CN217608035U - Bending-resistant flexible substrate structure - Google Patents
Bending-resistant flexible substrate structure Download PDFInfo
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- CN217608035U CN217608035U CN202123323263.0U CN202123323263U CN217608035U CN 217608035 U CN217608035 U CN 217608035U CN 202123323263 U CN202123323263 U CN 202123323263U CN 217608035 U CN217608035 U CN 217608035U
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Abstract
The utility model belongs to the technical field of the metal matrix technique and specifically relates to an anti flexible substrate structure that bends, including insulating film PI layer, the both sides on insulating film PI layer all are provided with heat-conducting glue layer, and are two sets of one side that insulating film PI layer was kept away from to heat-conducting glue layer is provided with copper foil layer and aluminium foil layer respectively, heat-conducting glue layer's inboard is embedded to have flexible shielding layer, heat-conducting glue layer's both sides all are provided with the bellying, the utility model discloses in set up flexible shielding silk screen through the inboard at heat-conducting glue layer and not only can strengthen heat-conducting glue layer intensity, and guaranteed heat-conducting glue layer's resistant crookedness, cooperate insulating film PI layer to support as the middle part, great reinforcing this base plate's anti bending ability, be used for providing insulating film PI layer and heat-conducting glue layer through the bellying that sets up simultaneously and produce the space of deformation, the design is comparatively reasonable, and simple structure, great reinforcing this base plate's practicality.
Description
Technical Field
The utility model relates to a metal base scatters technical field, especially relates to an anti crooked flexible substrate structure.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a common single-sided board is composed of three layers, namely a circuit layer (copper foil), an insulating layer and a metal base layer. The high-end use is also designed to be a double-sided board, and the structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer; very few applications are multilayer boards, which can be formed by laminating a common multilayer board with an insulating layer and an aluminum base.
The existing aluminum base material has simple structure and is not resistant to bending, so the practicability is not strong and is worth improving.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an in order to solve to exist among the prior art above-mentioned shortcoming, and a bending resistance flexible substrate structure that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an anti crooked flexible substrate structure, includes insulating film PI layer, the both sides on insulating film PI layer all are provided with heat-conducting adhesive layer, and are two sets of one side that insulating film PI layer was kept away from to heat-conducting adhesive layer is provided with copper foil layer and aluminium foil layer respectively, heat-conducting adhesive layer's inboard is embedded to have flexible shielding layer, heat-conducting adhesive layer's both sides all are provided with the bellying.
Preferably, the flexible shielding layer is a braided flexible shielding wire mesh.
Preferably, the height of the protrusions is eight to ten micrometers.
Preferably, an anti-oxidation layer is arranged on one side, away from the heat-conducting adhesive layer, of the aluminum foil layer.
Preferably, the antioxidation layer is an antioxidation material film layer sprayed on the aluminum foil layer.
The utility model provides an anti crooked flexible substrate structure, beneficial effect lies in: the utility model discloses in set up flexible shielding silk screen through the inboard at heat-conducting adhesive layer and not only can strengthen heat-conducting adhesive layer intensity, and guaranteed heat-conducting adhesive layer's resistant crookedness, cooperation insulating film PI layer supports as the middle part, great reinforcing this base plate's anti bending ability, the bellying through setting up is used for providing insulating film PI layer and heat-conducting adhesive layer simultaneously and produces the space of deformation, the design is comparatively reasonable, and simple structure, great reinforcing the practicality of this base plate.
Drawings
Fig. 1 is a schematic structural view of a bending-resistant flexible substrate structure according to the present invention.
In the figure: 1. an insulating film PI layer; 2. a heat-conducting adhesive layer; 3. a copper foil layer; 4. an aluminum foil layer; 5. a flexible shielding layer; 6. a boss portion; 7. and (4) an anti-oxidation layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1, an anti-bending flexible substrate structure, including insulating film PI layer 1, the both sides on insulating film PI layer 1 all are provided with heat-conducting adhesive layer 2, and one side that insulating film PI layer 1 was kept away from to two sets of heat-conducting adhesive layer 2 is provided with copper foil layer 3 and aluminium foil layer 4 respectively, and the inboard of heat-conducting adhesive layer 2 is embedded to have flexible shielding layer 5, and the both sides of heat-conducting adhesive layer 2 all are provided with bellying 6.
In more detail, the utility model provides a flexible shielding silk screen of flexible shielding layer 5 for establishment not only can strengthen heat-conducting glue layer 2 intensity through the inboard at heat-conducting glue layer 2 that sets up flexible shielding silk screen, and has guaranteed heat-conducting glue layer 2 resistant crookedness, and cooperation insulating film PI layer 1 supports as the middle part, great reinforcing this base plate's anti bending ability.
That is, the height of the protrusions 6 is eight to ten micrometers, and the protrusions 6 are provided to provide a space for the insulating film PI layer 1 and the thermal conductive adhesive layer 2 to deform.
In order to prevent 4 high temperature oxidation on aluminium foil layer, one side that heat-conducting glue layer 2 was kept away from to aluminium foil layer 4 is provided with oxidation resisting layer 7, and oxidation resisting layer 7 is the spraying at 4 anti-oxidant material retes on aluminium foil layer.
The utility model discloses in set up flexible shielding silk screen through the inboard at heat-conducting adhesive layer 2 and not only can strengthen heat-conducting adhesive layer 2 intensity, and guaranteed heat-conducting adhesive layer 2 resistant crookedness, cooperation insulating film PI layer 1 supports as the middle part, great reinforcing this base plate's anti bending ability, the bellying 6 through setting up is used for providing insulating film PI layer 1 and heat-conducting adhesive layer 2 and produces the space of deformation simultaneously, the design is comparatively reasonable, and simple structure, great reinforcing this base plate's practicality.
The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides an anti crooked flexible substrate structure, includes insulating film PI layer (1), the both sides on insulating film PI layer (1) all are provided with heat-conducting glue layer (2), and are two sets of one side that insulating film PI layer (1) was kept away from in heat-conducting glue layer (2) is provided with copper foil layer (3) and aluminium foil layer (4) respectively, its characterized in that: the inboard embedded flexible shielding layer (5) that have of heat conduction glue film (2), the both sides of heat conduction glue film (2) all are provided with bellying (6).
2. A bend-resistant flexible substrate structure according to claim 1, wherein: the flexible shielding layer (5) is a braided flexible shielding wire mesh.
3. A bend-resistant flexible substrate structure as claimed in claim 1, wherein: the height of the protrusions (6) is eight to ten micrometers.
4. A bend-resistant flexible substrate structure according to claim 1, wherein: and an oxidation resistant layer (7) is arranged on one side, far away from the heat-conducting adhesive layer (2), of the aluminum foil layer (4).
5. A bend-resistant flexible substrate structure as claimed in claim 4, wherein: the antioxidation layer (7) is an antioxidation material film layer sprayed on the aluminum foil layer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123323263.0U CN217608035U (en) | 2021-12-28 | 2021-12-28 | Bending-resistant flexible substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123323263.0U CN217608035U (en) | 2021-12-28 | 2021-12-28 | Bending-resistant flexible substrate structure |
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| Publication Number | Publication Date |
|---|---|
| CN217608035U true CN217608035U (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202123323263.0U Active CN217608035U (en) | 2021-12-28 | 2021-12-28 | Bending-resistant flexible substrate structure |
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| CN (1) | CN217608035U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117500171A (en) * | 2023-12-11 | 2024-02-02 | 士丰电子科技(昆山)有限公司 | FPC antenna and production process thereof |
| CN117656606A (en) * | 2024-01-30 | 2024-03-08 | 福建省晋江市泗农建材有限公司 | High-resistance anti-reflection non-radiation ceramic heat-insulation composite board and production process thereof |
-
2021
- 2021-12-28 CN CN202123323263.0U patent/CN217608035U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117500171A (en) * | 2023-12-11 | 2024-02-02 | 士丰电子科技(昆山)有限公司 | FPC antenna and production process thereof |
| CN117500171B (en) * | 2023-12-11 | 2024-05-07 | 士丰电子科技(昆山)有限公司 | FPC antenna and production process thereof |
| CN117656606A (en) * | 2024-01-30 | 2024-03-08 | 福建省晋江市泗农建材有限公司 | High-resistance anti-reflection non-radiation ceramic heat-insulation composite board and production process thereof |
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