CN115334761B - Ultrathin single-sided FPC module product and manufacturing process thereof - Google Patents
Ultrathin single-sided FPC module product and manufacturing process thereof Download PDFInfo
- Publication number
- CN115334761B CN115334761B CN202211065455.2A CN202211065455A CN115334761B CN 115334761 B CN115334761 B CN 115334761B CN 202211065455 A CN202211065455 A CN 202211065455A CN 115334761 B CN115334761 B CN 115334761B
- Authority
- CN
- China
- Prior art keywords
- film
- laminating
- product
- glass fiber
- fiber cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an ultrathin single-sided FPC module product and a manufacturing process thereof, which are characterized in that a cover film lamination process and a reinforcement protection film lamination process are adjusted on the basis of the prior art, and the ultrathin single-sided FPC module product is specifically operated as follows: the laminating structure of the vacuum laminating machine used in the laminating process of the cover film and the laminating process of the reinforcing protective film is limited, the upper surface and the lower surface of the product are both provided with release films, the other surface of the release films is provided with glass fiber cloth, namely, the whole structure is provided with two pieces of glass fiber cloth, the glass fiber cloth has the characteristics of low pressure, light and thin auxiliary materials and no thermal rebound, and after the glass fiber cloth is contacted and laminated with the product, the technical problems that the conventional laminating process is in a high-temperature and high-pressure state, the product is lighter and thinner, and the product is easy to cause warping, curling, wrinkling and the like in the production process can be solved.
Description
Technical Field
The invention relates to the technical field of FPC (flexible printed circuit) module products, in particular to an ultrathin single-sided FPC module product and a manufacturing process thereof.
Background
At present, the requirements of consumer electronic products on FPC (flexible electronic circuit board) are lighter, thinner and thinner, and according to market demands, the products need to be made of copper (PI: 12.5/20 micrometers, copper: 12/18 micrometers) with 12 micrometers as a conventional single-sided ultrathin material on the market, and the product yield is low by using the conventional manufacturing process, has defects such as wrinkles, warpage and the like, and the overall yield is less than 50 percent, and cannot meet the requirements of customer standards.
Disclosure of Invention
In order to overcome the defects of the prior art, one of the purposes of the invention is to provide a manufacturing process of an ultrathin single-sided FPC module product, which can effectively improve the product yield and reduce the occurrence of defects such as wrinkling, warping and the like of the product by adjusting the lamination process conditions of a cover film and a reinforcing protective film on the basis of the prior art; the second purpose of the invention is to provide an ultrathin single-sided FPC module product, which is light and thin and is not easy to warp and wrinkle.
One of the purposes of the invention is realized by adopting the following technical scheme:
the manufacturing process of the ultrathin single-sided FPC module product sequentially comprises the following steps of: preparing a coil stock, pasting a bearing film by RTR, pasting a dry film by RTR, exposing by RTR, cutting a piece of material, developing, etching, removing the dry film, optically detecting (AOI), cleaning, pasting a covering film, laminating the covering film, baking, checking for the first time, punching, sandblasting, depositing gold, tearing the bearing film, cleaning a gold surface, pasting a reinforcing protective film, laminating the reinforcing protective film, baking, checking for the second time, punching the shape, testing, packaging and discharging, wherein the laminating covering film is laminated by adopting a vacuum laminating machine; wherein, the lamination structure of the vacuum lamination machine adopted for laminating the covering film comprises the following steps from top to bottom: vacuum air bag (self-carrying of equipment), glass fiber cloth, release film, product with attached cover film, release film, glass fiber cloth and baked iron plate (self-carrying of equipment); after the reinforcing protective film is pressed, a vacuum pressing machine is adopted for covering and pressing; wherein, the lamination structure of the vacuum lamination machine that pressfitting reinforcement protection film adopted from top to bottom is in proper order: vacuum air bag (self-contained), glass fiber cloth, release film, product with reinforced protective film, release film, glass fiber cloth and baked iron plate (self-contained). Wherein RTR (roll to roll) is a term commonly used in circuit boards and means roll-to-roll. The RTR process can effectively reduce the problem of crush injury of the product in the production process and greatly improve the production efficiency in a factory.
Further, parameters of the vacuum lamination machine for laminating the covering film are as follows: the pre-pressing time is 0-20 s, the molding time is 130-170 s, the temperature is 170-190 ℃, and the pressure is 17-21 kg/cm 2 。
Further, the covering film comprises a polyimide film and a halogen-free epoxy adhesive, and the thickness of the covering film is 22.5-32.5 mu m; preferably, the polyimide film manufacturer is brillouin chemical industry, japan. The halogen-free epoxy adhesive comprises epoxy resin as a main component, and is self-made by material manufacturers, wherein common manufacturers and models comprise, but are not limited to, SF305C-0515NT250AT of Guangdong life technology and technology Co., ltd, FHT0515S2 of Taihong technology and technology Co., ltd, and IF-FC1315NHF1 of Liangmao electronics Co., ltd.
Advancing oneThe parameters of the vacuum lamination machine for laminating the reinforcing protective film are as follows: the pre-pressing time is 0-20 s, the molding time is 80-120 s, the temperature is 170-190 ℃, and the pressure is 17-21 kg/cm 2 。
Further, the reinforcing protective film comprises a polyimide film and a halogen-free epoxy adhesive, and the thickness of the reinforcing protective film is 22.5-32.5 mu m. The reinforced protective film and the covering film are made of the same material, but have different areas, and can be adjusted according to the actual production process.
Further, the thickness of the bearing film is 40-60 mu m, and the thickness of the bearing product is basically consistent with that of a conventional double-sided board, thereby being beneficial to the production of the previous process.
Further, the release film is a low-silicon PET release film.
Further, the first inspection and the second inspection are both QC inspection.
Further, the tests include functional tests, shipment tests (FQC), and final tests (FQA).
The second purpose of the invention is realized by adopting the following technical scheme:
an ultrathin single-sided FPC module product is prepared by the manufacturing process of the ultrathin single-sided FPC module product.
Compared with the prior art, the invention has the beneficial effects that:
(1) Because the conventional lamination process is in a high-temperature and high-pressure state, and the product is lighter and thinner, the defects of warping, curling, wrinkling and the like are easily caused in the production process, and in order to solve the problems, the manufacturing process of the invention adjusts the lamination process of the cover film and the lamination process of the reinforcing protective film on the basis of the prior art, and specifically comprises the following steps: the laminating structure of the vacuum laminating machine used in the laminating process of the cover film and the laminating process of the reinforcing protective film is limited, the upper surface and the lower surface of the product are both provided with release films, the other surface of the release films is provided with glass fiber cloth, namely the whole structure is provided with two pieces of glass fiber cloth, and the glass fiber cloth has the characteristics of low pressure, light and thin auxiliary materials and no thermal rebound, and can solve the problems of warping, creasing and curling of the product caused by high temperature after being contacted and laminated with the product.
(2) The invention relates to a pressed ginseng in the manufacturing processThe number of the pressures is 17-21 kg/cm 2 The pressure of the machine is 90-130 kg/cm compared with that of a conventional rapid press 2 Compared with the prior art, the pressure is greatly reduced, and the pressure is matched with a lamination structure adopting a specific vacuum lamination machine, so that the problems of product warping, creasing and curling caused by high temperature and high pressure can be solved, and the yield of the product is improved.
(3) The ultra-thin single-sided FPC module product prepared by the manufacturing process has the total thickness of the base material, the cover film and the reinforcing protective film of 40-60 mu m, can be light and thin, and has the advantages of no crease and poor warping, and high overall yield.
(4) The thinner low-silicon PET release film (25 mu m) is used as an auxiliary material for lamination in the manufacturing process, is thinner than a TPX (thermoplastic polyurethane) resist film (120 mu m) used in conventional production, and is better matched with a lamination structure of a specific vacuum lamination machine, so that the plane shrinkage force of a product is reduced, and the proportion of warping, creasing and curling of the product is reduced.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic diagram of a lamination structure of a vacuum lamination machine lamination cover film;
FIG. 3 is a schematic diagram of a lamination structure of a reinforcement protective film laminated by a vacuum lamination machine;
in the figure: 1. a vacuum air bag; 2. glass fiber cloth; 3. a release film; 4. a product to which the cover film has been attached; 5. a product to which the reinforcing protective film has been attached; 6. and baking the iron plate.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
Example 1
As shown in fig. 1, a manufacturing process of an ultrathin single-sided FPC module product sequentially includes the following steps: roll stock, RTR tape carrier film (corresponding to RTR tape carrier film in fig. 1), RTR tape dry film, RTR exposure, cut-to-piece stock, development, etching, dry film removal, optical inspection (AOI), cleaning (corresponding to chemical cleaning in fig. 1), laminating cover film (corresponding to cover film in fig. 1), baking, QC inspection, punching, sandblasting, gold deposition, tear carrier film (corresponding to tear carrier film in fig. 1), gold surface cleaning, laminating reinforcement protective film (corresponding to PI reinforcement in fig. 1), baking, QC inspection, die-cut form, functional testing, shipment inspection (FQC), final inspection (FQA), packaging, and shipment; wherein RTR (roll to roll) is a term commonly used in circuit boards and means roll-to-roll. The RTR process can effectively reduce the problem of crush injury of the product in the production process and greatly improve the production efficiency in a factory. Wherein, the base material is copper foil base material, which is composed of 12.5 μm polyimide film and 18mm copper foil.
Wherein the lamination covering film is laminated by a vacuum lamination machine; as shown in fig. 2, the lamination stack structure of the vacuum lamination machine used for laminating the cover film is as follows from top to bottom: vacuum air bag 1 (self-contained), glass fiber cloth 2, release film 3, product 4 with attached cover film (cover film upwards), release film 3, glass fiber cloth 2 and baked iron plate 6 (self-contained); the parameters of the vacuum lamination machine for laminating the covering film are as follows: pre-pressing time 10s, molding time 150s, temperature 180 ℃ and pressure 19kg/cm 2 。
After the reinforcing protective film is pressed, a vacuum pressing machine is adopted for covering and pressing; as shown in fig. 3, the lamination structure of the vacuum lamination machine used for laminating the reinforcing protective film is as follows from top to bottom: vacuum air bag 1 (self-contained equipment), glass fiber cloth 2, release film 3, product 5 (reinforcing protective film upwards) with reinforcing protective film attached, release film 3, glass fiber cloth 2 and baking iron plate 6 (self-contained equipment). The parameters of the vacuum lamination machine for laminating the reinforced protective film are as follows: pre-pressing time 10s, molding time 100s, temperature 180 ℃ and pressure 19kg/cm 2 。
Specifically, the covering film comprises a polyimide film and a halogen-free epoxy adhesive, and the thickness of the covering film is 30 mu m; preferably, the polyimide film manufacturer is brillouin chemical industry, japan. The halogen-free epoxy adhesive comprises the main component of epoxy resin, SF305C-0515NT250AT purchased from Guangdong raw and beneficial technologies Co., ltd; the release film 3 is made of a low-silicon PET release film. The reinforcing protective film comprises a polyimide film and a halogen-free epoxy adhesive, the thickness of the reinforcing protective film is 30 mu m, and the reinforcing protective film and the covering film are made of the same material. The thickness of the bearing film is 50 mu m, and the thickness of the bearing film is basically consistent with that of a conventional double-sided board, so that the bearing film is beneficial to the production of the front-stage working procedure.
Example 2
As shown in fig. 1, a manufacturing process of an ultrathin single-sided FPC module product sequentially includes the following steps: roll stock, RTR tape carrier film (corresponding to RTR tape carrier film in fig. 1), RTR tape dry film, RTR exposure, cut-to-piece stock, development, etching, dry film removal, optical inspection (AOI), cleaning (corresponding to chemical cleaning in fig. 1), laminating cover film (corresponding to cover film in fig. 1), baking, QC inspection, punching, sandblasting, gold deposition, tear carrier film (corresponding to tear carrier film in fig. 1), gold surface cleaning, laminating reinforcement protective film (corresponding to PI reinforcement in fig. 1), baking, QC inspection, die-cut form, functional testing, shipment inspection (FQC), final inspection (FQA), packaging, and shipment; wherein RTR (roll to roll) is a term commonly used in circuit boards and means roll-to-roll. The RTR process can effectively reduce the problem of crush injury of the product in the production process and greatly improve the production efficiency in a factory. Wherein, the base material is copper foil base material, which is composed of 12.5 μm polyimide film and 18mm copper foil.
Wherein the lamination covering film is laminated by a vacuum lamination machine; as shown in fig. 2, the lamination stack structure of the vacuum lamination machine used for laminating the cover film is as follows from top to bottom: vacuum air bag 1 (self-contained), glass fiber cloth 2, release film 3, product 4 with attached cover film (cover film upwards), release film 3, glass fiber cloth 2 and baked iron plate 6 (self-contained); the parameters of the vacuum lamination machine for laminating the covering film are as follows: prepressing time 0s, molding time 170s, temperature 170 ℃ and pressure 17kg/cm 2 。
After the reinforcing protective film is pressed, a vacuum pressing machine is adopted for covering and pressing; as shown in fig. 3, the lamination structure of the vacuum lamination machine used for laminating the reinforcing protective film is as follows from top to bottom: true senseAir bag 1 (self-contained equipment), glass fiber cloth 2, release film 3, product 5 (with upward reinforcing protective film) with reinforcing protective film, release film 3, glass fiber cloth 2 and baked iron plate 6 (self-contained equipment). The parameters of the vacuum lamination machine for laminating the reinforced protective film are as follows: prepressing time 0s, molding time 120s, temperature 170 ℃ and pressure 17kg/cm 2 。
Specifically, the covering film comprises a polyimide film and a halogen-free epoxy adhesive, and the thickness of the covering film is 22.5 mu m; preferably, the polyimide film manufacturer is brillouin chemical industry, japan. The main component of the halogen-free epoxy adhesive is epoxy resin, which is purchased from IF-FC1315NHF1 of the company of Liangmao electronics; the release film 3 is made of a low-silicon PET release film. The reinforcing protective film comprises a polyimide film and a halogen-free epoxy adhesive, the thickness of the reinforcing protective film is 22.5 mu m, and the reinforcing protective film and the covering film are made of the same material. The thickness of the bearing film is 40 mu m, and the thickness of the bearing film is basically consistent with that of a conventional double-sided board, so that the bearing film is beneficial to the production of the front-stage working procedure.
Example 3
As shown in fig. 1, a manufacturing process of an ultrathin single-sided FPC module product sequentially includes the following steps: roll stock, RTR tape carrier film (corresponding to RTR tape carrier film in fig. 1), RTR tape dry film, RTR exposure, cut-to-piece stock, development, etching, dry film removal, optical inspection (AOI), cleaning (corresponding to chemical cleaning in fig. 1), laminating cover film (corresponding to cover film in fig. 1), baking, QC inspection, punching, sandblasting, gold deposition, tear carrier film (corresponding to tear carrier film in fig. 1), gold surface cleaning, laminating reinforcement protective film (corresponding to PI reinforcement in fig. 1), baking, QC inspection, die-cut form, functional testing, shipment inspection (FQC), final inspection (FQA), packaging, and shipment; wherein RTR (roll to roll) is a term commonly used in circuit boards and means roll-to-roll. The RTR process can effectively reduce the problem of crush injury of the product in the production process and greatly improve the production efficiency in a factory. Wherein, the base material is copper foil base material, which is composed of 12.5 μm polyimide film and 18mm copper foil.
Wherein the lamination covering film adoptsPressing by a vacuum pressing machine; as shown in fig. 2, the lamination stack structure of the vacuum lamination machine for laminating the cover film is as follows from top to bottom: vacuum air bag 1 (self-contained), glass fiber cloth 2, release film 3, product 4 with attached cover film (cover film upwards), release film 3, glass fiber cloth 2 and baked iron plate 6 (self-contained); the parameters of the vacuum lamination machine for laminating the covering film are as follows: pre-pressing time 20s, molding time 130s, temperature 190 ℃ and pressure 21kg/cm 2 。
After the reinforcing protective film is pressed, a vacuum pressing machine is adopted for covering and pressing; as shown in fig. 3, the lamination structure of the vacuum lamination machine used for laminating the reinforcing protective film is as follows from top to bottom: vacuum air bag 1 (self-contained equipment), glass fiber cloth 2, release film 3, product 5 (reinforcing protective film upwards) with reinforcing protective film attached, release film 3, glass fiber cloth 2 and baking iron plate 6 (self-contained equipment). The parameters of the vacuum lamination machine for laminating the reinforced protective film are as follows: pre-pressing for 20s, molding for 80s, temperature 190 ℃ and pressure 21kg/cm 2 。
Specifically, the covering film comprises a polyimide film and a halogen-free epoxy adhesive, and the thickness of the covering film is 32.5 mu m; preferably, the polyimide film manufacturer is brillouin chemical industry, japan. The main component of the halogen-free epoxy adhesive is epoxy resin, which is purchased from FHT0515S2 of Taihong technology Co., ltd; the release film 3 is made of a low-silicon PET release film. The reinforcing protective film comprises a polyimide film and a halogen-free epoxy adhesive, the thickness of the reinforcing protective film is 32.5 mu m, and the reinforcing protective film and the covering film are made of the same material. The thickness of the bearing film is 60 mu m, and the thickness of the bearing film is basically consistent with that of a conventional double-sided board, so that the bearing film is beneficial to the production of the front-stage working procedure.
Comparative example 1
Comparative example 1 differs from example 1 in that: the laminated cover film of comparative example 1 was laminated using a rapid lamination machine; the lamination structure of the conventional rapid lamination machine sequentially comprises the following components from top to bottom: an upper hot plate (self-contained equipment), a silicon aluminum foil, a release film 3, a product (with a cover film downwards), the release film 3, a green silica gel pad, glass fiber cloth 2, a baked iron plate 6 (self-contained equipment) and a lower hot plate (self-contained equipment); the parameters of the rapid lamination machine for laminating the covering film are as follows: prepressingFor 10s, molding time 100s, temperature 180 ℃ and pressure 110kg/cm 2 。
Comparative example 2
Comparative example 2 is different from example 1 in that: the lamination reinforcing protective film of comparative example 2 was laminated using a vacuum lamination machine; the lamination structure of the vacuum lamination machine is sequentially as follows from top to bottom: vacuum air bag 1 (equipment is self-contained), glass fiber cloth 2, green silica gel pad, release film 3, product (reinforcing protective film upwards), release film 3 and baking iron plate 6 (equipment is self-contained).
Comparative example 3
Comparative example 3 is different from example 1 in that: the laminated cover film of comparative example 3 was laminated using a rapid lamination machine; the lamination structure of the conventional rapid lamination machine sequentially comprises the following components from top to bottom: an upper hot plate (self-contained equipment), a silicon aluminum foil, a release film 3, a product (with a cover film downwards), the release film 3, a green silica gel pad, glass fiber cloth 2, a baked iron plate 6 (self-contained equipment) and a lower hot plate (self-contained equipment); the parameters of the rapid lamination machine for laminating the covering film are as follows: pre-pressing time 10s, molding time 100s, temperature 180 ℃ and pressure 110kg/cm 2 . Laminating the reinforcing protective film by a vacuum lamination machine; the lamination structure of the vacuum lamination machine is sequentially as follows from top to bottom: vacuum air bag 1 (equipment is self-contained), glass fiber cloth 2, green silica gel pad, release film 3, product (reinforcing protective film upwards), release film 3 and baking iron plate 6 (equipment is self-contained).
Performance testing
Quality inspection, including appearance inspection, connectivity inspection and solderability inspection, is performed on the flexible circuit boards prepared by the processes of examples 1 to 3 after improvement and comparative examples 1 to 3 before improvement; wherein, the appearance inspection standard is: and observing whether the surface is smooth and even, and whether the surface is provided with concave-convex points or scratches. The phenomenon that whether holes are drilled in a leaking way, wrong holes are drilled or copper foils around the holes are broken is caused; whether the outer edge of the circuit board has poor warping and wrinkling or not; connectivity verification: the universal meter is used for checking whether the PCB circuit board is communicated or not. Weldability test criteria: the wettability of the solder to the pattern of the circuit board was examined. The yield of the product and whether the outer edge of the circuit board is tilted or not and the crease failure rate are checked are shown in table 1.
Table 1 yield and occurrence of cockling and creasing failure of each group of products
As is clear from Table 1, the overall yields of the products of the processes of examples 1 to 3 were 83% or more, and the warpage and wrinkle defects were much lower than those of comparative examples 1 to 3, as compared with comparative examples 1 to 3. The cover films are laminated by adopting a conventional rapid lamination machine in comparative examples 1 and 3, and the cover films have the characteristics of high pressure and good filling effect, and are easy to warp and wrinkle. The comparative example 2 and the comparative example 3 are pressed by the conventional vacuum pressing to reinforce the protective film, and the green silica gel pad is selected in the laminated structure and is arranged below the vacuum air bag 1 and the glass fiber cloth 2, and the protective film is characterized by good filling effect, but is easy to cause warping and wrinkling. In embodiments 1 to 3, the lamination structure of the vacuum lamination machine in the lamination covering film and the lamination reinforcing protective film procedure is adjusted, so that the lamination structure of the vacuum lamination machine used in the covering film lamination procedure and the reinforcement protective film lamination procedure is limited, the upper surface and the lower surface of the product are both provided with release films 3, the other surface of the release films 3 is provided with glass fiber cloth 2, namely, the whole structure is provided with two glass fiber cloths 2 altogether, the glass fiber cloth 2 has the characteristics of low pressure, light and thin auxiliary materials and no thermal rebound, and after the glass fiber cloth contacts and is laminated with the product, the overall yield of the product can be effectively improved by adjusting parameters, and the product cannot have crease and warp defects.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (7)
1. The manufacturing process of the ultrathin single-sided FPC module product sequentially comprises the following steps of: roll-up material and RTR (resin transfer printing) adhesive bearing filmThe method comprises the steps of dry film pasting, RTR exposure, sheet cutting, developing, etching, dry film removing, optical detection, cleaning, laminating a covering film, laminating the covering film, baking, first checking, punching, sand blasting, gold depositing, bearing film tearing, gold surface cleaning, reinforcing protecting film laminating, baking, second checking, shape punching, testing, packaging and shipment, and is characterized in that the laminating covering film is laminated by a vacuum laminating machine; wherein, the lamination structure of the vacuum lamination machine adopted for laminating the covering film comprises the following steps from top to bottom: vacuum air bag, glass fiber cloth, release film, product with attached cover film, release film, glass fiber cloth and baked iron plate; the lamination reinforcing protective film is covered and laminated by a vacuum lamination machine; wherein, the lamination structure of the vacuum lamination machine that pressfitting reinforcement protection film adopted from top to bottom is in proper order: vacuum air bag, glass fiber cloth, release film, product with reinforced protective film, release film, glass fiber cloth and baked iron plate; wherein, the parameters of vacuum pressfitting machine pressfitting tectorial membrane are: the pre-pressing time is 0-20 s, the molding time is 130-170 s, the temperature is 170-190 ℃, and the pressure is 17-21 kg/cm 2 The method comprises the steps of carrying out a first treatment on the surface of the The parameters of the vacuum lamination machine for laminating the reinforcing protective film are as follows: the pre-pressing time is 0-20 s, the molding time is 80-120 s, the temperature is 170-190 ℃, and the pressure is 17-21 kg/cm 2 The method comprises the steps of carrying out a first treatment on the surface of the The release film is a low-silicon PET release film with the thickness of 25 mu m.
2. The process for manufacturing the ultrathin single-sided FPC module product according to claim 1, wherein the cover film comprises a polyimide film and a halogen-free epoxy adhesive, and has a thickness of 20-40 μm.
3. The process for manufacturing the ultrathin single-sided FPC module product according to claim 1, wherein the reinforcing protective film comprises a polyimide film and a halogen-free epoxy adhesive, and the thickness of the reinforcing protective film is 20-40 μm.
4. The process for manufacturing an ultrathin single-sided FPC module product according to claim 1, wherein the thickness of the carrier film is 40-60 μm.
5. The process for manufacturing an ultrathin single-sided FPC module according to claim 1, wherein the first inspection and the second inspection are QC inspection.
6. The process for manufacturing an ultra-thin single sided FPC module product of claim 1, wherein the testing includes shipment inspection and final inspection.
7. An ultrathin single-sided FPC module product, characterized in that it is prepared by the manufacturing process of the ultrathin single-sided FPC module product according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211065455.2A CN115334761B (en) | 2022-09-01 | 2022-09-01 | Ultrathin single-sided FPC module product and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211065455.2A CN115334761B (en) | 2022-09-01 | 2022-09-01 | Ultrathin single-sided FPC module product and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115334761A CN115334761A (en) | 2022-11-11 |
| CN115334761B true CN115334761B (en) | 2023-09-01 |
Family
ID=83929480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211065455.2A Active CN115334761B (en) | 2022-09-01 | 2022-09-01 | Ultrathin single-sided FPC module product and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115334761B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115955783B (en) * | 2022-12-30 | 2024-03-08 | 福莱盈电子股份有限公司 | Method for improving size stability of ACF golden finger of LCM soft and hard plate |
| CN117279225B (en) * | 2023-11-22 | 2024-01-26 | 深圳市鑫达辉软性电路科技有限公司 | FPC suitable for intelligent wearing and quick pressing process thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206551619U (en) * | 2016-12-28 | 2017-10-13 | 苏州培华电子材料有限公司 | A kind of height is residual to connect low silicon migration mould release membrance |
| WO2018006527A1 (en) * | 2016-07-05 | 2018-01-11 | 惠州市金百泽电路科技有限公司 | Method for manufacturing a cover film-protected, gold-electroplated and component-inbuilt pcb board |
| CN207869508U (en) * | 2017-12-06 | 2018-09-14 | 广州兴森快捷电路科技有限公司 | FPC quick pressing structures |
| CN110557893A (en) * | 2019-10-12 | 2019-12-10 | 珠海景旺柔性电路有限公司 | processing method for pressing thick copper thin covering film |
| CN211019452U (en) * | 2019-08-27 | 2020-07-14 | 东莞康源电子有限公司 | Vacuum reinforcing pressing machine |
| CN216217823U (en) * | 2021-08-24 | 2022-04-05 | 吉安新宇腾跃电子有限公司 | Press laminated structure for improving glue overflow of cover film |
| CN114786352A (en) * | 2022-03-16 | 2022-07-22 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
-
2022
- 2022-09-01 CN CN202211065455.2A patent/CN115334761B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018006527A1 (en) * | 2016-07-05 | 2018-01-11 | 惠州市金百泽电路科技有限公司 | Method for manufacturing a cover film-protected, gold-electroplated and component-inbuilt pcb board |
| CN206551619U (en) * | 2016-12-28 | 2017-10-13 | 苏州培华电子材料有限公司 | A kind of height is residual to connect low silicon migration mould release membrance |
| CN207869508U (en) * | 2017-12-06 | 2018-09-14 | 广州兴森快捷电路科技有限公司 | FPC quick pressing structures |
| CN211019452U (en) * | 2019-08-27 | 2020-07-14 | 东莞康源电子有限公司 | Vacuum reinforcing pressing machine |
| CN110557893A (en) * | 2019-10-12 | 2019-12-10 | 珠海景旺柔性电路有限公司 | processing method for pressing thick copper thin covering film |
| CN216217823U (en) * | 2021-08-24 | 2022-04-05 | 吉安新宇腾跃电子有限公司 | Press laminated structure for improving glue overflow of cover film |
| CN114786352A (en) * | 2022-03-16 | 2022-07-22 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115334761A (en) | 2022-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115334761B (en) | Ultrathin single-sided FPC module product and manufacturing process thereof | |
| CN108323037B (en) | PCB processing technology of double-sided step position electro-gold | |
| CN104703405B (en) | Rigid-flex combined board and its manufacture method | |
| KR100724046B1 (en) | Method and device for manufacturing laminated plate | |
| CN109195344B (en) | Method for enhancing dry film adhesion of fine circuit printed board | |
| CN112770549B (en) | Covered aluminum foil and method for improving lamination glue overflow of embedded copper block PCB | |
| CN112074087A (en) | Method for attaching surface covering film of wireless charging coil plate | |
| CN113099619A (en) | Circuit board multilayer pressing positioning heat-buffering cushion, manufacturing method and manufacturing equipment thereof | |
| CN113286454A (en) | Method for improving Air-gap structure bonding of FPC (Flexible printed Circuit) board | |
| CN110831350A (en) | Method for manufacturing bottomless copper circuit board | |
| CN109532145B (en) | Non-adhesive double-sided flexible copper-clad plate and preparation method thereof | |
| CN112040657A (en) | Manufacturing method of special-shaped step plate | |
| CN113260174A (en) | Pattern electroplating method of FPC board | |
| US20070113972A1 (en) | Method of manufacturing flexible laminate substrate | |
| CN114786352B (en) | Manufacturing method of anti-warping circuit board | |
| KR101425580B1 (en) | Tacking method of using carrier film forming coverlay film | |
| CN111601462B (en) | High-temperature-resistant and high-dielectric-property copper-clad plate and preparation method thereof and circuit board | |
| CN111970858B (en) | High-offset rigid-flex PCB and manufacturing method thereof | |
| JP2002052614A (en) | Method for manufacturing laminated sheet | |
| CN112235937A (en) | Press-fit connection structure between circuit boards and press-fit connection method thereof | |
| CN217551507U (en) | Laser forming device for composite material plate with double-sided film covering | |
| CN113411961B (en) | Soft-hard combined circuit board and preparation method thereof | |
| KR20200133055A (en) | Flexible copper clad laminate and manufacturing method thereof | |
| JP3776259B2 (en) | Method for producing coverlay film with excellent dimensional stability | |
| CN216123017U (en) | Flexible circuit board structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |