CN217832188U - Lead-free welding hot air reflow welding machine - Google Patents
Lead-free welding hot air reflow welding machine Download PDFInfo
- Publication number
- CN217832188U CN217832188U CN202221458247.4U CN202221458247U CN217832188U CN 217832188 U CN217832188 U CN 217832188U CN 202221458247 U CN202221458247 U CN 202221458247U CN 217832188 U CN217832188 U CN 217832188U
- Authority
- CN
- China
- Prior art keywords
- fixedly arranged
- hot air
- hot
- conveyer belt
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a leadless welding hot-air reflow soldering machine relates to reflow soldering technical field. The utility model discloses a main part device, devices for heating air, conveyor, eduction gear, controlling means, the main part device sets up subaerial, and the devices for heating air sets up in the inside of main part device, and conveyor sets up the inside at the main part device. The utility model discloses a set up the main part device and improved a leadless welding hot-blast backward flow welding machine, high durability and convenient use, moreover, the steam generator is simple in operation, high efficiency, carry out hot-blast backward flow welding through setting up the devices for heating, set up a plurality of temperature regions, guarantee that the PCB board heating is even, can carry out the transport that speed is unequal to the PCB board of equidimension not through setting up conveyor, guarantee that different types of PCB board obtain reasonable welding, can be when hot-blast backward flow recycles through setting up eduction gear, exhaust waste gas and certain impurity, guarantee hot-blast purity, can control the speed of carrying and the meticulous control of temperature in the equipment through setting up controlling means.
Description
Technical Field
The utility model belongs to the technical field of reflow soldering, especially, relate to a leadless welding hot-blast reflow soldering machine.
Background
Due to the demand for miniaturization of electronic PCB boards, sheet-like components are present and the conventional soldering method has not been adapted to the demand. At first, the reflow soldering process is adopted only in the assembly of the hybrid integrated circuit board, and the reflow soldering process is to blow air or nitrogen gas to a circuit board to which the component is attached after heating the air or nitrogen gas to a high enough temperature, so that the solder on two sides of the component is bonded with the mainboard after melting. The process has the advantages that the temperature is easy to control, oxidation can be avoided in the welding process, but the reflow soldering still has certain defects in practical use, for example, the existing reflow soldering can only be used for welding the same type of PCB with the same size, and the PCB is heated unevenly and damaged due to too fast temperature rise in the direct heating process. Therefore, we propose a hot air reflow soldering machine for lead-free soldering.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a leadless welding hot-air reflow soldering machine to current problem has been solved: the existing reflow soldering can only be used for soldering the same type of PCB boards with the same size, and the PCB boards are heated unevenly and damaged due to too fast temperature rise in the direct heating process.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a leadless welding hot-blast backflow welding machine, including main part device, hot air device, conveyor, eduction gear, controlling means, the main part device sets up subaerial, hot air device sets up the inside at the main part device, conveyor sets up the inside at the main part device, eduction gear sets up the top at the main part device, controlling means sets up the front at the main part device.
Further, the main part device includes organism, base, top cap, temperature monitor, air supplement unit, the fixed top that sets up at the base of organism, the base is fixed to be set up subaerial, the fixed top that sets up at the organism of top cap, the fixed front that sets up at the top cap of temperature monitor, the fixed back that sets up at the organism of air supplement unit.
Furthermore, the hot air device comprises an air inlet pipe, a fan, an electric heating net, a backflow cover and a backflow pipe, wherein the air inlet pipe is fixedly arranged in the top cover, the fan is fixedly arranged at the bottom of the air inlet pipe, the electric heating net is fixedly arranged at the bottom of the fan, the backflow cover is fixedly arranged in the top cover, and the backflow pipe is fixedly arranged on the side face of the backflow cover.
Further, conveyor includes main conveyer belt, vice conveyer belt, variable speed latch, the fixed top that sets up at the organism of main conveyer belt, the fixed top that sets up at the organism of vice conveyer belt, vice conveyer belt and main conveyer belt joint, the fixed setting of variable speed latch is between main conveyer belt and vice conveyer belt.
Further, eduction gear includes exhaust gas discharge pipe, filter screen, the fixed top that sets up at the intake pipe of exhaust gas discharge pipe, the fixed top that sets up at the top cap of filter screen.
Further, controlling means includes control cabinet, control panel, the fixed setting of control cabinet is in the front of organism, control panel is fixed to be set up at the top of control cabinet.
The utility model discloses following beneficial effect has:
1. the utility model discloses a set up the main part device and improved a leadless welding hot-blast backflow welding machine, convenient to use, easy operation, efficiency is higher, carries out hot-blast backflow welding through setting up hot-blast apparatus, sets up a plurality of temperature regions, guarantees that the PCB board heating is even, can carry out the transport that speed is unequal to the PCB board of equidimension not through setting up conveyor, guarantees that different types of PCB board obtains reasonable welding.
2. The utility model discloses a set up eduction gear can be when hot-blast backward flow is recycled, and hot-blast purity is guaranteed to exhaust waste gas and certain impurity, can control the speed of carrying and the meticulous control of temperature in the equipment through setting up controlling means.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages simultaneously.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of the point A in FIG. 1 according to the present invention;
fig. 3 is a front view of the present invention;
fig. 4 is a side view of the present invention;
fig. 5 is a top view of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a main body device; 101. a body; 102. a base; 103. a top cover; 104. a temperature display; 105. a gas supply device; 2. a hot air device; 201. an air inlet pipe; 202. a fan; 203. an electric heating net; 204. a reflow hood; 205. a return pipe; 3. a conveying device; 301. a main conveyor belt; 302. a secondary conveyor belt; 303. a variable speed latch; 4. a discharge device; 401. an exhaust gas discharge pipe; 402. filtering with a screen; 5. a control device; 501. a control seat; 502. a control panel.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Please refer to fig. 1-5, the utility model relates to a lead-free welding hot-air reflow soldering machine, including main body device 1, hot air device 2, conveyor 3, eduction gear 4, controlling means 5, main body device 1 sets up subaerial, and hot air device 2 sets up in main body device 1's inside, and conveyor 3 sets up in main body device 1's inside, and eduction gear 4 sets up at main body device 1's top, and controlling means 5 sets up in main body device 1's front.
Main part device 1 includes organism 101, base 102, top cap 103, temperature monitor 104, air supplement 105, the fixed top that sets up at base 102 of organism 101, base 102 is fixed to be set up subaerial, the fixed top that sets up at organism 101 of top cap 103, the fixed front that sets up at top cap 103 of temperature monitor 104, air supplement 105 is fixed to be set up at the back of organism 101, through setting up organism 101 in main part device 1, base 102, top cap 103, temperature monitor 104, air supplement 105 has improved a leadless welding hot-blast backflow welder, high durability and convenient use, and is simple in operation, and efficiency is higher.
The control device 5 comprises a control seat 501 and a control panel 502, wherein the control seat 501 is fixedly arranged on the front surface of the machine body 101, the control panel 502 is fixedly arranged on the top of the control seat 501, and the control seat 501 and the control panel 502 in the control device 5 can control the conveying speed and the fine control of the temperature in the equipment.
One specific application of this embodiment is: the utility model discloses after putting into operation, the user of service passes through organism 101 in the main part device 1, base 102, top cap 103, temperature display 104, air supplement 105 uses this kind of leadless welding hot-blast backward flow welding machine, high durability and convenient use, and is simple in operation, high efficiency, intake pipe 201 through among the hot air device 2, fan 202, electric heat net 203, backward flow cover 204, back flow 205 can carry out hot-blast backward flow welding, set up a plurality of temperature regions, guarantee that the PCB board heating is even, through main conveyer belt 301 among the conveyor 3, sub-conveyer belt 302, variable speed latch 303 can carry out the transport of speed to the PCB board of equidimension not, guarantee that different kinds of PCB boards obtain reasonable welding, through exhaust pipe 401 among the eduction gear 4, filter screen 402 can be when hot-blast backward flow recycles, exhaust waste gas and certain impurity, guarantee hot-blast purity, through control cabinet 501 among the controlling means 5, the rate of transport and the meticulous control of temperature in the equipment can be controlled to control panel 502.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended to aid in the description of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. The utility model provides a leadless welding hot-air reflow soldering machine, includes main part device (1), hot-blast apparatus (2), conveyor (3), eduction gear (4), controlling means (5), its characterized in that: the hot air device is characterized in that the main body device (1) is arranged on the ground, the hot air device (2) is arranged inside the main body device (1), the conveying device (3) is arranged inside the main body device (1), the discharging device (4) is arranged at the top of the main body device (1), and the control device (5) is arranged on the front face of the main body device (1).
2. A hot air reflow soldering machine for lead-free soldering according to claim 1, wherein: the main body device (1) comprises a machine body (101), a base (102), a top cover (103), a temperature display (104) and an air supplement device (105), wherein the machine body (101) is fixedly arranged at the top of the base (102), and the base (102) is fixedly arranged on the ground.
3. A lead-free solder hot air reflow soldering machine as claimed in claim 2, wherein: the top cover (103) is fixedly arranged at the top of the machine body (101), the temperature display (104) is fixedly arranged on the front side of the top cover (103), and the air supply device (105) is fixedly arranged on the back side of the machine body (101).
4. A hot air reflow soldering machine for lead-free soldering according to claim 1, wherein: the hot air device (2) comprises an air inlet pipe (201), a fan (202), an electric heating net (203), a backflow cover (204) and a backflow pipe (205), wherein the air inlet pipe (201) is fixedly arranged inside the top cover (103), and the fan (202) is fixedly arranged at the bottom of the air inlet pipe (201).
5. A lead-free solder hot air reflow soldering machine as claimed in claim 4, wherein: the electric heating net (203) is fixedly arranged at the bottom of the fan (202), the backflow cover (204) is fixedly arranged inside the top cover (103), and the backflow pipe (205) is fixedly arranged on the side surface of the backflow cover (204).
6. A lead-free solder hot air reflow soldering machine as claimed in claim 1, wherein: conveyor (3) are including main conveyer belt (301), vice conveyer belt (302), variable speed latch (303), the fixed top that sets up at organism (101) of main conveyer belt (301), the fixed top that sets up at organism (101) of vice conveyer belt (302), vice conveyer belt (302) and main conveyer belt (301) joint, variable speed latch (303) are fixed to be set up between main conveyer belt (301) and vice conveyer belt (302).
7. A hot air reflow soldering machine for lead-free soldering according to claim 1, wherein: exhaust apparatus (4) include exhaust gas discharging pipe (401), filter screen (402), exhaust gas discharging pipe (401) is fixed to be set up at the top of intake pipe (201), filter screen (402) is fixed to be set up at the top of top cap (103).
8. A hot air reflow soldering machine for lead-free soldering according to claim 1, wherein: the control device (5) comprises a control seat (501) and a control panel (502), wherein the control seat (501) is fixedly arranged on the front face of the machine body (101), and the control panel (502) is fixedly arranged on the top of the control seat (501).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221458247.4U CN217832188U (en) | 2022-06-13 | 2022-06-13 | Lead-free welding hot air reflow welding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221458247.4U CN217832188U (en) | 2022-06-13 | 2022-06-13 | Lead-free welding hot air reflow welding machine |
Publications (1)
Publication Number | Publication Date |
---|---|
CN217832188U true CN217832188U (en) | 2022-11-18 |
Family
ID=84023677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221458247.4U Active CN217832188U (en) | 2022-06-13 | 2022-06-13 | Lead-free welding hot air reflow welding machine |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN217832188U (en) |
-
2022
- 2022-06-13 CN CN202221458247.4U patent/CN217832188U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104308314A (en) | Reflow welding process of DIP through-hole part | |
CN209265295U (en) | A kind of Reflow Soldering control system based on PID temperature control system | |
CN217832188U (en) | Lead-free welding hot air reflow welding machine | |
CN103128399A (en) | Control system for desk type reflow soldering machine | |
CN207006790U (en) | A kind of flash baking conveying device for pcb board production | |
CN215754794U (en) | Furnace-passing carrier cover plate return line | |
CN206662472U (en) | A kind of heater of MI crest welders | |
CN109841546A (en) | A kind of diode rectifier production system | |
CN107995798A (en) | A kind of reflow soldering and its reflow soldering process for electronic circuit board | |
CN209561343U (en) | A kind of diode rectifier production system | |
CN215393021U (en) | PCB circuit board leadless reflow soldering machine | |
CN211481631U (en) | Two paster hybrid reflow soldering device of SMT | |
CN211102017U (en) | Multi-temperature-zone reflow furnace | |
CN220312029U (en) | Circuit board reflow soldering equipment | |
CN2433040Y (en) | Welder with waste gas retrieving device | |
CN108633188A (en) | A kind of safety-type reflow machine | |
CN214381653U (en) | Reflow soldering device for SMT (surface mount technology) chip and SMT chip mounter thereof | |
CN207835960U (en) | A kind of fast welder of SMT double applyings piece | |
CN113492242A (en) | Water-cooled vacuum sealing door system | |
CN204206618U (en) | Wave-soldering and equipment for after-treatment tinuous production | |
CN105776147B (en) | A kind of ground electrode plate component and ozone generator | |
CN109041453A (en) | A kind of route plate cooling device | |
CN215393020U (en) | Intelligent lead-free backflow environment-friendly welding machine device | |
CN219484469U (en) | 5 micron self-purification temperature control heating module suitable for ultra-clean reflow oven | |
CN203109398U (en) | Vapor reflow oven |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |