CN104942394B - Lead ceramic thermistor welding method with high reliability - Google Patents
Lead ceramic thermistor welding method with high reliability Download PDFInfo
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- CN104942394B CN104942394B CN201510299651.XA CN201510299651A CN104942394B CN 104942394 B CN104942394 B CN 104942394B CN 201510299651 A CN201510299651 A CN 201510299651A CN 104942394 B CN104942394 B CN 104942394B
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- preheating zone
- lead
- temperature
- preheating
- welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
Abstract
Adjusted the invention discloses a kind of lead ceramic thermistor welding method with high reliability, including routing：Control width between lead；Upper tin adjustment：Adjust solder joint soldering tin amount；Suction piece, inserted sheet adjustment：Pass through adjustment, it is ensured that the physical dimension of formed product lead and chip；Welding：Lead and chip are sequentially sent to preheating zone, hot air welding area and heat preservation zone, wherein preheating is distinguished into six sections of preheatings, hot air welding divides into two sections of hot air weldings.Molten tin scolding tin corrosion power between lead and PTC electrode surfaces is this approach enhance, the reliability of welding is strengthened, it is ensured that ceramic thermistor high pressure resistant, heavy current requirement for a long time.
Description
Technical field
The present invention relates to a kind of ceramic thermistor welding method, more particularly to a kind of lead with high reliability
Ceramic thermistor welding method, belongs to thermal resistor manufacturing technology field.
Background technology
Lead type ceramic thermistor, refers to the electrode surface of ceramic thermistor chip two welding two pins, so
Body is sealed with encapsulating material afterwards, to be adapted to automatic insertion needs.Lead when ceramic thermistor is assembled from contact
Conducting is acted on, and the weld strength of lead ceramic thermistor directly affects the performance of ceramic thermistor.Such as country YD/
T741-2002 standards require communication overcurrent protection with positive temperature coefficient (PTC) thermal resistor technical requirements, to pressure-resistant
The failure mode of 600V PTC themistor requirement：AC600V, initial current 15A, conduction time 60min, number of times 1 time.
When carrying out failure mode experiment, PTC themistor can sustain experiment or in failure state.This index, the weldering to PTC
Connect quality requirement very high, often due to the reason for welding, and cause failure mode performance to pass through.
Domestic patent CN 101229602A disclose a kind of chip of thermistor and the welding method of lead.But should
Method preheating warm area is short, and (scolding tin corrosion power can be referred to by the welding pulling-out force of butt welding point for the scolding tin corrosion power decline of Product jointing
Mark is tested), cause the deterioration of high pressure resistant, heavy current the performance of ceramic thermistor long-time.
The content of the invention
For above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of lead ceramics heat with high reliability
Sensitive resistor welding method, the problem of scolding tin corrosion power for solving Product jointing declines.
The technical scheme is that such：A kind of lead ceramic thermistor welding side with high reliability
Method, including routing adjustment：Control width between lead；Upper tin adjustment：Adjust solder joint soldering tin amount；Suction piece, inserted sheet adjustment：By adjusting
It is whole, it is ensured that the physical dimension of formed product lead and chip；Welding：Lead and chip are sequentially sent to preheating zone, hot air welding
Area and heat preservation zone, the preheating zone include the first preheating zone, the second preheating zone, the 3rd preheating zone, the 4th preheating zone, the 5th preheating
Area and the 6th preheating zone, the hot air welding area include the first hot blast area and the second hot blast area, and first preheating zone temperature is
90~110 DEG C, second preheating zone temperature is 130~150 DEG C, and the 3rd preheating zone temperature is 190~210 DEG C, described
4th preheating zone temperature is 210~300 DEG C, and the 5th preheating zone temperature is 240~320 DEG C, the 6th preheating zone temperature
For 270~360 DEG C, the first hot blast area temperature is 360~440 DEG C, and the second hot blast area temperature is 360~450 DEG C, institute
It is 200~260 DEG C, first preheating zone, the second preheating zone, the 3rd preheating zone, the 4th preheating zone, the 5th to state heat preservation zone temperature
The preheating time of preheating zone and the 6th preheating zone is 130~150s, during the processing in the first hot blast area and the second hot blast area
Between be 2~4s, 250~300s of the heat preservation zone soaking time.
It is preferred that, 360~430 DEG C of the first hot blast area temperature, 380~450 DEG C of the second hot blast area temperature is described
Second hot blast area temperature is higher 20 DEG C than the first hot blast area temperature.
It is preferred that, the scolding tin is SnCu alloy tins, and wherein Cu mass percents are 1~3%.
The beneficial effect of technical scheme provided by the present invention is：Pass through setting for multiple preheating zones and Liang Ge hot blasts area
Put, enhance molten tin scolding tin corrosion power between lead and PTC electrode surfaces, strengthen the reliability of welding, test display welding
Vertical pulling-out force be more than 10N, it is ensured that ceramic thermistor high pressure resistant, heavy current requirement for a long time.
Embodiment
With reference to embodiment, the invention will be further described, but not as a limitation of the invention.
Embodiment 1, the specific manufacturing process of the ceramic thermistor that the present embodiment is related to be it is such, by dispensing,
Wet ball grinding, pre-burning, secondary wet process ball milling, granulation, shaping, sintering obtain substrate.Sputtering electrode after substrate cleaning, is divided
Choosing.Then chip is welded with lead by special welding equipment, scolding tin selects SnCu alloy tins (cupric 1~3%),
Lead material is tinned wird or CP wire, wire diameter：0.5~1.0mm of Φ.
Step is during welding
1st, routing is adjusted：By the selection of different moulds, to control the P between lead wide, product size requirement is reached.
2nd, upper tin adjustment：By the adjustment of solder joint tin amount, to ensure the reliability of product solder joint.
3rd, suction piece, inserted sheet adjustment：Pass through adjustment, it is ensured that the combination physical dimension of formed product lead and chip.
4th, the wire for being plugged silver strip enters preheating zone, and the first preheating zone temperature is 90 DEG C, and the second preheating zone temperature is 130
DEG C, the 3rd preheating zone temperature is 190 DEG C, and the 4th preheating zone temperature is 210 DEG C, and the 5th preheating zone temperature is 240 DEG C, the 6th preheating
Area's temperature is 270 DEG C, and six preheating zone preheating times are 130s, amounts to preheating 780s, subsequently into hot air welding (tin melts)
Area is welded, wherein the first hot blast area temperature is 360 DEG C, the second hot blast area temperature is 380 DEG C, and each hot blast area treatment time is common for 2s
Count 4s, it is ensured that it is optimum temperature set-point that solder joint melts tin state at tin zone length 4/5, completely, finally enters 200 DEG C of insulations
Area is incubated 300s.Every batch of product is after welding debugging is good, and product can enter after welding pulling force and apparent size confirmation are qualified
Row batch production；Technological temperature and belt speed frequency will be finely adjusted according to the welding effect of product during welding.
The product cut-out being welded：The product being welded passes through cutting knife by gear drive, adjusts the time of cutting knife and makes
Every product of cut-out meets technological requirement；Ultrasonic wave is cleaned after lead welding, and in 140 ± 10 DEG C/(45~60) min techniques
Lower drying.Ceramic thermistor post-production：Substrate after weld formation, carries out following process, including encapsulate, solidify, be made
Finished product.
Embodiment 2, the specific manufacturing process of the ceramic thermistor that the present embodiment is related to be it is such, by dispensing,
Wet ball grinding, pre-burning, secondary wet process ball milling, granulation, shaping, sintering obtain substrate.Sputtering electrode after substrate cleaning, is divided
Choosing.Then chip is welded with lead by special welding equipment, scolding tin selects SnCu alloy tins (cupric 1~3%),
Lead material is tinned wird or CP wire, wire diameter：0.5~1.0mm of Φ.
Step is during welding
1st, routing is adjusted：By the selection of different moulds, to control the P between lead wide, product size requirement is reached.
2nd, upper tin adjustment：By the adjustment of solder joint tin amount, to ensure the reliability of product solder joint.
3rd, suction piece, inserted sheet adjustment：Pass through adjustment, it is ensured that the combination physical dimension of formed product lead and chip.
4th, the wire for being plugged silver strip enters preheating zone, and the first preheating zone temperature is 110 DEG C, and the second preheating zone temperature is 150
DEG C, the 3rd preheating zone temperature is 210 DEG C, and the 4th preheating zone temperature is 300 DEG C, and the 5th preheating zone temperature is 320 DEG C, the 6th preheating
Area's temperature is 360 DEG C, and six preheating zone preheating times are 150s, amounts to preheating 900s, subsequently into hot air welding (tin melts)
Area is welded, wherein the first hot blast area temperature is 430 DEG C, the second hot blast area temperature is 450 DEG C, and each hot blast area treatment time is common for 3s
Count 6s, it is ensured that it is optimum temperature set-point that solder joint melts tin state at tin zone length 4/5, completely, finally enters 260 DEG C of insulations
Area is incubated 250s.Every batch of product is after welding debugging is good, and product can enter after welding pulling force and apparent size confirmation are qualified
Row batch production；Technological temperature and belt speed frequency will be finely adjusted according to the welding effect of product during welding.
The product cut-out being welded：The product being welded passes through cutting knife by gear drive, adjusts the time of cutting knife and makes
Every product of cut-out meets technological requirement；Ultrasonic wave is cleaned after lead welding, and in 140 ± 10 DEG C/(45~60) min techniques
Lower drying.Ceramic thermistor post-production：Substrate after weld formation, carries out following process, including encapsulate, solidify, be made
Finished product.
Embodiment 3, the specific manufacturing process of the ceramic thermistor that the present embodiment is related to be it is such, by dispensing,
Wet ball grinding, pre-burning, secondary wet process ball milling, granulation, shaping, sintering obtain substrate.Sputtering electrode after substrate cleaning, is divided
Choosing.Then chip is welded with lead by special welding equipment, scolding tin selects SnCu alloy tins (cupric 1~3%),
Lead material is tinned wird or CP wire, wire diameter：0.5~1.0mm of Φ.
Step is during welding
1st, routing is adjusted：By the selection of different moulds, to control the P between lead wide, product size requirement is reached.
2nd, upper tin adjustment：By the adjustment of solder joint tin amount, to ensure the reliability of product solder joint.
3rd, suction piece, inserted sheet adjustment：Pass through adjustment, it is ensured that the combination physical dimension of formed product lead and chip.
4th, the wire for being plugged silver strip enters preheating zone, and the first preheating zone temperature is 100 DEG C, and the second preheating zone temperature is 140
DEG C, the 3rd preheating zone temperature is 200 DEG C, and the 4th preheating zone temperature is 260 DEG C, and the 5th preheating zone temperature is 280 DEG C, the 6th preheating
Area's temperature is 300 DEG C, and six preheating zone preheating times are 140s, amounts to preheating 840s, subsequently into hot air welding (tin melts)
Area is welded, wherein the first hot blast area temperature is 380 DEG C, the second hot blast area temperature is 400 DEG C, and each hot blast area treatment time is common for 4s
Count 8s, it is ensured that it is optimum temperature set-point that solder joint melts tin state at tin zone length 4/5, completely, finally enters 240 DEG C of insulations
Area is incubated 280s.Every batch of product is after welding debugging is good, and product can enter after welding pulling force and apparent size confirmation are qualified
Row batch production；Technological temperature and belt speed frequency will be finely adjusted according to the welding effect of product during welding.
The product cut-out being welded：The product being welded passes through cutting knife by gear drive, adjusts the time of cutting knife and makes
Every product of cut-out meets technological requirement；Ultrasonic wave is cleaned after lead welding, and in 140 ± 10 DEG C/(45~60) min techniques
Lower drying.Ceramic thermistor post-production：Substrate after weld formation, carries out following process, including encapsulate, solidify, be made
Finished product.
Product obtained by each embodiment is compared with the performance test according to product made from patent described in background technology
As shown in the table, the inventive method test result is better than patent described in background technology.
Claims (2)
1. a kind of lead ceramic thermistor welding method with high reliability, including routing adjustment：It is wide between control lead
Degree；Upper tin adjustment：Adjust solder joint soldering tin amount；Suction piece, inserted sheet adjustment：Pass through adjustment, it is ensured that formed product lead and chip it is several
What size；Welding：Lead and chip are sequentially sent to preheating zone, hot air welding area and heat preservation zone, it is characterised in that：The preheating
Area includes the first preheating zone, the second preheating zone, the 3rd preheating zone, the 4th preheating zone, the 5th preheating zone and the 6th preheating zone, described
Hot air welding area includes the first hot blast area and the second hot blast area, and first preheating zone temperature is 90~110 DEG C, and described second is pre-
Hot zone temperature be 130~150 DEG C, the 3rd preheating zone temperature be 190~210 DEG C, the 4th preheating zone temperature be 210~
300 DEG C, the 5th preheating zone temperature is 240~320 DEG C, and the 6th preheating zone temperature is 270~360 DEG C, described first
Hot blast area temperature is 360~430 DEG C, and the second hot blast area temperature is 380~450 DEG C, and the second hot blast area temperature compares the
One hot blast area temperature is high 20 DEG C, and the heat preservation zone temperature is 200~260 DEG C, first preheating zone, the second preheating zone, the 3rd
Preheating zone, the 4th preheating zone, the preheating time of the 5th preheating zone and the 6th preheating zone are 130~150s, first hot blast
The treatment time in area and the second hot blast area is 2~4s, 250~300s of the heat preservation zone soaking time.
2. the lead ceramic thermistor welding method according to claim 1 with high reliability, it is characterised in that：
The scolding tin is SnCu alloy tins, and wherein Cu mass percents are 1~3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510299651.XA CN104942394B (en) | 2015-06-03 | 2015-06-03 | Lead ceramic thermistor welding method with high reliability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510299651.XA CN104942394B (en) | 2015-06-03 | 2015-06-03 | Lead ceramic thermistor welding method with high reliability |
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| CN104942394A CN104942394A (en) | 2015-09-30 |
| CN104942394B true CN104942394B (en) | 2017-07-11 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105957903A (en) * | 2016-06-14 | 2016-09-21 | 中国工程物理研究院流体物理研究所 | Lead connecting structure and lead welding process for gallium arsenide photoconductive switch |
| CN107910273B (en) * | 2017-11-06 | 2019-12-27 | 安徽华东光电技术研究所有限公司 | Method for sintering LTCC substrate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4817857A (en) * | 1987-06-15 | 1989-04-04 | Westinghouse Electric Corp. | Process for restricted lead content soldering of copper with controlled copper contamination of the molten solder reservoir |
| JP4041628B2 (en) * | 1998-10-13 | 2008-01-30 | 松下電器産業株式会社 | Heating device and heating method |
| US6780225B2 (en) * | 2002-05-24 | 2004-08-24 | Vitronics Soltec, Inc. | Reflow oven gas management system and method |
| CN1281371C (en) * | 2003-11-28 | 2006-10-25 | 北京工业大学 | Grain reinforced SnCu base composite solder ointment and preparation method thereof |
| US8110015B2 (en) * | 2007-05-30 | 2012-02-07 | Illinois Tool Works, Inc. | Method and apparatus for removing contaminants from a reflow apparatus |
| CN101229602B (en) * | 2008-01-24 | 2010-06-02 | 石开轩 | Method of welding thermistance chip and down lead |
| CN202363190U (en) * | 2011-11-29 | 2012-08-01 | 东莞市宇驰电子有限公司 | Welding type thermal resistor |
| CN103611996B (en) * | 2013-10-24 | 2016-03-23 | 中国航天科技集团公司第九研究院第七七一研究所 | A kind of welding method of mother-daughter board connector long needle |
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Effective date of registration: 20190327 Address after: 223900 No. 5 workshop of Sihong Economic Development Zone, Suqian City, Jiangsu Province Patentee after: Jiangsu Xinlingzhi Electronic Technology Co., Ltd. Address before: 215500 Tonglin Road, High-tech Park, Changshu Economic Development Zone, Suzhou City, Jiangsu Province, 88 Patentee before: Changshu Linzhi Electronics Co., Ltd. |
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