JPH0434740U - - Google Patents
Info
- Publication number
- JPH0434740U JPH0434740U JP7601490U JP7601490U JPH0434740U JP H0434740 U JPH0434740 U JP H0434740U JP 7601490 U JP7601490 U JP 7601490U JP 7601490 U JP7601490 U JP 7601490U JP H0434740 U JPH0434740 U JP H0434740U
- Authority
- JP
- Japan
- Prior art keywords
- porous member
- semiconductor
- pellet
- pick
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案に係る半導体ペレツトのピツク
アツプ装置の略示的断面図、第２図は同ピツクア
ツプ装置の平面図、第３図は同ピツクアツプ装置
の動作状態を示す要部のみの拡大断面図、第４図
は従来例のテーブルにおける吸着状態を示す説明
図である。
１１……テーブル、１２……テーブルの胴部、
１３……アダプター、１４……ポーラス部材、１
５……吸引領域、１６……ピストン、１７……ピ
ストンロツド、１８……針状部材、１９……貫通
孔、２０……接続部、２１……粘着シート、２２
……ペレツト、２３……コレツト。
FIG. 1 is a schematic sectional view of a semiconductor pellet pick-up device according to the present invention, FIG. 2 is a plan view of the pick-up device, and FIG. 3 is an enlarged sectional view of only the main parts showing the operating state of the pick-up device. , FIG. 4 is an explanatory diagram showing the suction state on a conventional table. 11... table, 12... body of table,
13...Adapter, 14...Porous member, 1
5... Suction area, 16... Piston, 17... Piston rod, 18... Needle member, 19... Through hole, 20... Connection portion, 21... Adhesive sheet, 22
...Pellet, 23...Collet.
Claims (1)
半導体ウエーハの各ペレツトを粘着シートからピ
ツクアツプするピツクアツプ装置であつて、前記
半導体ウエーハが載置されるテーブルの吸着面が
ポーラス部材で形成され、該ポーラス部材を貫通
し前記粘着シートの下面から対応するペレツトを
突き上げる針状部材が進退するように構成された
ことを特徴とする半導体ペレツトのピツクアツプ
装置。 (2) ポーラス部材の下部に、ポーラス部材の全
面が吸引作用を行うよう、吸引領域が設けられた
請求項(1)記載の半導体ペレツトのピツクアツプ
装置。 (3) 進退する針状部材が複数本である請求項(1)
又は(2)記載の半導体ペレツトのピツクアツプ装
置。[Claims for Utility Model Registration] (1) A pick-up device that picks up each pellet of a semiconductor wafer divided into pellets along a street from an adhesive sheet, wherein the suction surface of the table on which the semiconductor wafer is placed is 1. A device for picking up semiconductor pellets, characterized in that a needle-like member made of a porous member moves back and forth through the porous member and pushes up a corresponding pellet from the lower surface of the adhesive sheet. (2) The device for picking up semiconductor pellets according to claim (1), wherein a suction area is provided below the porous member so that the entire surface of the porous member performs a suction action. (3) Claim (1) in which there is a plurality of needle-like members that advance and retreat.
Or the semiconductor pellet pick-up device described in (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7601490U JPH0434740U (en) | 1990-07-17 | 1990-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7601490U JPH0434740U (en) | 1990-07-17 | 1990-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434740U true JPH0434740U (en) | 1992-03-23 |
Family
ID=31617103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7601490U Pending JPH0434740U (en) | 1990-07-17 | 1990-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434740U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078388A (en) * | 2006-09-21 | 2008-04-03 | Shin Etsu Polymer Co Ltd | Holding tool |
| JP2013172042A (en) * | 2012-02-22 | 2013-09-02 | Mitsubishi Electric Corp | Chip pickup device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60102754A (en) * | 1983-11-09 | 1985-06-06 | Nec Corp | Chip isolating mechanism |
| JPS6144842B2 (en) * | 1980-05-15 | 1986-10-04 | Emu Deii Corp |
-
1990
- 1990-07-17 JP JP7601490U patent/JPH0434740U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144842B2 (en) * | 1980-05-15 | 1986-10-04 | Emu Deii Corp | |
| JPS60102754A (en) * | 1983-11-09 | 1985-06-06 | Nec Corp | Chip isolating mechanism |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078388A (en) * | 2006-09-21 | 2008-04-03 | Shin Etsu Polymer Co Ltd | Holding tool |
| JP4662284B2 (en) * | 2006-09-21 | 2011-03-30 | 信越ポリマー株式会社 | Holding jig |
| JP2013172042A (en) * | 2012-02-22 | 2013-09-02 | Mitsubishi Electric Corp | Chip pickup device |
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