JPS6260039U - - Google Patents
Info
- Publication number
- JPS6260039U JPS6260039U JP1985141948U JP14194885U JPS6260039U JP S6260039 U JPS6260039 U JP S6260039U JP 1985141948 U JP1985141948 U JP 1985141948U JP 14194885 U JP14194885 U JP 14194885U JP S6260039 U JPS6260039 U JP S6260039U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- mounting shaft
- compressed air
- collector body
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Description
第１図はこの考案の一実施例による半導体装置
組立用コレツトの断面図、第２図はこの考案によ
る上記半導体装置組立用コレツトの立体図、第３
図は従来の半導体部品封止作業を示す説明図であ
る。
図において、１は半導体装置、２は半導体部品
、６はコレツト本体、７は窪み、８は穴、９は溝
、１０は取付用軸である。なお、各図中同一部分
または相当部分は同一符号により示す。
FIG. 1 is a sectional view of a collet for assembling a semiconductor device according to an embodiment of this invention, FIG. 2 is a three-dimensional view of the collet for assembling a semiconductor device according to this invention, and FIG.
The figure is an explanatory diagram showing a conventional semiconductor component sealing operation. In the figure, 1 is a semiconductor device, 2 is a semiconductor component, 6 is a collector body, 7 is a recess, 8 is a hole, 9 is a groove, and 10 is a mounting shaft. In addition, the same parts or corresponding parts in each figure are indicated by the same reference numerals.
Claims (1)
た取付用軸と、該取付用軸の下端に取付けられた
コレツト本体と、該コレツト本体の底面部に半導
体部品収納可能に設けられた窪みと、該窪み中央
より上記取付用軸まで貫通し、半導体部品を真空
吸着または圧空押付けする穴と、上記窪み側面に
複数個設けられた溝とからなることを特徴とする
半導体装置組立用コレツト。 A mounting shaft consisting of a hollow shaft and connected to a vacuum/compressed air supply section, a collector body attached to the lower end of the mounting shaft, and a recess provided in the bottom of the collector body to accommodate semiconductor components. A collet for assembling a semiconductor device, comprising: a hole penetrating from the center of the recess to the mounting shaft for vacuum suction or compressed air pressing of a semiconductor component; and a plurality of grooves provided on the side surface of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985141948U JPS6260039U (en) | 1985-09-19 | 1985-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985141948U JPS6260039U (en) | 1985-09-19 | 1985-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260039U true JPS6260039U (en) | 1987-04-14 |
Family
ID=31050210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985141948U Pending JPS6260039U (en) | 1985-09-19 | 1985-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260039U (en) |
-
1985
- 1985-09-19 JP JP1985141948U patent/JPS6260039U/ja active Pending