CN102523691A - Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces - Google Patents
Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces Download PDFInfo
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- CN102523691A CN102523691A CN2011104435988A CN201110443598A CN102523691A CN 102523691 A CN102523691 A CN 102523691A CN 2011104435988 A CN2011104435988 A CN 2011104435988A CN 201110443598 A CN201110443598 A CN 201110443598A CN 102523691 A CN102523691 A CN 102523691A
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Abstract
The invention discloses a process for forming aligned holes in a single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces. The process comprises the following steps of: dragging a whole roll of first-layer insulation protection film to a line workbench surface, and forwards conveying, wherein windows and positioning holes are continuously formed in the insulation protection film through a die, and is attached to a conductive copper foil in a roll-to-roll manner; and directly forming the aligned holes in the attached conductive copper foil according to the positions of the positioning holes punched in the first-layer insulation protection film by the die. The first-layer insulation protection film is not required to be aligned with a pure copper foil, and compared with the conventional method, the process has the advantages that: the alignment precision is improved greatly, and the process is stable and reliable; furthermore, roll-to-roll production is realized, the production efficiency is improved, and the production cost is reduced.
Description
Technical field
The present invention discloses a kind of two and shows conductor individual layer FPC registration holes technology, divides by International Patent Classification (IPC) (IPC) to belong to flex circuit application FPC manufacturing technology field.
Background technology
FPC is the abbreviation of gentle (scratching) property wiring board (Flexible Printed Circuits), is a kind of light and handy, slim, flexible printed substrate.FPC uses Copper Foil to form the wiring material of circuit on insulation film, has that high bendability, wiring are laborsaving, the speciality of small volume and less weight, is used for multiple electronics and massaging device products such as mobile phone, hard disk drive (hereinafter to be referred as HDD), DVD.FPC FPC can be made as individual layer, and double-deck (can reach 6 layers), multilayer hollow (Air Gap), band anisotropic conductive (exempting ACF) and the little circuit COF of high density (Chip on Film) etc. are dissimilar, are fit to different needs.
In flex circuit application (FPC) is manufactured; A kind of special single face (layer) flex plate is arranged, and it has only one deck conductive layer (fine copper), and the two sides is insulating barrier (diaphragm); But need on the insulating barrier on two sides, to leave window simultaneously; Expose conductor, as pad or plug, industry is commonly called as and is false double sided board or the two-sided contact FPC of individual layer.In the production process of this kind FPC; Process common in the industry is: go up with getting out registration holes with numerical control brill or CNC earlier at ground floor insulating barrier (diaphragm); Mould is left ground floor insulating barrier (diaphragm) window again; Simultaneously pure copper foil is bored with numerical control or CNC gets out registration holes, the registration holes through diaphragm and Copper Foil is at last carried out diaphragm and Copper Foil contraposition and is fit together.Yet above-mentioned process usually causes between the windowing of pad that subsequent etch goes out and ground floor insulating barrier can't satisfying requirement of client than off normal because of the error of contraposition.Simultaneously, this process must be carried out prebored hole to insulating barrier and pure copper foil respectively, can't carry out working continuously of volume to volume (Roll To Roll), and production efficiency is low.
Common process in the industry, the aligning accuracy difference with can't continuity method production, bring very big puzzlement for the flexible printed board industry.
Summary of the invention
To the deficiency of prior art, the invention provides a kind of two and show conductor individual layer FPC registration holes technology, this process has been avoided final production finished product off normal problem, has improved yield of products.
For achieving the above object, the present invention realizes through following technical scheme:
A kind of two show conductor individual layer FPC registration holes technology; Its step comprises as follows: the ground floor insulating protective film that will put in order volume draws to the flowing water work top and is fed forward; This insulating protective film is fitted with the copper-foil conducting electricity volume to volume, then earlier by continuous windowing of mould and location hole again; According to the position of positioning hole that mould is gone out at the ground floor insulating protective film, directly on the copper-foil conducting electricity after the applying, carry out registration holes and make.
Further; The color of described ground floor insulating protective film and copper-foil conducting electricity is different; After insulating protective film and copper-foil conducting electricity are compound; The ground floor insulating protective film is washed the part of location hole in advance open and is exposed copper, sets CCD from the moving-target impact machine, goes out the position, hole automatically according to the site color difference of exposing copper.
Further; Release liners is posted in described ground floor insulating protective film one side; Before fitting, peel off above-mentioned release liners earlier with copper-foil conducting electricity; Insulating protective film is peeled off side and the copper-foil conducting electricity automatic rolling of release liners and is fitted, and above-mentioned applying operation is by hauling machine diaphragm and Copper Foil to be drawn respectively to the board of fitting to carry out.
The ground floor insulating protective film is also referred to as coverlay among the present invention; Through ground floor insulating protective film continuous mould windowing and volume to volume (Roll To Roll) are fitted; Use again from moving-target impact machine (CCD) according to mould in hole that the ground floor insulating barrier is gone out; Directly after insulating barrier and pure copper foil are compound, carry out registration holes and make, and then fit, finally form two and show conductor individual layer FPC with another insulating protective film contraposition.Process of the present invention is because need not be to carrying out contraposition between ground floor insulating barrier and the pure copper foil; Improved the aligning accuracy of two interlayers, need not hole simultaneously, can volume to volume (Roll To Roll) produce Copper Foil; Simplified production procedure; Shortened the production time, improved production efficiency, the application that in the industry cycle still belongs to the first time of this process.
Description of drawings
Fig. 1 is a schematic flow sheet of the present invention.
Embodiment
Embodiment: a kind of two show conductor individual layer FPC registration holes technology; Its step comprises as follows: the ground floor insulating protective film that will put in order volume draws to the flowing water work top and is fed forward; This insulating protective film is fitted with the copper-foil conducting electricity volume to volume, then earlier by continuous windowing of mould and location hole again; According to the position of positioning hole that mould is gone out at the ground floor insulating protective film, directly on the copper-foil conducting electricity after the applying, carry out registration holes and make.The color of described ground floor insulating protective film and copper-foil conducting electricity is different; After insulating protective film and copper-foil conducting electricity are compound; The ground floor insulating protective film is washed the part of location hole in advance open and is exposed copper, sets CCD from the moving-target impact machine, goes out the position, hole automatically according to the site color difference of exposing copper.Release liners is posted in ground floor insulating protective film one side; Before fitting, peel off above-mentioned release liners earlier with copper-foil conducting electricity; Insulating protective film is peeled off side and the copper-foil conducting electricity automatic rolling of release liners and is fitted, and above-mentioned applying operation is by hauling machine diaphragm and Copper Foil to be drawn respectively to the board of fitting to carry out.
Technical scheme of the present invention is following:
1.----roll extrusion applying----cuts continuously towards film.Of Fig. 1, this process comprises 1,40 ton of automatic hydraulic press 2 of automatic feeding, mould, and automatic material receiving device 3, automatic hot make-up machine 4 draws materials device 5.Through control system with automatic feeding 1; 40T hydraulic press 2, automatic material receiving device 3, automatic hot make-up machine 4 links; Reach the whole volume of ground floor insulating material is left window and location hole continuously, through automatic make-up machine 4 diaphragm is fitted with pure copper foil again.Through automatic material cutting machine 6 material after compound is cut into sheet material by design size at last;
2. CCD is towards registration holes, after diaphragm and pure copper foil are compound, because of mould is arranged in advance diaphragm gone out the hole; After diaphragm and pure copper foil are compound; The part in hole will be exposed copper, sets the CCD automatic punch machine, goes out the position, hole automatically according to the site color difference of exposing copper.The registration holes of the material after compound has so just formed.Because the hole of compound back material is to form through the direct CCD punching out in the hole on the diaphragm, this hole is high with the relative position accuracy of the windowing on the film, has avoided final production finished product off normal problem fully, has improved yield of products.
The present invention's one preferable implementation process:
1. dress mould: the diaphragm mould of corresponding product is installed to 40 tons of hydraulic press, regulate the die-cut degree of depth of film tool through limit switch;
2. heat up from make-up machine: automatic make-up machine temperature is set to needs temperature, and this temperature of system that heats up;
3. go up volume: be wrapped on the roller of feed system diaphragm coiled material H1 and pure copper foil coiled material H2 are whole, the adjustment vernier knob is adjusted to the fixed position with coiled material, and fixes;
4. draw operations: with the traction material diaphragm and Copper Foil are drawn respectively to the relevant position, make the release liners M of diaphragm receive material collecting device simultaneously;
5. parameter is confirmed: on control panel, access the parameter of Related product, confirm die-cut frequency of mould and step-length, confirm automatic make-up machine step-length, confirm automatic material cutting machine frequency;
6. above-mentioned 1-5 brings into operation after accomplishing. and all produce end until whole roll of material, carry out the production of second roll of material again by 3-5;
7. sheet material one end after will fitting is clipped on the CCD target impact machine, selects to use the file of this product.Just can carry out automatic punching according to the position, hole of the sheet material upper protective film of fitting.
Technique effect of the present invention:
1. aligning accuracy significantly improves:
This technical process is directly according to the hole of going out on the film; With the direct pore-forming of CCD perforating press; Make contraposition deviation between diaphragm and the fine copper less than 0.04; And process commonly used adopts hole artificial again contraposition or the tool contraposition of CNC respectively of diaphragm and Copper Foil. the deviation of artificial contraposition is preferably less than 0.1, the tool contraposition can accomplish that preferably deviation is less than 0.08.This technology is compared traditional mode, and aligning accuracy significantly improves, and reliable and stable;
2. production cost descends, and production efficiency improves:
This process does not need CNC boring, has practiced thrift the relevant cost of labor of boring and the auxiliary material (like aluminium foil, paper substrate plate, phenolic board etc.) of all kinds of CNC boring;
This process does not need artificial diaphragm and Copper Foil to be carried out contraposition, has practiced thrift cost of labor, by the sheet material of 250.355 sizes: 60/people/time of artificial contraposition, 180/people/time of CNC punching.
The above record is merely the embodiment that utilizes this origination techniques content, anyly is familiar with modification, the variation that this creation of this art utilization is done, and all belongs to the claim of this creation opinion, and is not limited to embodiment announcement person.
Claims (4)
1. show conductor individual layer FPC registration holes technology for one kind two; It is characterized in that: this technology comprises the steps: that the ground floor insulating protective film with whole volume draws to the flowing water work top and is fed forward; This insulating protective film is fitted with the copper-foil conducting electricity volume to volume, then earlier by continuous windowing of mould and location hole again; According to the position of positioning hole that mould is gone out at the ground floor insulating protective film, directly on the copper-foil conducting electricity after the applying, carry out registration holes and make.
2. according to claim 1 two show conductor individual layer FPC registration holes technology; It is characterized in that: the color of described ground floor insulating protective film and copper-foil conducting electricity is different; After insulating protective film and copper-foil conducting electricity are compound; The ground floor insulating protective film is washed the part of location hole in advance open and is exposed copper, sets CCD from the moving-target impact machine, goes out the position, hole automatically according to the site color difference of exposing copper.
3. according to claim 1 and 2 two show conductor individual layer FPC registration holes technology; It is characterized in that: release liners is posted in described ground floor insulating protective film one side; Before fitting, peel off above-mentioned release liners earlier with copper-foil conducting electricity; Insulating protective film is peeled off side and the copper-foil conducting electricity automatic rolling of release liners and is fitted, and above-mentioned applying operation is by hauling machine diaphragm and Copper Foil to be drawn respectively to the board of fitting to carry out.
4. according to claim 1 two show conductor individual layer FPC registration holes technology; It is characterized in that: described ground floor insulating protective film and copper-foil conducting electricity are cut into sheet material after fitting; The ground floor insulating protective film is washed the part of location hole in advance open and is exposed copper; Set CCD from the moving-target impact machine, go out the position, hole automatically according to the site color difference of exposing copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104435988A CN102523691A (en) | 2011-12-27 | 2011-12-27 | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104435988A CN102523691A (en) | 2011-12-27 | 2011-12-27 | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces |
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| CN102523691A true CN102523691A (en) | 2012-06-27 |
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| CN2011104435988A Pending CN102523691A (en) | 2011-12-27 | 2011-12-27 | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102909561A (en) * | 2012-10-31 | 2013-02-06 | 金鹏源康(广州)精密电路有限公司 | Combined automatic punching system and half-broken continuous punching method thereof |
| CN104244585A (en) * | 2013-07-04 | 2014-12-24 | 漳州市福世通电子有限公司 | Process method for bonding between roll type FPC line base material and sheet type cover film |
| CN105072809A (en) * | 2015-07-13 | 2015-11-18 | 苏州市华扬电子有限公司 | Method for improving line alignment precision of single-face double-contact type FPC board |
| CN105430914A (en) * | 2015-11-30 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Manufacturing method of one-sided double-contact flexible circuit board |
| CN105592630A (en) * | 2015-11-24 | 2016-05-18 | 苏州市华扬电子有限公司 | Manufacture method of one-side dual-contact FPC location hole |
| CN110769607A (en) * | 2019-10-16 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Circuit board and manufacturing method thereof |
| CN111629532A (en) * | 2020-07-07 | 2020-09-04 | 珠海景旺柔性电路有限公司 | Processing method for improving alignment precision of covering film |
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| CN101453832A (en) * | 2007-11-30 | 2009-06-10 | 比亚迪股份有限公司 | Method for manufacturing hollowed-out board |
| CN101830544A (en) * | 2010-05-10 | 2010-09-15 | 苏州市普滤得净化有限公司 | Ozone control device for bottled water and ozone control process |
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
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- 2011-12-27 CN CN2011104435988A patent/CN102523691A/en active Pending
Patent Citations (4)
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| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101453832A (en) * | 2007-11-30 | 2009-06-10 | 比亚迪股份有限公司 | Method for manufacturing hollowed-out board |
| CN101830544A (en) * | 2010-05-10 | 2010-09-15 | 苏州市普滤得净化有限公司 | Ozone control device for bottled water and ozone control process |
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102909561A (en) * | 2012-10-31 | 2013-02-06 | 金鹏源康(广州)精密电路有限公司 | Combined automatic punching system and half-broken continuous punching method thereof |
| CN104244585A (en) * | 2013-07-04 | 2014-12-24 | 漳州市福世通电子有限公司 | Process method for bonding between roll type FPC line base material and sheet type cover film |
| CN105072809A (en) * | 2015-07-13 | 2015-11-18 | 苏州市华扬电子有限公司 | Method for improving line alignment precision of single-face double-contact type FPC board |
| CN105592630A (en) * | 2015-11-24 | 2016-05-18 | 苏州市华扬电子有限公司 | Manufacture method of one-side dual-contact FPC location hole |
| CN105430914A (en) * | 2015-11-30 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Manufacturing method of one-sided double-contact flexible circuit board |
| CN110769607A (en) * | 2019-10-16 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Circuit board and manufacturing method thereof |
| CN111629532A (en) * | 2020-07-07 | 2020-09-04 | 珠海景旺柔性电路有限公司 | Processing method for improving alignment precision of covering film |
| CN111629532B (en) * | 2020-07-07 | 2021-09-28 | 珠海景旺柔性电路有限公司 | Processing method for improving alignment precision of covering film |
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Application publication date: 20120627 |