CN105772886A - Through hole reflow soldering device and control method thereof - Google Patents
Through hole reflow soldering device and control method thereof Download PDFInfo
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- CN105772886A CN105772886A CN201610298723.3A CN201610298723A CN105772886A CN 105772886 A CN105772886 A CN 105772886A CN 201610298723 A CN201610298723 A CN 201610298723A CN 105772886 A CN105772886 A CN 105772886A
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- warm area
- furnace
- upper furnace
- outer housing
- guide rail
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a through hole reflow soldering device. The through hole reflow soldering device comprises a reflow soldering machine platform. A soldering machine platform cover which can be opened and closed is arranged at the back edge of the upper plane of the reflow soldering machine platform. The upper plane of the reflow soldering machine platform is provided with a product conveying line adjustable in width. The reflow soldering machine platform is internally provided with first lower furnace pipes and second lower furnace pipes from left to right in sequence. A first warm area upper furnace pipe used for air draft is arranged in the position, corresponding to each first lower furnace pipe, of the interior of the soldering machine platform cover. A second warm area upper furnace pipe blowing cold air downwards is arranged in the position, corresponding to each second lower furnace pipe, of the interior of the soldering machine platform cover. Each first warm area upper furnace pipe and the corresponding first lower furnace pipe form a first warm area. Each second warm area upper furnace pipe and the corresponding second lower furnace pipe form a second warm area. Air blocking curtains which are used for separating the cold air from hot air and can be stretched or shortened are arranged in the positions, located between the first warm areas and the second warm areas, of the product conveying line. The reflow soldering machine platform is provided with a man-machine control interface and further provided with a cooling area. The through hole reflow soldering device is suitable for soldering of through holes of PCBs, the soldering temperature is convenient to control, and the soldering effect is better.
Description
Technical field
The present invention relates to welding equipment of circuit board, particularly to a kind of Through-hole reflow device.
Background technology
At present, in the solder technology of circuit board, the welding equipment generally adopted is " wave-soldering ", wave-soldering is by tin bar melt into liquid by molten tin bath, utilize motor to stir and form crest, allow PCB and component weld, be commonly used in the welding of hands plug-in unit and the glue plate of smt.Reflow welding is used primarily in SMT industry, and the tin cream being printed on PCB fusing, by hot blast or the conduction of other heat radiations, is welded by it with component.But the Baking out mode of this kind of wave-soldering is to there are some defects: 1, wave-soldering first to spray scaling powder, then through preheating, welding, cooling zone.Reflow Soldering through preheating zone, recirculating zone, cooling zone.It addition, wave-soldering is applicable to hands plate and some offset plate, and requiring that all elements are heat-resisting, crossing crest surface cannot have the element of SMT tin cream, and the plank of SMT tin cream just may only cross Reflow Soldering, it is not possible to uses wave-soldering.2, weld defect is many, after back segment detects, if it find that solder skip, then needs artificial repair welding, and manual labor amount is big.3, the components and parts heatproof degree needed is high.4, the waste energy, the substantial amounts of soldering tin bar of every daily consumption and scaling powder.
Summary of the invention
It is an object of the invention to the drawbacks described above for prior art, a kind of temperature difference adding heat space that can make product process is provided to be maintained at a peak value, temperature difference fluctuation will not be made too big, it is easy to control temperature and the Through-hole reflow device that can upper and lower temperature be separated.
nullFor solving the drawbacks described above of prior art，Present invention provide the technical scheme that a kind of Through-hole reflow device，Including Reflow Soldering board，The upper plane back edge of described Reflow Soldering board is provided with a welding machine platform lid that can open and close，The upper plane of described Reflow Soldering board is provided with can the product pipeline of adjustment width，At least one upwards first lower furnace of blowing hot-air and at least one is to the second lower furnace of blowing up it is sequentially provided with from left to right in described Reflow Soldering board，In described welding machine platform lid, the position of corresponding first lower furnace is provided with the first warm area upper furnace of convulsion，In described welding machine platform lid, the position of corresponding described second lower furnace is provided with the second warm area upper furnace to fall wind，Described first warm area upper furnace and the first lower furnace form the first warm area，Described second warm area upper furnace and the second lower furnace form the second warm area，Described product pipeline is positioned at the position of described first warm area and described second warm area and is provided with for cold wind and hot blast being separated、And the screen that can stretch or shorten，Reflow Soldering board is provided with Human-machine Control interface，It is equipped with temperature sensor in described first warm area and described second warm area，It is provided with gas analyzer for O2 in described Reflow Soldering board，Described Reflow Soldering board is additionally provided with a cooling zone；
Described product pipeline includes dynamic guide rail and determines guide rail, the distance that described dynamic guide rail is moved forward and backward by multiple step motor control, regulate dynamic guide rail and the distance determined between guide rail, for carrying various sizes of product, the described two ends determining guide rail are respectively erected in the two ends of described Reflow Soldering board, described dynamic guide rail and determine to be equipped with on guide rail conveyer belt, described dynamic guide rail with determine guide rail is all interval with multiple locking device for locking product；
Described screen undulate, described screen is high temperature resistant heat insulation material, it is provided with screen between the posterior edges of described dynamic guide rail and described Reflow Soldering board, the described forward edge determining guide rail and described Reflow Soldering board is provided with screen, during described dynamic guide rail adjustable range forward, and described dynamic guide rail and determine guide rail distance and diminish, described screen is stretched, during described dynamic guide rail adjustable range backward, described dynamic guide rail becomes big with determining guide rail distance, and described screen shrinks.
A kind of improvement as Through-hole reflow device of the present invention, described first lower furnace includes lower furnace outer housing, lower furnace inner bag and two lower ventilating boards, flue connecting plate and the fixing seat of multiple heating wire it is provided with in described lower furnace outer housing, described lower furnace inner bag is arranged on described flue connecting plate, the fixing seat of multiple described heating wires is fixed with at least one heating wire simultaneously, the two ends of described heating wire are connected to described lower furnace outer housing both sides, lower wind wheel fan housing it is provided with in the cavity of described lower furnace inner bag, the cavities open place of described lower furnace inner bag is stamped heating board, described lower heating board is interval with several exhaust vents, two described lower ventilating boards are separately mounted to the both sides of described lower furnace outer housing, the middle part of described lower furnace outer housing is provided with lower furnace blower fan.
A kind of improvement as Through-hole reflow device of the present invention, during the work of described lower furnace blower fan, air after being heated by heating wire is sent in the cavity of lower furnace inner bag, after the cavity of described lower furnace inner bag, flowed out by the through hole of described lower heating board, cannot continuing to rise owing to being separated by screen between lower heating board and described first warm area upper furnace, hot-air flows in the cavity of lower furnace outer housing again, described heating wire again heat Posterior circle and utilize.
A kind of improvement as Through-hole reflow device of the present invention, described first warm area upper furnace includes the first upper furnace outer housing, ventilating board on first upper furnace inner bag and two first, it is provided with the first upper furnace connecting plate in the cavity of described first upper furnace outer housing, described first upper furnace inner bag is arranged on the first upper furnace connecting plate in the cavity of described first upper furnace outer housing, the cavities open of described first upper furnace inner bag is stamped on first heating board, on described first, heating board is provided with several exhaust vents, on two described first, ventilating board is separately positioned on the both sides of described first upper furnace outer housing, the middle part of described first upper furnace outer housing is provided with the first convulsion motor.
As a kind of improvement of Through-hole reflow device of the present invention, during described first convulsion motor operations, the hot-air of described first upper furnace inner bag is extracted out outside the first upper furnace outer housing.
A kind of improvement as Through-hole reflow device of the present invention, described second warm area upper furnace includes the second upper furnace outer housing, ventilating board on second upper furnace inner bag and two second, multiple second upper furnace connecting plate it is interval with in the cavity of described second upper furnace outer housing, described second upper furnace inner bag is arranged on the second upper furnace connecting plate in the cavity of described second upper furnace outer housing, it is provided with wind wheel fan housing in the cavity of described second upper furnace inner bag, the cavities open of described second upper furnace inner bag is stamped on second heating board, on described second, heating board is provided with several exhaust vents, on two described second, ventilating board is separately positioned on the both sides of described second upper furnace outer housing, the middle part of described second upper furnace outer housing is provided with a fan, the wind wheel of described fan stretches in described upper wind wheel fan housing.
A kind of improvement as Through-hole reflow device of the present invention, during the work of described fan, cold air flows in the cavity of described second upper furnace outer housing from the air holes of described welding machine Tai Gai side, cold air is delivered in the cavity of the second upper furnace inner bag again through fan after entering described second upper furnace outer housing, again by the exhaust vent blowout of heating board on described second, and blow to product upper surface.
Compared with prior art, the invention have the advantage that present invention employs can the first warm area of reflux and the second warm area, first lower furnace heat air delivery of the first warm area, blow to the lower surface direction of product, first warm area upper furnace of the first warm area carries out convulsion, the heat of product upper surface is detached, makes the temperature of product surface reduce；Product is through multiple second warm areas, second lower furnace heat air delivery, blow to the lower surface direction of product, the second downward transporting cold wind of warm area upper furnace of the second warm area, act on the upper surface of product, the temperature difference making product upper surface and product lower surface reaches maximum, and this product adopts screen upper and lower temperature to be separated, it is simple to control the temperature of product upper surface and the temperature of lower surface.
It is a further object to provide the control method of a kind of Through-hole reflow device, comprise the following steps:
A) control warm area, the first warm area (preheating zone) and second warm area (recirculating zone) of reflowable heating are set；First warm area is formed by the first warm area upper furnace and the first lower furnace, and the second warm area is formed by the second warm area upper furnace and the second lower furnace；Second warm area upper furnace is only blown a cold wind over, and blows a cold wind in cooling zone；
B) the first warm area and the temperature value of the second warm area are set, temperature value by temperature sensor senses warm area, make the temperature difference between the first warm area upper furnace and first lower furnace of the first warm area reach maximum, make the temperature difference between the second warm area upper furnace and second lower furnace of the second warm area reach maximum；
C) preparing the product conveying unit of adjustable width, product is delivered to the first warm area, the second warm area and cooling zone by this product conveying unit；
D) the first lower furnace heat air delivery of the first warm area, blows to the lower surface direction of product, and the first warm area upper furnace of the first warm area carries out convulsion, is detached by the heat of product upper surface, makes the temperature of product surface reduce, it is prevented that element high temperature；Product, through multiple second warm areas, the second lower furnace heat air delivery, blows to the lower surface direction of product, the second downward transporting cold wind of warm area upper furnace of the second warm area, acts on the upper surface of product, makes the temperature difference of product upper surface and product lower surface reach maximum；
E) output of products cooling zone, goes out finished product.
As a kind of improvement of the control method of Through-hole reflow device of the present invention, the hot blast temperature that the hot blast temperature of described second lower furnace conveying is carried more than the first lower furnace.
As a kind of improvement of the control method of Through-hole reflow device of the present invention, the hot blast temperature of described second lower furnace conveying is 150 DEG C～260 DEG C；The hot blast temperature of described first lower furnace conveying is 30 DEG C～150 DEG C.
Compared with prior art, the invention have the advantage that the control method of the Through-hole reflow device that the present invention adopts, be provided with two warm areas, first warm area is preheating zone, second warm area is recirculating zone, and the temperature value of the first warm area and the second warm area can be separately provided, and makes the temperature value of the first warm area and the second warm area keep balance, and there is hydronic effect, make full use of hot blast, reduce energy loss, save the energy, this method step is simple, it is easy to implement.
The reflow process of the present invention: PCB is print solder paste first, components and parts are manually inserted before entering Reflow Soldering, when entering the first warm area (the preheating warm area) of two 130 DEG C～150 DEG C, solvent, gas evaporation in soldering paste fall, simultaneously, soldering paste softening, slump, cover pad, pad, component's feet and oxygen is isolated；And make sticking-element be preheated fully, when subsequently entering the second warm area (Reflow Soldering), temperature rises rapidly with 2-3 DEG C of international standard heating rate per second and makes soldering paste reach molten state, liquid solder is blended on weld interface in the pad of PCB, components and parts welding end and pin moistening, diffusion, cross flow and backflow and generates metallic compound, forms solder joints；Last PCB enters cooling zone makes solder joint solidify.
Accompanying drawing explanation
Just with detailed description of the invention, the present invention and useful technique effect thereof are described in further detail with reference to the accompanying drawings below, wherein:
Fig. 1 is three-dimensional structure diagram of the present invention.
Fig. 2 is front view of the present invention.
Fig. 3 is A-A sectional view in Fig. 2 of the present invention.
Fig. 4 is B-B sectional view in Fig. 2 of the present invention.
Fig. 5 is the present invention the first warm area structure chart.
Fig. 6 is the present invention the second warm area structure chart.
Fig. 7 is lower furnace structural representation of the present invention.
Fig. 8 is upper furnace structural representation of the present invention.
Fig. 9 is the structural representation after the present invention installs airduct.
Figure 10 is PCB plate through hole Reflow Soldering temperature characteristics analysis principle figure of the present invention.
Figure 11 is A place enlarged drawing in Fig. 1.
nullAccompanying drawing labelling title: 1、Reflow Soldering board 2、Welding machine platform lid 3、Product pipeline 4、First lower furnace 5、Second lower furnace 6、First warm area upper furnace 7、Second warm area upper furnace 8、First warm area 9、Second warm area 10、Screen 11、Human-machine Control interface 12、Gas analyzer for O2 13、Main air draft pipeline 14、Air holes 15、Cooling zone 41、Lower furnace outer housing 42、Lower furnace inner bag 43、Lower ventilating board 44、Flue connecting plate 45、Heating wire fixes seat 46、Heating wire 47、Lower wind wheel fan housing 48、Lower heating board 49、Lower furnace blower fan 61、First upper furnace outer housing 62、First upper furnace inner bag 63、Ventilating board 64 on first、First upper furnace connecting plate 65、Heating board 66 on first、First convulsion motor 71、Second upper furnace outer housing 72、Second upper furnace inner bag 73、Ventilating board 74 on second、Second upper furnace connecting plate 75、Upper wind wheel fan housing 76、Heating board 77 on second、Fan.
Detailed description of the invention
Just the invention will be further described with specific embodiment with reference to the accompanying drawings below, but embodiments of the present invention are not limited to this.
nullSuch as Fig. 1、Fig. 2、Fig. 3、Fig. 4、Fig. 5、Fig. 6、Fig. 7、Shown in Fig. 8 and Figure 11，A kind of Through-hole reflow device，Including Reflow Soldering board 1，The upper plane back edge of Reflow Soldering board 1 is provided with a welding machine platform lid 2 that can open and close，The support arm that welding machine platform lid 2 can be stretched by one connects control and opens or closes，The upper plane of Reflow Soldering board 1 is provided with can the product pipeline 3 of adjustment width，Be sequentially provided with from left to right in Reflow Soldering board 1 two upwards the first lower furnace 4 of blowing hot-air and one to the second lower furnace 5 of blowing up，In welding machine platform lid 2, the position of corresponding first lower furnace 4 is provided with the first warm area upper furnace 6 of convulsion，In welding machine platform lid 2, the position of corresponding second lower furnace 5 is provided with the second warm area upper furnace 7 to fall wind，First warm area upper furnace 6 and the first lower furnace 4 form the first warm area 8，Second warm area upper furnace 7 and the second lower furnace 5 form the second warm area 9，Product pipeline 3 is positioned at the position of the first warm area 8 and the second warm area 9 and is provided with for cold wind and hot blast being separated、And the screen 10 that can stretch or shorten，Reflow Soldering board 1 is provided with Human-machine Control interface 11，It is equipped with temperature sensor in first warm area 8 and the second warm area 9，Gas analyzer for O2 12 it is provided with in Reflow Soldering board 1，Reflow Soldering board 1 is additionally provided with a cooling zone 15.The present embodiment is primarily directed to PCB plate through hole solder reflow operation, control the second warm area upper furnace 7 by Human-machine Control interface 11 to blow a cold wind over, close the second warm area upper furnace heating wire heating, make the temperature difference of the second warm area upper furnace 7 of the second warm area 9 and the second lower furnace 5 at a peak value.The present embodiment only has the Cai You thermal treatment zone, bottom, then blows a cold wind in top.Such design can be tried one's best the damage to component body of the less temperature.The temperature of two preheating zones and a recirculating zone can independently be controlled, and then blows a cold wind in cooling zone.
Preferably, product pipeline 3 includes dynamic guide rail 31 and determines guide rail 32, the distance that dynamic guide rail 31 is moved forward and backward by multiple step motor control, regulate dynamic guide rail 31 and the distance determined between guide rail 32, for carrying various sizes of product, the two ends determining guide rail 32 are respectively erected in the two ends of Reflow Soldering board 1, move guide rail 31 and determine to be equipped with conveyer belt on guide rail 32, move guide rail 31 and determine all to be interval with multiple locking device 33 for locking product on guide rail 32.
Preferably, screen 10 undulate, screen 10 is high temperature resistant heat insulation material, moves and is provided with screen 10 between guide rail 31 and the posterior edges of Reflow Soldering board 1, and the forward edge determining guide rail 32 and Reflow Soldering board 1 is provided with screen 10, during dynamic guide rail 31 adjustable range forward, dynamic guide rail 31 and determine guide rail 32 distance and diminish, screen 10 is stretched, when moving guide rail 31 adjustable range backward, moving guide rail 31 and determine guide rail 32 apart from becoming big, screen 10 shrinks.
Preferably, first lower furnace 4 includes lower furnace outer housing 41, lower furnace inner bag 42 and two lower ventilating boards 43, flue connecting plate 44 and the fixing seat 45 of multiple heating wire it is provided with in lower furnace outer housing 41, lower furnace inner bag 42 is arranged on flue connecting plate 44, the fixing seat 45 of multiple heating wires is fixed with at least one heating wire 46 simultaneously, the two ends of heating wire 46 are connected to the both sides of lower furnace outer housing 41, lower wind wheel fan housing 47 it is provided with in the cavity of lower furnace inner bag 42, the cavities open place of lower furnace inner bag 42 is stamped heating board 48, lower heating board 48 is interval with several exhaust vents, two lower ventilating boards 43 are separately mounted to the both sides of lower furnace outer housing 41, the middle part of lower furnace outer housing 41 is provided with lower furnace blower fan 49.
Preferably, when lower furnace blower fan 49 works, air after being heated by heating wire 46 is sent in the cavity of lower furnace inner bag 42, after the cavity of lower furnace inner bag 42, flowed out by the through hole of lower heating board 48, cannot continuing to rise owing to being separated by screen 10 between lower heating board 48 and the first warm area upper furnace 6, hot-air flows in the cavity of lower furnace outer housing 41 again, heating wire 46 again heat Posterior circle and utilize.
Preferably, first warm area upper furnace 6 includes the first upper furnace outer housing 61, ventilating board 63 on first upper furnace inner bag 62 and two first, the first upper furnace connecting plate 64 it is provided with in the cavity of the first upper furnace outer housing 61, first upper furnace inner bag 62 is arranged on the first upper furnace connecting plate 64 in the cavity of the first upper furnace outer housing 61, the cavities open of the first upper furnace inner bag 62 is stamped on first heating board 65, on first, heating board 65 is provided with several exhaust vents, on two first, ventilating board 63 is separately positioned on the both sides of the first upper furnace outer housing 61, the middle part of the first upper furnace outer housing 61 is provided with the first convulsion motor 66.
As it is shown in figure 9, the wind pipe of the first convulsion motor 66 connects main air draft pipeline 13.
Preferably, when the first convulsion motor 66 works, the hot-air of the first upper furnace inner bag 62 is extracted out outside the first upper furnace outer housing 61.
Preferably, second warm area upper furnace 7 includes the second upper furnace outer housing 71, ventilating board 73 on second upper furnace inner bag 72 and two second, multiple second upper furnace connecting plate 74 it is interval with in the cavity of the second upper furnace outer housing 71, second upper furnace inner bag 72 is arranged on the second upper furnace connecting plate 74 in the cavity of the second upper furnace outer housing 71, it is provided with wind wheel fan housing 75 in the cavity of the second upper furnace inner bag 72, the cavities open of the second upper furnace inner bag 72 is stamped on second heating board 76, on second, heating board 76 is provided with several exhaust vents, on two second, ventilating board 73 is separately positioned on the both sides of the second upper furnace outer housing 71, the middle part of the second upper furnace outer housing 71 is provided with a fan 77, the wind wheel of fan 77 stretches in wind wheel fan housing 75.
Preferably, when fan 77 works, cold air flows in the cavity of the second upper furnace outer housing 71 from welding machine platform lid 1 side air holes 14, cold air is delivered in the cavity of the second upper furnace inner bag 72 again through fan 77 after entering the second upper furnace outer housing 71, again by the exhaust vent blowout of heating board 76 on second, and blow to product upper surface.
The invention have the advantage that present invention employs can the first warm area 8 and the second warm area 9 of reflux, first lower furnace heat air delivery of the first warm area 8, blow to the lower surface direction of product, first warm area upper furnace of the first warm area 8 carries out convulsion, the heat of product upper surface is detached, makes the temperature of product surface reduce；Product when multiple second warm area 9, the second lower furnace heat air delivery, blow to the lower surface direction of product, the second downward transporting cold wind of warm area upper furnace of the second warm area 9, act on the upper surface of product.
The control method of a kind of Through-hole reflow device, comprises the following steps:
A) control warm area, the first warm area (preheating zone) and second warm area (recirculating zone) of reflowable heating are set；First warm area is formed by the first warm area upper furnace and the first lower furnace, and the second warm area is formed by the second warm area upper furnace and the second lower furnace；Second warm area upper furnace is only blown a cold wind over, and blows a cold wind in cooling zone；
B) the first warm area and the temperature value of the second warm area are set, temperature value by temperature sensor senses warm area, make the temperature difference between the first warm area upper furnace and first lower furnace of the first warm area reach maximum, make the temperature difference between the second warm area upper furnace and second lower furnace of the second warm area reach maximum；
C) preparing the product conveying unit of adjustable width, product is delivered to the first warm area, the second warm area and cooling zone by this product conveying unit；
D) the first lower furnace heat air delivery of the first warm area, blows to the lower surface direction of product, and the first warm area upper furnace of the first warm area carries out convulsion, is detached by the heat of product upper surface, makes the temperature of product surface reduce, it is prevented that element high temperature；Product, through multiple second warm areas, the second lower furnace heat air delivery, blows to the lower surface direction of product, the second downward transporting cold wind of warm area upper furnace of the second warm area, acts on the upper surface of product, makes the temperature difference of product upper surface and product lower surface reach maximum；
E) output of products cooling zone, goes out finished product.
Preferably, the hot blast temperature that the hot blast temperature of the second lower furnace conveying is carried more than the first lower furnace.
Preferably, the hot blast temperature of the second lower furnace conveying is 150 DEG C～260 DEG C；The hot blast temperature of described first lower furnace conveying is 30 DEG C～150 DEG C.
The control method of the Through-hole reflow device that the present invention adopts, being provided with two warm areas, the first warm area is preheating zone, and the second warm area is recirculating zone, the temperature value of the first warm area and the second warm area can be separately provided, the temperature value making the first warm area and the second warm area keeps balance, and has hydronic effect, makes full use of hot blast, reduce energy loss, saving the energy, this method step is simple, it is easy to implement.
The PCB plate through hole reflow process of the present invention: PCB is print solder paste first, components and parts are manually inserted before entering Reflow Soldering, when entering the first warm area (the preheating warm area) of two 140 DEG C～160 DEG C, solvent, gas evaporation in soldering paste fall, simultaneously, soldering paste softening, slump, cover pad, pad, component's feet and oxygen is isolated；And make sticking-element be preheated fully, when subsequently entering the second warm area (Reflow Soldering), temperature rises rapidly with 2-3 DEG C of international standard heating rate per second and makes soldering paste reach molten state, liquid solder is blended on weld interface in the pad of PCB, components and parts welding end and pin moistening, diffusion, cross flow and backflow and generates metallic compound, forms solder joints；Last PCB enters cooling zone makes solder joint solidify.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, being appreciated that when without departing from principles of the invention and structure and these embodiments can be carried out multiple change, amendment, replacement and modification, the scope of the invention and equivalency range limits.
Claims (10)
- null1. a Through-hole reflow device，Including Reflow Soldering board，The upper plane back edge of described Reflow Soldering board is provided with a welding machine platform lid that can open and close，It is characterized in that，The upper plane of described Reflow Soldering board is provided with can the product pipeline of adjustment width，At least one upwards first lower furnace of blowing hot-air and at least one is to the second lower furnace of blowing up it is sequentially provided with from left to right in described Reflow Soldering board，In described welding machine platform lid, the position of corresponding first lower furnace is provided with the first warm area upper furnace of convulsion，In described welding machine platform lid, the position of corresponding described second lower furnace is provided with the second warm area upper furnace to fall wind，Described first warm area upper furnace and the first lower furnace form the first warm area，Described second warm area upper furnace and the second lower furnace form the second warm area，Described product pipeline is positioned at the position of described first warm area and described second warm area and is provided with for cold wind and hot blast being separated、And the screen that can stretch or shorten，Reflow Soldering board is provided with Human-machine Control interface，It is equipped with temperature sensor in described first warm area and described second warm area，It is provided with gas analyzer for O2 in described Reflow Soldering board，Described Reflow Soldering board is additionally provided with a cooling zone；Described product pipeline includes dynamic guide rail and determines guide rail, the distance that described dynamic guide rail is moved forward and backward by multiple step motor control, regulate dynamic guide rail and the distance determined between guide rail, for carrying various sizes of product, the described two ends determining guide rail are respectively erected in the two ends of described Reflow Soldering board, described dynamic guide rail and determine to be equipped with on guide rail conveyer belt, described dynamic guide rail with determine guide rail is all interval with multiple locking device for locking product；Described screen undulate, described screen is high temperature resistant heat insulation material, it is provided with screen between the posterior edges of described dynamic guide rail and described Reflow Soldering board, the described forward edge determining guide rail and described Reflow Soldering board is provided with screen, during described dynamic guide rail adjustable range forward, and described dynamic guide rail and determine guide rail distance and diminish, described screen is stretched, during described dynamic guide rail adjustable range backward, described dynamic guide rail becomes big with determining guide rail distance, and described screen shrinks.
- 2. Through-hole reflow device according to claim 1, it is characterized in that, described first lower furnace includes lower furnace outer housing, lower furnace inner bag and two lower ventilating boards, flue connecting plate and the fixing seat of multiple heating wire it is provided with in described lower furnace outer housing, described lower furnace inner bag is arranged on described flue connecting plate, the fixing seat of multiple described heating wires is fixed with at least one heating wire simultaneously, the two ends of described heating wire are connected to described lower furnace outer housing both sides, lower wind wheel fan housing it is provided with in the cavity of described lower furnace inner bag, the cavities open place of described lower furnace inner bag is stamped heating board, described lower heating board is interval with several exhaust vents, two described lower ventilating boards are separately mounted to the both sides of described lower furnace outer housing, the middle part of described lower furnace outer housing is provided with lower furnace blower fan.
- 3. Through-hole reflow device according to claim 2, it is characterized in that, during the work of described lower furnace blower fan, air after being heated by heating wire is sent in the cavity of lower furnace inner bag, after the cavity of described lower furnace inner bag, the through hole of described lower heating board flow out, cannot continue to rise owing to being separated by screen between lower heating board and described first warm area upper furnace, hot-air flows in the cavity of lower furnace outer housing again, described heating wire again heat Posterior circle and utilize.
- 4. Through-hole reflow device according to claim 1, it is characterized in that, described first warm area upper furnace includes the first upper furnace outer housing, ventilating board on first upper furnace inner bag and two first, it is provided with the first upper furnace connecting plate in the cavity of described first upper furnace outer housing, described first upper furnace inner bag is arranged on the first upper furnace connecting plate in the cavity of described first upper furnace outer housing, the cavities open of described first upper furnace inner bag is stamped on first heating board, on described first, heating board is provided with several exhaust vents, on two described first, ventilating board is separately positioned on the both sides of described first upper furnace outer housing, the middle part of described first upper furnace outer housing is provided with the first convulsion motor.
- 5. Through-hole reflow device according to claim 4, it is characterised in that during described first convulsion motor operations, the hot-air of described first upper furnace inner bag is extracted out outside the first upper furnace outer housing.
- 6. Through-hole reflow device according to claim 1, it is characterized in that, described second warm area upper furnace includes the second upper furnace outer housing, ventilating board on second upper furnace inner bag and two second, multiple second upper furnace connecting plate it is interval with in the cavity of described second upper furnace outer housing, described second upper furnace inner bag is arranged on the second upper furnace connecting plate in the cavity of described second upper furnace outer housing, it is provided with wind wheel fan housing in the cavity of described second upper furnace inner bag, the cavities open of described second upper furnace inner bag is stamped on second heating board, on described second, heating board is provided with several exhaust vents, on two described second, ventilating board is separately positioned on the both sides of described second upper furnace outer housing, the middle part of described second upper furnace outer housing is provided with a fan, the wind wheel of described fan stretches in described upper wind wheel fan housing.
- 7. Through-hole reflow device according to claim 6, it is characterized in that, during the work of described fan, cold air flows in the cavity of described second upper furnace outer housing from the air holes of described welding machine Tai Gai side, cold air is delivered in the cavity of the second upper furnace inner bag again through fan after entering described second upper furnace outer housing, again by the exhaust vent blowout of heating board on described second, and blow to product upper surface.
- 8. the control method of a Through-hole reflow device, it is characterised in that comprise the following steps:A) control warm area, the first warm area and second warm area of reflowable heating are set；First warm area is formed by the first warm area upper furnace and the first lower furnace, and the second warm area is formed by the second warm area upper furnace and the second lower furnace；Second warm area upper furnace is only blown a cold wind over, and blows a cold wind in cooling zone；B) the first warm area and the temperature value of the second warm area are set, temperature value by temperature sensor senses warm area, make the temperature difference between the first warm area upper furnace and first lower furnace of the first warm area reach maximum, make the temperature difference between the second warm area upper furnace and second lower furnace of the second warm area reach maximum；C) preparing the product conveying unit of adjustable width, product is delivered to the first warm area, the second warm area and cooling zone by this product conveying unit；D) the first lower furnace heat air delivery of the first warm area, blows to the lower surface direction of product, and the first warm area upper furnace of the first warm area carries out convulsion, is detached by the heat of product upper surface, makes the temperature of product surface reduce, it is prevented that element high temperature；Product, through multiple second warm areas, the second lower furnace heat air delivery, blows to the lower surface direction of product, the second downward transporting cold wind of warm area upper furnace of the second warm area, acts on the upper surface of product, makes the temperature difference of product upper surface and product lower surface reach maximum；E) output of products cooling zone, goes out finished product.
- 9. the control method of Through-hole reflow device according to claim 8, it is characterised in that the hot blast temperature that the hot blast temperature of described second lower furnace conveying is carried more than the first lower furnace.
- 10. the control method of Through-hole reflow device according to claim 8, it is characterised in that the hot blast temperature of described second lower furnace conveying is 150 DEG C～260 DEG C；The hot blast temperature of described first lower furnace conveying is 30 DEG C～150 DEG C.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106112168A (en) * | 2016-08-22 | 2016-11-16 | 朗微士光电（苏州）有限公司 | A kind of online vacuum back-flow welding machine and application thereof |
| CN106802082A (en) * | 2017-03-07 | 2017-06-06 | 东莞市创威自动化科技有限公司 | It is a kind of to be easy to cleaning maintenance, the heating furnace of high energy efficiency |
| CN108063108A (en) * | 2018-01-22 | 2018-05-22 | 广安市嘉乐电子科技有限公司 | A kind of MB bridges heap bonding machine |
| CN108237293A (en) * | 2016-12-26 | 2018-07-03 | 上海朗仕电子设备有限公司 | A kind of monoblock type extractor fan |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093232A (en) * | 1996-09-11 | 1998-04-10 | Nihon Dennetsu Kk | Reflow soldering equipment |
| CN102049587A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for large temperature difference adjustment of reflow soldering machine and temperature control method |
| CN102353682A (en) * | 2011-07-01 | 2012-02-15 | 深圳市日联科技有限公司 | On-the-spot online automatic optical detection equipment and method |
| CN202910423U (en) * | 2012-09-01 | 2013-05-01 | 何毅 | Double-channel reflow soldering machine |
| CN103231139A (en) * | 2013-04-24 | 2013-08-07 | 无锡市崇安区科技创业服务中心 | Intelligent reflow soldering system |
| CN203448824U (en) * | 2013-08-31 | 2014-02-26 | 东莞市科隆威自动化设备有限公司 | Reflow soldering heating device |
| JP5694546B2 (en) * | 2011-09-15 | 2015-04-01 | 富士通テレコムネットワークス株式会社 | Reflow soldering apparatus and method |
| CN204504450U (en) * | 2015-01-21 | 2015-07-29 | 李战胜 | A kind of structure improved Through-hole reflow machine |
| CN205629586U (en) * | 2016-05-06 | 2016-10-12 | 东莞市科隆威自动化设备有限公司 | Through -hole reflow soldering device |
-
2016
- 2016-05-06 CN CN201610298723.3A patent/CN105772886B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093232A (en) * | 1996-09-11 | 1998-04-10 | Nihon Dennetsu Kk | Reflow soldering equipment |
| CN102049587A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for large temperature difference adjustment of reflow soldering machine and temperature control method |
| CN102353682A (en) * | 2011-07-01 | 2012-02-15 | 深圳市日联科技有限公司 | On-the-spot online automatic optical detection equipment and method |
| JP5694546B2 (en) * | 2011-09-15 | 2015-04-01 | 富士通テレコムネットワークス株式会社 | Reflow soldering apparatus and method |
| CN202910423U (en) * | 2012-09-01 | 2013-05-01 | 何毅 | Double-channel reflow soldering machine |
| CN103231139A (en) * | 2013-04-24 | 2013-08-07 | 无锡市崇安区科技创业服务中心 | Intelligent reflow soldering system |
| CN203448824U (en) * | 2013-08-31 | 2014-02-26 | 东莞市科隆威自动化设备有限公司 | Reflow soldering heating device |
| CN204504450U (en) * | 2015-01-21 | 2015-07-29 | 李战胜 | A kind of structure improved Through-hole reflow machine |
| CN205629586U (en) * | 2016-05-06 | 2016-10-12 | 东莞市科隆威自动化设备有限公司 | Through -hole reflow soldering device |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106112168A (en) * | 2016-08-22 | 2016-11-16 | 朗微士光电（苏州）有限公司 | A kind of online vacuum back-flow welding machine and application thereof |
| CN108237293A (en) * | 2016-12-26 | 2018-07-03 | 上海朗仕电子设备有限公司 | A kind of monoblock type extractor fan |
| CN108237293B (en) * | 2016-12-26 | 2023-08-08 | 上海朗仕电子设备有限公司 | Integral updraft ventilator |
| CN106802082A (en) * | 2017-03-07 | 2017-06-06 | 东莞市创威自动化科技有限公司 | It is a kind of to be easy to cleaning maintenance, the heating furnace of high energy efficiency |
| CN108063108A (en) * | 2018-01-22 | 2018-05-22 | 广安市嘉乐电子科技有限公司 | A kind of MB bridges heap bonding machine |
| CN109014481B (en) * | 2018-09-21 | 2021-04-09 | 安徽机电职业技术学院 | Energy-saving efficient reflow soldering machine |
| CN109014481A (en) * | 2018-09-21 | 2018-12-18 | 安徽机电职业技术学院 | A kind of energy-efficient reflow machine |
| CN110091025A (en) * | 2019-06-25 | 2019-08-06 | 唐山铁路工务器材制造有限公司 | Continuous brazing equipment and method |
| CN111451592A (en) * | 2020-03-19 | 2020-07-28 | 金升阳（怀化）科技有限公司 | Through hole reflow soldering equipment and through hole reflow soldering processing method |
| CN111451592B (en) * | 2020-03-19 | 2022-04-19 | 金升阳（怀化）科技有限公司 | Through hole reflow soldering equipment and through hole reflow soldering processing method |
| CN112139620A (en) * | 2020-09-26 | 2020-12-29 | 黄山学院 | Device and method for full-automatic control of selective wave soldering |
| CN113305391A (en) * | 2021-07-02 | 2021-08-27 | 深圳市顺达成电子设备有限公司 | Hot air solidifying and cooling furnace |
| CN113305391B (en) * | 2021-07-02 | 2023-01-03 | 深圳市顺达成电子设备有限公司 | Hot air solidifying and cooling furnace |
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