CN214753663U

CN214753663U - Small-size solidification equipment after BGA chip plants ball

Info

Publication number: CN214753663U
Application number: CN202120479163.8U
Authority: CN
Inventors: 张敦勇; 徐文斌; 张明啸
Original assignee: Shenzhen Dinghua Science And Technology Development Co ltd
Current assignee: Shenzhen Dinghua Science And Technology Development Co ltd
Priority date: 2021-03-05
Filing date: 2021-03-05
Publication date: 2021-11-16
Anticipated expiration: 2031-03-05

Abstract

The utility model relates to a solidification equipment technical field just discloses a small-size solidification equipment after BGA chip plants ball, including the frame plate, the right side swing joint of frame plate has the panel beating shell, the left side swing joint of panel beating shell preheats the infrared pipe, the top swing joint of frame plate has the fixed plate, the top fixedly connected with strengthening rib of fixed plate, the positive swing joint of strengthening rib has the connecting plate, the positive swing joint of connecting plate has the connecting block, the positive swing joint of connecting block has the fly leaf. This small-size solidification equipment after BGA chip plants ball can realize BGA and plant quick heating after the ball, and solidification tin ball position prevents that the tin ball from running, improves the yields, can greatly reduced BGA tin ball solidification's cost, reduces the pollution to the environment, can accomplish the solidification flow after BGA plants the ball at any time, does not need professional technical support, can also integrate simultaneously in the BGA production line, satisfies many-sided demand.

Description

Small-size solidification equipment after BGA chip plants ball

Technical Field

The utility model relates to a solidification equipment technical field specifically is a small-size solidification equipment after BGA chip plants ball.

Background

The BGA package occupies a large area of a substrate, and the BGA package is a solder ball array package which is formed by manufacturing array solder balls at the bottom of a package body substrate to be used as I/O ends of a circuit to be mutually connected with a printed circuit board, and a device packaged by adopting the technology is a surface mounting type device.

BGA welds bump and uses tin ball preparation, traditional process is after having planted the ball with BGA, once only drop into in the sword reflow soldering equipment, prior art is mostly large-scale reflow soldering equipment, but reflow soldering equipment area is big, the input cost is high, after the ball is planted to small batch BGA, the additional cost of production is high, it is big to environmental pollution, reflow soldering equipment needs the special messenger to operate, the special messenger maintains, the reflow soldering parameter sets up, a large amount of experience of needs supports, BGA encapsulation test of not being convenient for, reflow soldering equipment is not convenient for integrate to the automatic ball production line of planting of BGA, need carry out a large amount of reequiping designs and can adapt to the requirement, inconvenient use, so propose a small-size solidification equipment behind BGA chip ball planting and solve above-mentioned problem of proposing.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model is not enough to prior art, the utility model provides a small-size solidification equipment behind BGA chip ball planting, possess advantages such as rapid heating, it is big to have solved reflow soldering equipment area, the input cost is high, after small batch BGA planted the ball, the additional cost of production is high, it is big to environmental pollution, reflow soldering equipment needs the special person operation, the special person maintains, the reflow soldering parameter sets up, a large amount of experiences of needs support, BGA encapsulation test of being not convenient for, reflow soldering equipment is not convenient for integrate to the automatic ball production line of planting of BGA, need carry out a large amount of repacking designs and can meet the demands, the problem of inconvenient use.

(II) technical scheme

In order to realize the purpose of rapid heating, the utility model provides a following technical scheme: a small-sized curing device used after ball planting of BGA chips comprises a frame plate, wherein a sheet metal shell is movably connected to the right side of the frame plate, a preheating infrared tube is movably connected to the left side of the sheet metal shell, a fixed plate is movably connected to the top of the frame plate, reinforcing ribs are fixedly connected to the top of the fixed plate, a connecting plate is movably connected to the front of the reinforcing ribs, a connecting block is movably connected to the front of the connecting plate, a movable plate is movably connected to the front of the connecting block, a fixed baffle is fixedly connected to the front of the movable plate, a fan is movably connected to the bottom of the fixed baffle, a heating tube is movably connected to the bottom of the fan, a heating head is movably connected to the bottom of the heating tube, a limiting plate is fixedly connected to the left side of the movable plate, an air cylinder is fixedly connected to the left side of the limiting plate, and a connecting frame is movably connected to the bottom of the frame plate, the left side and the right side of the bottom of the frame plate are movably connected with frame legs.

Preferably, the number of the frame feet is two, and the two frame feet are movably connected with the connecting frame.

Preferably, the fixed square hole has been seted up to the inboard of frame foot, sheet metal shell and link swing joint.

Preferably, the reinforcing rib is movably connected with the connecting plate through a movable screw, and the fixed baffle is movably connected with the limiting plate.

Preferably, the fan, the heating pipe and the heating head are all located on the front face of the frame plate, and the front face of the frame foot is provided with a connecting hole.

Preferably, the connecting frame is movably connected with the frame legs through connecting screws, and the connecting block is movably connected with the movable plate through bolts.

(III) advantageous effects

Compared with the prior art, the utility model provides a small-size solidification equipment after BGA chip plants ball possesses following beneficial effect:

the small-sized curing device after ball planting of the BGA chip is used for fixing a heating component through a frame plate, a preheating infrared tube is fixed through a metal plate shell and is fixed on the frame plate together for preheating after ball planting of the BGA chip, so that the temperature of a heating area of the BGA chip is uniform, and a solder ball is prevented from appearing, a heating head is made of stainless steel and is connected with the heating tube, the inside of the heating tube is resistance heating, the temperature can be adjusted through controlling current, a fan is installed on the upper part of the heating tube, air blows downwards through the heating tube, the heated air flow is discharged through the heating head and is used for heating the solder ball after ball planting, a heating temperature curve and heating time can be set through controlling the temperature of the heating tube, each section of heating working conditions of reflow soldering are simulated, the up-and-down movement of the heating head is controlled through an air cylinder and is used for controlling the distance between the heating head and the BGA chip, during working, the BGA chip after ball planting and a jig are horizontally placed in the lower area of the heating head, the infrared pipe is preheated in the opening earlier, make the zone of heating preheat, treat to preheat even back, open middle hot-blast main heating mechanism, the heating head aims at the BGA chip, preset temperature curve and heat time, wait the procedure to walk, the heating is accomplished, BGA tin ball heating melts and fixes on the chip again, this device can accomplish the solidification operation after BGA tin ball planting fast, high convenience and fastness, need not artificial intervention, small in floor area, be fit for the reflux heating after a small amount of BGA chip planting ball, overall structure is simple, and convenient to use, can realize BGA plants quick heating after the ball, solidification tin ball position, prevent that the tin ball from running, the yield is improved, can greatly reduced BGA tin ball solidification's cost, reduce the pollution to the environment, can accomplish the solidification flow after the BGA ball planting at any time, do not need professional technical support, simultaneously can also integrate in many-sided BGA production line, satisfy the needs.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a front view of the frame foot connection structure in the structure of the present invention.

In the figure: the device comprises a frame plate 1, a sheet metal shell 2, a preheating infrared tube 3, a fixing plate 4, a reinforcing rib 5, a connecting plate 6, a connecting block 7, a movable plate 8, a fixed baffle 9, a fan 10, a heating tube 11, a heating head 12, a limiting plate 13, an air cylinder 14, a connecting frame 15 and a frame foot 16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a small-sized curing device for BGA chips after ball-planting comprises a frame plate 1, a sheet metal shell 2 movably connected to the right side of the frame plate 1, a preheating infrared tube 3 movably connected to the left side of the sheet metal shell 2, a fixed plate 4 movably connected to the top of the frame plate 1, a reinforcing rib 5 fixedly connected to the top of the fixed plate 4, a connecting plate 6 movably connected to the front of the reinforcing rib 5, a connecting block 7 movably connected to the front of the connecting plate 6, a movable plate 8 movably connected to the front of the connecting block 7, a fixed baffle 9 fixedly connected to the front of the movable plate 8, a fan 10 movably connected to the bottom of the fixed baffle 9, a heating tube 11 movably connected to the bottom of the heating tube 11, a heating head 12 movably connected to the bottom of the heating tube 11, a limiting plate 13 fixedly connected to the left side of the movable plate 8, and a reinforcing rib 5 movably connected to the connecting plate 6 through a movable screw, the fixed baffle 9 is movably connected with a limiting plate 13, the left side of the limiting plate 13 is fixedly connected with an air cylinder 14, the rack plate 1 is used for fixing a heating component, a preheating infrared tube 3 is fixed through a sheet metal shell 2 and is fixed on the rack plate 1 together for preheating after ball planting of a BGA chip, the temperature of a heating area of the BGA chip is uniform, the solder ball is prevented from changing, a heating head 12 is made of stainless steel and is connected with a heating tube 11, the inside of the heating tube 11 is resistance heating, the temperature can be adjusted through controlling current, a fan 10 is installed on the upper portion of the heating tube 11, downward blowing is carried out through the heating tube 11, heated airflow is discharged through the heating head 12 for heating the solder ball after ball planting of the BGA chip, a heating temperature curve and heating time can be set through controlling the temperature of the heating tube 11, heating working conditions of each section of reflow soldering can be simulated, and the up-down movement of the heating head 12 is controlled through the air cylinder 14, the device is used for controlling the distance between the BGA chip and the BGA chip, when in work, the BGA chip with the planted balls and a jig are horizontally placed in the lower area of the heating head 12, the preheating infrared tube 3 is firstly started to preheat a heating area, after the heating area is uniformly preheated, the middle hot air tube heating mechanism is opened, the heating head 12 is aligned to the BGA chip, the temperature curve and the heating time are preset, the procedures are finished, the heating is finished, the BGA solder balls are heated and melted and fixed on the chip, the device can quickly finish the curing operation after the BGA solder balls are planted, the device is convenient and quick, does not need manual intervention, has small occupied area, is suitable for the reflux heating after a small number of BGA chips are planted with the balls, has simple integral structure and convenient use, can realize the quick heating after the BGA are planted with the balls, can cure the positions of the solder balls, prevent the solder balls from running, can improve the yield, can greatly reduce the curing cost of the solder balls, can reduce the pollution to the environment, and can finish the curing process after the BGA chip is planted with the BGA, need not professional technical ability support, simultaneously can also integrate to in the BGA production line, satisfy many-sided demand, the bottom swing joint of frame board 1 has link 15, the equal swing joint in the left and right sides of frame board 1 bottom has frame foot 16, link 15 passes through connecting screw and 16 swing joints of frame foot, connecting block 7 passes through bolt and 8 swing joint of fly leaf, fan 10, heating tube 11 and heating head 12 all are located the front of frame board 1, the connecting hole has been seted up in the front of frame foot 16, fixed square hole has been seted up to the inboard of frame foot 16,

sheet metal shell

2 and 15 swing joint of link, the quantity of frame foot 16 is two, two frame feet 16 all with 15 swing joint of link.

When using, be used for fixed heating element through rack board 1, it is fixed that infrared pipe 3 passes through panel beating shell 2 to preheat, together fixed rack board 1 again, a preheating for BGA chip plant after the ball, make BGA chip zone of heating temperature even, prevent that the tin ball from appearing, heating head 12 is made with the stainless steel, be connected with

heating tube

11, 11 inside resistance heating for the heating tube, can adjust the temperature through control current, fan 10 installation is heat pipe 11 upper portion again, blow down through heating tube 11, the air current of heating is used for heating the tin ball after BGA plants the ball through heating head 12 discharge, can set up heating temperature curve and heat time through the temperature of control heating tube 11, simulate out each section of reflow soldering heating operating mode.

To sum up, the small-sized curing device after ball planting of BGA chip is used for fixing a heating component through a frame plate 1, a preheating infrared tube 3 is fixed through a sheet metal shell 2 and is fixed on the frame plate 1 together for preheating after ball planting of the BGA chip, so that the temperature of the heating area of the BGA chip is uniform, the solder ball is prevented from being changed, a heating head 12 is made of stainless steel and is connected with a heating tube 11, the inside of the heating tube 11 generates heat through resistance, the temperature can be adjusted through controlling the current, a fan 10 is installed on the upper portion of the heating tube 11, blows downwards to pass through the heating tube 11, heated airflow is discharged through the heating head 12 to heat the solder ball after ball planting of BGA, a heating temperature curve and heating time can be set through controlling the temperature of the heating tube 11, each section of heating working condition of reflow soldering can be simulated, the up-and-down movement of the heating head 12 is controlled through an air cylinder 14 to control the distance with the BGA chip, when the device works, a BGA chip with planted balls and a jig are horizontally placed in the lower area of a heating head 12, a preheating infrared tube 3 is firstly started to preheat a heating area, after the BGA chip is uniformly preheated, a middle hot air tube heating mechanism is opened, the heating head 12 is aligned with the BGA chip, a temperature curve and heating time are preset, the processes are finished, heating is finished, the BGA solder balls are heated, melted and fixed on the chip, the device can quickly finish curing operation of the BGA solder balls after ball planting, the device is convenient and quick, does not need manual intervention, has small occupied area, is suitable for reflux heating of a small number of BGA chips after ball planting, has simple integral structure and convenient use, can realize quick heating after ball planting of the BGA, can cure the solder balls, prevent the solder balls from running, improves the yield, can greatly reduce the cost of curing the solder balls, reduces pollution to the environment, can finish the curing process after ball planting at any time, does not need professional support skills, simultaneously can also integrate to in the BGA production line, satisfy many-sided demand, it is big to have solved reflow soldering equipment area, the input cost is high, after small batch BGA plant the ball, the additional cost of production is high, it is big to environmental pollution, reflow soldering equipment needs the special messenger to operate, the special messenger maintains, the reflow soldering parameter sets up, a large amount of experiences of needs support, BGA encapsulation test of being not convenient for, reflow soldering equipment is not convenient for integrate to the automatic production line of planting the ball of BGA, need carry out a large amount of reequip designs and can meet the demands, the problem of inconvenient use.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a small-size solidification equipment after BGA chip plants ball, includes frame board (1), its characterized in that: the infrared heating device is characterized in that the right side of the frame plate (1) is movably connected with a sheet metal shell (2), the left side of the sheet metal shell (2) is movably connected with a preheating infrared tube (3), the top of the frame plate (1) is movably connected with a fixed plate (4), the top of the fixed plate (4) is fixedly connected with a reinforcing rib (5), the front of the reinforcing rib (5) is movably connected with a connecting plate (6), the front of the connecting plate (6) is movably connected with a connecting block (7), the front of the connecting block (7) is movably connected with a movable plate (8), the front of the movable plate (8) is fixedly connected with a fixed baffle (9), the bottom of the fixed baffle (9) is movably connected with a fan (10), the bottom of the fan (10) is movably connected with a heating tube (11), and the bottom of the heating tube (11) is movably connected with a heating head (12), the utility model discloses a portable computer, including fly leaf, the left side fixedly connected with limiting plate (13) of fly leaf (8), the left side fixedly connected with cylinder (14) of limiting plate (13), the bottom swing joint of frame board (1) has link (15), the equal swing joint in the left and right sides of frame board (1) bottom has frame foot (16).

2. The BGA chip post-ball-mounting small curing device of claim 1, wherein: the number of the machine frame feet (16) is two, and the two machine frame feet (16) are movably connected with the connecting frame (15).

3. The BGA chip post-ball-mounting small curing device of claim 1, wherein: fixed square hole has been seted up to the inboard of frame foot (16), sheet metal housing (2) and link (15) swing joint.

4. The BGA chip post-ball-mounting small curing device of claim 1, wherein: the reinforcing ribs (5) are movably connected with the connecting plate (6) through movable screws, and the fixed baffle (9) is movably connected with the limiting plate (13).

5. The BGA chip post-ball-mounting small curing device of claim 1, wherein: the fan (10), the heating pipe (11) and the heating head (12) are all located on the front face of the frame plate (1), and the front face of the frame foot (16) is provided with a connecting hole.

6. The BGA chip post-ball-mounting small curing device of claim 1, wherein: the connecting frame (15) is movably connected with the frame foot (16) through a connecting screw, and the connecting block (7) is movably connected with the movable plate (8) through a bolt.