JPS62104460U - - Google Patents
Info
- Publication number
- JPS62104460U JPS62104460U JP19672085U JP19672085U JPS62104460U JP S62104460 U JPS62104460 U JP S62104460U JP 19672085 U JP19672085 U JP 19672085U JP 19672085 U JP19672085 U JP 19672085U JP S62104460 U JPS62104460 U JP S62104460U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electrode
- glass
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａは本考案の一実施例である３端子リー
ドレスダイオードの外形図、第１図ｂは第１図ａ
の縦断面図、第２図は３端子リードレスダイオー
ドの回路図、第３図は従来のリードレスダイオー
ドの断面図である。
１……電極、２……中間電極、３……ガラスバ
ルブ、４……ダイオード本体。
Figure 1a is an outline drawing of a three-terminal leadless diode that is an embodiment of the present invention, and Figure 1b is Figure 1a.
2 is a circuit diagram of a three-terminal leadless diode, and FIG. 3 is a sectional view of a conventional leadless diode. 1... Electrode, 2... Intermediate electrode, 3... Glass bulb, 4... Diode body.
Claims (1)
、各電極間に１個又は複数個の半導体素子を接続
し、ガラス気密封止により一体構造としたことを
特徴とするリードレス半導体装置。 A leadless semiconductor device characterized in that one or more electrodes are provided between the electrodes at both ends, one or more semiconductor elements are connected between each electrode, and the integrated structure is formed by hermetically sealing with glass. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19672085U JPS62104460U (en) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19672085U JPS62104460U (en) | 1985-12-20 | 1985-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62104460U true JPS62104460U (en) | 1987-07-03 |
Family
ID=31155796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19672085U Pending JPS62104460U (en) | 1985-12-20 | 1985-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104460U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881683A (en) * | 2012-09-28 | 2013-01-16 | 苏州群鑫电子有限公司 | Double-chip glass-sealed diode |
-
1985
- 1985-12-20 JP JP19672085U patent/JPS62104460U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881683A (en) * | 2012-09-28 | 2013-01-16 | 苏州群鑫电子有限公司 | Double-chip glass-sealed diode |