JPH028038U - - Google Patents
Info
- Publication number
- JPH028038U JPH028038U JP8357488U JP8357488U JPH028038U JP H028038 U JPH028038 U JP H028038U JP 8357488 U JP8357488 U JP 8357488U JP 8357488 U JP8357488 U JP 8357488U JP H028038 U JPH028038 U JP H028038U
- Authority
- JP
- Japan
- Prior art keywords
- collect
- mounter
- nozzle
- pellets
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の実施例１を示す断面図、第２
図は本考案の実施例２を示す断面図、第３図は従
来のマウンタ用コレツトを示す断面図、第４図は
従来のマウンタ用コレツトによるマウント状態を
示す断面図である。
１……コレツト、２……ノズル孔、３……ペレ
ツト、３′……ペレツト、４……シート、５……
吸着ノズル、６……スプリング、７……リードフ
レーム、８……ロー材、９……エアシリンダ、１
０……突上針。
Fig. 1 is a sectional view showing the first embodiment of the present invention;
FIG. 3 is a cross-sectional view showing a second embodiment of the present invention, FIG. 3 is a cross-sectional view showing a conventional mounter collet, and FIG. 4 is a cross-sectional view showing a mounted state by a conventional mounter collet. 1...Collection, 2...Nozzle hole, 3...Pellet, 3'...Pellet, 4...Sheet, 5...
Suction nozzle, 6... Spring, 7... Lead frame, 8... Brazing material, 9... Air cylinder, 1
0... Overhead needle.
Claims (1)
の吸着ノズルをコレツト本体に装備したことを特
徴とするマウンタ用コレツト。 A collect for a mounter, characterized in that the collect body is equipped with a small-diameter suction nozzle with a nozzle hole for vacuum suction of pellets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8357488U JPH028038U (en) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8357488U JPH028038U (en) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028038U true JPH028038U (en) | 1990-01-18 |
Family
ID=31308288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8357488U Pending JPH028038U (en) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028038U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54179914U (en) * | 1978-06-09 | 1979-12-19 | ||
| JPH0624060U (en) * | 1992-08-21 | 1994-03-29 | 株式会社ノーリツ | Connection structure of faucet with wall for bathtub |
| KR101395536B1 (en) * | 2012-09-04 | 2014-05-15 | 에스티에스반도체통신 주식회사 | Collet module for pick-up semiconductor die |
-
1988
- 1988-06-24 JP JP8357488U patent/JPH028038U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54179914U (en) * | 1978-06-09 | 1979-12-19 | ||
| JPH0624060U (en) * | 1992-08-21 | 1994-03-29 | 株式会社ノーリツ | Connection structure of faucet with wall for bathtub |
| KR101395536B1 (en) * | 2012-09-04 | 2014-05-15 | 에스티에스반도체통신 주식회사 | Collet module for pick-up semiconductor die |