CN117500171A - FPC antenna and production process thereof - Google Patents
FPC antenna and production process thereof Download PDFInfo
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- CN117500171A CN117500171A CN202311688051.3A CN202311688051A CN117500171A CN 117500171 A CN117500171 A CN 117500171A CN 202311688051 A CN202311688051 A CN 202311688051A CN 117500171 A CN117500171 A CN 117500171A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000010410 layer Substances 0.000 claims abstract description 104
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 87
- 239000011889 copper foil Substances 0.000 claims abstract description 87
- 239000012790 adhesive layer Substances 0.000 claims abstract description 52
- 239000000853 adhesive Substances 0.000 claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000010408 film Substances 0.000 claims description 90
- 238000007599 discharging Methods 0.000 claims description 32
- 239000003085 diluting agent Substances 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 19
- 239000002390 adhesive tape Substances 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000002699 waste material Substances 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000000748 compression moulding Methods 0.000 claims description 6
- 239000013039 cover film Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 230000003872 anastomosis Effects 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims 3
- 230000009286 beneficial effect Effects 0.000 abstract description 7
- 238000007664 blowing Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 230000036541 health Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 150000001924 cycloalkanes Chemical class 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
Abstract
The invention provides an FPC antenna and a production process thereof, wherein the FPC antenna comprises a substrate layer, a first adhesive layer, a copper foil, a second adhesive layer and a PI film layer which are sequentially arranged, wherein the copper foil is adhered to the substrate layer through the first adhesive layer, the second adhesive layer is coated on the copper foil, the PI film layer is adhered to the copper foil through the second adhesive layer, and antenna structures are uniformly distributed on the lower surface of the PI film layer. According to the invention, the antenna structure is manufactured on the lower surface of the PI film layer, on one hand, the antenna structure can be extruded and deformed when being pressed and bonded with the copper foil, so that the upper surface of the PI film layer cannot be jacked up by the copper foil to protrude, and the surface of the final FPC is ensured to be flat; on the other hand, grooves between the antenna structures are beneficial for the adhesive to enter the lower surface of the PI film layer in an embedding mode, meanwhile, the PI film layer is embedded into the adhesive, the adhesive and the PI film layer are mutually embedded, and the adhesion is tighter.
Description
Technical Field
The invention relates to the technical field of FPC (flexible printed circuit) production and processing, in particular to an FPC antenna and a production process thereof.
Background
The flexible circuit board (FPC) is increasingly used, which is not separated from many characteristics of the flexible circuit board, such as excellent bending resistance, solderability, ultra-thin volume, low cost, and the like, and has been involved in aspects of various industries.
At present, a circuit on an FPC antenna used in various electronic products is usually realized through film exposure, development and etching processes, the process is complex, the manufacturing process is complex, a large amount of chemical reagents are needed in the production process, the waste of raw materials is large, the produced wastewater can cause environmental pollution, the production efficiency of the FPC antenna is low, the cost is high, and the mass production of the FPC antenna is not facilitated.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide an FPC antenna and a manufacturing process thereof, which are used for solving the problems of environmental pollution, low production efficiency and high cost caused by a chemical etching method for the circuit of the FPC in the prior art.
To achieve the above and other related objects, the present invention provides the following technical solutions:
in a first aspect, the present invention provides a production process of an FPC antenna, including the steps of:
s1, preparing a copper foil, a double-sided adhesive tape, a substrate layer and a covering film, and cutting the copper foil, the double-sided adhesive tape, the substrate layer and the covering film into the same width according to the requirement of a specified size;
s2, the covering film sequentially comprises a PI film layer, a second adhesive layer and a second release layer from top to bottom, and a required hole site and a positioning hole are punched in the covering film;
s3, the double-sided adhesive tape comprises a first adhesive layer and a first release layer, and one surface of the copper foil is attached to the first adhesive layer by using an attaching machine to obtain the copper foil attached with the double-sided adhesive tape;
s4, punching the copper foil attached with the double-sided adhesive tape by using a die with a specified shape to obtain a circuit with a specified shape, wherein the copper foil and the first adhesive layer are ensured to be cut off without cutting off the first release layer during punching, and a penetrated positioning hole is ensured to be punched in the first release layer;
s5, removing the second release layer of the covering film in the step S2, and attaching the covering film to the copper foil obtained in the step S4 through the anastomosis of the positioning holes;
s6, removing the first release layer of the double-sided adhesive, and attaching the substrate layer to the first adhesive layer to obtain an FPC coiled material;
s7, identifying positioning holes in the FPC coiled material through the positioning guide posts, and then die-cutting a single FPC antenna.
By adopting the technical scheme, the traditional etching circuit mode is replaced by the die cutting and laminating process, the whole production process does not need the use of chemicals, and the method has no influence on the health of staff and is environment-friendly. The production process is not only suitable for producing FPC antennas, but also suitable for producing PCB boards, and has wide application range.
In an embodiment of the present invention, in step S2, an antenna structure is formed on the lower surface of the PI film layer by compression molding with a compression mold, and the antenna structure is uniformly distributed on the lower surface of the PI film layer.
In an embodiment of the present invention, in step S2, the PI film layer is made of black matte PI or black bright PI, and the second adhesive layer is formed of a black adhesive, and the black adhesive includes the following raw materials in percentage by weight: 30-50% of modified epoxy resin, 10-25% of rubber, 10-20% of carbon powder, 5-10% of diluent, 5-15% of accelerator and 0.05-0.5% of antioxidant.
In an embodiment of the present invention, the diluent includes a fast-drying diluent and a slow-drying diluent, and a mass ratio of the fast-drying diluent to the slow-drying diluent is 5:1-10:1. Wherein the quick-drying diluent comprises one or a combination of a plurality of hydrocarbon solvent naphtha, cyclic alkanes, ethyl acetate, methyl acetate and carbon tetrachloride. The slow-drying diluent comprises one or a combination of a plurality of butyl acetate, isopropanol and n-propyl ester.
In an embodiment of the present invention, an aluminum layer is plated on a side of the copper foil, which is close to the substrate layer, and the aluminum layer of the copper foil is connected to the substrate layer through a first adhesive layer.
In an embodiment of the present invention, in step S3, a PET protection film is attached to the other surface of the copper foil, and the width of the PET protection film is not smaller than the width of the circuit.
In an embodiment of the present invention, in step S5, a laminating machine with photoelectric sensing is used to laminate the cover film and the copper foil, the laminating machine includes a frame, a first discharging shaft, a second discharging shaft, a waste shaft, two pressing rolls, and a receiving shaft are respectively disposed on the frame, a photoelectric sensing mechanism is disposed between the first discharging shaft, the second discharging shaft, and the pressing rolls, and an output end of the photoelectric sensing mechanism is connected to a PLC controller, where the PLC controller is used to control discharging speeds of the first discharging shaft and the second discharging shaft.
In an embodiment of the present invention, a cover film is disposed on the first discharging shaft, and the waste shaft is disposed on one side of the first discharging shaft and is used for winding up the second release layer; the second discharging shaft is provided with a copper foil adhered with double-sided adhesive tape, and the copper foil faces to a second adhesive layer of the covering film; and a deflection shaft is arranged between the first discharging shaft and the pressing roller and used for adjusting the transmission direction of the covering film, and the photoelectric sensing mechanism is arranged between the deflection shaft and the pressing roller.
In an embodiment of the present invention, a distance adjusting component for adjusting a distance between two pressing rolls is disposed between the two pressing rolls.
In a second aspect, the present invention provides an FPC antenna, which is manufactured by the above-mentioned manufacturing process of an FPC antenna.
In an embodiment of the invention, the FPC antenna includes a substrate layer, a first adhesive layer, a copper foil, a second adhesive layer and a PI film layer that are sequentially disposed, the copper foil is adhered to the substrate layer through the first adhesive layer, the second adhesive layer is coated on the copper foil, the PI film layer is adhered to the copper foil through the second adhesive layer, antenna structures are uniformly distributed on the lower surface of the PI film layer, and the antenna structures can deform and squeeze when being pressed with the copper foil.
As described above, the FPC antenna and the production process thereof have the following beneficial effects:
1. according to the invention, the FPC is manufactured in a die cutting and attaching mode, a traditional etching circuit mode is replaced, chemicals are not needed in the whole production process, the health of workers is not influenced, and the FPC is green and environment-friendly and is more suitable for industrial production.
2. According to the invention, the antenna structure is manufactured on the lower surface of the PI film layer, on one hand, the antenna structure can be extruded when being pressed and bonded with the copper foil, so that the upper surface of the PI film layer cannot be jacked up by the copper foil to protrude, and the surface of the final FPC is ensured to be flat; on the other hand, grooves between the antenna structures are beneficial for the adhesive to enter the lower surface of the PI film layer in an embedding mode, meanwhile, the PI film layer is embedded into the adhesive, the adhesive and the PI film layer are mutually embedded, and the adhesion is tighter.
3. The carbon powder added in the black adhesive can play a good role in heat conduction, and transfer heat generated at the circuit position of the copper foil to the whole covering film to play a role in heat dissipation.
4. The laminating machine adopts the photoelectric sensing mechanism to identify whether the positioning holes are identical or not, so that the film layers are aligned more accurately; and the laminating machine rectifies the covering film by arranging the deflection shaft capable of translating, so that the laminating machine has a simple structure and is beneficial to popularization.
Drawings
Fig. 1 is a schematic structural diagram of an FPC antenna according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of a laminator disclosed in an embodiment of the invention.
Description of element reference numerals
1. A substrate layer; 2. a first adhesive layer; 3. copper foil; 4. a second adhesive layer; 5. a PI film layer; 51. an antenna structure; 6. a first discharging shaft; 7. a second discharging shaft; 8. a waste shaft; 9. a material pressing roller; 10. a material receiving shaft; 11. a deflection shaft; 12. and a photoelectric sensing mechanism.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
Example 1
A production process of an FPC antenna comprises the following steps:
s1, preparing a copper foil 3, double-sided adhesive tape, a substrate layer 1 and a covering film, and cutting the copper foil 3, the double-sided adhesive tape, the substrate layer 1 and the covering film into the same width according to the requirement of a specified size;
s2, the covering film sequentially comprises a PI film layer 5, a second adhesive layer 4 and a second release layer from top to bottom, and the covering film is punched to form a required hole site and a positioning hole;
s3, the double-sided adhesive tape comprises a first adhesive layer 2 and a first release layer, and one surface of the copper foil 3 is attached to the first adhesive layer 2 by using an attaching machine to obtain the copper foil 3 attached with the double-sided adhesive tape;
s4, punching the copper foil 3 attached with the double-sided adhesive tape by using a die with a specified shape to obtain a circuit with a specified shape, wherein the copper foil 3 and the first adhesive layer 2 are ensured to be cut without cutting the first release layer during punching, and the penetrated positioning holes are ensured to be punched in the first release layer;
s5, removing the second release layer of the covering film in the step S2, and attaching the covering film to the copper foil 3 obtained in the step S4 through the anastomosis of the positioning holes;
s6, removing the first release layer of the double-sided adhesive, and attaching the substrate layer 1 to the first adhesive layer 2 to obtain an FPC coiled material;
s7, identifying positioning holes in the FPC coiled material through the positioning guide posts, and then die-cutting a single FPC antenna.
By adopting the technical scheme, the traditional etching circuit mode is replaced by the die cutting and laminating process, the whole production process does not need the use of chemicals, and the method has no influence on the health of staff and is environment-friendly. The production process is not only suitable for producing FPC antennas, but also suitable for producing PCB boards, and has wide application range.
In the step S1, various coiled materials are cut into required widths in the early stage, so that alignment and lamination of various layers of materials in later lamination are facilitated, and the coiled materials are cut in the early stage more time and labor-saving.
In step S2, a pad of the FPC is formed by punching out a desired hole site in the middle of the cover film, and subsequently exposing the copper foil 3.
In step S2, an antenna structure is formed on the lower surface of the PI film by compression molding with a compression molding die, and the antenna structure is uniformly distributed on the lower surface of the PI film. In the subsequent bonding process with the copper foil 3, since the copper foil 3 is usually about 1mm in circuit structure and not a whole plane, the PI film layer 5 is directly bonded on the copper foil 3 to cause local protrusion, so that the surface of the FPC is uneven, and warpage and other adverse effects are caused. In order to solve the problem of uneven PI film 5 after lamination, the invention adopts a compression molding mode of a compression molding die to manufacture the antenna structures 51 on the lower surface of the PI film 5, and the antenna structures 51 are uniformly distributed on the lower surface of the PI film 5. On the one hand, referring to fig. 1, the antenna structure 51 can be extruded when being pressed and bonded with the copper foil 3, and the antenna which is not contacted with the copper foil 3 can hang down freely to play a supporting role, so that the upper surface of the PI film layer 5 cannot be jacked up by the copper foil 3 to protrude, and the surface of the final FPC is ensured to be flat. On the other hand, the grooves between the antenna structures 51 are beneficial for the adhesive to enter the lower surface of the PI film layer 5 in an embedding way, meanwhile, the PI film layer 5 is also embedded into the adhesive, and the two are mutually embedded, so that the mechanical adhesive force is beneficial to be generated.
In step S3, a PET protective film is attached to the other surface of the copper foil 3, and the width of the PET protective film is not smaller than the width of the circuit. By attaching a PET protective film to the other side of the copper foil 3, oxidation of the side of the copper foil 3 can be effectively prevented, and the PET protective film can be removed before a subsequent punching line.
The copper foil 3 in the present invention may be a pure copper foil 3 or a composite copper foil. In an embodiment of the present invention, an aluminum layer is plated on a side of the copper foil 3 close to the substrate layer 1, the aluminum layer of the copper foil 3 is connected to the substrate layer 1 through the first adhesive layer 2, and the copper foil 3 is connected to the PI film layer 5 through the second adhesive layer 4.
In step S4, the present invention punches the double sided tape-attached copper foil 3 from the surface of the copper foil 3 using a hydraulic or oil pressure die cutter, punch press or circular cutter, cuts the copper foil 3 and the first adhesive layer 2 without cutting the first release layer, and punches corresponding positioning holes in the first release layer.
In step S5, laminating machine with photoelectric sensing is used to laminate covering film and copper foil 3, refer to fig. 2, the laminating machine includes the frame, set up first blowing axle 6, second blowing axle 7, waste material axle 8, two swager roller 9, receipts material axle 10 in the frame respectively, be provided with photoelectric sensing mechanism 12 between first blowing axle 6, second blowing axle 7 and the swager roller 9, PLC controller is connected to photoelectric sensing mechanism 12' S output, PLC controller is used for controlling the blowing speed of first blowing axle 6 and second blowing axle 7.
Specifically, a covering film is arranged on the first discharging shaft 6, and the waste shaft 8 is arranged at one side of the first discharging shaft 6 and used for rolling up the second release layer; the second discharging shaft 7 is provided with a copper foil 3 attached with double-sided adhesive tape, and the surface of the copper foil 3 faces to the second adhesive layer 4 of the covering film; a deflection shaft 11 is arranged between the first discharging shaft 6 and the pressing roller 9 and used for adjusting the transmission direction of the covering film, and a photoelectric sensing mechanism 12 is arranged between the deflection shaft 11 and the pressing roller 9.
When the device is used, the first discharging shaft 6 rotates to convey the covering film to the pressing roller 9, and the second release layer of the covering film is torn off and rolled by the waste shaft 8; the second discharging shaft 7 conveys the copper foil 3 attached with the double-sided tape to the pressing roller 9. It is worth noting that the deflection shaft 11 between the first discharging shaft 6 and the pressing roller 9 can adjust the conveying direction of the cover film to be nearly parallel to the conveying direction of the copper foil 3, so that the photoelectric sensing mechanism 12 can conveniently recognize whether the positioning holes of the first discharging shaft and the pressing roller coincide; meanwhile, the deflection shaft 11 can horizontally move left and right, so that the deflection shaft 11 can adjust the left and right edge distances of the covering film according to the result identified by the photoelectric sensing mechanism 12, and the covering film is aligned with the copper foil 3, and correction is effectively performed.
Further, a spacing adjusting component for adjusting the spacing between the two pressing rollers 9 is arranged between the two pressing rollers.
Example 2
Referring to fig. 1, the FPC antenna includes a substrate layer 1, a first adhesive layer 2, a copper foil 3, a second adhesive layer 4 and a PI film layer 5, wherein the substrate layer 1, the first adhesive layer 2, the second adhesive layer 4 and the PI film layer 5 are sequentially arranged, the copper foil 3 is adhered to the substrate layer 1 through the first adhesive layer 2, the second adhesive layer 4 is coated on the copper foil 3, the PI film layer 5 is adhered to the copper foil 3 through the second adhesive layer 4, antenna structures 51 are uniformly distributed on the lower surface of the PI film layer 5, and the antenna structures 51 can deform and squeeze when being pressed with the copper foil 3, so that the upper surface of the PI film layer 5 is flat and not convex.
Further, the PI film layer 5 is made of black matte PI or black bright PI, and the second adhesive layer 4 is formed of black adhesive.
Further, the black adhesive comprises the following components in percentage by weight: 30-50% of modified epoxy resin, 10-25% of rubber, 10-20% of carbon powder, 5-10% of diluent, 5-15% of accelerator and 0.05-0.5% of antioxidant. The black PI film layer 5 and the black adhesive are adopted as the covering film of the FPC, so that the FPC has better signal shielding effect and anti-interference performance, and can better shield unnecessary light. In addition, carbon powder added in the black adhesive can play a good heat conduction role, and heat generated at the circuit position of the copper foil 3 is transferred to the whole covering film to play a heat dissipation role.
Still further, the diluents include fast drying diluents and slow drying diluents. Wherein the quick-drying diluent comprises one or a combination of a plurality of hydrocarbon solvent naphtha, cyclic alkanes, ethyl acetate, methyl acetate and carbon tetrachloride. The slow-drying diluent comprises one or a combination of a plurality of butyl acetate, isopropanol and n-propyl ester. According to the invention, through the proportion of the quick-drying diluent and the slow-drying diluent, the viscosity of the black adhesive is controllable and adjustable, and the fluidity of the black adhesive can be improved, so that the black adhesive can diffuse into an unextruded space when the antenna structure 51 is extruded, and the flat coverage of the PI film layer 5 is promoted. The mass ratio of the quick-drying diluent to the slow-drying diluent is 5:1-10:1.
Further, the accelerator may be selected from, but not limited to, modified amine accelerators, which impart a hydrophobic effect to the second adhesive layer 4, improve its water resistance, and promote release film peeling on the second adhesive layer.
In summary, the FPC is manufactured in a die cutting and attaching mode, a traditional etching circuit mode is replaced, chemicals are not needed in the whole production process, the health of workers is not affected, and the FPC is green and environment-friendly and is more suitable for industrial production. In addition, the antenna structure is manufactured on the lower surface of the PI film layer, on one hand, the antenna structure can be extruded when being pressed and adhered with the copper foil, so that the upper surface of the PI film layer cannot be jacked up by the copper foil to protrude, and the surface of the final FPC is smooth; on the other hand, grooves between the antenna structures are beneficial for the adhesive to enter the lower surface of the PI film layer in an embedding mode, meanwhile, the PI film layer is embedded into the adhesive, the adhesive and the PI film layer are mutually embedded, and the adhesion is tighter. In addition, the carbon powder added in the black adhesive can play a good role in heat conduction, and heat generated at the circuit position of the copper foil is transferred to the whole covering film to play a role in heat dissipation. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. It is intended that all equivalent modifications and variations of the invention be covered by the claims of this invention be accomplished by those of ordinary skill in the art without departing from the spirit and scope of the invention as disclosed herein.
Claims (10)
1. The production process of the FPC antenna is characterized by comprising the following steps of:
s1, preparing a copper foil, a double-sided adhesive tape, a substrate layer and a covering film, and cutting the copper foil, the double-sided adhesive tape, the substrate layer and the covering film into the same width according to the requirement of a specified size;
s2, the covering film sequentially comprises a PI film layer, a second adhesive layer and a second release layer from top to bottom, and a required hole site and a positioning hole are punched in the covering film;
s3, the double-sided adhesive tape comprises a first adhesive layer and a first release layer, and one surface of the copper foil is attached to the first adhesive layer by using an attaching machine to obtain the copper foil attached with the double-sided adhesive tape;
s4, punching the copper foil attached with the double-sided adhesive tape by using a die with a specified shape to obtain a circuit with a specified shape, wherein the copper foil and the first adhesive layer are ensured to be cut off without cutting off the first release layer during punching, and a penetrated positioning hole is ensured to be punched in the first release layer;
s5, removing the second release layer of the covering film in the step S2, and attaching the covering film to the copper foil obtained in the step S4 through the anastomosis of the positioning holes;
s6, removing the first release layer of the double-sided adhesive, and attaching the substrate layer to the first adhesive layer to obtain an FPC coiled material;
s7, identifying positioning holes in the FPC coiled material through the positioning guide posts, and then die-cutting a single FPC antenna.
2. The manufacturing process of the FPC antenna according to claim 1, wherein in step S2, an antenna structure is formed on the lower surface of the PI film layer by compression molding with a compression mold, and the antenna structure is uniformly distributed on the lower surface of the PI film layer.
3. The production process of the FPC antenna according to claim 1, wherein in step S2, the PI film layer is made of black matte PI or black bright PI, the second adhesive layer is formed of black adhesive, and the black adhesive comprises the following raw materials in percentage by weight: 30-50% of modified epoxy resin, 10-25% of rubber, 10-20% of carbon powder, 5-10% of diluent, 5-15% of accelerator and 0.05-0.5% of antioxidant.
4. The production process of the FPC antenna according to claim 3, wherein the diluent comprises a quick-drying diluent and a slow-drying diluent, and the mass ratio of the quick-drying diluent to the slow-drying diluent is 5:1-10:1.
5. The process for producing an FPC antenna according to claim 1, wherein an aluminum layer is plated on a side of the copper foil close to the base material layer, and the aluminum layer of the copper foil is connected with the base material layer through the first adhesive layer.
6. The process according to claim 5, wherein in step S3, a PET protective film is attached to the other surface of the copper foil, and the width of the PET protective film is not smaller than the width of the circuit.
7. The production process of the FPC antenna according to claim 1, wherein in the step S5, a laminating machine with photoelectric induction is used for laminating the cover film and the copper foil, the laminating machine comprises a frame, a first discharging shaft, a second discharging shaft, a waste shaft, two pressing rolls and a receiving shaft are respectively arranged on the frame, a photoelectric induction mechanism is arranged among the first discharging shaft, the second discharging shaft and the pressing rolls, and the output end of the photoelectric induction mechanism is connected with a PLC (programmable logic controller) which is used for controlling the discharging speeds of the first discharging shaft and the second discharging shaft.
8. The manufacturing process of the FPC antenna according to claim 7, wherein a cover film is provided on the first discharging shaft, and the waste shaft is provided on one side of the first discharging shaft for winding up the second release layer; the second discharging shaft is provided with a copper foil adhered with double-sided adhesive tape, and the copper foil faces to a second adhesive layer of the covering film; and a deflection shaft is arranged between the first discharging shaft and the pressing roller and used for adjusting the transmission direction of the covering film, and the photoelectric sensing mechanism is arranged between the deflection shaft and the pressing roller.
9. An FPC antenna, characterized in that it is manufactured by a production process of an FPC antenna according to claims 1 to 8.
10. The FPC antenna according to claim 9, wherein the FPC antenna comprises a substrate layer, a first adhesive layer, a copper foil, a second adhesive layer and a PI film layer which are sequentially arranged, the copper foil is adhered to the substrate layer through the first adhesive layer, the second adhesive layer is coated on the copper foil, the PI film layer is adhered to the copper foil through the second adhesive layer, antenna structures are uniformly distributed on the lower surface of the PI film layer, and the antenna structures can deform and squeeze when being pressed with the copper foil.
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