JPS58119461A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS58119461A JPS58119461A JP21530981A JP21530981A JPS58119461A JP S58119461 A JPS58119461 A JP S58119461A JP 21530981 A JP21530981 A JP 21530981A JP 21530981 A JP21530981 A JP 21530981A JP S58119461 A JPS58119461 A JP S58119461A
- Authority
- JP
- Japan
- Prior art keywords
- work
- tank
- nozzle
- heater
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 この発明は半田づけ装置に関する。[Detailed description of the invention] The present invention relates to a soldering device.
詳しくは半田全装置内で加熱溶融して液状となし適量づ
つワーク上に滴下しつつ半田づけｔ行うようにしたもの
で、特に電子機器組立その他の量産ラインでの使用、す
なわち半田づけ作業の自動化に適した半田づけ装置に関
する。Specifically, the soldering device heats and melts the solder to a liquid state, which is then dripped onto the workpiece in appropriate amounts to perform soldering.It is particularly useful for use in mass production lines such as electronic device assembly, that is, to automate soldering work. This invention relates to a soldering device suitable for.
従来の半田づけは半田とてと半田を第１図に示すように
ワーク上で近接させ、こて２１の熱で半田２２を溶融し
て半田づけ全行っていた。しかしこの場合は半田こてや
半田がワークに接触するので電子部品のような傷つき易
い物に対しては細心の注意が必要となり、特に半田づけ
作業全目動化する場合の大きな問題となっていた。また
場合によってはワーク面を予熱する必要があり、この場
合は別の予熱装置を用いるのが常であった。さらに半田
とてと半田給供口と少なくとも２個の部材が半田づけ箇
所に並ぶことになるので単に体裁上の問題のみならず作
業上の邪魔になることがあった。In conventional soldering, the solder tip and the solder are brought close to each other on the workpiece as shown in FIG. 1, and the solder 22 is melted by the heat of the iron 21 to perform the entire soldering. However, in this case, the soldering iron and solder come into contact with the workpiece, so extreme care must be taken when dealing with easily damaged items such as electronic components, which is a major problem especially when soldering work is fully automated. Ta. Further, in some cases, it is necessary to preheat the work surface, and in this case, a separate preheating device has usually been used. Furthermore, since the solder tip and the solder supply port and at least two other members are lined up at the soldering location, there are not only aesthetic problems but also problems with the work.
この発明は上記の如き従来の才田とての欠点を改めるた
めになさ汎たもので、概説すると、耐熱性のケーシング
内にヒータを付設し半田補給路を有したタンクを設け、
同タンクの一端から溶融半田の供給ノズルを導出し、同
ノズル外周には第二のヒ・−夕を巻装し、さらにケーシ
ングを前記タンクとの間隙部に外気全取入汎る空気取入
口をケーシングに設けるとともにｍＪ記間隙部全前記ノ
ズルの先端部附近で外部に向は開放し、前記タンクの前
記ノズル導出端と反対側の端部に圧縮空気の供符号１は
ケーシングで耐熱性素材で形成される。This invention was developed in order to correct the above-mentioned drawbacks of the conventional solder, and can be summarized as follows: A tank with a heater and a solder supply path is provided inside a heat-resistant casing.
A supply nozzle for molten solder is led out from one end of the tank, a second heater is wrapped around the outer periphery of the nozzle, and an air intake is installed in the gap between the casing and the tank to take in all of the outside air. is provided in the casing, and the entire gap mJ is open to the outside near the tip of the nozzle, and the compressed air is supplied to the end of the tank opposite to the nozzle outlet end. is formed.
内部が透視できることが好ましいので耐熱ガラヌク外周
にヒータ３が巻か牡で半田補給路４から内部に入ｎらｎ
たたとえば線状半田ケ溶融するようにしている。ヒータ
３にはセンサーがっけら汎温度全目動調節する。符号５
は放熱板である。ケー３−
シングＪとタンク２との間には間隙部６を設は空気取入
ロアをケーシング壁部に貫設する。空気取入ロアにはパ
イプ（図示せず）が連絡さｎ間隙部６内に空気が強制供
給さｎる。タンク２の図中下端部にノズル８がケーシン
グ１の関目端よりやや長めてで導出さｎる。符号９は第
２のヒータで半田のノズル内での同化を防止するととも
に間隙部６内の空気を加熱する。タンク２の図中上端部
に圧縮空気の供給路１０が設けらｎコントローラ１２を
通じコンプレッサ（図示せず）に連通している。この圧
縮空気の供給路１０を通じて、先ず、溶融半田がタンク
２からノズル８を通じて押し出さ扛てワーク１１上に滴
下さｎ、次に、負圧が刀）けら汎て必要以上の滴下が防
止さｎる。空気取入ロアから適宜導入さｎた外気はヒー
タ９によって加熱さｎワーク面の予熱を行う。ヒータ９
のオンオフはタイマーにより行うことができる。符号１
３はケーシング１のキャンプで目動上下機構（図示せず
）に取り付ける場合はこの部分を保持させることができ
る。また手作業用の装置の場合４−
はこの部分を把手状に形成すわばよい。It is preferable that the inside can be seen through, so the heater 3 is wrapped around the outer circumference of the heat-resistant galanium, and the solder supply path 4 is inserted into the inside.
For example, linear solder is melted. The heater 3 is equipped with a sensor that controls the temperature in all directions. code 5
is a heat sink. Casing 3 - A gap 6 is provided between the casing J and the tank 2, and an air intake lower is provided through the casing wall. A pipe (not shown) is connected to the air intake lower, and air is forcibly supplied into the gap 6. A nozzle 8 is led out at the lower end of the tank 2 in the figure, slightly longer than the end of the casing 1. Reference numeral 9 denotes a second heater that prevents solder from being assimilated within the nozzle and heats the air within the gap 6. A compressed air supply path 10 is provided at the upper end of the tank 2 in the figure, and communicates with a compressor (not shown) through a controller 12. Through this compressed air supply path 10, the molten solder is first pushed out from the tank 2 through the nozzle 8 and drips onto the workpiece 11.Next, negative pressure is applied to prevent more dripping than necessary. Ru. The outside air introduced from the air intake lower is heated by the heater 9 to preheat the work surface. Heater 9
can be turned on and off using a timer. code 1
3 is a camp of the casing 1, which can be held when attached to a moving up/down mechanism (not shown). In the case of a manual device, this part may be formed into a handle shape.
泰
以」−のように構成さｆ′した結果を発明による半田づ
け装置は次のような利点？有する。先ず、装置全体はケ
ーシング１ というコンパクトな形になり目動上下機構
等に付設し易くなる。ノズル８の先端はワーク１１に接
触することがないのでワーク而全損傷する心配はなくな
る。半田の滴下量は圧縮空気の流入量やノズルの適宜数
ジ替えによって加減できるので便利である。壕り圧力を
コントロールできるので滴下量は一定に保つことができ
るから溶接部がき庇いに仕上る。熱風がワーク面に吹き
つけら扛るので特別の予熱装＠を必要としないから装置
全体としてコンパクトなものとなり目動機器への組み込
みが容易となる。What are the following advantages of the soldering device according to the invention, which is constructed as follows? have First of all, the entire device has a compact shape with a casing 1, which makes it easy to attach it to a moving up/down mechanism. Since the tip of the nozzle 8 does not come into contact with the workpiece 11, there is no fear that the workpiece will be completely damaged. It is convenient because the amount of solder dripped can be adjusted by changing the amount of compressed air flowing in or changing the nozzle several times. Since the trench pressure can be controlled, the amount of dripping can be kept constant, so the welded area can be finished as an eave. Since the hot air is blown onto the work surface, no special preheating equipment is required, making the entire device compact and easy to incorporate into moving equipment.
４４、図面の簡単な説明
５−
］・・−・・・・・・・・ケーシング ２ ・・・・
°・・・タンク３ ・−・・・・・・・・・ヒータ
４・・・・・・・・・・・半田補給路５・・・・・・
・・・・放熱板 ６・・・・ 間隙部７・・・・
・・・・ 空気取入口 ８・ ・ ノズル９・・・
・・・・・・・・・・第２のヒータ１．０・・・・・・
・・・・・圧縮空気供給路代理人 木 村 進 でテ
、ｊ］。44. Brief explanation of the drawings 5-]...Casing 2...
°・・・Tank 3 ・−・・・・・・・・・Heater
4・・・・・・・・・Solder supply route 5・・・・・・
... Heat sink 6 ... Gap section 7 ...
... Air intake 8. Nozzle 9...
・・・・・・・・・Second heater 1.0・・・・・・
...Susumu Kimura, agent for compressed air supply route].
゛オ 第１図 □ ３２１−Oh Figure 1 □ 321-
Claims (1)
け、同タンクの一端ヵ）らノズル８を４出するとともに
その外周に第２のヒータ９を設け、さらにケーシングＪ
と前記タンク２との間隙部６に外気を取９入几る空気取
入ロアをケーシング１の壁部に設けるとともに前記間隙
部６を前記ノズルの先端部附近で外部に向Ｉｒｆ８の導
出端とは反対側の端部に圧縮空気の供給路］０を設けた
ことを特徴とする半田づけ装置。[Scope of Claims] 1. A molten solder tank 2 with a heater 3 and a solder supply path 4 is provided in a casing 1 made of a heat-resistant material, and a nozzle 8 is inserted from one end of the tank into a molten solder tank 2. At the same time, a second heater 9 is provided on the outer periphery of the casing J.
An air intake lower is provided on the wall of the casing 1 to introduce outside air into the gap 6 between the tank 2 and the tank 2, and the gap 6 is connected to the outside near the tip of the nozzle with the outlet end of the Irf 8. A soldering device characterized in that a compressed air supply path]0 is provided at the opposite end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21530981A JPS58119461A (en) | 1981-12-30 | 1981-12-30 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21530981A JPS58119461A (en) | 1981-12-30 | 1981-12-30 | Soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58119461A true JPS58119461A (en) | 1983-07-15 |
Family
ID=16670180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21530981A Pending JPS58119461A (en) | 1981-12-30 | 1981-12-30 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58119461A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60186027A (en) * | 1984-02-27 | 1985-09-21 | Sanken Electric Co Ltd | Forming method for solder layer and solder supply device used therefor |
| JPS62179795A (en) * | 1986-02-03 | 1987-08-06 | ティーディーケイ株式会社 | Method for attaching electronic parts |
| EP0266843A2 (en) * | 1986-11-05 | 1988-05-11 | Philips Patentverwaltung GmbH | Device for depositing amounts of droplet-shaped solder on surfaces to be wetted |
| FR2670505A1 (en) * | 1990-12-17 | 1992-06-19 | Solems Sa | METHOD AND APPARATUS FOR SUPPLYING A METALLIC COMPOUND MADE OF A SUBSTRATE. |
| CN103639604A (en) * | 2013-12-16 | 2014-03-19 | 西南交通大学 | Liquid molten drop control based welding-brazing method and device |
-
1981
- 1981-12-30 JP JP21530981A patent/JPS58119461A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60186027A (en) * | 1984-02-27 | 1985-09-21 | Sanken Electric Co Ltd | Forming method for solder layer and solder supply device used therefor |
| JPS62179795A (en) * | 1986-02-03 | 1987-08-06 | ティーディーケイ株式会社 | Method for attaching electronic parts |
| EP0266843A2 (en) * | 1986-11-05 | 1988-05-11 | Philips Patentverwaltung GmbH | Device for depositing amounts of droplet-shaped solder on surfaces to be wetted |
| US4828886A (en) * | 1986-11-05 | 1989-05-09 | U.S. Philips Corporation | Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for carrying out the method |
| FR2670505A1 (en) * | 1990-12-17 | 1992-06-19 | Solems Sa | METHOD AND APPARATUS FOR SUPPLYING A METALLIC COMPOUND MADE OF A SUBSTRATE. |
| CN103639604A (en) * | 2013-12-16 | 2014-03-19 | 西南交通大学 | Liquid molten drop control based welding-brazing method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4426571A (en) | Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies | |
| CN105689831A (en) | Steam reflow apparatus and steam reflow method | |
| CN105772886A (en) | Through hole reflow soldering device and control method thereof | |
| US3614389A (en) | Electrically heated dental wax supplying and manipulating tools | |
| CN105772887A (en) | Multifunctional reflow soldering device and control method thereof | |
| JPS58119461A (en) | Soldering device | |
| AU738294B2 (en) | High frequency induction fusing | |
| JP2013201128A (en) | Hot gas torches, hot gas torch systems and hot gas heating methods | |
| CN205702762U (en) | A kind of Multifunctional reflux welder | |
| SE7704799L (en) | DEVICE FOR CONTINUOUS AND AUTOMATIC SUPPLY OF MELTED METAL OR METAL ALLOY TO OVENS, WHICH ARE ARRANGED TO FEED MACHINES FOR MOLDING METALS AND ALLOYS | |
| US5146694A (en) | Vapor reflow type soldering apparatus | |
| JPH04186852A (en) | Bonding equipment | |
| JPH077021Y2 (en) | Air heater | |
| US20060054658A1 (en) | Electrically-controlled soldering pot apparatus | |
| JPS5927771A (en) | Soldering device | |
| JPS57171570A (en) | Production of vessel having connecting pipe in refrigerator | |
| JPH087656Y2 (en) | Reflow furnace | |
| SE9102528D0 (en) | HOT GAS HEATING DEVICE | |
| JPH0577033A (en) | Method for soldering heat exchanger | |
| CN215787298U (en) | Reflow furnace for preventing solder paste from melting and flowing away | |
| JPS6384761A (en) | Automatic brazing device | |
| JPS5964162A (en) | Method and device for soldering | |
| CA1090990A (en) | Brazing heat exchanger tubes to headers | |
| KR870002147B1 (en) | Manufacturing method and equipment of stalpeth cable | |
| JPH0321812Y2 (en) |