CN105772886B - A kind of Through-hole reflow device and its control method - Google Patents
A kind of Through-hole reflow device and its control method Download PDFInfo
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- CN105772886B CN105772886B CN201610298723.3A CN201610298723A CN105772886B CN 105772886 B CN105772886 B CN 105772886B CN 201610298723 A CN201610298723 A CN 201610298723A CN 105772886 B CN105772886 B CN 105772886B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses a kind of Through-hole reflow device,Including Reflow Soldering board,The upper plane back edge of Reflow Soldering board is provided with a welding machine platform lid that can be opened and closed,The upper plane of Reflow Soldering board is provided with can be with the product pipeline of adjustment width,The first lower furnace and the second lower furnace are sequentially provided with Reflow Soldering board from left to right,The position of corresponding first lower furnaces of welding machine Tai Gainei is provided with the first warm area upper furnace of exhausting,The position of corresponding second lower furnaces of welding machine Tai Gainei is provided with the second warm area upper furnace to fall wind,First warm area upper furnace and the first lower furnace form the first warm area,Second warm area upper furnace and the second lower furnace form the second warm area,Product pipeline is located at the first warm area and the position of the second warm area is provided with for cold wind and hot blast to be separated,And the screen that can be stretched or shorten,Reflow Soldering board is provided with Human-machine Control interface,A cooling zone is additionally provided with Reflow Soldering board.This product is welded suitable for PCB plate through hole, is easy to control welding temperature, is made welding effect more preferably.
Description
Technical field
The present invention relates to welding equipment of circuit board, more particularly to a kind of Through-hole reflow device.
Background technology
At present, in the welding technique of circuit board, the welding equipment of generally use is " wave-soldering ", and wave-soldering is to pass through tin
Tin bar melt into liquid is stirred to form crest, allows PCB to be welded with component, be commonly used in the weldering of hand plug-in unit by groove using motor
Connect the glue plate with smt.Reflow welding is used primarily in SMT industries, and it is conducted by hot blast or other heat radiations, will be printed on PCB
On tin cream fusing welded with component.But the Baking out mode of this kind of wave-soldering is in the presence of some defects：1st, crest
Weldering will first spray scaling powder, then by preheating, welding, cooling zone.Reflow Soldering is by preheating zone, recirculating zone, cooling zone.In addition, ripple
Peak weldering is applied to hand plate and point offset plate, and requires that all elements are heat-resisting, and the member of SMT tin creams cannot be had by crossing crest surface
Part, the plank of SMT tin creams may only just cross Reflow Soldering, it is not possible to use wave-soldering.2nd, weld defect is more, after back segment detection, such as
Fruit finds solder skip, then needs artificial repair welding, and manual labor amount is big.3rd, the component heatproof degree needed is high.4th, the energy is wasted, often
The substantial amounts of soldering tin bar of daily consumption and scaling powder.
The content of the invention
The purpose of the present invention is the drawbacks described above for prior art, there is provided a kind of heating space that can pass through product
Temperature difference be maintained at a peak value, will not make temperature difference fluctuation it is too big, be easily controlled temperature and can by upper and lower temperature every
The Through-hole reflow device opened.
To solve the drawbacks described above of prior art, technical scheme provided by the invention is：A kind of Through-hole reflow device, bag
Reflow Soldering board is included, the upper plane back edge of the Reflow Soldering board is provided with a welding machine platform lid that can be opened and closed, institute
Stating the upper plane of Reflow Soldering board, be provided with can be with the product pipeline of adjustment width, in the Reflow Soldering board from left to right successively
Provided with least one first lower furnace of blowing hot-air and at least one the second lower furnace blown upwards upwards, the welding machine Tai Gainei
The position of corresponding first lower furnace is provided with the first warm area upper furnace of exhausting, and the welding machine Tai Gainei corresponds to second time stove
The position of courage is provided with the second warm area upper furnace to fall wind, and the first warm area upper furnace and the first lower furnace form first
Warm area, the second warm area upper furnace and the second lower furnace form the second warm area, and the product pipeline is positioned at the described first temperature
Area and the position of second warm area are provided with the screen for being used for separating and can stretch or shorten cold wind and hot blast, backflow
Welding machine platform is provided with Human-machine Control interface, is equipped with temperature sensor in first warm area and second warm area, described time
Oxygen analyser is provided with fluid welding board, a cooling zone is additionally provided with the Reflow Soldering board；
The product pipeline includes dynamic guide rail and determines guide rail, and the dynamic guide rail before and after multiple step motor controls by moving
Dynamic distance, adjust dynamic guide rail and determine the distance between guide rail, for conveying various sizes of product, the both ends for determining guide rail
Be respectively erected in the both ends of the Reflow Soldering board, the dynamic guide rail and determine to be equipped with conveyer belt on guide rail, the dynamic guide rail with
Determine to be interval with multiple locking devices for being used to lock product on guide rail；
The screen undulate, the screen are high temperature resistant heat insulation material, the dynamic guide rail and the Reflow Soldering
Screen is provided between the posterior edges of board, the forward edge for determining guide rail and the Reflow Soldering board is provided with screen,
The dynamic guide rail forward adjustable range when, the dynamic guide rail and determine guide rail distance and diminish, the screen is stretched, and described move is led
Rail backward adjustable range when, the dynamic guide rail and determine guide rail distance and become big, the screen contraction.
One kind as Through-hole reflow device of the present invention is improved, and first lower furnace includes lower furnace outer cover, lower stove
Courage inner bag and two lower ventilating boards, the lower furnace outer cover is interior to be provided with flue connecting plate and multiple heating wire fixed seats, under described
Flue inner bag is arranged on the flue connecting plate, and multiple heating wire fixed seats are fixed with least one heating wire simultaneously,
The both ends of the heating wire are connected to the lower furnace outer cover both sides, and lower wind wheel wind is provided with the cavity of the lower furnace inner bag
Cover, be stamped heating board at the cavities open of the lower furnace inner bag, several air-out are interval with the lower heating board
Hole, two lower ventilating boards are separately mounted to the both sides of the lower furnace outer cover, and the middle part of the lower furnace outer cover is provided with down
Flue blower fan.
One kind as Through-hole reflow device of the present invention is improved, and during the lower furnace blower fan work, heating wire is heated
Air afterwards is sent in the cavity of lower furnace inner bag, after the cavity of the lower furnace inner bag, by the lower heating board
Through hole flows out, and can not continue to rise due to being separated by screen between lower heating board and the first warm area upper furnace, hot-air
Flow into again in the cavity of lower furnace outer cover, heating Posterior circle again by the heating wire utilizes.
One kind as Through-hole reflow device of the present invention is improved, and the first warm area upper furnace is included outside the first upper furnace
Ventilating board on cover, the first upper furnace inner bag and two first, the cavity of the first upper furnace outer cover is interior to be provided with the first upper furnace
Connecting plate, the first upper furnace inner bag are arranged on the first upper furnace connecting plate in the cavity of the first upper furnace outer cover
On, heating board on first is stamped on the cavities open of the first upper furnace inner bag, heating board is provided with some on described first
Individual exhaust vent, ventilating board is separately positioned on the both sides of the first upper furnace outer cover on two described first, stove on described first
The middle part of courage outer cover is provided with the first exhausting motor.
One kind as Through-hole reflow device of the present invention is improved, during the first exhausting motor operations, on described first
The hot-air of flue inner bag is extracted out outside the first upper furnace outer cover.
One kind as Through-hole reflow device of the present invention is improved, and the second warm area upper furnace is included outside the second upper furnace
Ventilating board on cover, the second upper furnace inner bag and two second, multiple the are interval with the cavity of the second upper furnace outer cover
Two upper furnace connecting plates, the second upper furnace inner bag are arranged on the second upper furnace in the cavity of the second upper furnace outer cover
On connecting plate, upper wind wheel fan housing is provided with the cavity of the second upper furnace inner bag, the cavity of the second upper furnace inner bag is opened
Heating board on second is stamped on mouthful, and heating board is provided with several exhaust vents on described second, ventilating board on two described second
The both sides of the second upper furnace outer cover are separately positioned on, the middle part of the second upper furnace outer cover is provided with a fan, described
The wind wheel of fan is stretched into the upper wind wheel fan housing.
One kind as Through-hole reflow device of the present invention is improved, and during fan work, cold air is from the welding machine
Flowed into the air holes of Tai Gai sides in the cavity of the second upper furnace outer cover, cold air enters after the second upper furnace outer cover again
It is delivered to by fan in the cavity of the second upper furnace inner bag, then is blown out by the exhaust vent of heating board on described second, and is blown
To product upper surface.
Compared with prior art, it is an advantage of the invention that：Present invention employs the first warm area that can be heated at reflux and
Two warm areas, the first lower furnace heat air delivery of the first warm area, blow to the lower surface direction of product, on the first warm area of the first warm area
Flue carries out exhausting, and the heat of product upper surface is detached, makes the temperature of product surface reduce；Product passes through multiple second warm areas
When, the second lower furnace heat air delivery, blown to the lower surface direction of product, the second warm area upper furnace of the second warm area conveys downwards cold
Wind, act on the upper surface of product, the temperature difference of product upper surface and product lower surface is reached maximum, this product is used and kept out the wind
Curtain separates upper and lower temperature, is easy to control the temperature of product upper surface and the temperature of lower surface.
It is a further object to provide a kind of control method of Through-hole reflow device, comprise the following steps：
A warm area) is controlled, the first warm area (preheating zone) and the second warm area (recirculating zone) of reflowable heating are set；First temperature
Area is formed by the first warm area upper furnace with the first lower furnace, and the second warm area is formed by the second warm area upper furnace with the second lower furnace；
Second warm area upper furnace is only blown a cold wind over, and cooling zone is blown a cold wind over；
B the temperature value of the first warm area and the second warm area) is set, by the temperature value of temperature sensor senses warm area, makes the
Temperature difference between first warm area upper furnace of one warm area and the first lower furnace reaches maximum, makes the second warm area of the second warm area
Temperature difference between upper furnace and the second lower furnace reaches maximum；
C) product conveying unit of preparation adjustable width, product are delivered to the first warm area, the by the product conveying unit
Two warm areas and cooling zone；
D) the first lower furnace heat air delivery of the first warm area, blows to the lower surface direction of product, the first temperature of the first warm area
Area's upper furnace carries out exhausting, and the heat of product upper surface is detached, makes the temperature of product surface reduce, prevents element high temperature from breaking
It is bad；When product passes through multiple second warm areas, the second lower furnace heat air delivery, blown to the lower surface direction of product, the second warm area
The second downward transporting cold wind of warm area upper furnace, acts on the upper surface of product, makes the temperature of product upper surface and product lower surface
Difference reaches maximum；
E) output of products cooling zone, finished product is gone out.
The a kind of of control method as Through-hole reflow device of the present invention improves, the hot blast of the second lower furnace conveying
Temperature is more than the hot blast temperature of the first lower furnace conveying.
The a kind of of control method as Through-hole reflow device of the present invention improves, the hot blast of the second lower furnace conveying
Temperature is 150 DEG C~260 DEG C；The hot blast temperature of the first lower furnace conveying is 30 DEG C~150 DEG C.
Compared with prior art, it is an advantage of the invention that：The control method for the Through-hole reflow device that the present invention uses, if
It is equipped with two warm areas, the first warm area is preheating zone, and the second warm area is recirculating zone, and the temperature value of the first warm area and the second warm area all may be used
To be separately provided, the temperature value of the first warm area and the second warm area is kept balance, and there is hydronic effect, fully profit
With hot blast, energy loss is reduced, saves the energy, this method step is simple, easily implements.
The reflow process of the present invention：PCB print solder pastes first, component is inserted into Reflow Soldering is artificial before, is entered
During two 130 DEG C~150 DEG C of the first warm area (preheating warm area), solvent, gas evaporation in soldering paste fall, meanwhile, soldering paste softening,
Slump, pad is covered, pad, component's feet are isolated with oxygen；And sticking-element is sufficiently preheated, subsequently enter
During one the second warm area (Reflow Soldering), temperature is risen rapidly with 2-3 DEG C of international standard heating rate per second makes soldering paste reach fusing
State, liquid solder are blended on weld interface in the wetting of PCB pad, component welding end and pin, diffusion, cross flow and backflow
Metallic compound is generated, forms solder joints；Last PCB, which enters cooling zone, solidifies solder joint.
Brief description of the drawings
Just with embodiment technique effect of the invention and its beneficial is made with reference to the accompanying drawings below further details of
Description, wherein：
Fig. 1 is three-dimensional structure diagram of the present invention.
Fig. 2 is front view of the present invention.
Fig. 3 is A-A sectional views in Fig. 2 of the present invention.
Fig. 4 is B-B sectional views in Fig. 2 of the present invention.
Fig. 5 is the first warm area structure chart of the invention.
Fig. 6 is the second warm area structure chart of the invention.
Fig. 7 is lower furnace structural representation of the present invention.
Fig. 8 is upper furnace structural representation of the present invention.
Fig. 9 is the structural representation after present invention installation airduct.
Figure 10 is PCB plate through hole Reflow Soldering temperature characteristics analysis principle figure of the present invention.
Figure 11 is enlarged drawing at A in Fig. 1.
Reference title：1st, Reflow Soldering board 2, welding machine platform lid 3, product pipeline 4, the first lower furnace 5, second time stove
Courage 6, the first warm area upper furnace 7, the second warm area upper furnace 8, the first warm area 9, the second warm area 10, screen 11, Human-machine Control circle
It is face 12, oxygen analyser 13, main air draft pipeline 14, air holes 15, cooling zone 41, lower furnace outer cover 42, lower furnace inner bag 43, lower logical
Aerofoil 44, flue connecting plate 45, heating wire fixed seat 46, heating wire 47, lower wind wheel fan housing 48, lower heating board 49, lower furnace wind
Machine 61, the first upper furnace outer cover 62, ventilating board 64, the first upper furnace connecting plate 65, first on the first upper furnace inner bag 63, first
Upper heating board 66, the first exhausting motor 71, the second upper furnace outer cover 72, ventilating board 74, on the second upper furnace inner bag 73, second
Heating board 77, fan on two upper furnace connecting plates 75, upper wind wheel fan housing 76, second.
Embodiment
Just the invention will be further described with specific embodiment with reference to the accompanying drawings below, but embodiments of the present invention not office
It is limited to this.
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8 and Figure 11, a kind of Through-hole reflow device, including return
Fluid welding board 1, the upper plane back edge of Reflow Soldering board 1 are provided with a welding machine platform lid 2 that can be opened and closed, welding machine platform lid
2 are opened or closed by the support arm connection control that can be stretched, and the upper plane of Reflow Soldering board 1 is provided with can be with adjustment width
Product pipeline 3, be sequentially provided with from left to right in Reflow Soldering board 1 two upward blowing hot-airs the first lower furnace 4 and one to
On the second lower furnace 5 for blowing, the position of corresponding first lower furnace 4 is provided with the first warm area upper furnace of exhausting in welding machine platform lid 2
6, the position of corresponding second lower furnace 5 is provided with the second warm area upper furnace 7 to fall wind in welding machine platform lid 2, on the first warm area
The lower furnace 4 of flue 6 and first forms the first warm area 8, and the second warm area upper furnace 7 and the second lower furnace 5 form the second warm area 9, production
Product pipeline 3 be located at the first warm area 8 and the second warm area 9 position be provided be used to separate cold wind and hot blast and can stretch or
The screen 10 of shortening, Reflow Soldering board 1 are provided with Human-machine Control interface 11, temperature are equipped with the first warm area 8 and the second warm area 9
Sensor is spent, oxygen analyser 12 is provided with Reflow Soldering board 1, a cooling zone 15 is additionally provided with Reflow Soldering board 1.The present embodiment
Primarily directed to PCB plate through hole solder reflow operation, control the second warm area upper furnace 7 to blow a cold wind over by Human-machine Control interface 11, close
The heating of the second warm area upper furnace heating wire is closed, the second warm area upper furnace 7 of the second warm area 9 and the temperature difference of the second lower furnace 5 is existed
One peak value.The present embodiment only has bottom Cai You heating zones, and top is then blown a cold wind over.Such design can try one's best less temperature
Damage to component body.The temperature of two preheating zones and a recirculating zone can be independently controlled, and cooling zone is then blown a cold wind over.
Preferably, product pipeline 3 includes dynamic guide rail 31 and determines guide rail 32, and dynamic guide rail 31 passes through multiple step motor controls
Movable distance, adjust dynamic guide rail 31 and determine the distance between guide rail 32, for conveying various sizes of product, determine guide rail
32 both ends are respectively erected in the both ends of Reflow Soldering board 1, move guide rail 31 and determine to be equipped with conveyer belt on guide rail 32, move guide rail 31
With determine to be interval with multiple locking devices 33 for being used to lock product on guide rail 32.
Preferably, the undulate of screen 10, screen 10 are high temperature resistant heat insulation material, move guide rail 31 and Reflow Soldering board
Screen 10 is provided between 1 posterior edges, the forward edge for determining guide rail 32 and Reflow Soldering board 1 is provided with screen 10, dynamic to lead
Rail 31 forward adjustable range when, dynamic guide rail 31 and determine the distance of guide rail 32 and diminish, screen 10 is stretched, and moves guide rail 31 and adjusts backward
Apart from when, dynamic guide rail 31 and determine guide rail 32 apart from becoming greatly, screen 10 shrinks.
Preferably, the first lower furnace 4 includes lower furnace outer cover 41, lower furnace inner bag 42 and two lower ventilating boards 43, lower stove
Flue connecting plate 44 and multiple heating wire fixed seats 45 are provided with courage outer cover 41, lower furnace inner bag 42 is arranged on flue connecting plate 44
On, multiple heating wire fixed seats 45 are fixed with least one heating wire 46 simultaneously, and the both ends of heating wire 46 are connected to outside lower furnace
The both sides of cover 41, the cavity of lower furnace inner bag 42 is interior to be provided with lower wind wheel fan housing 47, is stamped at the cavities open of lower furnace inner bag 42
Heating board 48 once, several exhaust vents are interval with lower heating board 48, two lower ventilating boards 43 are separately mounted to lower furnace
The both sides of outer cover 41, the middle part of lower furnace outer cover 41 are provided with lower furnace blower fan 49.
Preferably, when lower furnace blower fan 49 works, the air after heating wire 46 is heated is sent to lower furnace inner bag 42
In cavity, after the cavity of lower furnace inner bag 42, flowed out by the through hole of lower heating board 48, due to the lower temperature of heating board 48 and first
Being separated between area's upper furnace 6 by screen 10 can not continue to rise, and hot-air flows into the cavity of lower furnace outer cover 41 again, by sending out
Heated filament 46 heats Posterior circle utilization again.
Preferably, the first warm area upper furnace 6 includes the first upper furnace outer cover 61, the first upper furnace inner bag 62 and two first
Upper ventilating board 63, the cavity of the first upper furnace outer cover 61 is interior to be provided with the first upper furnace connecting plate 64, and the first upper furnace inner bag 62 is pacified
On the first upper furnace connecting plate 64 in the cavity of the first upper furnace outer cover 61, the cavities open of the first upper furnace inner bag 62
On be stamped heating board 65 on first, heating board 65 is provided with several exhaust vents on first, and ventilating board 63 is distinguished on two first
The both sides of the first upper furnace outer cover 61 are arranged on, the middle part of the first upper furnace outer cover 61 is provided with the first exhausting motor 66.
As shown in figure 9, the wind pipe connection main air draft pipeline 13 of the first exhausting motor 66.
Preferably, when the first exhausting motor 66 works, the hot-air of the first upper furnace inner bag 62 is extracted out outside the first upper furnace
Outside cover 61.
Preferably, the second warm area upper furnace 7 includes the second upper furnace outer cover 71, the second upper furnace inner bag 72 and two second
Upper ventilating board 73, multiple second upper furnace connecting plates 74, the second upper furnace are interval with the cavity of the second upper furnace outer cover 71
Inner bag 72 is arranged on the second upper furnace connecting plate 74 in the cavity of the second upper furnace outer cover 71, the second upper furnace inner bag 72
Upper wind wheel fan housing 75 is provided with cavity, is stamped heating board 76 on second on the cavities open of the second upper furnace inner bag 72, on second
Heating board 76 is provided with several exhaust vents, and ventilating board 73 is separately positioned on the two of the second upper furnace outer cover 71 on two second
Side, the middle part of the second upper furnace outer cover 71 are provided with a fan 77, and the wind wheel of fan 77 is stretched into wind wheel fan housing 75.
Preferably, when fan 77 works, cold air flows into the second upper furnace outer cover from the side air holes 14 of welding machine platform lid 1
In 71 cavity, cold air is delivered to the second upper furnace inner bag 72 by fan 77 again after entering the second upper furnace outer cover 71
In cavity, then blown out by the exhaust vent of heating board 76 on second, and blow to product upper surface.
It is an advantage of the invention that：Present invention employs the first warm area 8 that can be heated at reflux and the second warm area 9, the first temperature
The first lower furnace heat air delivery in area 8, blows to the lower surface direction of product, and the first warm area upper furnace of the first warm area 8 is taken out
Wind, the heat of product upper surface is detached, make the temperature of product surface reduce；When product passes through multiple second warm areas 9, under second
Flue heat air delivery, blow, the second downward transporting cold wind of warm area upper furnace of the second warm area 9, act on to the lower surface direction of product
On the upper surface of product.
A kind of control method of Through-hole reflow device, comprises the following steps：
A warm area) is controlled, the first warm area (preheating zone) and the second warm area (recirculating zone) of reflowable heating are set；First temperature
Area is formed by the first warm area upper furnace with the first lower furnace, and the second warm area is formed by the second warm area upper furnace with the second lower furnace；
Second warm area upper furnace is only blown a cold wind over, and cooling zone is blown a cold wind over；
B the temperature value of the first warm area and the second warm area) is set, by the temperature value of temperature sensor senses warm area, makes the
Temperature difference between first warm area upper furnace of one warm area and the first lower furnace reaches maximum, makes the second warm area of the second warm area
Temperature difference between upper furnace and the second lower furnace reaches maximum；
C) product conveying unit of preparation adjustable width, product are delivered to the first warm area, the by the product conveying unit
Two warm areas and cooling zone；
D) the first lower furnace heat air delivery of the first warm area, blows to the lower surface direction of product, the first temperature of the first warm area
Area's upper furnace carries out exhausting, and the heat of product upper surface is detached, makes the temperature of product surface reduce, prevents element high temperature from breaking
It is bad；When product passes through multiple second warm areas, the second lower furnace heat air delivery, blown to the lower surface direction of product, the second warm area
The second downward transporting cold wind of warm area upper furnace, acts on the upper surface of product, makes the temperature of product upper surface and product lower surface
Difference reaches maximum；
E) output of products cooling zone, finished product is gone out.
Preferably, the hot blast temperature of the second lower furnace conveying is more than the hot blast temperature of the first lower furnace conveying.
Preferably, the hot blast temperature of the second lower furnace conveying is 150 DEG C~260 DEG C；The heat of the first lower furnace conveying
Air temperature is 30 DEG C~150 DEG C.
The control method for the Through-hole reflow device that the present invention uses, two warm areas being provided with, the first warm area is preheating zone,
Second warm area is recirculating zone, and the temperature value of the first warm area and the second warm area can be separately provided, and makes the first warm area and the second temperature
The temperature value in area keeps balance, and has hydronic effect, makes full use of hot blast, reduces energy loss, saves the energy,
This method step is simple, easily implements.
The PCB plate through hole reflow process of the present invention：PCB print solder pastes first, into Reflow Soldering, artificial insertion is first before
Device, during into two 140 DEG C~160 DEG C of the first warm area (preheating warm area), solvent, gas evaporation in soldering paste fall, meanwhile,
Soldering paste softening, slump, cover pad, pad, component's feet are isolated with oxygen；And it is sufficiently pre- to obtain sticking-element
Heat, when subsequently entering the second warm area (Reflow Soldering), temperature is risen rapidly with 2-3 DEG C of international standard heating rate per second to be made
Soldering paste reaches molten state, and liquid solder is in the wetting of PCB pad, component welding end and pin, diffusion, cross flow and backflow mixing
Metallic compound is generated on weld interface, forms solder joints；Last PCB, which enters cooling zone, solidifies solder joint.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments in the case where not departing from the principle and structure of the present invention, replace by understanding
And modification, the scope of the present invention are limited by appended claims and its equivalency range.
Claims (10)
1. a kind of Through-hole reflow device, including Reflow Soldering board, the upper plane back edge of the Reflow Soldering board is provided with one
The welding machine platform lid that can be opened and closed, it is characterised in that the upper plane of the Reflow Soldering board is provided with can be with adjustment width
Product pipeline, at least one first lower furnace of blowing hot-air upwards and extremely is sequentially provided with the Reflow Soldering board from left to right
Second lower furnace of a few upward blowing hot-air, the positions of corresponding first lower furnaces of the welding machine Tai Gainei provided with exhausting the
One warm area upper furnace, the position that the welding machine Tai Gainei corresponds to second lower furnace are provided with the second warm area of fall wind
Flue, the first warm area upper furnace and the first lower furnace form the first warm area, the second warm area upper furnace and second time stove
Courage forms the second warm area, and the position that the product pipeline be located at first warm area and second warm area is provided with for will be cold
The screen that wind and hot blast separate and can stretch or shorten, Reflow Soldering board are provided with Human-machine Control interface, first temperature
Temperature sensor is equipped with area and second warm area, oxygen analyser, the Reflow Soldering are provided with the Reflow Soldering board
A cooling zone is additionally provided with board；
The product pipeline includes dynamic guide rail and determines guide rail, and the dynamic guide rail is moved forward and backward by multiple step motor controls
Distance, adjust dynamic guide rail and determine the distance between guide rail, for conveying various sizes of product, the both ends difference for determining guide rail
It is erected at the both ends of the Reflow Soldering board, the dynamic guide rail and determines to be equipped with conveyer belt on guide rail, the dynamic guide rail and leads surely
Multiple locking devices for being used to lock product are interval with rail；
The screen undulate, the screen are high temperature resistant heat insulation material, the dynamic guide rail and the Reflow Soldering board
Posterior edges between be provided with screen, the forward edge for determining guide rail and the Reflow Soldering board is provided with screen, described
Dynamic guide rail forward adjustable range when, the dynamic guide rail and determine guide rail distance and diminish, the screen is stretched, the dynamic guide rail to
Afterwards during adjustable range, the dynamic guide rail becomes big with guide rail distance is determined, and the screen shrinks.
2. Through-hole reflow device according to claim 1, it is characterised in that first lower furnace is included outside lower furnace
Cover, lower furnace inner bag and two lower ventilating boards, the lower furnace outer cover is interior to be provided with flue connecting plate and multiple heating wire fixed seats,
The lower furnace inner bag is arranged on the flue connecting plate, and multiple heating wire fixed seats are fixed with least one hair simultaneously
Heated filament, the both ends of the heating wire are connected to the lower furnace outer cover both sides, leeward are provided with the cavity of the lower furnace inner bag
Fan housing is taken turns, heating board is stamped at the cavities open of the lower furnace inner bag, several is interval with the lower heating board
Exhaust vent, two lower ventilating boards are separately mounted to the both sides of the lower furnace outer cover, set in the middle part of the lower furnace outer cover
There is lower furnace blower fan.
3. Through-hole reflow device according to claim 2, it is characterised in that during the lower furnace blower fan work, will send out
Air after heated filament heating is sent in the cavity of lower furnace inner bag, after the cavity of the lower furnace inner bag, under described
The through hole outflow of heating board, due on being separated and can not continuing by screen between lower heating board and the first warm area upper furnace
Rise, hot-air flows into the cavity of lower furnace outer cover again, and heating Posterior circle again by the heating wire utilizes.
4. Through-hole reflow device according to claim 1, it is characterised in that the first warm area upper furnace includes first
Ventilating board on upper furnace outer cover, the first upper furnace inner bag and two first, the is provided with the cavity of the first upper furnace outer cover
One upper furnace connecting plate, the first upper furnace inner bag are arranged on the first upper furnace in the cavity of the first upper furnace outer cover
On connecting plate, heating board on first is stamped on the cavities open of the first upper furnace inner bag, set on described first on heating board
There are several exhaust vents, ventilating board is separately positioned on the both sides of the first upper furnace outer cover on two described first, and described
The middle part of one upper furnace outer cover is provided with the first exhausting motor.
5. Through-hole reflow device according to claim 4, it is characterised in that during the first exhausting motor operations, institute
The hot-air for stating the first upper furnace inner bag is extracted out outside the first upper furnace outer cover.
6. Through-hole reflow device according to claim 1, it is characterised in that the second warm area upper furnace includes second
Ventilating board on upper furnace outer cover, the second upper furnace inner bag and two second, the interior interval of cavity of the second upper furnace outer cover are set
There are multiple second upper furnace connecting plates, the second upper furnace inner bag is arranged on the in the cavity of the second upper furnace outer cover
On two upper furnace connecting plates, upper wind wheel fan housing, the second upper furnace inner bag are provided with the cavity of the second upper furnace inner bag
Cavities open on be stamped heating board on second, heating board is provided with several exhaust vents on described second, two described second
Upper ventilating board is separately positioned on the both sides of the second upper furnace outer cover, and the middle part of the second upper furnace outer cover is provided with a windward
Machine, the wind wheel of the fan are stretched into the upper wind wheel fan housing.
7. Through-hole reflow device according to claim 6, it is characterised in that during fan work, cold air from
Flowed into the welding machine Tai Gai sides air holes in the cavity of the second upper furnace outer cover, cold air enters second upper furnace
It is delivered in the cavity of the second upper furnace inner bag by fan after outer cover, then is blown by the exhaust vent of heating board on described second again
Go out, and blow to product upper surface.
A kind of 8. control method for controlling the Through-hole reflow device described in claim 1-7 any one, it is characterised in that bag
Include following steps：
A）Warm area is controlled, the first warm area and the second warm area of reflowable heating are set；First warm area by the first warm area upper furnace with
First lower furnace is formed, and the second warm area is formed by the second warm area upper furnace with the second lower furnace；Second warm area upper furnace only blows cold
Wind, cooling zone are blown a cold wind over；
B）The temperature value of the first warm area and the second warm area is set, by the temperature value of temperature sensor senses warm area, makes the first temperature
Temperature difference between the first warm area upper furnace in area and the first lower furnace reaches maximum, makes stove on the second warm area of the second warm area
Temperature difference between courage and the second lower furnace reaches maximum；
C）The product conveying unit of preparation adjustable width, product are delivered to the first warm area, the second temperature by the product conveying unit
Area and cooling zone；
D）First lower furnace heat air delivery of the first warm area, blows to the lower surface direction of product, on the first warm area of the first warm area
Flue carries out exhausting, and the heat of product upper surface is detached, makes the temperature of product surface reduce, prevents element high temperature；Production
When product pass through multiple second warm areas, the second lower furnace heat air delivery, blown to the lower surface direction of product, the second temperature of the second warm area
The downward transporting cold wind of area's upper furnace, is acted on the upper surface of product, reaches product upper surface and the temperature difference of product lower surface
It is maximum；
E）Output of products cooling zone, goes out finished product.
9. the control method of Through-hole reflow device according to claim 8, it is characterised in that second lower furnace is defeated
The hot blast temperature sent is more than the hot blast temperature of the first lower furnace conveying.
10. the control method of Through-hole reflow device according to claim 8, it is characterised in that second lower furnace
The hot blast temperature of conveying is 150 DEG C~260 DEG C；The hot blast temperature of the first lower furnace conveying is 30 DEG C~150 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610298723.3A CN105772886B (en) | 2016-05-06 | 2016-05-06 | A kind of Through-hole reflow device and its control method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610298723.3A CN105772886B (en) | 2016-05-06 | 2016-05-06 | A kind of Through-hole reflow device and its control method |
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| CN105772886B true CN105772886B (en) | 2018-02-27 |
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| CN106112168B (en) * | 2016-08-22 | 2019-02-22 | 朗微士光电（苏州）有限公司 | A kind of online vacuum back-flow welding machine |
| CN108237293B (en) * | 2016-12-26 | 2023-08-08 | 上海朗仕电子设备有限公司 | Integral updraft ventilator |
| CN106802082A (en) * | 2017-03-07 | 2017-06-06 | 东莞市创威自动化科技有限公司 | It is a kind of to be easy to cleaning maintenance, the heating furnace of high energy efficiency |
| CN108063108A (en) * | 2018-01-22 | 2018-05-22 | 广安市嘉乐电子科技有限公司 | A kind of MB bridges heap bonding machine |
| CN109014481B (en) * | 2018-09-21 | 2021-04-09 | 安徽机电职业技术学院 | Energy-saving efficient reflow soldering machine |
| CN110091025A (en) * | 2019-06-25 | 2019-08-06 | 唐山铁路工务器材制造有限公司 | Continuous brazing equipment and method |
| CN113163618A (en) * | 2020-01-22 | 2021-07-23 | 上海朗仕电子设备有限公司 | Vacuum device for reflow oven |
| CN111451592B (en) * | 2020-03-19 | 2022-04-19 | 金升阳（怀化）科技有限公司 | Through hole reflow soldering equipment and through hole reflow soldering processing method |
| CN112139620B (en) * | 2020-09-26 | 2022-04-01 | 黄山学院 | Device and method for full-automatic control of selective wave soldering |
| CN113305391B (en) * | 2021-07-02 | 2023-01-03 | 深圳市顺达成电子设备有限公司 | Hot air solidifying and cooling furnace |
| DE102021129122B4 (en) * | 2021-11-09 | 2024-03-07 | Ersa Gmbh | Soldering system, especially reflow soldering system with cover and switchable suction channel |
| CN115673456A (en) * | 2022-11-11 | 2023-02-03 | 广州金升阳科技有限公司 | Through hole reflow soldering method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1093232A (en) * | 1996-09-11 | 1998-04-10 | Nihon Dennetsu Kk | Reflow soldering equipment |
| CN102049587A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for large temperature difference adjustment of reflow soldering machine and temperature control method |
| CN102353682B (en) * | 2011-07-01 | 2013-06-12 | 深圳市日联科技有限公司 | On-the-spot online automatic optical detection equipment and method |
| WO2013038456A1 (en) * | 2011-09-15 | 2013-03-21 | 富士通テレコムネットワークス株式会社 | Device and method for reflow soldering |
| CN202910423U (en) * | 2012-09-01 | 2013-05-01 | 何毅 | Double-channel reflow soldering machine |
| CN103231139A (en) * | 2013-04-24 | 2013-08-07 | 无锡市崇安区科技创业服务中心 | Intelligent reflow soldering system |
| CN203448824U (en) * | 2013-08-31 | 2014-02-26 | 东莞市科隆威自动化设备有限公司 | Reflow soldering heating device |
| CN204504450U (en) * | 2015-01-21 | 2015-07-29 | 李战胜 | A kind of structure improved Through-hole reflow machine |
| CN205629586U (en) * | 2016-05-06 | 2016-10-12 | 东莞市科隆威自动化设备有限公司 | Through -hole reflow soldering device |
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