CN110740584A - method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel - Google Patents
method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel Download PDFInfo
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- CN110740584A CN110740584A CN201910967361.6A CN201910967361A CN110740584A CN 110740584 A CN110740584 A CN 110740584A CN 201910967361 A CN201910967361 A CN 201910967361A CN 110740584 A CN110740584 A CN 110740584A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
Abstract
The invention belongs to the technical field of circuit board processing, and provides a method for manufacturing ultra-long and ultra-thin polyimide single-panel gold-sinking, which comprises the following steps of S1, cutting and preprocessing, S2, pasting a dry film, S3, manufacturing a pattern, S4, etching, S5, processing plate edges, S6, punching, S7, fixing, S8, gold-sinking and S9, cleaning.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a method for manufacturing ultra-long and ultra-thin polyimide single-panel gold immersion plates.
Background
With the rapid development of the circuit board industry, the integration level of circuit pattern design is higher and higher, for high-frequency signals, the requirements on signal transmission quality are higher and higher, the structural design of the circuit board is stricter and stricter, and in order to ensure the signal transmission quality, a gold-plated process board is produced, and the nickel-gold electroplating technology is widely applied to during the surface treatment of the circuit board.
In the current printed circuit board industry, a circuit board with gold melting surface treatment is manufactured, the conventional size is less than or equal to 24inch, the conventional board thickness is mm which is more than or equal to 0.2mm, the length of the board is between 600 and 900mm, the board thickness is 0.078mm, and when the size and the board thickness exceed the processing capacity of equipment of a conventional circuit board factory, a plurality of enterprises produce the board of the type.
For the preparation of heavy golden plate, adopt the basket of hanging the preparation in the trade, and for just with the thin plate basket of hanging that has worn the teflon line of hanging the preparation, because hang the restriction of basket machining dimension and groove volume among the prior art, some circuit boards that surpass the equipment ability can't do heavy golden processing.
Disclosure of Invention
In view of the above, the invention provides methods for producing gold immersion for ultra-long and ultra-thin polyimide single panels, which can effectively solve the problem that the ultra-long and ultra-thin polyimide single panels cannot be subjected to gold immersion, and can improve the qualification rate of the products.
The technical scheme of the invention is as follows:
method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel, which is characterized by comprising the following steps:
s1, cutting and pretreatment: cutting the substrate into required processing size, cleaning the substrate, and roughening the substrate; s2, pasting a dry film; s3, making a graph;
s4, etching, namely etching surfaces of copper sheets and surfaces of copper sheets to form needed patterns to obtain a circuit board;
s5, plate edge treatment;
s6, punching: punching by using a punching machine, punching 3-5 groups of holes on each side of the short edge of the circuit board, wherein each group has 2 holes, and the holes in each group are symmetrically distributed on the edge of the board;
s7, fixing: placing the pattern surface of the circuit board outwards on a cross rod at the upper end of the hanging basket, wherein the long edge direction of the circuit board is vertical to the width direction of the hanging basket, the part which exceeds the width direction of the hanging basket naturally hangs down from the outside of the hanging basket, and fixing the circuit board on the clamping strip and the hanging basket by using a binding belt through a plate edge hole which is punched before;
s8, gold immersion, namely covering layers of gold plating layers on a gold immersion area of the circuit board through a chemical reaction;
s9, cleaning: the short edge of the circuit board is fixed on the carriage by using a red adhesive tape or crepe adhesive paper, and after the board is placed in front of the drying section of the cleaning machine and dried, the board is dried and then kraft paper is arranged.
, the step S5 includes edge wrapping and edge cutting, the edge wrapping process is to select a blue adhesive tape or a red adhesive tape with a proper width to wrap the position which is not needed by the edge of the plate in the unit, and the edge cutting process is to cut off the copper skin in the copper leakage area at the position where the plate edge has copper leakage after edge wrapping.
, the step S6 further includes punching groups of holes at intervals of 8-11cm on the long side of the circuit board, wherein the holes cannot be punched into the cells and wrinkles cannot be generated in the cells.
, in step S7, the circuit board needs to be fixed flat.
, in step S8, except the nickel bath auxiliary bath, the other aeration positions are all closed, and the electric shock and gas cap of the liquid medicine bath are closed, so as to finish the gold precipitation according to the normal flow.
In step , in step S9, the carriage must be longer than the circuit board and sufficiently fixed.
, in the step S2, the film sticking speed of the dry film sticking process is 1.5m/min, the film sticking pressure is 0.5MPa, and the film sticking temperature is 120 ℃.
, in step S2, the whole process of pasting is performed under vacuum condition to improve the contact tightness between the film and the dry film and reduce the astigmatism phenomenon, the dry film after pasting is flat, without wrinkles and without bubbles, when pasting, the polyethylene protective film is firstly torn off from the dry film, and then the dry film is pasted on the copper foil under the condition of heating and pressurizing.
According to the invention, the edge treatment and the punching processing are firstly carried out on the circuit board, so that the ultra-long and ultra-thin polyimide single-sided board can be effectively fixed on the hanging basket, the stability of the hanging basket is not influenced by processing factors in the gold immersion process, the limit of the processing size of the hanging basket and the size of a groove is broken through, the gold immersion processing of the ultra-long and ultra-thin polyimide single-sided board can be realized by adopting common production equipment conditions, and the qualification rate of products can be ensured.
The invention can effectively solve the problem that the single panel made of the ultra-long and ultra-thin polyimide material can not be used for gold immersion, and can improve the qualification rate of the products. The method is simple to operate, and facilitates the field gold immersion operation of the ultrathin polyimide single panel.
Detailed Description
For purposes of making the present invention more apparent its objects, aspects and advantages, the present invention is described in detail below in with reference to specific embodiments.
Example 1
method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel, which is characterized by comprising the following steps:
s1, cutting and pretreatment: cutting the substrate into required processing size, cleaning the substrate, and roughening the substrate; s2, pasting a dry film; s3, making a graph;
s4, etching, namely etching surfaces of copper sheets and surfaces of copper sheets to form needed patterns to obtain a circuit board;
s5, plate edge treatment;
s6, punching: punching by using a punching machine, punching 3 groups of holes on each side of the short edge of the circuit board, wherein each group of holes is 2, and each group of holes are symmetrically distributed on the edge of the board;
s7, fixing: placing the pattern surface of the circuit board outwards on a cross rod at the upper end of the hanging basket, wherein the long edge direction of the circuit board is vertical to the width direction of the hanging basket, the part which exceeds the width direction of the hanging basket naturally hangs down from the outside of the hanging basket, and fixing the circuit board on the clamping strip and the hanging basket by using a binding belt through a plate edge hole which is punched before;
s8, gold immersion, namely covering layers of gold plating layers on a gold immersion area of the circuit board through a chemical reaction;
s9, cleaning: the short edge of the circuit board is fixed on the carriage by using a red adhesive tape or crepe adhesive paper, and after the board is placed in front of the drying section of the cleaning machine and dried, the board is dried and then kraft paper is arranged.
, the step S5 includes edge wrapping and edge cutting, the edge wrapping process is to select a blue adhesive tape or a red adhesive tape with a proper width to wrap the position which is not needed by the edge of the plate in the unit, and the edge cutting process is to cut off the copper skin in the copper leakage area at the position where the plate edge has copper leakage after edge wrapping.
, the step S6 further includes punching groups of holes at intervals of 10cm on the long side of the circuit board, wherein the holes cannot be punched into the cells and wrinkles cannot be generated in the cells.
, in step S7, the circuit board needs to be fixed flat.
, in step S8, except the nickel bath auxiliary bath, the other aeration positions are all closed, and the electric shock and gas cap of the liquid medicine bath are closed, so as to finish the gold precipitation according to the normal flow.
In step , in step S9, the carriage must be longer than the circuit board and sufficiently fixed.
, in the step S2, the film sticking speed of the dry film sticking process is 1.5m/min, the film sticking pressure is 0.5MPa, and the film sticking temperature is 120 ℃.
, in step S2, the whole process of pasting is performed under vacuum condition to improve the contact tightness between the film and the dry film and reduce the astigmatism phenomenon, the dry film after pasting is flat, without wrinkles and without bubbles, when pasting, the polyethylene protective film is firstly torn off from the dry film, and then the dry film is pasted on the copper foil under the condition of heating and pressurizing.
According to the invention, the edge treatment and the punching processing are firstly carried out on the circuit board, so that the ultra-long and ultra-thin polyimide single-sided board can be effectively fixed on the hanging basket, the stability of the hanging basket is not influenced by processing factors in the gold immersion process, the limit of the processing size of the hanging basket and the size of a groove is broken through, the gold immersion processing of the ultra-long and ultra-thin polyimide single-sided board can be realized by adopting common production equipment conditions, and the qualification rate of products can be ensured.
The invention can effectively solve the problem that the single panel made of the ultra-long and ultra-thin polyimide material can not be used for gold immersion, and can improve the qualification rate of the products. The method is simple to operate, and facilitates the field gold immersion operation of the ultrathin polyimide single panel.
Example 2
method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel, which is characterized by comprising the following steps:
s1, cutting and pretreatment: cutting the substrate into required processing size, cleaning the substrate, and roughening the substrate; s2, pasting a dry film; s3, making a graph;
s4, etching, namely etching surfaces of copper sheets and surfaces of copper sheets to form needed patterns to obtain a circuit board;
s5, plate edge treatment;
s6, punching: punching by using a punching machine, punching 4 groups of holes on each side of the short edge of the circuit board, wherein each group of holes is 2, and each group of holes are symmetrically distributed on the edge of the board;
s7, fixing: placing the pattern surface of the circuit board outwards on a cross rod at the upper end of the hanging basket, wherein the long edge direction of the circuit board is vertical to the width direction of the hanging basket, the part which exceeds the width direction of the hanging basket naturally hangs down from the outside of the hanging basket, and fixing the circuit board on the clamping strip and the hanging basket by using a binding belt through a plate edge hole which is punched before;
s8, gold immersion, namely covering layers of gold plating layers on a gold immersion area of the circuit board through a chemical reaction;
s9, cleaning: the short edge of the circuit board is fixed on the carriage by using a red adhesive tape or crepe adhesive paper, and after the board is placed in front of the drying section of the cleaning machine and dried, the board is dried and then kraft paper is arranged.
, the step S5 includes edge wrapping and edge cutting, the edge wrapping process is to select a blue adhesive tape or a red adhesive tape with a proper width to wrap the position which is not needed by the edge of the plate in the unit, and the edge cutting process is to cut off the copper skin in the copper leakage area at the position where the plate edge has copper leakage after edge wrapping.
, the step S6 further includes punching groups of holes at intervals of 8cm on the long side of the circuit board, wherein the holes cannot be punched into the cells and wrinkles cannot be generated in the cells.
, in step S7, the circuit board needs to be fixed flat.
, in step S8, except the nickel bath auxiliary bath, the other aeration positions are all closed, and the electric shock and gas cap of the liquid medicine bath are closed, so as to finish the gold precipitation according to the normal flow.
In step , in step S9, the carriage must be longer than the circuit board and sufficiently fixed.
, in the step S2, the film sticking speed of the dry film sticking process is 1.5m/min, the film sticking pressure is 0.5MPa, and the film sticking temperature is 120 ℃.
, in step S2, the whole process of pasting is performed under vacuum condition to improve the contact tightness between the film and the dry film and reduce the astigmatism phenomenon, the dry film after pasting is flat, without wrinkles and without bubbles, when pasting, the polyethylene protective film is firstly torn off from the dry film, and then the dry film is pasted on the copper foil under the condition of heating and pressurizing.
According to the invention, the edge treatment and the punching processing are firstly carried out on the circuit board, so that the ultra-long and ultra-thin polyimide single-sided board can be effectively fixed on the hanging basket, the stability of the hanging basket is not influenced by processing factors in the gold immersion process, the limit of the processing size of the hanging basket and the size of a groove is broken through, the gold immersion processing of the ultra-long and ultra-thin polyimide single-sided board can be realized by adopting common production equipment conditions, and the qualification rate of products can be ensured.
The invention can effectively solve the problem that the single panel made of the ultra-long and ultra-thin polyimide material can not be used for gold immersion, and can improve the qualification rate of the products. The method is simple to operate, and facilitates the field gold immersion operation of the ultrathin polyimide single panel.
Example 3
method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel, which is characterized by comprising the following steps:
s1, cutting and pretreatment: cutting the substrate into required processing size, cleaning the substrate, and roughening the substrate; s2, pasting a dry film; s3, making a graph;
s4, etching, namely etching surfaces of copper sheets and surfaces of copper sheets to form needed patterns to obtain a circuit board;
s5, plate edge treatment;
s6, punching: punching by using a punching machine, punching 5 groups of holes on each side of the short edge of the circuit board, wherein each group of holes is 2, and each group of holes are symmetrically distributed on the edge of the board;
s7, fixing: placing the pattern surface of the circuit board outwards on a cross rod at the upper end of the hanging basket, wherein the long edge direction of the circuit board is vertical to the width direction of the hanging basket, the part which exceeds the width direction of the hanging basket naturally hangs down from the outside of the hanging basket, and fixing the circuit board on the clamping strip and the hanging basket by using a binding belt through a plate edge hole which is punched before;
s8, gold immersion, namely covering layers of gold plating layers on a gold immersion area of the circuit board through a chemical reaction;
s9, cleaning: the short edge of the circuit board is fixed on the carriage by using a red adhesive tape or crepe adhesive paper, and after the board is placed in front of the drying section of the cleaning machine and dried, the board is dried and then kraft paper is arranged.
, the step S5 includes edge wrapping and edge cutting, the edge wrapping process is to select a blue adhesive tape or a red adhesive tape with a proper width to wrap the position which is not needed by the edge of the plate in the unit, and the edge cutting process is to cut off the copper skin in the copper leakage area at the position where the plate edge has copper leakage after edge wrapping.
, the step S6 further includes punching groups of holes at intervals of 10.5cm on the long side of the circuit board, wherein the holes cannot be punched into the cells and wrinkles cannot be generated in the cells.
, in step S7, the circuit board needs to be fixed flat.
, in step S8, except the nickel bath auxiliary bath, the other aeration positions are all closed, and the electric shock and gas cap of the liquid medicine bath are closed, so as to finish the gold precipitation according to the normal flow.
In step , in step S9, the carriage must be longer than the circuit board and sufficiently fixed.
, in the step S2, the film sticking speed of the dry film sticking process is 1.5m/min, the film sticking pressure is 0.5MPa, and the film sticking temperature is 120 ℃.
, in step S2, the whole process of pasting is performed under vacuum condition to improve the contact tightness between the film and the dry film and reduce the astigmatism phenomenon, the dry film after pasting is flat, without wrinkles and without bubbles, when pasting, the polyethylene protective film is firstly torn off from the dry film, and then the dry film is pasted on the copper foil under the condition of heating and pressurizing.
According to the invention, the edge treatment and the punching processing are firstly carried out on the circuit board, so that the ultra-long and ultra-thin polyimide single-sided board can be effectively fixed on the hanging basket, the stability of the hanging basket is not influenced by processing factors in the gold immersion process, the limit of the processing size of the hanging basket and the size of a groove is broken through, the gold immersion processing of the ultra-long and ultra-thin polyimide single-sided board can be realized by adopting common production equipment conditions, and the qualification rate of products can be ensured.
The invention can effectively solve the problem that the single panel made of the ultra-long and ultra-thin polyimide material can not be used for gold immersion, and can improve the qualification rate of the products. The method is simple to operate, and facilitates the field gold immersion operation of the ultrathin polyimide single panel.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, the present embodiment is therefore to be considered as illustrative and not restrictive in all respects at , the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Moreover, it should be understood that although the present description is described in terms of embodiments, not every embodiment contains independent technical solutions, and such description of the description is merely for clarity, and those skilled in the art should integrate the description as , and the technical solutions in the embodiments can also be combined appropriately to form other embodiments that those skilled in the art can understand.
Claims (8)
- The gold immersion manufacturing method of the ultra-long and ultra-thin polyimide single panel is characterized by comprising the following steps of:s1, cutting and pretreatment: cutting the substrate into required processing size, cleaning the substrate, and roughening the substrate; s2, pasting a dry film; s3, making a graph;s4, etching, namely etching surfaces of copper sheets and surfaces of copper sheets to form needed patterns to obtain a circuit board;s5, plate edge treatment;s6, punching: punching by using a punching machine, punching 3-5 groups of holes on each side of the short edge of the circuit board, wherein each group has 2 holes, and the holes in each group are symmetrically distributed on the edge of the board;s7, fixing: placing the pattern surface of the circuit board outwards on a cross rod at the upper end of the hanging basket, wherein the long edge direction of the circuit board is vertical to the width direction of the hanging basket, the part which exceeds the width direction of the hanging basket naturally hangs down from the outside of the hanging basket, and fixing the circuit board on the clamping strip and the hanging basket by using a binding belt through a plate edge hole which is punched before;s8, gold immersion, namely covering layers of gold plating layers on a gold immersion area of the circuit board through a chemical reaction;s9, cleaning: the short edge of the circuit board is fixed on the carriage by using a red adhesive tape or crepe adhesive paper, and after the board is placed in front of the drying section of the cleaning machine and dried, the board is dried and then kraft paper is arranged.
- 2. The method for manufacturing the ultra-long and ultra-thin polyimide single-panel immersion gold according to claim 1, wherein the step S5 includes edge wrapping and edge cutting, and the edge wrapping process is to select a blue tape or a red tape with a proper width to wrap the position which is not needed near the edge of the unit inner panel; the edge cutting process is to cut off copper sheets in a copper leakage area at the edge of the plate at the position where copper leaks from the edge of the plate after edge covering.
- 3. The method as claimed in claim 1, wherein the step S6 further comprises punching holes at intervals of 8-11cm on the long side of the circuit board, wherein the holes are not punched into the unit and are not creased.
- 4. The method for manufacturing the ultra-long and ultra-thin polyimide single-panel immersion gold according to claim 1, wherein in the step S7, the circuit board needs to be fixed and flat.
- 5. The method for preparing an ultra-long and ultra-thin polyimide single-panel immersion gold according to claim 1, wherein in step S8, except for the nickel bath auxiliary bath, all other ventilation positions need to be closed, and the electric shock and gas cap of the liquid medicine bath are closed at the same time, so as to finish immersion gold according to a normal flow.
- 6. The method as claimed in claim 1, wherein in step S9, the carriage is longer than the circuit board and is fixed sufficiently.
- 7. The method for manufacturing the gold immersion plate of the ultra-long and ultra-thin polyimide single panel according to claim 1, wherein in the step S2, the film pasting speed of the dry film pasting process is 1.5m/min, the film pasting pressure is 0.5MPa, and the film pasting temperature is 120 ℃.
- 8. The method of claim 1, wherein in step S2, the whole process of pasting the film is performed under vacuum to increase the contact tightness between the film and the dry film and reduce the phenomenon of light scattering, the pasted dry film is flat, without wrinkles and bubbles, and the film is pasted by tearing the protective polyethylene film from the dry film and then pasting the dry film on the copper foil under heat and pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910967361.6A CN110740584A (en) | 2019-10-12 | 2019-10-12 | method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910967361.6A CN110740584A (en) | 2019-10-12 | 2019-10-12 | method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101448365A (en) * | 2008-12-25 | 2009-06-03 | 上海徕木电子股份有限公司 | Method for manufacturing metal circuit board for plastic rack |
| US20090261060A1 (en) * | 2008-04-18 | 2009-10-22 | Nitto Denko Corporation | Production Method of Suspension Board with Circuit |
| CN201873754U (en) * | 2010-11-10 | 2011-06-22 | 深圳市富翔科技有限公司 | Plating through hole thin board basket |
| CN102107290A (en) * | 2010-12-23 | 2011-06-29 | 北大方正集团有限公司 | Drilling method and drilling equipment |
| CN203333790U (en) * | 2013-07-25 | 2013-12-11 | 西安金百泽电路科技有限公司 | Circuit board gold plating hanging basket |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
| CN204887719U (en) * | 2015-08-06 | 2015-12-16 | 广州杰赛科技股份有限公司 | Hanger |
| CN105208794A (en) * | 2015-09-02 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Lead-free HASL (hot air solder leveling) PCB flexible board manufacturing method |
| CN105764271A (en) * | 2016-04-28 | 2016-07-13 | 江苏博敏电子有限公司 | Manufacturing process for memory bank module circuit board |
| CN105813393A (en) * | 2016-03-21 | 2016-07-27 | 东莞美维电路有限公司 | Fabrication method of selective gold deposition plate |
-
2019
- 2019-10-12 CN CN201910967361.6A patent/CN110740584A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090261060A1 (en) * | 2008-04-18 | 2009-10-22 | Nitto Denko Corporation | Production Method of Suspension Board with Circuit |
| CN101448365A (en) * | 2008-12-25 | 2009-06-03 | 上海徕木电子股份有限公司 | Method for manufacturing metal circuit board for plastic rack |
| CN201873754U (en) * | 2010-11-10 | 2011-06-22 | 深圳市富翔科技有限公司 | Plating through hole thin board basket |
| CN102107290A (en) * | 2010-12-23 | 2011-06-29 | 北大方正集团有限公司 | Drilling method and drilling equipment |
| CN203333790U (en) * | 2013-07-25 | 2013-12-11 | 西安金百泽电路科技有限公司 | Circuit board gold plating hanging basket |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
| CN204887719U (en) * | 2015-08-06 | 2015-12-16 | 广州杰赛科技股份有限公司 | Hanger |
| CN105208794A (en) * | 2015-09-02 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Lead-free HASL (hot air solder leveling) PCB flexible board manufacturing method |
| CN105813393A (en) * | 2016-03-21 | 2016-07-27 | 东莞美维电路有限公司 | Fabrication method of selective gold deposition plate |
| CN105764271A (en) * | 2016-04-28 | 2016-07-13 | 江苏博敏电子有限公司 | Manufacturing process for memory bank module circuit board |
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