CN105208794B - A kind of PCB manufacturing method of soft board of lead-free tin spray - Google Patents
A kind of PCB manufacturing method of soft board of lead-free tin spray Download PDFInfo
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- CN105208794B CN105208794B CN201510557984.8A CN201510557984A CN105208794B CN 105208794 B CN105208794 B CN 105208794B CN 201510557984 A CN201510557984 A CN 201510557984A CN 105208794 B CN105208794 B CN 105208794B
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- Prior art keywords
- soft board
- lead
- framework
- free tin
- spray
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of PCB manufacturing method of soft board of lead-free tin spray, comprise the following steps：S1, sawing sheet；S2, drilling；The heavy copper of S3, core material, electric plating of whole board, core material graphic making；S4, brown；S5, paste epiphragma, quick pressing；S6, move back brown；S7 plus framework, the soft board is fixed on framework；S8, cross blasting treatment；S9, lead-free tin spray.Soft board is fixedly connected on framework by edges of boards tooling hole and fixing hole by rivet, framework is prevented to be slid from spray tin frame to tin cylinder, and traditional lead-free tin spray mode can only handle the thick soft board for being less than or equal to 1OZ of copper, the thick common soft board for being less than or equal to 4OZ of copper can be handled using the method in the application, make common soft board the method for lead-free tin spray can be used to prepare, it is more environmentally-friendly, it is small to operating personnel's actual bodily harm.
Description
Technical field
The invention belongs to printed circuit board manufacture technology field, a kind of PCB soft board systems of lead-free tin spray are related in particular to
Make method.
Background technology
Printed circuit board (Printed Circuit Board, referred to as PCB) surface spray tin is at printed circuit board plate face
A kind of most commonly seen surface coating method of reason, also known as hot air leveling, immersed printed circuit board in the solder of melting, then
The excess solder in the surface of printed circuit board and plated through-hole is blown off by hot blast, so as to obtain a smooth, uniform light
Bright solder-coated layer, the quality of solder when spraying the fine or not direct subsequent production of tin quality.Tradition spray tin mode is that have lead to spray tin,
Lead and tin are modulated into solder according to a certain percentage, lead can improve activity of the solder in welding process, but lead it is poisonous, to people
Body is harmful to, and does not meet the environmental requirement advocated all the time, therefore the lead-free tin spray that has been born.
Lead-free tin spray is a kind of environmentally friendly technique, and its harm to the human body is very small, and a kind of technique advocated at this stage,
It is no more than 0.5 without the content in slicker solder for lead, solder melt point is higher in lead-free tin spray process so that pad is firmly a lot.
But in the prior art, generally required for the lead-free tin spray process of soft board using special spray tin frame, soft board is to be clipped in spray tin
On frame, operation does not notice that when hanger quickly lifts from tin cylinder, soft board may depart to fall cylinder, and can only typically produce copper thickness
Soft board less than or equal to 10Z, it is easy to occur the phenomenon of cover layer foaming for common soft board, during using lead-free tin spray, and
And microetch is generally only crossed on soft board surface, easily make tin face coarse after spraying tin, upper tin is bad.
The content of the invention
Therefore, the technical problems to be solved by the invention are that existing soft board lead-free tin spray process is only capable of processing copper thickness and is less than
Or the soft board equal to 10Z, and special spray tin frame is needed, microetch is generally only crossed on soft board surface, and tin face is easily coarse after spraying tin, upper tin
It is bad, so as to propose a kind of PCB manufacturing method of soft board of lead-free tin spray.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of PCB manufacturing method of soft board of lead-free tin spray, and it comprises the following steps：
S1, sawing sheet, core material is outputed according to jigsaw size；
S2, drilling, edges of boards tooling hole and effective unit endoporus are drilled out on the core material；
The heavy copper of S3, core material, electric plating of whole board, core material graphic making；
S4, brown, brown layer is formed on the core material surface；
S5, epiphragma and quick pressing are pasted on the core material surface, obtain the soft board；
S6, brown is moved back, remove the brown layer, expose copper face；
S7 plus framework, the soft board is fixed on framework；
S8, the soft board crossed into blasting treatment；
S9, lead-free tin spray.
Preferably, in the step S9, also include the process of baking sheet before lead-free tin spray, it is roasting in the baking sheet process
Plate temperature is 150~180 DEG C, time 2-4h.
Preferably, in the step S9, temperature during lead-free tin spray is 250~265 DEG C, and the time is 1~2s, air knife pressure
Power is 1.5-2kg.
Preferably, in the step S2, the tooling hole is arranged at the edges of boards of the soft board surrounding, instrument described in per side
Hole number is more than or equal to 3, and the tooling hole positioned at opposite side is symmetrical arranged.
Preferably, distance of the tooling hole away from corresponding soft board edge is more than 2cm, and the tooling hole away from its
The distance of corresponding effectively cell edges is more than 2cm, little for hanging the instrument pitch of holes of edges of boards side of the soft board
In 15cm.
Preferably, in the step S5, pressing-in temp is 180 DEG C, and pressing pressure is 60~90kg, and bonding processes include
10~15s of precompressed, 90~110s is pressed soon.
Preferably, the framework single side size in the step S7 is more than the single side size of the corresponding soft board,
The frame thickness is more than 1.5mm, is more than 5cm per hem width degree, and side is provided with fixing hole corresponding with the tooling hole.
Preferably, one side of the framework is provided with the hanging hole for hanging frame and soft board, the hanging hole is located at it
Framework one side center at place, and away from framework outer ledge 2cm.
Preferably, the part that the framework overlaps with the soft board does not block effective unit of the soft board, the extension
Hole position is beyond the soft board.
Preferably, in the step S3, the copper layer thickness of the heavy copper of internal layer is 0.3-0.6 μm.
The above-mentioned technical proposal of the present invention has advantages below compared with prior art：
(1) the PCB manufacturing method of soft board of lead-free tin spray of the present invention, tooling hole is added in soft board edges of boards, and increased
The framework with fixing hole supporting with the tooling hole is added, framework etches away two sides copper by FR4 sheet materials, and middle part gong is empty
It is made, the fixing hole on tooling hole and framework that soft board passes through edges of boards is fixedly connected on framework by rivet, avoids customized special
Spray tin frame, the connected mode of soft board and framework prevents framework to be slid from spray tin frame to tin cylinder, and traditional unleaded spray
Tin mode can only handle the thick soft board for being less than or equal to 1OZ of copper, and can handle copper thickness using the method in the application is less than or waits
In 4OZ common soft board, make common soft board the method for lead-free tin spray can be used to prepare, it is more environmentally-friendly, to operating personnel's body
Injure small.
(2) the PCB manufacturing method of soft board of lead-free tin spray of the present invention, hangs the side of soft board, and instrument pitch of holes is little
It is more intensive in 15cm, the fixing point that soft board is fixed on framework, it is therefore prevented that soft board comes off from framework.
(3) the PCB manufacturing method of soft board of lead-free tin spray of the present invention, after core material graphic making, increase
The step of brown, brown can increase soft board surface roughness, at the same the brown oxide generated can alleviate cover layer glue and
Difference between copper face between thermal coefficient of expansion, effectively prevent soft board during immersing tin cylinder cover layer bubble the problem of；
Towing plate (hardboard) is pasted during brown on soft board surface, it is therefore prevented that the situation of clamp is produced when crossing brown.
(4) the PCB manufacturing method of soft board of lead-free tin spray of the present invention, the work of baking sheet is increased before lead-free tin spray
Sequence, the easy moisture absorption of polyimides in soft board, baking sheet can remove the moisture in soft board, and moisture expands when preventing from spraying tin, further
Prevent cover layer from bubbling.
Brief description of the drawings
In order that present disclosure is more likely to be clearly understood, specific embodiment and combination below according to the present invention
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 be the lead-free tin spray described in the embodiment of the present invention PCB manufacturing method of soft board in the structure of soft board and framework show
It is intended to.
Reference is expressed as in figure：1- soft boards；2- frameworks；3- tooling holes；The effective unit endoporus of 4-；The effective units of 5-；
6- hanging holes；
Embodiment
Embodiment
The present embodiment provides a kind of PCB manufacturing method of soft board of lead-free tin spray, and the soft board 1 made is as shown in figure 1, described
Preparation method comprises the following steps：
S1, sawing sheet, core material is outputed according to jigsaw size；
S2, drilling, drill out edges of boards tooling hole 3 and effective unit endoporus 4 on the core material, and the tooling hole 3 is set
The edges of boards of the surrounding of soft board 1 are placed in, the number of tooling hole 3 is more than or equal to 3 described in per side, positioned at the instrument of opposite side
Hole 3 is symmetrical arranged, and distance of the tooling hole 3 away from the corresponding soft board edge where it is more than 2cm, is in the present embodiment
4cm, while the Edge Distance away from corresponding effective unit 5 is more than 2cm, is 3cm in the present embodiment, it is described soft for hanging
The spacing of tooling hole 3 of the edges of boards side of plate 1 is not more than 15cm, and the edges of boards of hanging soft boards 1 are the top of soft board 1 in Fig. 1 in the present embodiment
Edges of boards, the spacing of tooling hole 3 is 15cm；
S3, core material sink copper, in effective unit 4 need in effective unit endoporus 4 of UNICOM it is rich degree be 0.3-0.6
μm layers of copper, be 0.4 μm in the present embodiment；Electric plating of whole board, increase copper layer thickness and core material surface in effective unit endoporus 4
Copper layer thickness；Core material graphic making, the exposure of core material circuit is completed with 6 lattice exposure guide rules or 21 lattice exposure guide rules, after development
Etch line pattern, then carry out internal layer AOI detections, check inner figure the defects of opening short circuit and be modified；
S4, brown, soft board 1 is crossed into brown processing, soft board 1 need to paste towing plate (hardboard) during brown, prevent clamp, brown energy
Increase the surface roughness of soft board 1, while the brown oxide generated can alleviate thermal coefficient of expansion between cover layer glue and copper face
Between difference, prevent cover layer from bubbling；
S5, epiphragma and quick pressing are pasted on the core material surface, pressing-in temp is 180 DEG C, pressing pressure 60
~90kg, it is 80kg in the present embodiment, bonding processes include 10~15s of precompressed, are 12s in the present embodiment, press 90~110s soon,
It is 110s in the present embodiment, obtains the soft board 1；
S6, brown is moved back, remove the brown layer, expose copper face；
S7 plus framework 2, the soft board 1 is fixed on the frame 2, and the framework 2 etches away two sides copper by FR4 sheet materials, and
Middle part gong is empty obtained, and framework 2 is more than the edges of boards length of soft board 1 corresponding with the side per edge lengths, and frame thickness is more than 1.5mm,
It is 2mm in the present embodiment, is more than 5cm per hem width degree, be 7cm in the present embodiment, one side of framework 2 is additionally provided with for hanging frame
The hanging hole 6 of frame 2 and soft board 1, the hanging hole 6 are located at one side center of framework 2 where it, and away from the outer ledge 2cm of framework 2, position
Region beyond soft board 1, the framework 2 do not block effective unit 5 of the soft board 1 with the part that the soft board 1 overlaps；
S8, the soft board 1 is crossed to blasting treatment, the copper face on cleaning soft board 1 surface, because soft board 1 is already fixed to framework 2
On, be not in during sandblasting clamp situation；
S9, lead-free tin spray, before spraying tin, baking sheet first being carried out, baking sheet temperature is 150~180 DEG C, is 160 DEG C in the present embodiment,
Time is 2-4h, is 3h in the present embodiment, and to remove moisture in plate, moisture expands when preventing from spraying tin, cover layer foaming, unleaded spray
Temperature during tin is 250~265 DEG C, is 260 DEG C in the present embodiment, and the time is 1~2s, is 2s in the present embodiment, air knife pressure
It is 1.8kg in the present embodiment for 1.5-2kg, is cooled down after spraying tin and clean soft board 1, remove the impurity such as scruff, carries out outward appearance and open
Short-circuit conditions detect, and pack shipment.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (7)
1. the PCB manufacturing method of soft board of a kind of lead-free tin spray, it is characterised in that comprise the following steps：
S1, sawing sheet, core material is outputed according to jigsaw size；
S2, drilling, edges of boards tooling hole and effective unit endoporus are drilled out on the core material；
The heavy copper of S3, core material, electric plating of whole board, core material graphic making；
S4, brown, brown layer is formed on the core material surface；
S5, epiphragma and quick pressing are pasted on the core material surface, obtain the soft board；
S6, brown is moved back, remove the brown layer, expose copper face；
S7 plus framework, the soft board is fixed on framework；
S8, the soft board crossed into blasting treatment；
S9, lead-free tin spray；
In the step S2, the tooling hole is arranged at the edges of boards of the soft board surrounding, be more than per tooling hole number described in side or
Equal to 3, the tooling hole positioned at opposite side is symmetrical arranged；
Distance of the tooling hole away from corresponding soft board edge is more than 2cm, and the tooling hole is away from corresponding effective
The distance of cell edges is more than 2cm, is not more than 15cm for hanging the instrument pitch of holes of edges of boards side of the soft board；
In the step S5, pressing-in temp is 180 DEG C, and pressing pressure is 60~90kg, and bonding processes include 10~15s of precompressed,
90~110s of fast pressure.
2. the PCB manufacturing method of soft board of lead-free tin spray according to claim 1, it is characterised in that in the step S9, nothing
Also include the process of baking sheet before lead spray tin, in the baking sheet process, baking sheet temperature is 150~180 DEG C, time 2-4h.
3. the PCB manufacturing method of soft board of lead-free tin spray according to claim 1 or 2, it is characterised in that the step S9
In, temperature during lead-free tin spray is 250~265 DEG C, and the time is 1~2s, and air knife pressure is 1.5-2kg.
4. the PCB manufacturing method of soft board of lead-free tin spray according to claim 3, it is characterised in that in the step S7
The framework single side size is more than the single side size of the corresponding soft board, and the frame thickness is more than 1.5mm, big per hem width degree
In 5cm, side is provided with fixing hole corresponding with the tooling hole.
5. the PCB manufacturing method of soft board of lead-free tin spray according to claim 4, it is characterised in that one side of the framework
The hanging hole for hanging frame and soft board is provided with, the hanging hole is located at framework one side center where it, and away from the outside of framework
Edge 2cm.
6. the PCB manufacturing method of soft board of lead-free tin spray according to claim 5, it is characterised in that the framework with it is described
The part that soft board overlaps does not block effective unit of the soft board, and the hanging hole is located at beyond the soft board.
7. the PCB manufacturing method of soft board of lead-free tin spray according to claim 6, it is characterised in that interior in the step S3
The copper layer thickness of the heavy copper of layer is 0.3-0.6 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510557984.8A CN105208794B (en) | 2015-09-02 | 2015-09-02 | A kind of PCB manufacturing method of soft board of lead-free tin spray |
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| CN201510557984.8A CN105208794B (en) | 2015-09-02 | 2015-09-02 | A kind of PCB manufacturing method of soft board of lead-free tin spray |
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| CN105208794A CN105208794A (en) | 2015-12-30 |
| CN105208794B true CN105208794B (en) | 2018-01-23 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061127A (en) * | 2016-08-09 | 2016-10-26 | 安徽广德威正光电科技有限公司 | PCB plate-surface single-area local thickening copper plating production technology |
| CN107994106A (en) * | 2017-08-02 | 2018-05-04 | 宏齐光电子(深圳)有限公司 | A kind of LED encapsulation PCB substrate for spraying tin and its spray tin surfaces processing method |
| CN107770967A (en) * | 2017-10-18 | 2018-03-06 | 开平依利安达电子第三有限公司 | A kind of wiring board locally plates copper technology |
| CN108811364A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A kind of production method of spray tin red oil plate |
| CN110740584A (en) * | 2019-10-12 | 2020-01-31 | 西安金百泽电路科技有限公司 | method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel |
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| CN102883544A (en) * | 2011-07-13 | 2013-01-16 | 深圳市深联电路有限公司 | Method of preventing via hole from oil dropping in lead-free HASL process of circuit board |
| CN204217229U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Soft thin pcb board spray tin aid |
| CN104853544A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | Method for making metalized half hole |
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2015
- 2015-09-02 CN CN201510557984.8A patent/CN105208794B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883544A (en) * | 2011-07-13 | 2013-01-16 | 深圳市深联电路有限公司 | Method of preventing via hole from oil dropping in lead-free HASL process of circuit board |
| CN204217229U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Soft thin pcb board spray tin aid |
| CN104853544A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | Method for making metalized half hole |
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| CN105208794A (en) | 2015-12-30 |
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