JPS6384950U - - Google Patents
Info
- Publication number
- JPS6384950U JPS6384950U JP17991486U JP17991486U JPS6384950U JP S6384950 U JPS6384950 U JP S6384950U JP 17991486 U JP17991486 U JP 17991486U JP 17991486 U JP17991486 U JP 17991486U JP S6384950 U JPS6384950 U JP S6384950U
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- suction hole
- familiar
- collection
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図ａ，ｂは本考案の一実施例の底面図と正
面図、第２図は第１図のコレツトによる半導体ペ
レツトの吸着状態を示す側面図、第３図と第４図
はそれぞれ本考案の第２および第３の実施例に係
るペレツト本体の底面図、第５図は従来の、角錐
型コレツトの側面図、第６図は従来の平面コレツ
トの断面図である。
１……コレツト本体、２……真空吸引孔、３，
３ａ，３ｂ……突起、４，４ａ，４ｂ……溝、５
，５ａ，５ｂ……真空誘導溝、７……半導体ペレ
ツト、８……被ボンデイング基板、９……ボンデ
イング材。
Figures 1a and b are a bottom view and a front view of an embodiment of the present invention, Figure 2 is a side view showing the state of semiconductor pellet adsorption by the collector in Figure 1, and Figures 3 and 4 are respectively FIG. 5 is a side view of a conventional pyramid-shaped collet, and FIG. 6 is a sectional view of a conventional flat collet. 1...Collection body, 2...Vacuum suction hole, 3,
3a, 3b... protrusion, 4, 4a, 4b... groove, 5
, 5a, 5b...vacuum guide groove, 7...semiconductor pellet, 8...substrate to be bonded, 9...bonding material.
Claims (1)
孔が開口している先端底部平面に高さの同じ複数
の突起が設けられ、これら複数の突起の間に形成
されている溝が前記吸引孔に通じていることを特
徴とするダイスボンデイング用コレツト。 A vacuum suction hole is formed in the center of the main body, and a plurality of protrusions of the same height are provided on the bottom plane of the tip where the suction hole opens, and the grooves formed between these plurality of protrusions are the suction holes. A collection for die bonding that is characterized by being familiar with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17991486U JPS6384950U (en) | 1986-11-21 | 1986-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17991486U JPS6384950U (en) | 1986-11-21 | 1986-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6384950U true JPS6384950U (en) | 1988-06-03 |
Family
ID=31123397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17991486U Pending JPS6384950U (en) | 1986-11-21 | 1986-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384950U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275664A (en) * | 1993-03-22 | 1994-09-30 | Rohm Co Ltd | Picking-up device for semiconductor chip |
| JP2004087677A (en) * | 2002-08-26 | 2004-03-18 | Nitto Denko Corp | Collet and method for picking up chip part using the same |
| WO2005112537A1 (en) * | 2004-05-17 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | Part feeding head device and part mounting head device |
| JP2012028594A (en) * | 2010-07-26 | 2012-02-09 | Shinko Electric Ind Co Ltd | Electronic component mounting device and electronic component mounting method |
-
1986
- 1986-11-21 JP JP17991486U patent/JPS6384950U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275664A (en) * | 1993-03-22 | 1994-09-30 | Rohm Co Ltd | Picking-up device for semiconductor chip |
| JP2004087677A (en) * | 2002-08-26 | 2004-03-18 | Nitto Denko Corp | Collet and method for picking up chip part using the same |
| WO2005112537A1 (en) * | 2004-05-17 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | Part feeding head device and part mounting head device |
| JP2012028594A (en) * | 2010-07-26 | 2012-02-09 | Shinko Electric Ind Co Ltd | Electronic component mounting device and electronic component mounting method |