JPH0412700U - - Google Patents
Info
- Publication number
- JPH0412700U JPH0412700U JP5344190U JP5344190U JPH0412700U JP H0412700 U JPH0412700 U JP H0412700U JP 5344190 U JP5344190 U JP 5344190U JP 5344190 U JP5344190 U JP 5344190U JP H0412700 U JPH0412700 U JP H0412700U
- Authority
- JP
- Japan
- Prior art keywords
- vertically movable
- semiconductor chip
- collet
- suction hole
- die bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
Description
第１図は本考案の一実施例の断面図、第２図は
従来の半導体チツプ用ダイボンダの一例の断面図
である。
１……テープ、２……半導体チツプ、３……上
下動針、４……固定筒、５……上下動ノズル、６
……上下動筒、７……基板、８，８Ａ……側壁、
１０，１０Ａ……コレツト。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of an example of a conventional die bonder for semiconductor chips. 1...Tape, 2...Semiconductor chip, 3...Vertical moving needle, 4...Fixed tube, 5...Vertical moving nozzle, 6
...Vertical cylinder, 7... Board, 8, 8A... Side wall,
10,10A...Collect.
Claims (1)
真空吸着するための吸着孔を有するコレツトと前
記半導体チツプを下から押し上げる上下動針とか
らなるピツクアツプ部を有する半導体チツプ用ダ
イボンダにおいて、前記コレツトは先端部の少く
とも対向する外周部に半導体チツプを保持するた
めのテーパを有する側壁が設けられた上下動筒と
、この上下動筒内に設けられ吸着孔を有する上下
動ノズルとから構成されていることを特徴とする
半導体チツプ用ダイボンダ。 A die bonder for semiconductor chips has a pick-up section consisting of a collet having a suction hole for vacuum suctioning a semiconductor chip attached to a tape from above and a vertical moving needle for pushing up the semiconductor chip from below, and the collet has a tip end. consisting of a vertically movable cylinder having tapered side walls for holding a semiconductor chip on at least opposing outer peripheries thereof, and a vertically movable nozzle provided within the vertically movable cylinder and having a suction hole. A die bonder for semiconductor chips characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344190U JPH0412700U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344190U JPH0412700U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412700U true JPH0412700U (en) | 1992-01-31 |
Family
ID=31574627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5344190U Pending JPH0412700U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412700U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5470293U (en) * | 1977-10-28 | 1979-05-18 |
-
1990
- 1990-05-22 JP JP5344190U patent/JPH0412700U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5470293U (en) * | 1977-10-28 | 1979-05-18 | ||
| JPS573311Y2 (en) * | 1977-10-28 | 1982-01-21 |
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