CN104113986A - Automatic smoother for circuit board and a smoothing method of the automatic smoother - Google Patents
Automatic smoother for circuit board and a smoothing method of the automatic smoother Download PDFInfo
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- CN104113986A CN104113986A CN201410306530.9A CN201410306530A CN104113986A CN 104113986 A CN104113986 A CN 104113986A CN 201410306530 A CN201410306530 A CN 201410306530A CN 104113986 A CN104113986 A CN 104113986A
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- wiring board
- lifting device
- material tray
- tray lifting
- lower bolster
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Abstract
The invention discloses an automatic smoother for a circuit board. The automatic smoother for the circuit board includes a frame platform, a feeding mechanism, a hot-pressing smoothing mechanism and a discharge mechanism are arranged on the frame platform in sequence, and the hot-pressing smoothing mechanism includes a beam frame and at least one smoothing device. The automatic smoother for the circuit board in the invention can rapidly perform automatic smoothing operation on an OLB position of a flexible circuit board, has a good smoothing effect, enables the OLB position of the flexible circuit board not to be easy to restore, facilitates subsequent fitting operation of the flexible circuit board, can reduce a reject rate in a fitting process and production cost, and has the advantages of high work efficiency, simple structure, convenient operation and the like. In addition, the invention also discloses a smoothing method of the automatic smoother for the circuit board.
Description
Technical field
The present invention relates to flexible circuit board technical field of processing equipment, more particularly, relate to a kind of wiring board automatic smoothing machine and smooth method.
Background technology
Flexible circuit board is to take polyimides or polyester film a kind ofly to have a height reliability as what base material was made, excellent flexible printed circuit, be called for short soft board or FPC, have that distribution density is high, lightweight, the feature of thin thickness, main use on a lot of electronic products such as mobile phone, panel computer, notebook computer and digital camera.
OLB (outer lead bonding) refers to the outside pin in the peripheral four sides of TAB (Tape Automatic Bonding, the automatic combination of winding) assembly, can be respectively with wiring board on corresponding weld pad weld, be called " outer pin in conjunction with ".
In flexible circuit board, attach in the process connecting, generally need to the ACF for OLB (anisotropic conductive film) of wiring board be attached on the terminal of panel (liquid crystal display screen) by ACF sticking machine, as shown in figure 11, in the process engaging in OLB identification, because the OLB position of the wiring board just having completed is easily bent upwards (being perk), make the identification of OLB bad, when manufacturer uses this wiring board to produce, cause material casting to raise, increased production cost.Therefore, manufacturer generally can first smooth operation to the OLB position of wiring board, but existingly smooth operation and be generally manual working or automanual pressing operation, because flexible circuit board has restoration characteristics, so return to again perk state after a period of time, smooth effect not ideal enough, in addition, above-mentioned two kinds of operating types have the deficiency that operating efficiency is low.
Summary of the invention
The object of the invention is to overcome above-mentioned defect of the prior art, provide a kind of operating efficiency high, can be automatically to the OLB position of wiring board smooth and smooth effective, can reduce the wiring board automatic smoothing machine of material casting rate in laminating process and production cost and smooth method.
For achieving the above object, technical scheme provided by the invention is as follows: a kind of wiring board automatic smoothing machine, comprise frame platform, described frame platform is disposed with feeding mechanism, hot pressing smooths mechanism and discharging mechanism, described hot pressing smooths mechanism and comprises cross beam frame and at least one flattening device, described cross beam frame is erected on the table top of frame platform, each flattening device includes counterdie support plate, lower bolster and cope match-plate pattern, described counterdie support plate is installed on the table top of frame platform, described lower bolster is installed on counterdie support plate, described cope match-plate pattern is connected with the corresponding longitudinal cylinder being installed on cross beam frame and is positioned at the top of lower bolster, on described counterdie support plate, be equiped with a hot body, described hot body is positioned at a side of lower bolster, in the side direction of described hot body top near lower bolster, extend to form a bending and molding portion, the top of described bending and molding portion is provided with R angle, the inside of described hot body is equiped with electric heater unit, one side of described cope match-plate pattern is hinged with shaping wheel mount pad, on described shaping wheel mount pad, be equiped with rotating shaping wheel, described shaping wheel can be pressed on the R angle of bending and molding portion when cope match-plate pattern and lower bolster pressing.
As preferably, in such scheme, the R value at described R angle is 2.0～2.5mm.
In addition, the present invention also provides a kind of method that smooths of wiring board automatic smoothing machine, and this wiring board automatic smoothing machine is the wiring board automatic smoothing machine described in technique scheme, and this smooths method and comprises the following steps of carrying out successively:
A, enter material process: utilize feeding mechanism that wiring board to be smoothed is sent on the lower bolster of flattening device, and on the R angle that arranges, the bending and molding portion top that makes the OLB of wiring board be positioned at hot body;
B, hot pressing smooth operation: utilize electric heater unit to heat hot body, make the temperature of hot body reach 150 ° ± 5, then by the longitudinal cylinder being installed on cross beam frame, drive cope match-plate pattern and lower bolster pressing, the OLB downward bending that makes wiring board on the R angle that is pressed on bending and molding portion is taken turns in shaping on now shaping wheel mount pad, thereby realize, the OLB of wiring board is smoothed, wherein, the R value at R angle is 2.0～2.5mm, and pressing time is 6～10sec;
C, go out material process: smoothed rear longitudinal cylinder and driven cope match-plate pattern and lower bolster utilize discharging mechanism that the wiring board having smoothed is taken out from the lower bolster of flattening device and carry out discharging.
Compared with prior art, beneficial effect of the present invention is:
The present invention is by building a frame platform, and at frame platform, set gradually feeding mechanism, hot pressing smooths mechanism and discharging mechanism, hot pressing smooths mechanism and has at least one flattening device, the present invention can carry out the operation that smooths of automation rapidly to the OLB position of flexible circuit board, and smooth effective, can make the OLB position of flexible circuit board be difficult for restoring, be conducive to the laminating operation of flexible circuit board in the later stage, can reduce material casting rate and production cost in laminating process, there is the advantages such as operating efficiency is high, simple in structure, easy to operate.
Accompanying drawing explanation
Fig. 1 is the structural representation of wiring board automatic smoothing machine of the present invention;
Fig. 2 is the structural representation at another visual angle of wiring board automatic smoothing machine of the present invention;
Fig. 3 is the structural representation of the first material tray lifting device of the present invention, the second material tray lifting device, the 3rd material tray lifting device or the 4th material tray lifting device;
Fig. 4 is the structural representation of the first charging tray transfer device of the present invention or the second charging tray transfer device;
Fig. 5 is the structural representation of wiring board pan feeding suction means of the present invention or wiring board discharging suction means;
Fig. 6 is the structural representation that hot pressing of the present invention smooths mechanism;
Fig. 7 is the superstructure schematic diagram of flattening device of the present invention;
Fig. 8 is the substructure schematic diagram of flattening device of the present invention;
Fig. 9 is the exploded view of flattening device of the present invention;
Figure 10 is the structural representation of hot body of the present invention;
Schematic diagram when Figure 11 is the OLB position perk of wiring board;
Figure 12 is that the OLB position of wiring board smooths the detection spread of points wave pattern after a period of time by manual working;
Figure 13 is that the OLB position of wiring board smooths the detection spread of points wave pattern after a period of time by wiring board automatic smoothing machine of the present invention.
Below in conjunction with drawings and Examples, wiring board automatic smoothing machine of the present invention and the method that smooths thereof are described further.
Embodiment
Be below wiring board automatic smoothing machine of the present invention and the preferred example that smooths method thereof, therefore do not limit protection scope of the present invention.
Please refer to Fig. 1 and Fig. 2, there is shown a kind of wiring board automatic smoothing machine, comprise frame platform 1, frame platform 1 is disposed with feeding mechanism 2, the hot pressing by control system, controlled and smooths mechanism 3 and discharging mechanism 4.
As depicted in figs. 1 and 2, feeding mechanism 2 comprises can supply the first material tray lifting device 21 of placing the charging tray need to be smoothed wiring board, for unloading the second material tray lifting device 22 of empty charging tray, for the empty charging tray on the first material tray lifting device 21 being transplanted on to the first charging tray transfer device 23 of the second material tray lifting device 22 and for the wiring board to be smoothed of placing on the charging tray of the first material tray lifting device 21 being drawn to the pan feeding suction means 24 of lower bolster, the first material tray lifting device 21 and the second material tray lifting device 22 are installed in side by side frame platform 1 inside and extend the table top of frame platform 1, the first charging tray transfer device 23, pan feeding suction means 24 is installed in respectively the side of the first material tray lifting device 21 and the second material tray lifting device 22 and is movable to the top of the first material tray lifting device 21 and the second material tray lifting device 22.
As shown in Figure 3, the first material tray lifting device 21 and the second material tray lifting device 22 include riser guide 211, lifting platform 212 and drive motors 213, riser guide 211 is installed in the inside of frame platform 1, lifting platform 212 is slidably connected with riser guide 211, drive motors 213 is installed on riser guide 211 and with lifting platform 212 and is in transmission connection, and drive motors 213 can drive lifting platform 212 to move up and down.
As shown in Figure 4, the first charging tray transfer device 23 comprises moving guide rail frame 231, the first Mobile base 232, little guide rail 233, lifter plate 234, drive cylinder 235, suction cup carrier 236 and the first sucker 237, moving guide rail frame 231 is installed on the table top of frame platform 1 and is positioned at the side of the first material tray lifting device 21 and the second material tray lifting device 22, the first Mobile base 232 is slidably connected with moving guide rail frame 231, little guide rail 233 is vertically arranged on the first Mobile base 232, lifter plate 234 is slidably connected with little guide rail 233, driving cylinder 235 to be installed on the first Mobile base 232 and with lifter plate 234 is in transmission connection, drive cylinder 235 can drive lifter plate 234 to move up and down, suction cup carrier 236 is connected with lifter plate 234.Preferably, the first sucker 237 is provided with four, and the first sucker 237 is evenly distributed in suction cup carrier 236, and it is conducive to transporting of charging tray.
As shown in Figure 5, wiring board pan feeding suction means 24 comprises X-axis guide rail 241, Y-axis guide rail 242, the second Mobile base 243 and manipulator moving up and down 244, X-axis guide rail 241 is installed on the table top of frame platform 1 and is positioned at the side of the first material tray lifting device 21 and the second material tray lifting device 22, Y-axis guide rail 242 is installed on the second Mobile base 243 and by the second Mobile base 243 and is slidably connected with X-axis guide rail 241, the second Mobile base 243 can be driven by drive motors or cylinder, length direction along X-axis guide rail 241 moves, manipulator 244 is slidably connected on Y-axis guide rail 242, manipulator 244 also can be driven by drive motors or cylinder, length direction along Y-axis guide rail 242 moves, manipulator 244 is equiped with for drawing the second sucker 245 of wiring board.
As shown in Fig. 1 and Fig. 6, hot pressing smooths mechanism 3 and comprises cross beam frame 31 and at least one flattening device 32, and cross beam frame 31 is erected on the table top of frame platform 1, and the quantity of flattening device 32 is determined according to actual needs.
Particularly, as shown in Figure 7 to 9, each flattening device 32 includes counterdie support plate 321, lower bolster 322 and cope match-plate pattern 323, counterdie support plate 321 is installed on the table top of frame platform 1, lower bolster 322 is installed on counterdie support plate 321, on counterdie support plate 321, be equiped with a hot body 324, hot body 324 is positioned at a side of lower bolster 322.As shown in Figure 10, in the side direction of hot body 324 tops near lower bolster 322, extend to form a bending and molding portion 3241, the cross section of hot body 324 is " L " font, the top of bending and molding portion 3241 is provided with R angle (being fillet) 3242.In this enforcement, the R value at R angle 3242 is preferably 2.0～2.5mm.In addition, the inside of hot body 324 is equiped with electric heater unit 325, and preferably, electric heater unit 5 is set to a thermocouple, certainly, in actual applications, also can be set to other heaters, and non-enforcement is limited.In order to detect the temperature after hot body 324 is heated, on hot body 324, be equiped with heat sensor 328, heat sensor 328 and electric heater unit 325 are all electrically connected to humidity control system, are equiped with for showing the display 34 of hot body temperature on cross beam frame 31.
In this enforcement, cope match-plate pattern 323 is connected with the corresponding longitudinal cylinder 33 being installed on cross beam frame 31 and is positioned at the top of lower bolster 322.As preferably, between cope match-plate pattern 323 and longitudinal cylinder 33, be also equiped with patrix support plate 3212, patrix support plate 3212 is fixedly connected with the cylinder connector 35 of longitudinal cylinder 33 by the lock dog 3213 being installed on patrix support plate 3212.In addition, one side of cope match-plate pattern 323 is hinged with shaping wheel mount pad 326, on shaping wheel mount pad 326, be equiped with rotating shaping wheel 327, shaping wheel 327 can be pressed on the R angle 3242 of bending and molding portion 3241 when cope match-plate pattern 323 and lower bolster 322 pressing, shaping wheel 327 is in compressing the process of shaping, can not damage flexible circuit board, guarantee the quality of product.
The accuracy of the guide-localization when improving cope match-plate pattern 3233 lower bolster 322 matched moulds, the bottom of cope match-plate pattern 323 is equiped with at least two matched moulds alignment pins 329, and the top of lower bolster 322 offers and coordinates the dowel hole 3210 of installing with matched moulds alignment pin 329.
In this enforcement, the top of lower bolster 322 is equiped with some for limiting the limited post 3211 of circuit Board position.Between the table top of counterdie support plate 321 and frame platform 1, can also be equiped with the rectilinear motion slide block 37 being slidably connected with counterdie guide rail 36, counterdie guide rail 36 is installed on the table top of frame platform 1, one side of counterdie support plate 321 is in transmission connection by connecting plate 3214 and thrust unit, by thrust unit, drive counterdie support plate 321 to move, when wiring board is after flattening device 32 has smoothed, counterdie support plate 321 can move to discharging mechanism 4 from feeding mechanism 2 one edge lower die guiding rails 36, and it is conducive to wiring board transporting between feeding mechanism 2 and discharging mechanism 4.
As shown in Figure 1, discharging mechanism 4 comprises can be for the 3rd material tray lifting device 41 that is applied to load the empty charging tray of the wiring board smoothed, for unloading the 4th material tray lifting device 42 of the charging tray that is placed with the wiring board having smoothed, for the charging tray that is placed with the wiring board having smoothed on the 3rd material tray lifting device 41 being transplanted on to the second charging tray transfer device 43 of the 4th material tray lifting device 42 and for the wiring board having smoothed on lower bolster 322 being drawn to the discharging suction means 44 of the charging tray on the 3rd material tray lifting device 41, the 3rd material tray lifting device 41 and the 4th material tray lifting device 42 are installed in side by side frame platform 1 inside and extend the table top of frame platform 1, the second charging tray transfer device 43, discharging suction means 44 is installed in respectively the side of the 3rd material tray lifting device 41 and the 4th material tray lifting device 42 and is movable to the top of the 3rd material tray lifting device 41 and the 4th material tray lifting device 42.
In this enforcement, the 3rd material tray lifting device 41 is identical with the structure of the second material tray lifting device 22 with the first material tray lifting device 21 of feeding mechanism 2 with the 4th material tray lifting device 42, the second charging tray transfer device 43 is identical with the structure of the first charging tray transfer device 23 of feeding mechanism 2, wiring board discharging suction means 44 is identical with the structure of the wiring board pan feeding suction means 24 of feeding mechanism 2, does not therefore repeat them here.
Continuation is referring to figs. 1 to Figure 10, a kind of method that smooths of wiring board automatic smoothing machine, and this wiring board automatic smoothing machine is the wiring board automatic smoothing machine described in above-described embodiment, this smooths method and comprises the following steps of carrying out successively:
A, enter material process: utilize feeding mechanism 2 that wiring board to be smoothed is sent on the lower bolster 322 of flattening device 32, and on the R angle 3242 that arranges, bending and molding portion 3241 tops that make the OLB of wiring board be positioned at hot body;
B, hot pressing smooth operation: utilize 325 pairs of hot bodys 324 of electric heater unit to heat, make the temperature of hot body reach 150 ° ± 5, then by the longitudinal cylinder 33 being installed on cross beam frame 31, drive cope match-plate pattern 323 and lower bolster 322 pressings, shaping wheel 327 on now shaping wheel mount pad 326 is pressed on the OLB downward bending that makes wiring board on the R angle 3242 of bending and molding portion 3241, thereby realize, the OLB of wiring board is smoothed, wherein, the R value at R angle 3242 is 2.0～2.5mm, and pressing time is 6～10sec;
C, go out material process: smoothed and utilized discharging mechanism 4 that the wiring board having smoothed is taken out from the lower bolster 322 of flattening device 32 and carry out discharging afterwards.
Contrast from Figure 12 and Figure 13, the wiring board smoothing through wiring board automatic smoothing machine of the present invention detection spread of points fluctuation is over time less, be tending towards a horizontal line, it further illustrates the present invention and has the good effect that smooths, can make the OLB position of flexible circuit board be difficult for restoring, avoid returning to the perk state before smoothing.
In sum, the present invention can carry out the operation that smooths of automation rapidly to the OLB position of flexible circuit board, and smooth effective, can make the OLB position of flexible circuit board be difficult for restoring, be conducive to the laminating operation of flexible circuit board in the later stage, can reduce material casting rate and production cost in laminating process, there is the advantages such as operating efficiency is high, simple in structure, easy to operate.
Above-described embodiment is preferably execution mode of the present invention; but embodiments of the present invention are not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present invention and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection scope of the present invention.
Claims (10)
1. a wiring board automatic smoothing machine, comprise frame platform (1), it is characterized in that, described frame platform (1) is disposed with feeding mechanism (2), hot pressing smooths mechanism (3) and discharging mechanism (4), described hot pressing smooths mechanism (3) and comprises cross beam frame (31) and at least one flattening device (32), described cross beam frame (31) is erected on the table top of frame platform (1), each flattening device (32) includes counterdie support plate (321), lower bolster (322) and cope match-plate pattern (323), described counterdie support plate (321) is installed on the table top of frame platform (1), described lower bolster (322) is installed on counterdie support plate (321), described cope match-plate pattern (323) is connected with the corresponding longitudinal cylinder (33) being installed on cross beam frame (31) and is positioned at the top of lower bolster (322), on described counterdie support plate (321), be equiped with a hot body (324), described hot body (324) is positioned at a side of lower bolster (322), in the side direction of described hot body (324) top near lower bolster (322), extend to form a bending and molding portion (3241), the top of described bending and molding portion (3241) is provided with R angle (3242), the inside of described hot body (324) is equiped with electric heater unit (325), one side of described cope match-plate pattern (323) is hinged with shaping wheel mount pad (326), on described shaping wheel mount pad (326), be equiped with rotating shaping wheel (327), described shaping wheel (327) can be pressed on the R angle (3242) of bending and molding portion (3241) when cope match-plate pattern (323) and lower bolster (322) pressing.
2. wiring board automatic smoothing machine according to claim 1, is characterized in that, the R value at described R angle (3242) is 2.0～2.5mm.
3. wiring board automatic smoothing machine according to claim 1, it is characterized in that, on described hot body (324), be equiped with heat sensor (328), described heat sensor (328) is electrically connected to humidity control system, is equiped with for showing the display (34) of hot body (324) temperature on described cross beam frame (31).
4. wiring board automatic smoothing machine according to claim 1, it is characterized in that, the bottom of described cope match-plate pattern (323) is equiped with at least two matched moulds alignment pins (329), the top of described lower bolster (322) offers and coordinates the dowel hole (3210) of installing with matched moulds alignment pin (329), the top of described lower bolster (322) is equiped with some for limiting the limited post (3211) of circuit Board position, between described cope match-plate pattern (323) and longitudinal cylinder (33), be also equiped with patrix support plate (3212), described patrix support plate (3212) is fixedly connected with the cylinder connector (35) of longitudinal cylinder (33) by the lock dog (3213) being installed on patrix support plate (3212), between the table top of described counterdie support plate (321) and frame platform (1), be also equiped with the rectilinear motion slide block (37) being slidably connected with counterdie guide rail (36), one side of described counterdie support plate (321) is in transmission connection by connecting plate (3214) and thrust unit.
5. according to the wiring board automatic smoothing machine described in any one in claim 1～4, it is characterized in that, described feeding mechanism (2) comprises can supply the first material tray lifting device (21) of placing the charging tray need to be smoothed wiring board, for unloading the second material tray lifting device (22) of empty charging tray, for the empty charging tray on the first material tray lifting device (21) being transplanted on to the first charging tray transfer device (23) of the second material tray lifting device (22) and for the wiring board to be smoothed of placing on the charging tray of the first material tray lifting device (21) being drawn to the pan feeding suction means (24) of lower bolster, described the first material tray lifting device (21) and the second material tray lifting device (22) are installed in side by side frame platform (1) inside and extend the table top of frame platform (1), described the first charging tray transfer device (23), pan feeding suction means (24) is installed in respectively the side of the first material tray lifting device (21) and the second material tray lifting device (22) and is movable to the top of the first material tray lifting device (21) and the second material tray lifting device (22).
6. wiring board automatic smoothing machine according to claim 5, it is characterized in that, described discharging mechanism (4) comprises can be for the 3rd material tray lifting device (41) that is applied to load the empty charging tray of the wiring board smoothed, for unloading the 4th material tray lifting device (42) of the charging tray that is placed with the wiring board having smoothed, for the charging tray that is placed with the wiring board having smoothed on the 3rd material tray lifting device (41) being transplanted on to the second charging tray transfer device (43) of the 4th material tray lifting device (42) and for the wiring board having smoothed on lower bolster (322) being drawn to the discharging suction means (44) of the charging tray on the 3rd material tray lifting device (41), described the 3rd material tray lifting device (41) and the 4th material tray lifting device (42) are installed in side by side frame platform (1) inside and extend the table top of frame platform (1), described the second charging tray transfer device (43), discharging suction means (44) is installed in respectively the side of the 3rd material tray lifting device (41) and the 4th material tray lifting device (42) and is movable to the top of the 3rd material tray lifting device (41) and the 4th material tray lifting device (42).
7. wiring board automatic smoothing machine according to claim 6, it is characterized in that, described the first material tray lifting device (21), the second material tray lifting device (22), the 3rd material tray lifting device (41) and the 4th material tray lifting device (42) include riser guide (211), lifting platform (212) and drive motors (213), described riser guide (211) is installed in the inside of frame platform (1), described lifting platform (212) is slidably connected with riser guide (211), described drive motors (213) is installed in riser guide (211) above and is in transmission connection with lifting platform (212).
8. wiring board automatic smoothing machine according to claim 6, it is characterized in that, described the first charging tray transfer device (23) and the second charging tray transfer device (43) include moving guide rail frame (231), the first Mobile base (232), little guide rail (233), lifter plate (234), drive cylinder (235), suction cup carrier (236) and the first sucker (237), described the first Mobile base (232) is slidably connected with moving guide rail frame (231), described little guide rail (233) is vertically arranged on the first Mobile base (232), described lifter plate (234) is slidably connected with little guide rail (233), described driving cylinder (235) is installed in the first Mobile base (232) above and is in transmission connection with lifter plate (234), described suction cup carrier (236) is connected with lifter plate (234), described the first sucker (237) is evenly distributed in suction cup carrier (236).
9. wiring board automatic smoothing machine according to claim 6, it is characterized in that, described wiring board pan feeding suction means (24) and wiring board discharging suction means (44) include X-axis guide rail (241), Y-axis guide rail (242), the second Mobile base (243) and manipulator moving up and down (244), described Y-axis guide rail (242) is installed in the second Mobile base (243) and goes up and pass through the second Mobile base (243) and X-axis guide rail (241) and be slidably connected, described manipulator (244) is slidably connected on Y-axis guide rail (242), described manipulator (244) is equiped with the second sucker (245).
10. the method that smooths of wiring board automatic smoothing machine, is characterized in that, this wiring board automatic smoothing machine is the wiring board automatic smoothing machine described in any one in claim 1～9, and this smooths method and comprises the following steps of carrying out successively:
A, enter material process: the lower bolster (322) that utilizes feeding mechanism (2) that wiring board to be smoothed is sent into flattening device (32) is upper, and on the R angle (3242) that arranges, bending and molding portion (3241) top that makes the OLB of wiring board be positioned at hot body;
B, hot pressing smooth operation: utilize electric heater unit (325) to heat hot body (324), make the temperature of hot body reach 150 ° ± 5, then by the longitudinal cylinder (33) being installed on cross beam frame (31), drive cope match-plate pattern (323) and lower bolster (322) pressing, shaping wheel (327) on now shaping wheel mount pad (326) is pressed on the OLB downward bending that makes wiring board on the R angle (3242) of bending and molding portion (3241), thereby realize, the OLB of wiring board is smoothed, wherein, the R value at R angle (3242) is 2.0～2.5mm, and pressing time is 6～10sec;
C, go out material process: smoothed and utilized discharging mechanism (4) that the wiring board having smoothed is taken out from the lower bolster (322) of flattening device (32) and carry out discharging afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410306530.9A CN104113986B (en) | 2014-06-30 | 2014-06-30 | Automatic smoother for circuit board and a smoothing method of the automatic smoother |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410306530.9A CN104113986B (en) | 2014-06-30 | 2014-06-30 | Automatic smoother for circuit board and a smoothing method of the automatic smoother |
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| Publication Number | Publication Date |
|---|---|
| CN104113986A true CN104113986A (en) | 2014-10-22 |
| CN104113986B CN104113986B (en) | 2017-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410306530.9A Active CN104113986B (en) | 2014-06-30 | 2014-06-30 | Automatic smoother for circuit board and a smoothing method of the automatic smoother |
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| CN113613397A (en) * | 2021-09-13 | 2021-11-05 | 天津昌润鹏科技有限公司 | FPC pressing device for electronic product and using method |
| CN115172531A (en) * | 2022-08-10 | 2022-10-11 | 苏州映真智能科技有限公司 | Novel lead wire pressing and high-temperature cloth adding device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105451453A (en) * | 2016-01-07 | 2016-03-30 | 珠海市运泰利自动化设备有限公司 | Flexible printed circuit board (FPCB) micro leveling mechanism and FPCB micro leveler |
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| CN113613397A (en) * | 2021-09-13 | 2021-11-05 | 天津昌润鹏科技有限公司 | FPC pressing device for electronic product and using method |
| CN113613397B (en) * | 2021-09-13 | 2024-04-26 | 天津昌润鹏科技有限公司 | FPC pressing device for electronic product and use method |
| CN115172531A (en) * | 2022-08-10 | 2022-10-11 | 苏州映真智能科技有限公司 | Novel lead wire pressing and high-temperature cloth adding device and method |
| CN115172531B (en) * | 2022-08-10 | 2024-03-29 | 苏州映真智能科技有限公司 | Novel device and method for pressing outgoing line and adding high-temperature cloth |
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| CN104113986B (en) | 2017-02-01 |
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