CN108063108A - A kind of MB bridges heap bonding machine - Google Patents
A kind of MB bridges heap bonding machine Download PDFInfo
- Publication number
- CN108063108A CN108063108A CN201810061848.3A CN201810061848A CN108063108A CN 108063108 A CN108063108 A CN 108063108A CN 201810061848 A CN201810061848 A CN 201810061848A CN 108063108 A CN108063108 A CN 108063108A
- Authority
- CN
- China
- Prior art keywords
- bridges
- temperature
- heap
- bonding machine
- bridges heap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
Abstract
The present invention provides a kind of MB bridges heap bonding machine, belongs to MB bridge heap welding technology fields.A kind of MB bridges heap bonding machine, including heating tube, transmission device, MB bridges heap welding body, heating tube includes heating zone and cooling zone, heating zone includes the first warm area, the second warm area that temperature is 470 DEG C, the three-temperature-zone that temperature is 510 DEG C, the four-temperature region that temperature is 550 DEG C, the 5th warm area that temperature is 570 DEG C and the 6th warm area that temperature is 460 DEG C that temperature is 450 DEG C successively, 6th warm area is set close to cooling zone, and transmission device is used to MB bridges heap welding body being sent to cooling zone from the first warm area.MB bridge heap bonding machines are simple in structure, easy to operate, welding quality is high, efficient for this.
Description
Technical field
The invention belongs to MB bridge heap welding technology fields, specifically, are related to a kind of MB bridges heap bonding machine.
Background technology
Bridge heap is a kind of electronic component, and inside is made of multiple diodes, and main function is rectification, adjusts current direction,
Using bridge heap rectification, performance is more stablized during work.Wherein, MB bridges heap is patch type bridge heap, during its production, meeting
There is one of welding sequence, weld has large effect to the quality of MB bridge heap finished products.
Existing MB bridges heap is susceptible to bubble during being welded on welding or causes rosin joint, can thus generate very much
Waste product, production efficiency is not high.
Therefore, inventing a kind of MB bridge heaps bonding machine that can be solved the above problems becomes current urgent problem to be solved.
The content of the invention
For deficiency above-mentioned in the prior art, a kind of MB bridges heap bonding machine of offer of the invention, simple in structure, easy to operate,
Welding quality is high, efficient.
In order to achieve the above object, the solution that uses of the present invention is：
A kind of MB bridges heap bonding machine, including heating tube, transmission device, MB bridges heap welding body, heating tube includes heating zone
And cooling zone, heating zone include the first warm area, the second warm area that temperature is 470 DEG C, temperature 510 that temperature is 450 DEG C successively
DEG C three-temperature-zone, the four-temperature region that temperature is 550 DEG C, the 5th warm area that temperature is 570 DEG C and temperature is 460 DEG C the 6th
Warm area, the 6th warm area are set close to cooling zone, and transmission device is used to MB bridges heap welding body being sent to cooling from the first warm area
Area.
Further, in preferred embodiments of the present invention, MB bridges heap welding body includes cover board and is stacked multiple
Pedestal, each pedestal includes first end face and second end face, MB bridge heaps is both provided in the first end face of each pedestal, multiple
The first end face of the outermost pedestal of pedestal is detachably connected with cover board.
Further, in preferred embodiments of the present invention, the first end face and cover board of the outermost pedestal of multiple pedestals
It is detachably connected by bayonet unit.
Further, in preferred embodiments of the present invention, it is detachably connected between multiple pedestals.
Further, in preferred embodiments of the present invention, it is detachably connected between multiple pedestals by bayonet unit.
Further, in preferred embodiments of the present invention, MB bridges heap includes multiple MB bridges heap units, each MB bridges heap unit
Include MB bridges reator body and multiple pins, the both ends of each MB bridges heap unit are connected with pin.
Further, in preferred embodiments of the present invention, each MB bridges reator body successively include upper tablet, chip and under
Tablet is connected between upper tablet, chip and lower tablet with tin cream.
Further, in preferred embodiments of the present invention, transmission device includes belt pulley, motor and rack, belt rotation
Dynamic to be arranged in rack, belt pulley includes the first belt pulley and the second belt pulley, and the first belt pulley and the second belt pulley pass through gold
Belong to belt transmission connection, the first belt pulley and motor drive axis connection.
Further, in preferred embodiments of the present invention, cooling tube is provided in cooling zone.
Further, in preferred embodiments of the present invention, the pressure of cooling tube is 0.3MPa, and hydraulic pressure is 1.8 kilograms, water temperature
For 25-35 DEG C.
The advantageous effect of MB bridges heap bonding machine provided by the invention is that heating tube includes heating zone and cooling zone, heating zone
Including six warm areas, the temperature of six warm areas first rises into a ladder to be reached 570 DEG C and then is dropping to 460 DEG C, in this way
Temperature change, can make to be less prone to bubble during the welding that heats up in early period of MB bridges heap welding body, in the later stage
The situation of rosin joint is avoided the occurrence of in temperature-fall period, greatly improves the quality of finished product, while by transmission device by MB bridge heaps
Welding body is sent to cooling zone from first warm area, makes the process entirely welded convenient, succinct, at the same production cost compared with
It is low.
Description of the drawings
It in order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structure diagram of MB bridges heap bonding machine provided by the invention；
Fig. 2 is the structure diagram that MB bridges heap provided by the invention welds body；
Fig. 3 is structure diagram of the pedestal provided by the invention under the first visual angle；
Fig. 4 is structure diagram of the pedestal provided by the invention under the second visual angle；
Fig. 5 is the structure diagram of MB bridges heap provided by the invention；
Fig. 6 is the structure diagram of MB bridges heap unit provided by the invention；
Fig. 7 is the structure diagram of heating tube provided by the invention；
Fig. 8 is the structure diagram of transmission device provided by the invention.
Icon：100-MB bridge heap bonding machines；200- heating tubes；210- heating zones；The first warm areas of 211-；The second temperature of 212-
Area；213- three-temperature-zones；214- four-temperature regions；The 5th warm areas of 215-；The 6th warm areas of 216-；220- cooling zones；300- transmission dresses
It puts；310- belt pulleys；The first belt pulleys of 311-；The second belt pulleys of 312-；313- metal belts；320- motors；321- motors pass
Moving axis；330- racks；400-MB bridges heap welds body；410- cover boards；420- pedestals；421- first end faces；422- second end faces；
423- is buckled；424- card slots；425- grooves；430-MB bridge heaps；440-MB bridge heap units；441-MB bridge reator bodies；442- pins；
The upper tablets of 443-；444- chips；Tablet under 445-.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.The present invention implementation being usually described and illustrated herein in the accompanying drawings
The component of example can configure to arrange and design with a variety of.Based on the embodiment in the present invention, the common skill in this field
The every other embodiment that art personnel are obtained without creative efforts belongs to the model that the present invention protects
It encloses.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiments obtained without creative efforts belong to the model that the present invention protects
It encloses.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
Embodiment
Refer to Fig. 1, the present invention provides a kind of MB bridges heap bonding machine 100, including heating tube 200, transmission device 300,
MB bridges heap welds body 400.
With reference to Fig. 2, Fig. 3 and Fig. 4, MB bridges heap welding body 400 includes cover board 410 and the multiple pedestals 420 being stacked,
Each pedestal 420 includes first end face 421 and second end face 422, is both provided in the first end face 421 of each pedestal 420
MB bridges heap 430, it is preferred that groove 425 in the first end face 421 of each pedestal 420 is set, MB bridges heap 430 is placed in groove
425, MB bridges heap 430 is avoided to be moved around in first end face 421, influences the effect of welding.
Wherein, the purpose that multiple pedestals 420 are set be in order to be welded simultaneously to multiple MB bridges heaps 430, can be with
Increase the amount for the MB bridges heap 430 disposably processed, further improve the efficiency of welding.
It should be noted that the number of pedestal 420 is 4 in the present embodiment, or 2 or 3 or 5 etc., but
Without being limited thereto, the number of pedestal 420 can also be 1.
Wherein, the first end face 421 of the outermost pedestal 420 of multiple pedestals is detachably connected with cover board 410, it is therefore an objective to
For the ease of dismantling cover board 410.In the present embodiment, first end face 421 and the cover board 410 of outermost pedestal 420 pass through buckle
Device connects, and is provided with card slot 424 on cover board 410, the first end face 421 of pedestal 420 is provided with and 424 matched card of card slot
Button 423, it is preferable that card slot 424 and 423 interference fit of buckle can also set card slot in the first end face 421 of pedestal 420
424, it sets on cover board 410 and the matched buckle 423 of card slot 424.It should be noted that the quantity of card slot 424 and buckle 423
It can be 1, or multiple.
It in the present embodiment, is detachably connected between multiple pedestals 420, in order to facilitate between multiple pedestals 420
Fast quick-detach.Preferably, it is detachably connected between multiple pedestals 420 by bayonet unit, the first end face 421 of pedestal 420 is set
Buckle 423 is put, it, can also be in pedestal 420 in the setting of second end face 422 and the 423 matched card slots 424 of buckle of pedestal 420
First end face 421 set card slot 424, pedestal 420 second end face 422 set with card slot 424 it is matched buckle 423.
It should be noted that in the present embodiment, the first end face 421 and cover board of the outermost pedestal 420 of multiple pedestals
410 are detachably connected by bayonet unit realization, are detachably connected between multiple pedestals 420 also by bayonet unit realization, but
It is without being limited thereto, it can also realize and be detachably connected by other means, such as threaded connection, hinge connection etc..
Wherein, Fig. 5 is refer to, MB bridges heap 430 includes multiple MB bridges heap units 440, and each MB bridges heap unit 440 includes
MB bridges reator body 441 and multiple pins 442, the both ends of each MB bridges heap unit 440 are connected with pin 442, it is necessary to illustrate
It is that the number of pin 442 can be according to being actually configured.
Fig. 6 is refer to, each MB bridges reator body 441 includes upper tablet 443, chip 444 and lower tablet 445 successively, i.e.,
Each MB bridges reator body 441 includes upper tablet 443, chip 444 and lower tablet 445 from top to bottom, wherein, upper tablet 443, chip
It is connected between 444 and lower tablet 445 with tin cream, in the present embodiment, using solder(ing) paste, solder(ing) paste has centainly at normal temperatures
Viscosity, electronic component just can be sticked to commitment positions, under welding temperature, with the volatilization of solvent and portions additive,
It will be formed by weldering component together with printed circuit pad solder permanently connected.I.e. in the present invention, the welding of MB bridge heaps be for
Cure the tin cream in MB bridges reator body 441 in high temperature, make to use between tablet 443, chip 444 and lower tablet 445
It is stably connected with.
With reference to Fig. 1 and Fig. 7, heating tube 200 includes heating zone 210 and cooling zone 220, and heating zone 210 includes first successively
Warm area 211, the second warm area 212, three-temperature-zone 213, four-temperature region 214, the 5th warm area 215 and the 6th warm area 216.Wherein,
The temperature of first warm area 211 is 450 DEG C, the temperature of the second warm area 212 is 470 DEG C, the temperature of three-temperature-zone 213 is 510 DEG C,
The temperature of four-temperature region 214 is 550 DEG C, the temperature of the 5th warm area 215 is 570 DEG C, the temperature of the 6th warm area 216 is 460 DEG C.
Wherein, the temperature of six warm areas first rises and reaches 570 DEG C and then dropping to 460 DEG C into a ladder, substantially in one
A parabola, temperature change in this way can improve the welding quality of MB bridges heap welding body 400, and early period is in stage
Heating purpose is in order to avoid bubble occurs in tin cream during welding, influences final product quality, stablizes 570 DEG C of arrival and then exists
Dropping to 460 DEG C avoids the later stage from being directly entered cooling zone 220, and cooling is caused to make very much the finished product MB bridges heap 430 of welding too crisp soon, is gone out
The situation of existing rosin joint, temperature change in this way carry out the quality that welding greatly improves finished product.
Preferably, cooling tube (not shown) is provided in cooling zone 220, is cooled down using cooling tube, cooling velocity is fast,
It is environmentally safe, wherein, it is further preferred that the pressure of cooling tube is 0.3MPa, hydraulic pressure is 1.8 kilograms, water temperature 25-35
℃.Wherein, the 6th warm area 216 is set close to cooling zone 220.
With reference to Fig. 1 and Fig. 8, transmission device 300 includes belt pulley 310, motor 320 and rack 330, and belt pulley 310 rotates
It is arranged in rack 330, belt pulley 310 includes the first belt pulley 311 and the second belt pulley 312, the first belt pulley 311 and second
Belt pulley 312 is sequentially connected by metal belt 313, and the first belt pulley 311 is connected with motor transmission shaft 321, passes through motor 320
The first belt pulley 311 is driven to rotate, the first belt pulley 311 drives the first belt pulley 311 to rotate by metal belt 313.
The purpose of transmission device 300 is used to transmit MB bridges heap welding body 400 from the first warm area 211 of heating tube 200
To cooling zone 220, i.e., by motor 320 belt pulley 310 is driven to pass as on metal belt 313 MB bridges heap welding body 400
It is dynamic, MB bridges heap welding body 400 is made to reach the 6th warm area 216 from the first warm area 211 successively and is welded, then through supercooling
Area 220 is cooled down.
In the present embodiment, the metal belt 313 of transmission device 300 is located at the inside of heating tube 200, in order to make position
In on metal belt 313 MB bridges heap welding body 400 can be successively by heating tube 200 heating zone 210 welded and
Cooling zone 220 is cooled down.
In conclusion the heating tube of the MB bridge heap bonding machines includes heating zone and cooling zone, heating zone includes six warm areas,
The temperature of six warm areas first rises into a ladder to be reached 570 DEG C and then is dropping to 460 DEG C, and temperature change in this way can
So as to be less prone to bubble during the welding that MB bridges heap welding body heats up in early period, avoided in the temperature-fall period in later stage
There is the situation of rosin joint, greatly improve the quality of finished product, while MB bridges heap is welded from described by body by transmission device
First warm area is sent to cooling zone, makes the process entirely welded convenient, succinct, while production cost is relatively low.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of MB bridges heap bonding machine, it is characterised in that：Including heating tube, transmission device, MB bridges heap welding body, the heating
Pipe includes heating zone and cooling zone, the heating zone successively including temperature be 450 DEG C the first warm area, that temperature is 470 DEG C
Two warm areas, temperature are 510 DEG C of three-temperature-zone, temperature is 550 DEG C four-temperature region, the 5th warm area that temperature is 570 DEG C and
Temperature is 460 DEG C of the 6th warm area, and the 6th warm area is set close to the cooling zone, and the transmission device is used for the MB
Bridge heap welding body is sent to the cooling zone from first warm area.
2. MB bridges heap bonding machine according to claim 1, it is characterised in that：MB bridges heap welding body include cover board and
The multiple pedestals being stacked, each pedestal include first end face and second end face, the first end of each pedestal
MB bridge heaps are both provided on face, first end face and the cover board of the outermost pedestal of the multiple pedestal are detachably connected.
3. MB bridges heap bonding machine according to claim 2, it is characterised in that：The outermost pedestal of the multiple pedestal
First end face is detachably connected with the cover board by bayonet unit.
4. MB bridges heap bonding machine according to claim 2, it is characterised in that：It is detachably connected between multiple pedestals.
5. MB bridges heap bonding machine according to claim 3, it is characterised in that：Pass through bayonet unit between multiple pedestals
It is detachably connected.
6. MB bridges heap bonding machine according to claim 2, it is characterised in that：The MB bridges heap includes multiple MB bridges heap lists
Member, each MB bridges heap unit include MB bridges reator body and multiple pins, the both ends of each MB bridges heap unit with it is described
Pin connects.
7. MB bridges heap bonding machine according to claim 6, it is characterised in that：Each MB bridges reator body includes successively
Upper tablet, chip and lower tablet are connected between the upper tablet, the chip and the lower tablet with tin cream.
8. MB bridges heap bonding machine according to claim 1, it is characterised in that：The transmission device includes belt pulley, motor
And rack, the pulley rotation are arranged in the rack, the belt pulley includes the first belt pulley and the second belt pulley, institute
It states the first belt pulley and second belt pulley is sequentially connected by metal belt, first belt pulley and the motor drive
Axis connection.
9. MB bridges heap bonding machine according to claim 1, it is characterised in that：Cooling tube is provided in the cooling zone.
10. MB bridges heap bonding machine according to claim 9, it is characterised in that：The pressure of the cooling tube be 0.3MPa, water
It presses as 1.8 kilograms, water temperature is 25-35 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810061848.3A CN108063108A (en) | 2018-01-22 | 2018-01-22 | A kind of MB bridges heap bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810061848.3A CN108063108A (en) | 2018-01-22 | 2018-01-22 | A kind of MB bridges heap bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108063108A true CN108063108A (en) | 2018-05-22 |
Family
ID=62141909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810061848.3A Pending CN108063108A (en) | 2018-01-22 | 2018-01-22 | A kind of MB bridges heap bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108063108A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111375558A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Withstand voltage testing device |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4412122A (en) * | 1977-07-08 | 1983-10-25 | Thyssen Industrie Ag Maschinenbau | Method for welding bodies made of very hard or greatly refined armored steel, respectively, and structures made according to this method |
| CN1198582A (en) * | 1998-04-30 | 1998-11-11 | 北京·松下彩色显象管有限公司 | Simultaneous blackening anneling technology for shadow mask of chromoscope |
| CN1561403A (en) * | 2002-09-04 | 2005-01-05 | 杰富意钢铁株式会社 | Steel material for high heat input welding and its manufacturing method |
| CN101758241A (en) * | 2010-02-05 | 2010-06-30 | 金堆城钼业股份有限公司 | Method for preparing submicron molybdenum powder |
| CN201950323U (en) * | 2010-12-22 | 2011-08-31 | 维多利绍德机械科技（苏州）有限公司 | Reflux welding air temperature control device |
| US20110306205A1 (en) * | 2010-06-09 | 2011-12-15 | Byung-Hak Lee | Semiconductor Device and Method of Fabricating the Same |
| CN102689071A (en) * | 2012-06-18 | 2012-09-26 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
| CN103357981A (en) * | 2012-03-26 | 2013-10-23 | 武汉飞恩微电子有限公司 | Rotation type reflow soldering furnace and soldering method thereof |
| CN103447539A (en) * | 2013-06-25 | 2013-12-18 | 吉林省华兴粉末冶金科技有限公司 | Preparing method of iron powder for powder metallurgy |
| US20140290286A1 (en) * | 2011-10-25 | 2014-10-02 | L'air Liquide, Societe Anonyme Pour I'etude Et I'exploitation Des Procedes Georges Claude | Method and device for cooling soldered printed circuit boards |
| CN104362076A (en) * | 2014-09-23 | 2015-02-18 | 北京七星华创电子股份有限公司 | Temperature control device, temperature control system and temperature control method of semiconductor device |
| CN105772886A (en) * | 2016-05-06 | 2016-07-20 | 东莞市科隆威自动化设备有限公司 | Through hole reflow soldering device and control method thereof |
| CN105772887A (en) * | 2016-05-06 | 2016-07-20 | 东莞市科隆威自动化设备有限公司 | Multifunctional reflow soldering device and control method thereof |
| CN107131561A (en) * | 2017-06-12 | 2017-09-05 | 广东美的暖通设备有限公司 | Air conditioner and its electric-controlled plate, in air conditioner electric-controlled plate process for protecting |
| WO2017201814A1 (en) * | 2016-05-24 | 2017-11-30 | 深圳市劲拓自动化设备股份有限公司 | Reflow soldering apparatus |
| CN107562084A (en) * | 2017-08-31 | 2018-01-09 | 武汉光迅科技股份有限公司 | A kind of module and method for wavelength compensation based on chip temperature control and Heatless AWG technology |
| CN207731907U (en) * | 2018-01-22 | 2018-08-14 | 广安市嘉乐电子科技有限公司 | A kind of MB bridges heap bonding machine |
-
2018
- 2018-01-22 CN CN201810061848.3A patent/CN108063108A/en active Pending
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4412122A (en) * | 1977-07-08 | 1983-10-25 | Thyssen Industrie Ag Maschinenbau | Method for welding bodies made of very hard or greatly refined armored steel, respectively, and structures made according to this method |
| CN1198582A (en) * | 1998-04-30 | 1998-11-11 | 北京·松下彩色显象管有限公司 | Simultaneous blackening anneling technology for shadow mask of chromoscope |
| CN1561403A (en) * | 2002-09-04 | 2005-01-05 | 杰富意钢铁株式会社 | Steel material for high heat input welding and its manufacturing method |
| CN101758241A (en) * | 2010-02-05 | 2010-06-30 | 金堆城钼业股份有限公司 | Method for preparing submicron molybdenum powder |
| US20110306205A1 (en) * | 2010-06-09 | 2011-12-15 | Byung-Hak Lee | Semiconductor Device and Method of Fabricating the Same |
| CN201950323U (en) * | 2010-12-22 | 2011-08-31 | 维多利绍德机械科技（苏州）有限公司 | Reflux welding air temperature control device |
| US20140290286A1 (en) * | 2011-10-25 | 2014-10-02 | L'air Liquide, Societe Anonyme Pour I'etude Et I'exploitation Des Procedes Georges Claude | Method and device for cooling soldered printed circuit boards |
| CN103357981A (en) * | 2012-03-26 | 2013-10-23 | 武汉飞恩微电子有限公司 | Rotation type reflow soldering furnace and soldering method thereof |
| CN102689071A (en) * | 2012-06-18 | 2012-09-26 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
| CN103447539A (en) * | 2013-06-25 | 2013-12-18 | 吉林省华兴粉末冶金科技有限公司 | Preparing method of iron powder for powder metallurgy |
| CN104362076A (en) * | 2014-09-23 | 2015-02-18 | 北京七星华创电子股份有限公司 | Temperature control device, temperature control system and temperature control method of semiconductor device |
| CN105772886A (en) * | 2016-05-06 | 2016-07-20 | 东莞市科隆威自动化设备有限公司 | Through hole reflow soldering device and control method thereof |
| CN105772887A (en) * | 2016-05-06 | 2016-07-20 | 东莞市科隆威自动化设备有限公司 | Multifunctional reflow soldering device and control method thereof |
| WO2017201814A1 (en) * | 2016-05-24 | 2017-11-30 | 深圳市劲拓自动化设备股份有限公司 | Reflow soldering apparatus |
| CN107131561A (en) * | 2017-06-12 | 2017-09-05 | 广东美的暖通设备有限公司 | Air conditioner and its electric-controlled plate, in air conditioner electric-controlled plate process for protecting |
| CN107562084A (en) * | 2017-08-31 | 2018-01-09 | 武汉光迅科技股份有限公司 | A kind of module and method for wavelength compensation based on chip temperature control and Heatless AWG technology |
| CN207731907U (en) * | 2018-01-22 | 2018-08-14 | 广安市嘉乐电子科技有限公司 | A kind of MB bridges heap bonding machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111375558A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Withstand voltage testing device |
| CN111375558B (en) * | 2018-12-29 | 2024-01-09 | 乐山希尔电子股份有限公司 | Withstand voltage testing arrangement |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3174659B1 (en) | Soldering module | |
| CN108063108A (en) | A kind of MB bridges heap bonding machine | |
| CN207731907U (en) | A kind of MB bridges heap bonding machine | |
| CN106686905A (en) | Surface mount technology for sheet components | |
| CN108176907A (en) | A kind of wave-soldering furnace | |
| CN107570911A (en) | A kind of lead-free high-temperature solder(ing) paste for being used for mobile phone, computer main board and preparation method thereof | |
| CN208063564U (en) | A kind of PCBA automatic tests process units | |
| CN110402038A (en) | A kind of method of welding circuit board element | |
| CN106852020A (en) | A kind of manufacture method of raising PCBA production efficiencys | |
| CN208374411U (en) | Full-automatic dip-soldering machine | |
| CN204866567U (en) | Fin conveyer | |
| CN102186313A (en) | SMT (Surface Mounted Technology) circuit board quality monitoring method | |
| CN206733617U (en) | A kind of pulse thermocompression bonder | |
| CN104113986A (en) | Automatic smoother for circuit board and a smoothing method of the automatic smoother | |
| CN107135614A (en) | Printed circuit board (PCB) paster processing technology | |
| CN211152357U (en) | Automatic change printing ink and glue equipment of scribbling | |
| CN110739228B (en) | Method for quickly mounting BGA chip | |
| CN217832188U (en) | Lead-free welding hot air reflow welding machine | |
| CN206821079U (en) | One kind mixes a variety of pcb board wave crest welding devices | |
| CN107966221A (en) | Gas temperature detection device for gas phase reflow soldering | |
| CN206402548U (en) | A kind of sheet component paster structure | |
| CN206568572U (en) | A kind of quick welding docking facilities of communication engineering wiring board | |
| CN104824490A (en) | Implementing method of automatic production | |
| CN218217809U (en) | Plug-in component tin-conducting soldering disc combined structure and printed circuit board | |
| CN213560399U (en) | Double-track-driven eight-temperature-zone lead-free reflow soldering equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |