KR101395536B1 - Collet module for pick-up semiconductor die - Google Patents
Collet module for pick-up semiconductor die Download PDFInfo
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- KR101395536B1 KR101395536B1 KR1020120097654A KR20120097654A KR101395536B1 KR 101395536 B1 KR101395536 B1 KR 101395536B1 KR 1020120097654 A KR1020120097654 A KR 1020120097654A KR 20120097654 A KR20120097654 A KR 20120097654A KR 101395536 B1 KR101395536 B1 KR 101395536B1
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- semiconductor die
- collet
- picked
- module
- semiconductor
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet module for semiconductor die pick-up, and more particularly to a collet module for picking up a semiconductor die and a collet module for picking up a semiconductor die, will be.
Description
BACKGROUND OF THE
The semiconductor package has a function of protecting the semiconductor chip from the external environment and physically bonding and electrically connecting the electronic chip to the electronic system. Today's packaging technology is becoming increasingly important as it affects the performance of semiconductor devices and the cost, performance, and reliability of end products.
In general, a process of separating an individual semiconductor die from a wafer in a semiconductor package assembling process and attaching the semiconductor die to a substrate such as a lead frame or a printed circuit board (PCB) using an epoxy adhesive is referred to as a semiconductor die attach process. This is the first step in separating the semiconductor dies that were grouped on the wafer and commercializing them, and in order to perform the semiconductor die attach process (D / A), a process of cutting and separating the wafer into individual chip units Should be preceded.
As described above, in the semiconductor die package process, wafers having a plurality of chips are cut into individual semiconductor die units, and the individual semiconductor dies that are cut are picked up for bonding the individual semiconductor die to the package body, And a step of transferring it to a mounting portion is required. A portion of the semiconductor die transfer apparatus that picks up the semiconductor die from the wafer and transfers the semiconductor die directly to the semiconductor die is called a collet.
10 is a view showing a conventional semiconductor die transfer apparatus. The conventional apparatus includes a
11 is a view showing another conventional semiconductor die transfer apparatus. In order to solve the problem of the conventional semiconductor die transfer apparatus described above, it is attached to the upper surface of the
However, these conventional semiconductor die transfer devices are not suitable for semiconductor die transfer devices because the semiconductor die to be picked up and the neighboring semiconductor dies are attracted together or are influenced by the vacuum suction force and are subjected to double die, die flying, tape burr, There has been a problem that defects such as die rotation often occur in the die attaching process (D / A, die attach), and the yield deteriorates due to such defects.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor die pickup apparatus capable of eliminating defects in a die attaching process by forming a compression rod for fixing a semiconductor die to be picked up and neighboring semiconductor dies Collet module.
Another object of the present invention is to provide a collet module for picking up a semiconductor die which can be detachably attached to a compression plate or a compression rod to be easily replaced at the time of wear or breakage.
To this end, the collet module for semiconductor die pick-up according to the present invention is characterized in that the collet module for semiconductor die pick-up includes a plurality of semiconductor dies fixed to the adhesive tape on the vacuum stage using the vacuum suction force of the vacuum applying tube, A collet including a suction portion for contacting the semiconductor die and a suction hole communicating with the vacuum applying tube, and a flat plate-like supporting portion located above the suction portion; And a compression plate including a plurality of compression rods for pressing and fixing the semiconductor die adjacent to the semiconductor die to be picked up.
Further, the collet, the pressing rod and the compression plate of the collet module for semiconductor die pick-up according to the present invention are characterized by being made of any one material of rubber, silicon and urethane.
Further, the compression plate of the collet module for semiconductor die pick-up according to the present invention is detachably coupled to the collet.
The pressing rod of the collet module for semiconductor die-up according to the present invention is characterized in that four pieces are formed at positions where the semiconductor die adjacent to each of the four sides of the quadrangular-shaped pickup target semiconductor die can be pressed.
The collet module for semiconductor die pick-up according to the present invention further comprises a collet including a suction part which is in contact with the semiconductor die and which is in communication with the vacuum applying tube, and a plate-like support part which is located above the suction part, And a compression rod for compressing the semiconductor die adjacent to the semiconductor die to be picked up.
In addition, a fitting groove is formed in the support portion of the collet module for semiconductor die-pickup according to the present invention so that the pressing rod is detachably fitted, and one end of the pressing rod is formed with a step so as to be fitted and fixed in the fitting groove .
The collet and the pressing rod of the collet module for semiconductor die pick-up according to the present invention are characterized by being made of any one material of rubber, silicon and urethane elastic material.
The pressing rod of the collet module for semiconductor die-up according to the present invention is characterized in that four pieces are formed at positions where the semiconductor die adjacent to each of the four sides of the quadrangular-shaped pickup target semiconductor die can be pressed.
According to the collet module for semiconductor die pick-up according to the present invention having the above-described structure, it is possible to eliminate the defect in the die attaching process by forming the compression rod for fixing the semiconductor die to be picked up and the neighboring semiconductor dies.
In addition, according to the collet module for picking up semiconductor die according to the present invention, the compression plate or the compression rod can be attached and detached, so that the collet module can be easily replaced when it is worn or damaged.
1 is a perspective view showing an embodiment of a collet module for semiconductor die pick-up according to the present invention.
2 is an exploded perspective view showing an embodiment of a collet module for semiconductor die pick-up according to the present invention.
3 is a perspective view showing a position where the compression rod of the compression plate according to the present invention is in contact with the semiconductor die.
4 and 5 are cross-sectional views showing a collet module for semiconductor die pick-up according to the present invention.
FIG. 6A is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up according to the present invention is lowered, and FIG. 6B shows a state in which a semiconductor die to be picked up is attracted to a collet of a collet module for semiconductor die pick- And Fig. 6C is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up rises.
7 is a perspective view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.
8 is an exploded perspective view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.
9 is a cross-sectional view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.
10 and 11 are views showing a conventional semiconductor die transfer apparatus.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, the terms described below are defined in consideration of the functions of the present invention, and these may vary depending on the intention of the user, the operator, or the precedent. Therefore, the definition should be based on the contents throughout this specification.
FIG. 1 is a perspective view showing one embodiment of a collet module for semiconductor die pick-up according to the present invention, and FIG. 2 is an exploded perspective view showing an embodiment of a collet module for semiconductor die pick-up according to the present invention.
FIG. 3 is a perspective view showing a position where the compression rod of the compression plate according to the present invention is in contact with the semiconductor die, and FIGS. 4 and 5 are sectional views showing the collet module for picking up semiconductor die according to the present invention.
1 to 5, the
The
The
The
The
Meanwhile, although the
The supporting
A
The
Specifically, the
The thickness of the
The lower surface of the
This is because when the semiconductor die 30 is picked up and the
3, the
This is because, among the semiconductor dies adjacent to the semiconductor die 30 to be picked up, a double die, a die flying or a tape This is because tape burrs occur frequently. However, it is needless to say that the number of the
The
Referring to FIG. 4, the
Meanwhile, referring to FIG. 5, the
This is because it is possible to replace the
As described above, the compression
FIG. 6A is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up according to the present invention is lowered, and FIG. 6B shows a state in which a semiconductor die to be picked up is attracted to a collet of a collet module for semiconductor die pick- And Fig. 6C is a cross-sectional view showing a state in which the collet module for semiconductor die pick-up rises.
6A to 6C, when the
Hereinafter, another embodiment of a collet module for semiconductor die pick-up according to the present invention will be described in detail with reference to the accompanying drawings. In the description of the present invention, the same or similar reference numerals are given to the same or similar elements, and a detailed description thereof will be omitted.
8 is an exploded perspective view showing another embodiment of a collet module for picking up semiconductor die according to the present invention, and Fig. 9 is an exploded perspective view showing the collet module for picking up semiconductor die according to the present invention. Fig. 7 is a perspective view showing another embodiment of a collet module for semiconductor die- Sectional view showing another embodiment of a collet module for semiconductor die pick-up according to the present invention.
The
The pressing rod
Since the
As described above, the collet and the pressing rod are made of any one material of rubber, silicon, and urethane, and the pressing rod is provided with a semiconductor die adjacent to four sides of the quadrangular pick- And four pieces can be formed at positions that can be squeezed.
While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and similarities. Accordingly, the scope of the present invention should be construed as being limited to the embodiments described, and it is intended that the scope of the present invention encompasses not only the following claims, but also equivalents thereto.
10: Collet module 11: Collet
110: suction part 111: suction hole
115: support portion 117: compression plate fitting groove
119: squeeze rod fitting groove 13: squeeze plate
130: a pressing rod 131:
133: compression plate end portion 135: hollow hole
15: metal plate 20: vacuum tube
30: semiconductor die to be picked up 31, 32, 33, 34: semiconductor die
40: tape
Claims (8)
A collet including an adsorption portion which is in contact with the semiconductor die and in which an adsorption hole communicating with the vacuum application tube is formed, and a flat plate-like support portion which is located at an upper portion of the adsorption portion;
And a compression plate including a plurality of compression rods for pressing and fixing the semiconductor die adjacent to the semiconductor die to be picked up,
The pressing rod is made of any one material selected from the group consisting of rubber, silicone, and urethane, and is capable of pressing a semiconductor die adjacent to each of the four sides of the rectangular semiconductor wafer to be picked up, And the four collet modules are formed at positions where the semiconductor die is picked up.
Wherein the collet and the compression plate are made of any one material selected from the group consisting of rubber, silicone and urethane.
Wherein the compression plate is removably coupled to the collet. ≪ RTI ID = 0.0 > 11. < / RTI >
A collet including an adsorption portion which is in contact with the semiconductor die and in which an adsorption hole communicating with the vacuum application tube is formed, and a flat plate-like support portion which is located above the adsorption portion; And
And a compression rod coupled to the supporting portion to compress the semiconductor die adjacent to the semiconductor die to be picked up,
The pressing rod is made of any one material selected from the group consisting of rubber, silicone, and urethane, and is capable of pressing a semiconductor die adjacent to each of the four sides of the rectangular semiconductor wafer to be picked up, And the four collet modules are formed at positions where the semiconductor die is picked up.
Wherein the supporting portion is formed with a fitting groove so that the pressing rod is detachably fitted, and one end of the pressing rod is formed with a step so as to be fitted and fixed in the fitting groove.
Wherein the collet is made of any one material selected from the group consisting of rubber, silicone and urethane.
Priority Applications (1)
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KR1020120097654A KR101395536B1 (en) | 2012-09-04 | 2012-09-04 | Collet module for pick-up semiconductor die |
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KR1020120097654A KR101395536B1 (en) | 2012-09-04 | 2012-09-04 | Collet module for pick-up semiconductor die |
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KR20140030906A KR20140030906A (en) | 2014-03-12 |
KR101395536B1 true KR101395536B1 (en) | 2014-05-15 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11127609B2 (en) | 2019-06-24 | 2021-09-21 | Samsung Electronics Co., Ltd. | Collet apparatus and method for fabricating a semiconductor device using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102469766B1 (en) * | 2020-09-29 | 2022-11-23 | (주)마이크로컨텍솔루션 | Collet for picking-up semiconductor chip |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6364039U (en) * | 1986-10-14 | 1988-04-27 | ||
JPH028038U (en) * | 1988-06-24 | 1990-01-18 | ||
KR200414775Y1 (en) * | 2006-02-10 | 2006-04-24 | 한양정밀 (주) | apparatus for transfering die |
KR20100133632A (en) * | 2009-06-12 | 2010-12-22 | 이정구 | Rubber pick-up frame equiped with guiding block |
-
2012
- 2012-09-04 KR KR1020120097654A patent/KR101395536B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6364039U (en) * | 1986-10-14 | 1988-04-27 | ||
JPH028038U (en) * | 1988-06-24 | 1990-01-18 | ||
KR200414775Y1 (en) * | 2006-02-10 | 2006-04-24 | 한양정밀 (주) | apparatus for transfering die |
KR20100133632A (en) * | 2009-06-12 | 2010-12-22 | 이정구 | Rubber pick-up frame equiped with guiding block |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11127609B2 (en) | 2019-06-24 | 2021-09-21 | Samsung Electronics Co., Ltd. | Collet apparatus and method for fabricating a semiconductor device using the same |
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KR20140030906A (en) | 2014-03-12 |
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