JPH03104736U - - Google Patents
Info
- Publication number
- JPH03104736U JPH03104736U JP1286890U JP1286890U JPH03104736U JP H03104736 U JPH03104736 U JP H03104736U JP 1286890 U JP1286890 U JP 1286890U JP 1286890 U JP1286890 U JP 1286890U JP H03104736 U JPH03104736 U JP H03104736U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- holding part
- suction holding
- suction
- pyramid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図は、本考案の一実施例を示し、半導体チ
ツプを正常に吸着保持している状態を示す断面図
、第２図は、半導体チツプが傾斜した状態で吸着
保持している様子を示す斜視図、第３図は、半導
体の製造工程における移送の一例を示す斜視図、
第４図は、従来のコレツトの吸着状態を示す断面
図である。
１……半導体チツプ、２……コレツト、３……
吸着保持部、３ａ……側面、３ｂ……天井面、５
……収納トレイ、６……凹部、θ……傾斜角。
Fig. 1 shows an embodiment of the present invention, and is a cross-sectional view showing a state in which a semiconductor chip is normally suctioned and held, and Fig. 2 shows a state in which a semiconductor chip is suctioned and held in an inclined state. A perspective view, FIG. 3 is a perspective view showing an example of transfer in a semiconductor manufacturing process,
FIG. 4 is a sectional view showing the adsorption state of a conventional collet. 1...Semiconductor chip, 2...Collection, 3...
Suction holding part, 3a...Side surface, 3b...Ceiling surface, 5
...Storage tray, 6...Recess, θ...Inclination angle.
Claims (1)
成するとともに上記吸着保持部と連通する吸気孔
を設け、上記吸気孔を通して空気を吸引すること
により上記吸着保持部内に半導体チツプを吸着保
持するようにした半導体チツプ吸着用コレツトに
おいて、 上記半導体チツプの平面よりも僅かに大きく形
成された開口面と、 上記半導体チツプの平面よりも僅かに小さく形
成された天井面と、 上記開口面と上記天井面との間に設けられた側
面とにより上記角錐状の吸着保持部を形成し、 上記天井面に対する上記側面の傾斜角度が所定
の角度以下となるように上記天井面および開口面
の大きさを設定することにより、上記コレツト本
体の下端から至近距離の側面上において上記半導
体チツプを吸着保持するようにしたことを特徴と
する半導体チツプ吸着用コレツト。[Claims for Utility Model Registration] A pyramid-shaped suction holding part is formed in the lower part of the collet body, and an intake hole communicating with the suction holding part is provided. A semiconductor chip suction collet configured to suction and hold a semiconductor chip includes: an opening surface formed slightly larger than the plane of the semiconductor chip; a ceiling surface formed slightly smaller than the plane of the semiconductor chip; The pyramid-shaped suction holding part is formed by the side surface provided between the opening surface and the ceiling surface, and the ceiling surface and A collection for suctioning a semiconductor chip, characterized in that the size of the opening surface is set so that the semiconductor chip is suctioned and held on a side surface at a close distance from the lower end of the collector body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1286890U JPH03104736U (en) | 1990-02-13 | 1990-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1286890U JPH03104736U (en) | 1990-02-13 | 1990-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104736U true JPH03104736U (en) | 1991-10-30 |
Family
ID=31516315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1286890U Pending JPH03104736U (en) | 1990-02-13 | 1990-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104736U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018074028A (en) * | 2016-10-31 | 2018-05-10 | 富士ゼロックス株式会社 | Housing device and manufacturing method for substrate device |
-
1990
- 1990-02-13 JP JP1286890U patent/JPH03104736U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018074028A (en) * | 2016-10-31 | 2018-05-10 | 富士ゼロックス株式会社 | Housing device and manufacturing method for substrate device |
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