30 to be coupled with the support portion 115b, And a rod 130b.

The pressing rod fitting groove 119 is formed in the support part 115b according to the present invention so that the pressing rod 130b is detachably fitted. The pressing rod fitting groove 119 is formed at one end of the pressing rod 130b. It is preferable to form the protrusion 131 so that the protrusion 131 can be fitted and fixed.

Since the pressing rod 130b is fitted in the pressing rod fitting groove 119 of the supporting portion 115 in a detachable manner, the structure is simple, the pressing rod can be easily replaced, and the manufacturing cost can be reduced.

As described above, the collet and the pressing rod are made of any one material of rubber, silicon, and urethane, and the pressing rod is provided with a semiconductor die adjacent to four sides of the quadrangular pick- And four pieces can be formed at positions that can be squeezed.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and similarities. Accordingly, the scope of the present invention should be construed as being limited to the embodiments described, and it is intended that the scope of the present invention encompasses not only the following claims, but also equivalents thereto.

10: Collet module 11: Collet
110: suction part 111: suction hole
115: support portion 117: compression plate fitting groove
119: squeeze rod fitting groove 13: squeeze plate
130: a pressing rod 131:
133: compression plate end portion 135: hollow hole
15: metal plate 20: vacuum tube
30: semiconductor die to be picked up 31, 32, 33, 34: semiconductor die
40: tape

Claims (8)

The collet module for semiconductor die pick-up is a collet module for picking up only a semiconductor die to be picked up among a plurality of semiconductor dies fixed to an adhesive tape on a vacuum stage by using a vacuum suction force of a vacuum applying tube ,
A collet including an adsorption portion which is in contact with the semiconductor die and in which an adsorption hole communicating with the vacuum application tube is formed, and a flat plate-like support portion which is located at an upper portion of the adsorption portion;
And a compression plate including a plurality of compression rods for pressing and fixing the semiconductor die adjacent to the semiconductor die to be picked up,
The pressing rod is made of any one material selected from the group consisting of rubber, silicone, and urethane, and is capable of pressing a semiconductor die adjacent to each of the four sides of the rectangular semiconductor wafer to be picked up, And the four collet modules are formed at positions where the semiconductor die is picked up.
The method according to claim 1,
Wherein the collet and the compression plate are made of any one material selected from the group consisting of rubber, silicone and urethane.
3. The method of claim 2,
Wherein the compression plate is removably coupled to the collet. ≪ RTI ID = 0.0 > 11. < / RTI >
delete The collet module for semiconductor die pick-up is a collet module for picking up only a semiconductor die to be picked up among a plurality of semiconductor dies fixed to an adhesive tape on a vacuum stage by using a vacuum suction force of a vacuum applying tube ,
A collet including an adsorption portion which is in contact with the semiconductor die and in which an adsorption hole communicating with the vacuum application tube is formed, and a flat plate-like support portion which is located above the adsorption portion; And
And a compression rod coupled to the supporting portion to compress the semiconductor die adjacent to the semiconductor die to be picked up,
The pressing rod is made of any one material selected from the group consisting of rubber, silicone, and urethane, and is capable of pressing a semiconductor die adjacent to each of the four sides of the rectangular semiconductor wafer to be picked up, And the four collet modules are formed at positions where the semiconductor die is picked up.
6. The method of claim 5,
Wherein the supporting portion is formed with a fitting groove so that the pressing rod is detachably fitted, and one end of the pressing rod is formed with a step so as to be fitted and fixed in the fitting groove.
6. The method of claim 5,
Wherein the collet is made of any one material selected from the group consisting of rubber, silicone and urethane.
delete
KR1020120097654A 2012-09-04 2012-09-04 Collet module for pick-up semiconductor die KR101395536B1 (en)

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KR1020120097654A KR101395536B1 (en) 2012-09-04 2012-09-04 Collet module for pick-up semiconductor die

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KR101395536B1 true KR101395536B1 (en) 2014-05-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127609B2 (en) 2019-06-24 2021-09-21 Samsung Electronics Co., Ltd. Collet apparatus and method for fabricating a semiconductor device using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102469766B1 (en) * 2020-09-29 2022-11-23 (주)마이크로컨텍솔루션 Collet for picking-up semiconductor chip

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6364039U (en) * 1986-10-14 1988-04-27
JPH028038U (en) * 1988-06-24 1990-01-18
KR200414775Y1 (en) * 2006-02-10 2006-04-24 한양정밀 (주) apparatus for transfering die
KR20100133632A (en) * 2009-06-12 2010-12-22 이정구 Rubber pick-up frame equiped with guiding block

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6364039U (en) * 1986-10-14 1988-04-27
JPH028038U (en) * 1988-06-24 1990-01-18
KR200414775Y1 (en) * 2006-02-10 2006-04-24 한양정밀 (주) apparatus for transfering die
KR20100133632A (en) * 2009-06-12 2010-12-22 이정구 Rubber pick-up frame equiped with guiding block

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127609B2 (en) 2019-06-24 2021-09-21 Samsung Electronics Co., Ltd. Collet apparatus and method for fabricating a semiconductor device using the same

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