CN214381653U - Reflow soldering device for SMT (surface mount technology) chip and SMT chip mounter thereof - Google Patents

Abstract

The utility model provides a reflow soldering device for SMT paster and SMT chip mounter thereof, including the delivery track that is used for carrying component group board, the delivery track passes preheating zone I, heat-soak zone I, reflow zone I and cooling space I in proper order, still including enclosing to establish the exhaust chamber that is used for exhaust gas at preheating zone I, heat-soak zone I, reflow zone I and I end wall of cooling space external, the delivery track lower extreme is equipped with preheating zone II, heat-soak zone II, reflow zone II and the cooling space II that corresponds with preheating zone I, heat-soak zone I, reflow zone I and cooling space I, is located the bottom of preheating zone II, heat-soak zone II, reflow zone II and cooling space II is equipped with the heat transfer board. The utility model discloses a cooperation of exhaust chamber and heat transfer chamber I, heat transfer chamber II carries out reuse to the heat in the gas of preheating zone I, heat immersion zone I, reflow zone I and I department in cooling zone, has reduced the energy consumption, simultaneously, has avoided the heat directly to give off to the air in and influence the operation environment.

Description

Reflow soldering device for SMT (surface mount technology) chip and SMT chip mounter thereof

Technical Field

The utility model relates to a reflow soldering technical field specifically is a reflow soldering device for SMT paster and SMT chip mounter thereof.

Background

The utility model provides a reflow soldering device for electronic product that publication number is CN208434202U, including delivery guide and control box, one side fixedly connected with entry updraft ventilator of delivery guide, along delivery guide and reflow soldering device's inside has set gradually heating zone, heat preservation district, refluence district, cooling space, subsides dress device and export updraft ventilator, and one side of export updraft ventilator runs through there is the exhaust column and extends to entry updraft ventilator one side, one side of entry updraft ventilator is provided with the alarm lamp, and one of them emergency stop button is located alarm lamp one side. Above-mentioned a reflow soldering device for electronic product through setting up the cooling zone, cools down to the welded electronic product that heaies up, reaches the purpose of design, pastes the dress through pasting the device to the electronic product that the cooling finishes simultaneously, need not pass through two processes, can realize reflow soldering and paste integrative operation of dress, nevertheless is carrying out reflow soldering's in-process to electronic product, and the energy consumption is great, and waste gas directly discharges and influences the operational environment in the air.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a reflow soldering device for SMT paster and SMT chip mounter thereof to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a reflow soldering device for SMT patches comprises a conveying track used for conveying component assembly plates, wherein the conveying track sequentially penetrates through a preheating area I, an immersion heating area I, a reflow soldering area I and a cooling area I, the conveying track further comprises an exhaust cavity which is arranged around the end walls of the preheating area I, the immersion heating area I, the reflow soldering area I and the cooling area I and is externally used for exhausting waste gas, the lower end of the conveying track is provided with a preheating area II, an immersion heating area II, a reflow soldering area II and a cooling area II which correspond to the preheating area I, the immersion heating area I, the reflow soldering area I and the cooling area I, the bottoms of the preheating area II, the immersion heating area II, the reflow soldering area II and the cooling area II are provided with heat exchange plates, the exhaust cavity which is arranged outside the end wall of the reflow soldering area I is communicated with the heat exchange cavity I arranged at the bottom of the heat exchange plates, the exhaust cavity which is arranged outside the end walls of the preheating area I and the immersion soldering area I is communicated with the same gas pipe, when the component assembly plates move on the conveying track, be located I end wall department in the rewelding zone gas in the exhaust chamber gets into in proper order heat transfer chamber I, gas-supply pipe and is located II lower extreme heat transfer chambers of cooling zone, the bottom of heat transfer chamber II is equipped with the gas vent, is located outside I end wall of cooling zone the exhaust chamber communicates with II heat transfer chambers.

Preferably, the preheating zone I, the soaking zone I, the reflow zone I and the cooling zone I corresponding to the preheating zone II, the soaking zone II, the reflow zone II and the cooling zone II have the same structure.

Preferably, an orifice plate for gas permeation is provided in the middle of the conveying track.

Preferably, the heat exchange plate is made of copper, and when gas flows through the heat exchange cavity I or the heat exchange cavity II, heat in the gas enters the preheating area II, the heat soaking area II, the reflow area II or the cooling area II through the heat exchange plate.

Preferably, an exhaust fan is arranged in the exhaust cavity.

An SMT chip mounter comprises the reflow soldering device for SMT chip mounting.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a cooperation of exhaust chamber and heat transfer chamber I, heat transfer chamber II, to preheating zone I, soak heat district I, reflow zone I and the heat in the gas of I department in cooling zone carry out reuse, reduced the energy consumption, simultaneously, avoided the heat directly to give off to the air in and influence the operation environment, in addition, the utility model discloses concentrate the waste gas that produces when with reflow soldering from same gas vent discharge, be convenient for collect and carry out subsequent processing, avoid the waste gas of discharge to influence the operation environment.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic cross-sectional view taken at A in FIG. 1;

fig. 3 is a schematic view of the matching structure of the middle conveying track and the orifice plate of the present invention.

In the figure: 1 conveying track, 2 preheating zone I, 201 preheating zone II, 3 soaking zone I, 301 soaking zone II, 4 rewelding zone I, 401 rewelding zone II, 5 cooling zone I, 501 cooling zone II, 6 exhaust chamber, 7 heat exchange plate, 8 heat exchange chamber I, 9 gas-supply pipe, 10 heat exchange chamber II, 11 exhaust port, 12 orifice plates.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1:

a reflow soldering device for SMT patches comprises a conveying track 1 used for conveying component group boards, wherein the conveying track 1 sequentially penetrates through a preheating area I2, a heat immersion area I3, a rewelding area I4 and a cooling area I5, and further comprises an exhaust cavity 6 which is arranged around the end walls of the preheating area I2, the heat immersion area I3, the rewelding area I4 and the cooling area I5 and used for exhausting waste gas, an exhaust fan is arranged in the exhaust cavity 6, the lower end of the conveying track 1 is provided with a preheating area II 201, a heat immersion area II 301, a rewelding area II 401 and a cooling area II 501 which correspond to the preheating area I2, the heat immersion area I3, the rewelding area I4 and the cooling area I5, the bottoms of the conveying track 1 are provided with heat exchange plates 7, the exhaust cavity 6 arranged outside the end wall of the rewelding area I4 is communicated with a heat exchange cavity I8 arranged at the bottom of the heat exchange plates 7, the exhaust cavity 6 arranged outside the end walls of the preheating area II 201, the heat immersion area I3 and the preheating area I3 are communicated with the same gas pipe 9, when the component group plate moves on the conveying track 1, the gas in the exhaust cavity 6 at the end wall of the reflow zone I4 enters the heat exchange cavity I8 and the gas conveying pipe 9 in turn into the heat exchange cavity II 10 at the lower end of the cooling zone II 501, the bottom of the heat exchange cavity II 10 is provided with an exhaust port 11, the exhaust cavity 6 outside the end wall of the cooling zone I5 is communicated with the heat exchange cavity II 10, in addition, the middle of the conveying track 1 is provided with a pore plate 12 for gas permeation, wherein the preheating zone II 201, the heat soaking zone II 301, the reflow zone II 401 and the cooling zone II 501 correspond to the preheating zone I2, the heat soaking zone I3, the reflow zone I4 and the cooling zone I5 which have the same structure, wherein, the heat exchange plate 7 is made of copper, when gas flows through the heat exchange cavity I8 or the heat exchange cavity II 10, the heat in the gas enters a preheating zone II 201, a heat soaking zone II 301, a reflow zone II 401 or a cooling zone II 501 through the heat exchange plate 7.

Example 2:

an SMT mounter comprising the reflow soldering apparatus for SMT mounting described in embodiment 1.

The utility model discloses an application principle: specifically, an element group board sequentially passes through a preheating zone I2, a heat soaking zone I3, a reflow zone I4 and a cooling zone I5, and the electronic elements on the element group board are subjected to reflow soldering treatment by matching with a preheating zone II 201, a heat soaking zone II 301, a reflow zone II 401 and a cooling zone II 501, wherein the action principle and the specific structure of the element group board in the preheating zone I2, the heat soaking zone I3, the reflow zone I4 and the cooling zone I5 adopt the prior known technology, and are not elaborated in detail herein;

specifically, when the preheating zone I2, the heat immersion zone I3, the rewelding zone I4 and the cooling zone I5 carry out reflow soldering treatment on the component group plate, the gas at the rewelding zone I4 enters the heat exchange chamber I8 through the exhaust chamber 6 and then is converged into the gas pipe 9, meanwhile, the gas at the preheating zone I2 and the heat immersion zone I3 directly converges into the gas pipe 9 through the exhaust chamber 6, the gas mixed in the gas pipe 9 is conveyed into the heat exchange chamber II 10 again, meanwhile, the gas at the cooling zone I5 directly enters the heat exchange chamber II 10 through the exhaust chamber 6, finally, the gas mixed in the heat exchange chamber II 10 is discharged and collected through the exhaust port 11 for subsequent treatment, wherein when the gas flows through the heat exchange chamber I8, the heat in the gas exchanges heat with the heat exchange plate 7, so that the heat in the gas can enter the preheating zone II 201, the heat immersion zone II 301 and the rewelding zone II 401 for repeated utilization, the energy consumption has been reduced, and avoid the heat directly to give off to the air and influence the operation environment, wherein, when the gas flow through in heat transfer chamber II 10, heat in the gas carries out the heat exchange with the heat transfer board 7 that is located II 501 bottoms in cooling zone, with this, carry out reuse to the heat in the waste gas, the energy consumption has further been reduced, simultaneously, the heat of the gas that circulates to in heat transfer chamber II 10 has obviously reduced in I8 through heat transfer chamber, help cooling gradually and solidify with the welding point to the component group board that is located I5 department in cooling zone.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a reflow soldering device for SMT paster, includes conveying track (1) that is used for carrying component group board, conveying track (1) passes preheating zone I (2), heat soak zone I (3), rewelding zone I (4) and cooling space I (5) in proper order, its characterized in that: the exhaust device is characterized by further comprising an exhaust cavity (6) which is arranged around the end walls of the preheating area I (2), the heat immersion area I (3), the rewelding area I (4) and the cooling area I (5) and is externally used for exhausting waste gas, the lower end of the conveying track (1) is provided with a preheating area II (201), a heat immersion area II (301), a rewelding area II (401) and a cooling area II (501) which correspond to the preheating area I (2), the heat immersion area I (3), the rewelding area I (4) and the cooling area I (5), heat exchange plates (7) are arranged at the bottoms of the preheating area II (201), the heat immersion area II (301), the rewelding area II (401) and the cooling area II (501), the exhaust cavity (6) which is arranged outside the end wall of the rewelding area I (4) is communicated with a heat exchange cavity I (8) arranged at the bottom of the heat exchange plates (7), the exhaust cavity (6) which is arranged outside the end walls of the preheating area I (2) and the heat immersion area I (3) is communicated with the same gas pipe (9), when the component group plate moves on the conveying track (1), the gas in the exhaust cavity (6) enters the heat exchange cavity II (10) at the lower end of the cooling area II (501) through the heat exchange cavity I (8) and the gas conveying pipe (9) in sequence at the end wall of the reflow area I (4), the bottom of the heat exchange cavity II (10) is provided with an exhaust port (11), and the exhaust cavity (6) is communicated with the heat exchange cavity II (10) outside the end wall of the cooling area I (5).

2. A reflow soldering apparatus for an SMT patch according to claim 1, wherein: the preheating zone II (201), the heat immersion zone II (301), the reflow zone II (401) and the cooling zone II (501) correspond to the preheating zone I (2), the heat immersion zone I (3), the reflow zone I (4) and the cooling zone I (5) in the same structure.

3. A reflow soldering apparatus for an SMT patch according to claim 2, wherein: and a pore plate (12) for gas permeation is arranged in the middle of the conveying track (1).

4. A reflow soldering apparatus for an SMT patch according to claim 3, wherein: the material of heat transfer board (7) is copper, and when the gas stream was in heat transfer chamber I (8) or heat transfer chamber II (10), the heat in the gas got into through heat transfer board (7) preheating zone II (201), heat soak zone II (301), reflow zone II (401) or cooling space II (501).

5. A reflow soldering apparatus for an SMT patch according to claim 1, wherein: an exhaust fan is arranged in the exhaust cavity (6).

6. An SMT chip mounter is characterized in that: reflow soldering apparatus for SMT patch comprising any of claims 1-5.

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