JPH0229524U - - Google Patents
Info
- Publication number
- JPH0229524U JPH0229524U JP10770188U JP10770188U JPH0229524U JP H0229524 U JPH0229524 U JP H0229524U JP 10770188 U JP10770188 U JP 10770188U JP 10770188 U JP10770188 U JP 10770188U JP H0229524 U JPH0229524 U JP H0229524U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip suction
- holder
- suctioning
- collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は本考案の他の実施例を示す断面図である。第
３図は従来のマウント用コレツトの断面図である
。
１……ホルダー、２……可動コレツト先端部、
２′……コレツト先端部、３……ノズル穴、４…
…ペレツト、５……シート、６……突上針、７…
…コレツト可動アーム、８……真空チユーブ。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing another embodiment of the present invention. FIG. 3 is a sectional view of a conventional mounting collet. 1...Holder, 2...Movable collet tip,
2'... Collet tip, 3... Nozzle hole, 4...
...Pellet, 5... Sheet, 6... Thrust needle, 7...
...Collection movable arm, 8...Vacuum tube.
Claims (1)
吸着用コレツトにおいて、ホルダーの下部にチツ
プ吸着部を可動できるように取り付けたことを特
徴とする半導体チツプ吸着用コレツト。 A semiconductor chip suction collet for suctioning and holding a semiconductor chip, characterized in that a chip suction part is movably attached to the lower part of the holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770188U JPH0229524U (en) | 1988-08-15 | 1988-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770188U JPH0229524U (en) | 1988-08-15 | 1988-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229524U true JPH0229524U (en) | 1990-02-26 |
Family
ID=31342352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10770188U Pending JPH0229524U (en) | 1988-08-15 | 1988-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229524U (en) |
-
1988
- 1988-08-15 JP JP10770188U patent/JPH0229524U/ja active Pending