JPH03102798U - - Google Patents
Info
- Publication number
- JPH03102798U JPH03102798U JP1201090U JP1201090U JPH03102798U JP H03102798 U JPH03102798 U JP H03102798U JP 1201090 U JP1201090 U JP 1201090U JP 1201090 U JP1201090 U JP 1201090U JP H03102798 U JPH03102798 U JP H03102798U
- Authority
- JP
- Japan
- Prior art keywords
- board
- bonding head
- transfer
- head
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
Description
第１図はこの考案の一実施例を示す斜視図、第
２図はこの考案の一実施例によるボンデイング状
態を示す正面図、第３図はこの種の従来装置を示
す斜視図である。
図中、１……吸着ヘツド、２……ホルダ、６…
…レール、７……ＩＣ部品、８……基板、９……
ボンデイングヘツドである。なお、図中同一符号
は同一又は相当部分を示す。
FIG. 1 is a perspective view showing an embodiment of this invention, FIG. 2 is a front view showing a bonding state according to an embodiment of this invention, and FIG. 3 is a perspective view showing a conventional device of this type. In the figure, 1... suction head, 2... holder, 6...
...Rail, 7...IC parts, 8...Board, 9...
It is a bonding head. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
、移載後ＩＣのリードと基板のパターンとを半田
付けするボンデイングヘツドとを、同一レール上
に移動可能に併設したものにおいて、上記吸着ヘ
ツドをボンデイングヘツドと干渉しないようホル
ダに水平に設置したことを特徴とするＩＣ用移載
装置。 A suction head that suctions an IC and transfers it onto a board, and a bonding head that solders the IC leads and a pattern on the board after the transfer are movably installed together on the same rail. An IC transfer device characterized in that the IC is installed horizontally in a holder so as not to interfere with a bonding head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1201090U JPH03102798U (en) | 1990-02-09 | 1990-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1201090U JPH03102798U (en) | 1990-02-09 | 1990-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102798U true JPH03102798U (en) | 1991-10-25 |
Family
ID=31515511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1201090U Pending JPH03102798U (en) | 1990-02-09 | 1990-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102798U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179795A (en) * | 1986-02-03 | 1987-08-06 | ティーディーケイ株式会社 | Method for attaching electronic parts |
| JPH01254000A (en) * | 1988-04-04 | 1989-10-11 | Hitachi Ltd | Correction device for inserting position of printed board parts |
-
1990
- 1990-02-09 JP JP1201090U patent/JPH03102798U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179795A (en) * | 1986-02-03 | 1987-08-06 | ティーディーケイ株式会社 | Method for attaching electronic parts |
| JPH01254000A (en) * | 1988-04-04 | 1989-10-11 | Hitachi Ltd | Correction device for inserting position of printed board parts |
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