CN216217823U

CN216217823U - Press laminated structure for improving glue overflow of cover film

Info

Publication number: CN216217823U
Application number: CN202122018582.4U
Authority: CN
Inventors: 肖扬林
Original assignee: Ji'an Xinyu Tengyue Electronics Co ltd
Current assignee: Ji'an Xinyu Tengyue Electronics Co ltd
Priority date: 2021-08-24
Filing date: 2021-08-24
Publication date: 2022-04-05
Anticipated expiration: 2031-08-24

Abstract

The utility model belongs to the technical field of FPC cover film pressing, in particular to a press lamination structure for improving cover film glue overflow, which comprises an FPC, wherein the upper end of the FPC is provided with a first glass fiber cloth, the upper end of the first glass fiber cloth is provided with a silicon aluminum foil, the upper end of the silicon aluminum foil is provided with a first steel plate, the lower end of the FPC is provided with green silica gel, the lower end of the green silica gel is provided with a second glass fiber cloth, the lower end of the second glass fiber cloth is provided with a silicon steel plate, the outer end of the first steel plate and the outer end of the silicon steel plate are provided with a support plate, a heat-conducting thin plate is arranged inside the support plate, the first steel plate is fixed on the support plate, the front end and the rear end of the heat-conducting thin plate are exposed outside, the thickness of the heat-conducting thin plate is 0.05 mm, the surface of the support plate is provided with a metal foil, the problem that the surface layer of a flexible circuit board is damaged due to collision of external objects is solved, the current laminated cover film glue overflow amount is more than or equal to more than 0.13mm, the weldable area of the bonding pad is reduced, and the problem of processing capacity is reduced.

Description

Press laminated structure for improving glue overflow of cover film

Technical Field

The utility model belongs to the technical field of FPC (flexible printed circuit) cover film pressing, and particularly relates to a press lamination structure for improving cover film glue overflow.

Background

The FPC coverlay is named as CVL, and the components of the coverlay comprise a curing agent, butanone, a diluent, rubber and the like, and the dosage of the formula is different according to different situations. The covering film plays a role in protecting the circuit, and the dustproof, antifouling and antistatic protection circuit is not exposed in the air, so that the oxidation corrosion of the copper foil is avoided; for subsequent surface treatment, areas that do not require gold plating are covered with CVL and in subsequent SMT, solder resist is applied. At present, different auxiliary materials of the rapid press have different laminated structures, and the glue overflow amount generated by a covering film is also different. The glue overflow amount of the currently adopted laminated cover film is more than or equal to 0.13mm, so that the weldable area of the bonding pad is reduced, and the processing capacity is reduced; in view of the problems of exposure during the pressing and using process of the present FPC cover film, it is necessary to improve and optimize the structure of the pressing of the FPC cover film.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems in the prior art, the utility model provides a press lamination structure for improving the glue overflow of a cover film, which has the characteristics of reducing the glue overflow amount and increasing the weldable area of a bonding pad.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an improve and cover press laminated structure that membrane overflowed gluey, includes the FPC board, the upper end of FPC board is equipped with the fine cloth of first glass, the upper end of the fine cloth of first glass is equipped with the silicon aluminium foil, the upper end of silicon aluminium foil is equipped with first steel sheet, the lower extreme of FPC board is equipped with green silica gel, green silica gel's lower extreme is equipped with the fine cloth of second glass, the lower extreme of the fine cloth of second glass is equipped with the silicon steel plate, the outer end of first steel sheet and the outer end of silicon steel plate are equipped with the support plate, the inside of support plate is equipped with the heat conduction thin plate.

As the preferable technical scheme of the press lamination structure for improving the glue overflow of the cover film, the first steel plate is fixed on the carrier plate.

According to the preferable technical scheme of the press lamination structure for improving the glue overflow of the cover film, the front end and the rear end of the heat-conducting thin plate are exposed outside.

As the preferable technical scheme of the press lamination structure for improving the glue overflow of the cover film, the thickness of the heat-conducting thin plate is 0.05 mm.

As the preferable technical scheme of the press lamination structure for improving the glue overflow of the cover film, the surface of the carrier plate is provided with the metal foil.

Compared with the prior art, the utility model has the beneficial effects that: by adding the first glass fiber cloth, the product can be prevented from shifting due to strong plasticity of the glass fiber cloth, the glue blocking layer is formed to prevent the product from sliding, and the glue blocking layer is arranged to prevent the product from overflowing; through increasing first steel sheet, guarantee the suppression roughness, prevent that the product atress inequality from leading to the part overflow to glue badly, be of value to reducing and overflow gluey volume, increase the weldable area of pad, solved and adopted at present that the laminated cover film overflows gluey volume and is being greater than or equal to more than 0.13mm, reduced the weldable area of pad, reduced the problem of processing procedure ability.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic structural view of a cross section of a laminated structure of a press for improving the glue overflow of a cover film according to the present invention;

FIG. 2 is a schematic structural view of a plane of a laminated structure of a press for improving the glue overflow of a cover film according to the present invention;

FIG. 3 is a schematic structural diagram of the carrier according to the present invention;

in the figure: 1. FPC; 2. a first fiberglass cloth; 3. a silicon aluminum foil; 4. a first steel plate; 5. green silica gel; 6. a second glass fiber cloth; 7. a silicon steel plate; 8. a carrier plate; 9. a heat conductive sheet; 10. a metal foil.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides an improve press laminated structure that covers membrane and overflow and glue, including FPC board 1, the upper end of FPC board 1 is equipped with first glass fine cloth 2, the upper end of first glass fine cloth 2 is equipped with silicon aluminium foil 3, the upper end of silicon aluminium foil 3 is equipped with first steel sheet 4, the lower extreme of FPC board 1 is equipped with green silica gel 5, the lower extreme of green silica gel 5 is equipped with second glass fine cloth 6, the lower extreme of second glass fine cloth 6 is equipped with silicon steel plate 7, the outer end of first steel sheet 4 and the outer end of silicon steel plate 7 are equipped with support plate 8, the inside of support plate 8 is equipped with heat conduction sheet metal 9, in this embodiment, through increasing the first glass fine cloth 2 of one deck in the top layer of FPC board 1, because of glass fine cloth plasticity is strong, can prevent that the product from shifting, form and hinder the glue layer and prevent that the product from sliding, and there is hindering the glue layer, prevent that the product from overflowing.

Specifically, first steel sheet 4 is fixed on support plate 8, and through increasing first steel sheet 4 in this embodiment, guarantee the suppression roughness, prevent that the uneven atress of product from leading to the excessive glue of part bad.

Specifically, the front end and the rear end of the heat conducting thin plate 9 are exposed outside, and the exposed arrangement in this embodiment is to enable heat transferred through the heat conducting thin plate 9 to be rapidly dissipated through the front end and the rear end.

Specifically, the thickness of the heat conducting thin plate 9 is 0.05 mm, and the heat conducting thin plate 9 with the thickness can achieve good heat conducting performance and avoid material waste.

Specifically, the surface of carrier plate 8 is equipped with metal foil 10, and flexible circuit board is when the removal of taking in this embodiment, can cause the flexible circuit board top layer impaired because external article and flexible circuit board collide usually, in order to avoid this kind of condition, sets up metal foil 10 on the top layer of carrier plate 8, with external environment direct contact for external article and flexible circuit board are isolated, thereby has avoided bumping external article and has left the mar on flexible circuit board.

The glue overflow amount in the pressing process of the covering film is reduced by changing the laminated structure of the press, the glue overflow amount of the covering film is obviously reduced by improving the data comparison before and after the improvement, the windowing of the covering film can be reduced, the weldable area of the bonding pad is ensured, and the processing capacity is improved (see data in the following figure).

The working principle and the using process of the utility model are as follows: by adding the first glass fiber cloth 2, the product can be prevented from shifting due to strong plasticity of the glass fiber cloth, the glue blocking layer is formed to prevent the product from sliding, and the glue blocking layer is arranged to prevent the product from overflowing; through increasing first steel sheet 4, guarantee the suppression roughness, it is bad to prevent that the product atress inequality from leading to the excessive glue of part, the front and back end of inside heat conduction sheet metal 9 exposes externally, can make the heat through the heat conduction sheet metal 9 transmission can be through the front and back end effluvium fast, through be equipped with foil 10 on the surface at support plate 8, make flexible circuit board when the removal of taking, can cause the flexible circuit board top layer impaired because external article and flexible circuit board collision usually, in order to avoid this kind of condition, set up foil 10 on the top layer of support plate 8, with external environment direct contact, make external article isolated with flexible circuit board, thereby avoided bumping external article and left the mar on flexible circuit board.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an improve press laminated structure that covers membrane excessive glue, includes FPC board (1), its characterized in that: the upper end of FPC board (1) is equipped with the fine cloth of first glass (2), the upper end of the fine cloth of first glass (2) is equipped with silicon aluminium foil (3), the upper end of silicon aluminium foil (3) is equipped with first steel sheet (4), the lower extreme of FPC board (1) is equipped with green silica gel (5), the lower extreme of green silica gel (5) is equipped with the fine cloth of second glass (6), the lower extreme of the fine cloth of second glass (6) is equipped with silicon steel plate (7), the outer end of first steel sheet (4) and the outer end of silicon steel plate (7) are equipped with support plate (8), the inside of support plate (8) is equipped with heat conduction thin plate (9).

2. The press lamination structure for improving the cover film glue overflow of claim 1, wherein: the first steel plate (4) is fixed on the carrier plate (8).

3. The press lamination structure for improving the cover film glue overflow of claim 1, wherein: the front end and the rear end of the heat-conducting thin plate (9) are exposed outside.

4. The press lamination structure for improving the cover film glue overflow of claim 1, wherein: the thickness of the heat-conducting thin plate (9) is 0.05 mm.

5. The press lamination structure for improving the cover film glue overflow of claim 1, wherein: the surface of the carrier plate (8) is provided with a metal foil (10).