JPS63191646U - - Google Patents
Info
- Publication number
- JPS63191646U JPS63191646U JP8097787U JP8097787U JPS63191646U JP S63191646 U JPS63191646 U JP S63191646U JP 8097787 U JP8097787 U JP 8097787U JP 8097787 U JP8097787 U JP 8097787U JP S63191646 U JPS63191646 U JP S63191646U
- Authority
- JP
- Japan
- Prior art keywords
- nail
- semiconductor chip
- glass
- thickness
- electrode portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はリードレスダイオードの一部切欠正面
図、第２図は第１図のＡ−Ａ線に沿つた断面図で
ある。
１，２……釘形電極、３……半導体チツプ、１
２……酸化膜。
FIG. 1 is a partially cutaway front view of a leadless diode, and FIG. 2 is a sectional view taken along line A-A in FIG. 1. 1, 2...nail-shaped electrode, 3...semiconductor chip, 1
2...Oxide film.
Claims (1)
プおよび半導体チツプと接着される釘形電極部分
をガラスで包蔵してなるものにおいて、上記ガラ
スと接触する釘形電極部分に０．５μｍないし２
μｍの厚さの酸化膜が設けられていることを特徴
とするリードレスダイオード。 In a device in which a semiconductor chip is held between nail-shaped electrodes, and the semiconductor chip and the nail-shaped electrode portion to be bonded to the semiconductor chip are enclosed in glass, the nail-shaped electrode portion in contact with the glass has a thickness of 0.5 μm to 2 μm.
A leadless diode characterized by being provided with an oxide film with a thickness of μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8097787U JPS63191646U (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8097787U JPS63191646U (en) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63191646U true JPS63191646U (en) | 1988-12-09 |
Family
ID=30932286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8097787U Pending JPS63191646U (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63191646U (en) |
-
1987
- 1987-05-29 JP JP8097787U patent/JPS63191646U/ja active Pending