JPS62170637U - - Google Patents
Info
- Publication number
- JPS62170637U JPS62170637U JP5819686U JP5819686U JPS62170637U JP S62170637 U JPS62170637 U JP S62170637U JP 5819686 U JP5819686 U JP 5819686U JP 5819686 U JP5819686 U JP 5819686U JP S62170637 U JPS62170637 U JP S62170637U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- push
- head
- sheet
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
第１図はこの考案の一実施例を示す断面図、第
２図は作業前のウエハを示す断面図、第３図は従
来装置の側面図、第４図はその動作工程を示す部
分断面図である。
図中８は粘着シート、１２はピン、２０はウエ
ハ、２１はチツプ、２３は突き上げヘツド、２３
ａは突出平面部、２３ｂはテーパー部、２３ｃは
真空吸着部である。なお、図中同一符号は同一又
は相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a sectional view showing a wafer before operation, Fig. 3 is a side view of a conventional device, and Fig. 4 is a partial sectional view showing its operating process. It is. In the figure, 8 is an adhesive sheet, 12 is a pin, 20 is a wafer, 21 is a chip, 23 is a push-up head, 23
23b is a tapered portion, and 23c is a vacuum suction portion. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ハ、このウエハを表面に接着したシート、このシ
ートの下方に位置され、上記チツプと略同外形の
突出平面部と、この突出平面部と連続した下方向
のテーパー部と、このテーパー部に設けられ上記
チツプを囲む周囲のチツプを真空吸着する吸着部
を有した突き上げヘツド、この突き上げヘツド内
に配置され上記チツプを突き上げるピンを備えた
チツプ分離装置。 A wafer cut approximately in the thickness direction for each chip, a sheet with this wafer glued to the surface, a protruding plane part located below this sheet and having approximately the same external shape as the above chip, and a lower part continuous with this protruding plane part. A chip separator comprising: a tapered part in the direction; a push-up head having a suction part provided in the taper part for vacuum-chucking chips surrounding the chip; and a pin disposed within the push-up head for pushing up the chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5819686U JPS62170637U (en) | 1986-04-17 | 1986-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5819686U JPS62170637U (en) | 1986-04-17 | 1986-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62170637U true JPS62170637U (en) | 1987-10-29 |
Family
ID=30888564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5819686U Pending JPS62170637U (en) | 1986-04-17 | 1986-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62170637U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01109729A (en) * | 1987-10-22 | 1989-04-26 | Fujitsu Ltd | Whole-surface cut chip release device |
| JPH01158746A (en) * | 1987-12-15 | 1989-06-21 | Matsushita Electron Corp | Semiconductor chip pickup device |
| WO2022176076A1 (en) * | 2021-02-17 | 2022-08-25 | 株式会社新川 | Pick-up device and pick-up method for semiconductor die |
-
1986
- 1986-04-17 JP JP5819686U patent/JPS62170637U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01109729A (en) * | 1987-10-22 | 1989-04-26 | Fujitsu Ltd | Whole-surface cut chip release device |
| JPH01158746A (en) * | 1987-12-15 | 1989-06-21 | Matsushita Electron Corp | Semiconductor chip pickup device |
| WO2022176076A1 (en) * | 2021-02-17 | 2022-08-25 | 株式会社新川 | Pick-up device and pick-up method for semiconductor die |
| JP7145557B1 (en) * | 2021-02-17 | 2022-10-03 | 株式会社新川 | Semiconductor die pick-up device and pick-up method |