JPS62179795A - Method for attaching electronic parts - Google Patents
Method for attaching electronic partsInfo
- Publication number
- JPS62179795A JPS62179795A JP61021600A JP2160086A JPS62179795A JP S62179795 A JPS62179795 A JP S62179795A JP 61021600 A JP61021600 A JP 61021600A JP 2160086 A JP2160086 A JP 2160086A JP S62179795 A JPS62179795 A JP S62179795A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- suction head
- substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 13
- 238000005476 soldering Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、チップ状電子部品等のリードレスの電子部品
をプリント基板等に装着するための電子部品の取り付け
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting method for mounting a leadless electronic component such as a chip-shaped electronic component onto a printed circuit board or the like.
（従来の技術）
従来、リードレスのチップ状電子部品をプリント基板に
装着する場合、プリント基板上に予め仮止め用の接着剤
を塗布しておき、その接着剤塗布位置にチップ状電子部
品を吸着ヘッドで吸着移送して取り付けるようにしてい
た。(Prior art) Conventionally, when mounting a leadless chip-shaped electronic component on a printed circuit board, an adhesive for temporary fixing is applied on the printed circuit board in advance, and the chip-shaped electronic component is placed at the position where the adhesive is applied. It used to be attached by suction and transfer using a suction head.
（発明が解決しようとする問題点）
ところで、従来のリードレスのチップ状電子部品の取り
付け方法であると、はんだ付け工程において最終的に電
子部品の電極と基板側導電パターンとをはんだ付けして
しまう前に、接着剤の接着力のばらつきや乾燥具合等に
起因して、基板に仮止めされていたチップ状電子部品が
基板取り扱い時の衝撃等で脱落してしまう不都合があっ
た。(Problems to be Solved by the Invention) By the way, in the conventional method for attaching leadless chip-shaped electronic components, the electrodes of the electronic component and the conductive pattern on the board are finally soldered together in the soldering process. Before storage, there is a problem in that chip-shaped electronic components temporarily attached to the board may fall off due to impact or the like when handling the board due to variations in adhesive strength or dryness of the adhesive.
（問題点を解決するための手段）
本発明は、上記の点に鑑み、吸着ヘッドによる電子部品
の基板上への移送と同時に基板側導電パターンへの電子
部品の接続固定を実行するようにして、従来の接着剤に
よる仮止めを不要とした電子部品の取り付け方法を提供
しようとするものである。(Means for Solving the Problems) In view of the above-mentioned points, the present invention connects and fixes the electronic component to the conductive pattern on the substrate side at the same time as the electronic component is transferred onto the substrate by the suction head. The present invention aims to provide a method for attaching electronic components that does not require temporary fixing using conventional adhesives.
本発明は、吸着ヘッドで電子部品を吸着して基板上に載
置し、この載置状態においてノズルより導電性接着剤、
溶融はんだ等の導電性物質を吐出して電子部品の電極と
基板側導電パターンとを接続固定することにより、上記
従来技術の問題点を解消している。In the present invention, an electronic component is suctioned by a suction head and placed on a substrate, and in this placed state, a conductive adhesive is applied from a nozzle.
The problems of the prior art described above are solved by discharging a conductive substance such as molten solder to connect and fix the electrodes of the electronic component and the conductive pattern on the substrate side.
（作用）
本発明の電子部品の取り付け方法では、電子部品を基板
上に移送した時に、導電性接着剤又ははんだにより基板
上の導電パターンに電子部品の電極を電気的に接続し、
かつ機械的に電子部品端部を固定できるから、仮止めの
接着剤及びその後のはんだ工程を不要にでとる。また、
電子部品は確実に固定されるから、電子部品を本発明に
より装着した基板に対し、別の工程で別個の電子部品を
挿入する等の作業を支障無く実行可能である。なお、電
子部品は、端部電極が無くとも、少なくとも一部が電子
部品端部に露出する電極部分があればよい。(Function) In the electronic component mounting method of the present invention, when the electronic component is transferred onto the substrate, the electrodes of the electronic component are electrically connected to the conductive pattern on the substrate using a conductive adhesive or solder,
In addition, since the ends of the electronic components can be fixed mechanically, temporary adhesives and subsequent soldering processes are unnecessary. Also,
Since the electronic components are securely fixed, operations such as inserting separate electronic components in a separate process into the board on which the electronic components are mounted according to the present invention can be carried out without any hindrance. Note that the electronic component does not need to have an end electrode as long as it has an electrode portion that is at least partially exposed at the end of the electronic component.
（実施例）
以下、本発明に係る電子部品の取り付け方法の実施例を
図面に従って説明する。(Example) Hereinafter, an example of the method for attaching an electronic component according to the present invention will be described with reference to the drawings.
第１図乃至第３図で本発明の第１実施例を説明する。こ
れらの図において、１は吸着ヘッドであり、ＸＹテーブ
ル機構等でプリント基板２上の任意の位置に移動（また
は基板側が移動）するようになっており、エアーシリン
グ等で碧降自在となっている。吸着へラド１の先端部分
の側方には一対のノズル３が配置されている。これらの
ノズル３も吸着ヘッド１とともに昇降自在である。A first embodiment of the present invention will be explained with reference to FIGS. 1 to 3. In these figures, 1 is a suction head, which can be moved to any position on the printed circuit board 2 (or the board side can be moved) by an XY table mechanism, etc., and can be freely moved by air sillage, etc. There is. A pair of nozzles 3 are arranged on the sides of the tip of the suction blade 1. These nozzles 3 can also be moved up and down together with the suction head 1.
まず、前記吸着ヘッド１は、リードレスの電子部品とし
てのチップ状電子部品４を供給部から真空吸引力を利用
して吸着してｖＳ１図のごとく基板２上の所定位置へ移
動する。First, the suction head 1 suctions a chip-shaped electronic component 4 as a leadless electronic component from a supply section using vacuum suction force, and moves it to a predetermined position on the substrate 2 as shown in FIG.
次に、第２図のように吸着ヘッド１は下降して基板２上
にチップ状電子部品４を載置する。このとき、電子部品
４の両端（短辺）の端部電極４Ａは基板側の導電パター
ン（配線パターン）５上に位置している。そして、吸着
へラド１によるチップ状電子部品４の吸着を継続した載
置状態において、電子部品４の両端部上方に開口してい
る７ズル３より一定量の導電性接着剤又は溶融状態のは
んだが吐出され、第３図のように導電性接着剤又ははん
だ６によりチップ状電子部品４の端部電極４Ａが導電パ
ターン５に電気的に接続され、かつ［１的にも固着され
る。Next, as shown in FIG. 2, the suction head 1 descends and places the chip-shaped electronic component 4 on the substrate 2. At this time, the end electrodes 4A at both ends (short sides) of the electronic component 4 are located on the conductive pattern (wiring pattern) 5 on the substrate side. Then, while the chip-shaped electronic component 4 is placed in a state where the suction spatula 1 continues to attract it, a certain amount of conductive adhesive or molten solder is applied from the seven nozzles 3 that are open above both ends of the electronic component 4. is discharged, and as shown in FIG. 3, the end electrode 4A of the chip-shaped electronic component 4 is electrically connected to the conductive pattern 5 by the conductive adhesive or solder 6, and is also fixed to [1].
なお、ノズル３がらの導電性接着剤又は溶融はんだの一
定量の吐出は、例えば導電性接着剤又は溶融はんだを空
気圧で作動するシリング内に満たし、このシリングとノ
ズル３とを連通させておき、吸着へラド１がチップ状電
子部品４を基板上に接触させたことをセンサー等で検知
し、前記シリングを一定量動かすことによって実行可能
である。In order to discharge a certain amount of the conductive adhesive or molten solder from the nozzle 3, for example, the conductive adhesive or molten solder is filled in a pneumatically actuated sill, and this sill is communicated with the nozzle 3. This can be carried out by detecting with a sensor or the like that the suction pad 1 has brought the chip-shaped electronic component 4 into contact with the substrate, and then moving the shilling by a certain amount.
また、ノズル３は吸着ヘッド側のＩｆｉ構と連動させて
もよいし、単独の機構としてもよい。Further, the nozzle 3 may be linked with the Ifi mechanism on the suction head side, or may be an independent mechanism.
上記第１実施例では端部電極を有するチップ状電子部品
を取り付ける場合を示したが、端部電極が無いチップ状
電子部品の場合にも本発明を適用できる。この場合を、
第４図乃至第６図で本発明の第２実施例として説明する
。Although the first embodiment described above shows a case where a chip-shaped electronic component having an end electrode is attached, the present invention can also be applied to a chip-shaped electronic component having no end electrode. In this case,
A second embodiment of the present invention will be explained with reference to FIGS. 4 to 6.
まず、前記吸着ヘッド１は、チップ状積層磁器コンデン
サ等であって端部電極を形成しないで省略したチップ状
電子部品７を供給部から真空吸引： 力
を利用しで吸着して第４図のごとく基板２上の所定位置
へ移動する。First, the suction head 1 uses a vacuum suction force to adsorb a chip-shaped electronic component 7, which is a chip-shaped multilayer ceramic capacitor or the like and is omitted without forming an end electrode, from a supply section, as shown in FIG. and move to a predetermined position on the board 2.
次に、第５図のように吸着へラド１は下降して基板２上
にチップ状電子部品７を載置する。このとき、電子部品
７の両端（短辺）は基板側の導電パターン（配線パター
ン）５上に位置している。そして、吸着ヘッド１による
チップ状電子部品７の吸着を継続した載置状態において
、ノズル３より一定量の導電性接着剤（又は溶融状態の
はんだ）が吐出され、第６図のように導電性接着剤６に
よりチップ状電子部品７の内部電極７Ａの端部露出部分
が導電パターン５に電気的に接続され、かつ電子部品７
の端部は機械的にも固着される。Next, as shown in FIG. 5, the suction pad 1 descends and places the chip-shaped electronic component 7 on the substrate 2. At this time, both ends (short sides) of the electronic component 7 are located on the conductive pattern (wiring pattern) 5 on the board side. Then, in the placed state where the chip-shaped electronic component 7 continues to be attracted by the suction head 1, a certain amount of conductive adhesive (or molten solder) is discharged from the nozzle 3, and as shown in FIG. The exposed end portion of the internal electrode 7A of the chip-shaped electronic component 7 is electrically connected to the conductive pattern 5 by the adhesive 6, and the electronic component 7
The ends are also mechanically secured.
（発明の効果）
以上説明したように、本発明の電子部品の取り付け方法
によれば、吸着ヘッドで電子部品を吸着して基板上に載
置し、この載置状態においてノズルより導電性接着剤、
溶融はんだ等の導電性物質を吐出して電子部品の電極と
基板側導電パターンとを電気的に接続しかつ当該電子部
品を固定するようにしたので、従来の接着剤による仮止
めやその後のはんだ工程を不要にでき、電子部品の装着
工数の低減が可能である。また、電子部品は吸着ヘッド
による移送と同時に基板に確実に固定されるため、後工
程で別の電子部品等の挿入を支障なく実行することが可
能な利点がある。(Effects of the Invention) As explained above, according to the electronic component mounting method of the present invention, the electronic component is suctioned by the suction head and placed on the substrate, and in this placed state, the conductive adhesive is applied from the nozzle. ,
By discharging a conductive substance such as molten solder, the electrodes of the electronic component and the conductive pattern on the board are electrically connected and the electronic component is fixed, eliminating the need for temporary fixing using conventional adhesives or subsequent soldering. It is possible to eliminate the need for a process and reduce the number of steps needed to install electronic components. Furthermore, since the electronic component is securely fixed to the substrate at the same time as it is transferred by the suction head, there is an advantage that it is possible to insert other electronic components or the like in a subsequent process without any trouble.
第１図乃至第３図は本発明に係る電子部品の取り付け方
法の第１実施例を説明する正断面図、第４図乃至ＰｊＳ
Ｇ図は第２実施例を説明する正断面図である。
１・・・吸着ヘッド、２・・・プリント基板、３・・・
ノズル、４，７・・・チップ状電子部品、５・・・導電
パターン、６・・・導電性接着剤又ははんだ。1 to 3 are front sectional views illustrating a first embodiment of the method for attaching electronic components according to the present invention, and FIG. 4 to PjS
FIG. G is a front sectional view illustrating the second embodiment. 1... Suction head, 2... Printed circuit board, 3...
Nozzle, 4, 7... Chip-shaped electronic component, 5... Conductive pattern, 6... Conductive adhesive or solder.
Claims (1)
、この載置状態においてノズルより導電性接着剤、溶融
はんだ等の導電性物質を吐出して電子部品の電極と基板
側導電パターンとを電気的に接続しかつ当該電子部品を
固定することを特徴とする電子部品の取り付け方法。(1) The suction head picks up the electronic component and places it on the board, and in this placed state, a conductive substance such as conductive adhesive or molten solder is discharged from the nozzle to conduct electricity between the electrodes of the electronic component and the board side. A method for attaching an electronic component, the method comprising electrically connecting the electronic component to a pattern and fixing the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61021600A JPH0750828B2 (en) | 1986-02-03 | 1986-02-03 | How to install electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61021600A JPH0750828B2 (en) | 1986-02-03 | 1986-02-03 | How to install electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62179795A true JPS62179795A (en) | 1987-08-06 |
| JPH0750828B2 JPH0750828B2 (en) | 1995-05-31 |
Family
ID=12059528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61021600A Expired - Lifetime JPH0750828B2 (en) | 1986-02-03 | 1986-02-03 | How to install electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0750828B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102798U (en) * | 1990-02-09 | 1991-10-25 | ||
| JPH04268790A (en) * | 1991-02-25 | 1992-09-24 | Yamatake Honeywell Co Ltd | Circuit board manufacturing method and device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190769A (en) * | 1981-05-20 | 1982-11-24 | Toshiba Corp | Dropping device for molten solder |
| JPS58119461A (en) * | 1981-12-30 | 1983-07-15 | Higashiyama Denki Kogyo Kk | Soldering device |
| JPS60257587A (en) * | 1984-06-04 | 1985-12-19 | 松下電器産業株式会社 | Soldering method |
-
1986
- 1986-02-03 JP JP61021600A patent/JPH0750828B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190769A (en) * | 1981-05-20 | 1982-11-24 | Toshiba Corp | Dropping device for molten solder |
| JPS58119461A (en) * | 1981-12-30 | 1983-07-15 | Higashiyama Denki Kogyo Kk | Soldering device |
| JPS60257587A (en) * | 1984-06-04 | 1985-12-19 | 松下電器産業株式会社 | Soldering method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102798U (en) * | 1990-02-09 | 1991-10-25 | ||
| JPH04268790A (en) * | 1991-02-25 | 1992-09-24 | Yamatake Honeywell Co Ltd | Circuit board manufacturing method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0750828B2 (en) | 1995-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4682207A (en) | Semiconductor device including leadless packages and a base plate for mounting the leadless packages | |
| US4836435A (en) | Component self alignment | |
| JPS62179795A (en) | Method for attaching electronic parts | |
| JP2002368403A (en) | Mounting structure, manufacturing method therefor, printing mask and printing method | |
| JPS62179796A (en) | Apparatus for attaching electronic parts | |
| JPH01143389A (en) | Hybrid integrated circuit device | |
| JP2571366B2 (en) | How to attach electronic components | |
| JPH04336490A (en) | Method for forming reflow solder | |
| JPH06275944A (en) | Soldering method | |
| JP2858318B2 (en) | Electronic component mounting method | |
| JPS6366078B2 (en) | ||
| JPS62186591A (en) | Apparatus for attaching electronic parts | |
| JP3893687B2 (en) | Mounting structure and mounting method for surface mount components | |
| JPS62202586A (en) | Electronic parts fitting structure | |
| JP3471377B2 (en) | Electronic component soldering method | |
| JP3764307B2 (en) | Printing machine for printed wiring board and method for manufacturing electronic circuit | |
| JP2666076B2 (en) | Electronic component mounting device | |
| JPS5910768Y2 (en) | Printed board | |
| JPS634690A (en) | Thick film hybrid integrated circuit substrate | |
| JPH03228388A (en) | Circuit board | |
| JPH0252495A (en) | Method of mounting flat package ic | |
| JPS62120100A (en) | Method of mounting chip parts on printed wiring board | |
| JPH01303785A (en) | Connection structure of multi-terminal electronic component | |
| JPH1140911A (en) | Printed board | |
| JPH0691178B2 (en) | Soldering method to thick film IC |