CN103841767A - Transparent printed circuit board and manufacturing method thereof - Google Patents
Transparent printed circuit board and manufacturing method thereof Download PDFInfo
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- CN103841767A CN103841767A CN201210477618.8A CN201210477618A CN103841767A CN 103841767 A CN103841767 A CN 103841767A CN 201210477618 A CN201210477618 A CN 201210477618A CN 103841767 A CN103841767 A CN 103841767A
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Abstract
The invention relates to a manufacturing method of a transparent printed circuit board. The method comprises the following steps: providing single-side blackening copper foil which includes a copper body layer and a first blackening layer formed at one side of the copper body layer; bonding a transparent substrate layer to the surface of the first blackening layer through a first colloid layer; performing blackening processing on the surface, which is opposite to the first blackening layer, of the single-side blackening copper foil so that the single-side blackening copper foil forms double-sided blackening copper foil; removing part of the double-sided blackening copper foil so as to making the double-sided blackening copper foil into a conductive line layer; and successively arranging a second colloid layer and a transparent coverage layer at one side, which is away from the transparent substrate layer, of the conductive line layer so as to form a transparent printed circuit board. The invention also relates to a transparent printed circuit board manufactured by use of the method.
Description
Technical field
The present invention relates to circuit board making technology, relate in particular to a kind of transparent printed circuit board (PCB) and preparation method thereof.
Background technology
Printed circuit board (PCB) is widely used because having packaging density advantages of higher.Refer to document Takahashi about the application of circuit board, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 1418-1425.
Because electronic product is to individualized development, also more and more diversified for the requirement of printed circuit board (PCB) that is applied to electronic product.Have at present a kind of transparent printed circuit board (PCB), it is transparent material for carrying and protecting insulated substrate, the coverlay etc. of conducting wire layer, and inner conducting wire layer is because substrate and coverlay are transparently to become visible.Single-layer and transparent circuit board is the inner transparent circuitry plate only with one deck conducting wire layer, and the material of this conducting wire layer is bright brown copper, because bright brown genus light color is to make the transparency of whole transparent circuitry plate reduce in visual effect.
Summary of the invention
In view of this, be necessary to provide transparent printed circuit board (PCB) that a kind of transparency is higher and preparation method thereof.
A manufacture method for transparent printed circuit board (PCB), comprises step: one side melanism Copper Foil is provided, comprises copper body layer and be formed at the first blackening layer of this copper body layer one side; By the first colloid layer, transparent substrates layer is adhered to the surface of this first blackening layer; This one side melanism Copper Foil is carried out to Darkening process with respect to the surface of this first blackening layer, form the second blackening layer, thereby this one side melanism Copper Foil is formed as two-sided melanism Copper Foil; Remove this two-sided melanism Copper Foil of part, thereby this two-sided melanism Copper Foil is made and formed conducting wire layer; And set gradually the second colloid layer and transparent covering layer at this conducting wire layer away from a side of this transparent substrates layer, thereby form transparent printed circuit board (PCB).
A transparent printed circuit board (PCB) that adopts above-mentioned manufacture method to form, comprises transparent substrates layer, conducting wire layer and transparent covering layer.This conducting wire layer is adhered to the surface of this transparent substrates layer, and this conducting wire layer comprises copper body layer and be formed at relative two the first surperficial blackening layers of copper body layer and the second blackening layer, and this first blackening layer is adjacent with this transparent substrates layer.This transparent covering layer is adhered to this second blackening layer surface.
With respect to prior art, the relative two sides of the transparent printed circuit board (PCB) of the present embodiment all has blackening layer, i.e. the first blackening layer and the second blackening layer, and black is dark system, makes the transparency of whole transparent printed circuit board (PCB) obviously strengthen in visual effect.
Brief description of the drawings
Fig. 1 is the generalized section that the embodiment of the present invention provides one side melanism Copper Foil.
Fig. 2 forms the generalized section after the first colloid layer at the first blackening layer surface-coated colloid of the Copper Foil of Fig. 1.
Fig. 3 is the generalized section after pressing transparent substrates layer on the first colloid layer of Fig. 2.
Fig. 4 is that the shiny surface of Copper Foil forms the second blackening layer and forms the generalized section after two-sided melanism Copper Foil in Fig. 3.
The generalized section forming after the layer of conducting wire made by two-sided melanism Copper Foil in Fig. 4 by Fig. 5.
Fig. 6 is that the generalized section after transparent mulch film is closed in the second blackening layer one side pressure of the conducting wire layer in Fig. 5.
Main element symbol description
| One side |
10 |
| Two-sided |
16 |
| |
101 |
| The |
102 |
| |
103 |
| |
104 |
| The |
11 |
| |
12 |
| The |
105 |
| Copper- |
20 |
| Conducting |
162 |
| The |
13 |
| |
14 |
| Transparent printed circuit board (PCB) | 30 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Transparent printed circuit board (PCB) the technical program being provided below in conjunction with drawings and Examples and preparation method thereof is described in further detail.
Refer to Fig. 1 to Fig. 6, the manufacture method of the transparent printed circuit board (PCB) that the technical program embodiment provides comprises the following steps:
Step 1: refer to Fig. 1, one side melanism Copper Foil 10 is provided, this one side melanism Copper Foil 10 comprises copper body layer 101 and the first blackening layer 102, this one side melanism Copper Foil 10 has relative first surface 103 and second surface 104, this first blackening layer 102 is formed at a side of this copper body layer 101, and the surface of this first blackening layer 102 forms the first surface 103 of this one side melanism Copper Foil 10.This first blackening layer 102, for wherein to carry out after Darkening process forming in a surface at the Copper Foil without Darkening process, is not formed this copper body layer 101 by the part of Darkening process.
Step 2: refer to Fig. 2, on the first blackening layer 102 surfaces of one side melanism Copper Foil 10, the first colloid layer 11 is set.
The method to set up of this first colloid layer 11 is: utilize colloid coating machine that liquid transparent colloid is coated to this first blackening layer 102 surfaces; This transparent colloid is carried out to prebake conditions, and prebake conditions temperature is 85 DEG C ± 5 DEG C, and the prebake conditions time is 15 minutes (min) ± 3min, makes transparent colloid telogenesis semi-solid preparation shape, forms the first colloid layer 11.Preferably, the thickness of this first colloid layer 11 is less than 15 microns (μ m).
Step 3: refer to Fig. 3, pressing transparent substrates layer 12 on this first colloid layer 11, this first colloid layer 11 bonds together this transparent substrates layer 12 with one side melanism Copper Foil 10.
The material of this transparent substrates layer 12 can be clear PET.Be appreciated that this first colloid layer 11 can be also pressing semi-solid preparation film, this transparent substrates layer 12 is formed at the surface of the first blackening layer 102 of one side melanism Copper Foil 10 together with the first colloid layer 11 by the mode of pressing, be not limited to the present embodiment.The thickness range of this transparent substrates layer 12 is preferably 25 to 50 microns.
Step 4: refer to Fig. 4, the second surface of this one side melanism Copper Foil 10 104 is carried out to Darkening process, form the second blackening layer 105, thereby form copper-clad base plate 20.
The method of the second surface of this one side melanism Copper Foil 10 104 being carried out to Darkening process can adopt known black method for oxidation, low temperature melanism method or high temperature melanism method etc.After Darkening process forms the second blackening layer 105, this one side melanism Copper Foil 10 changes two-sided melanism Copper Foil 16 into, this copper-clad base plate 20 comprise transparent substrates layer 12, two-sided melanism Copper Foil 16 and be arranged at transparent substrates layer 12 and two-sided melanism Copper Foil 16 between the first colloid layer 11, this first colloid layer 11 bonds together this transparent substrates layer 12 with two-sided melanism Copper Foil 16, to form copper-clad base plate 20.This one side melanism Copper Foil 10 comprises copper body layer 101, be formed at copper body layer 101 first surface 103 the first blackening layer 102 and be formed at the second blackening layer 105 of the second surface 104 of copper body layer 101.
Step 5: refer to Fig. 5, remove the two-sided melanism Copper Foil 16 of part, form conducting wire layer 162 to make.The two-sided melanism Copper Foil 16 of removing comprises the first blackening layer 102, copper body layer 101 and second blackening layer 105 of correspondence position.This conducting wire layer 162 comprises many conducting wires, and this conducting wire layer 162 can be made by image transfer technique and etch process.
Step 6: refer to Fig. 6, the second colloid layer 13 and transparent mulch film 14 are provided, and this second colloid layer 13 and transparent mulch film 14 are pressed on to the surface of this conducting wire layer 162 away from this transparent substrates layer 12 successively, form transparent printed circuit board (PCB) 30.
This second colloid layer 13 can be film, can be also the semi-solid preparation colloid forming after the liquid transparent colloid that is coated on transparent mulch film 14 surfaces is solidified.The material of this transparent mulch film 14 can be clear PET.In this step, this transparent printed circuit board (PCB) 30 can be by forming this second colloid layer 13 and transparent mulch film 14 with two-sided melanism Copper Foil 16, the first colloid layer 11 and transparent substrates layer 12 one step press in pressing machine.After pressing, the material of this second colloid layer 13 fills up the space between the conducting wire of this conducting wire layer 162 under pressure force effect.The thickness of the second colloid layer 13 of transparent printed circuit board (PCB) 30 part between this conducting wire layer 162 and this transparent mulch film 14 is less than 15 microns.The thickness range of this transparent mulch film 14 is preferably 25 to 50 microns.
As shown in Figure 6, this transparent printed circuit board (PCB) 30 comprises transparent substrates layer 12, the first colloid layer 11, conducting wire layer 162, the second colloid layer 13 and transparent mulch film 14.This conducting wire layer 162 comprises copper body layer 101 and is formed at respectively copper body layer 101 apparent surfaces' the first blackening layer 102 and the second blackening layer 105, and this conducting wire layer 162 comprises many conducting wires.This conducting wire layer 162 is adhered to a surface of this transparent substrates layer 12 by this first colloid layer 11, and this first blackening layer 102 is adjacent with this first colloid layer 11.This second colloid layer 13 is arranged at a side of the second blackening layer 105 of this conducting wire layer 162, and the material of this second colloid layer 13 has been full of the space between many conducting wires of this conducting wire layer 162.This transparent mulch film 14 is arranged at the surface of this second colloid layer 13 away from this conducting wire layer 162.This first colloid layer 11 and the second colloid layer 13 are transparent colloid, and the material of this transparent substrates layer 12 and transparent mulch film 14 can be clear PET.
With respect to prior art, the relative two sides of the transparent printed circuit board (PCB) 30 of the present embodiment all has blackening layer, i.e. the first blackening layer 102 and the second blackening layer 105, black is dark system, makes the transparency of whole transparent printed circuit board (PCB) 30 obviously strengthen in visual effect.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a manufacture method for transparent printed circuit board (PCB), comprises step:
One side melanism Copper Foil is provided, comprises copper body layer and be formed at the first blackening layer of this copper body layer one side;
By the first colloid layer, transparent substrates layer is adhered to the surface of this first blackening layer;
This one side melanism Copper Foil is carried out to Darkening process with respect to the surface of this first blackening layer, form the second blackening layer, thereby this one side melanism Copper Foil is formed as two-sided melanism Copper Foil;
Remove this two-sided melanism Copper Foil of part, thereby this two-sided melanism Copper Foil is made and formed conducting wire layer; And
Set gradually the second colloid layer and transparent covering layer at this conducting wire layer away from a side of this transparent substrates layer, thereby form transparent printed circuit board (PCB).
2. the manufacture method of transparent printed circuit board (PCB) as claimed in claim 1, is characterized in that, the surperficial method that transparent substrates layer is adhered to this first blackening layer by the first colloid layer comprises step:
Liquid towards transparent colloid carries out prebake conditions, makes transparent colloid telogenesis semi-solid preparation shape, forms the first colloid layer; And
Transparent substrates layer is adhered to this first colloid layer by the method for pressing.
3. the manufacture method of transparent printed circuit board (PCB) as claimed in claim 1, is characterized in that, this prebake conditions temperature range is 85 DEG C ± 5 DEG C, and the prebake conditions time is 15 minutes ± 3 minutes.
4. the manufacture method of transparent printed circuit board (PCB) as claimed in claim 1, it is characterized in that, this second colloid layer is film, the method that forms successively the second colloid layer and transparent covering layer away from a side of this transparent substrates layer at this conducting wire layer is, by the method for pressing, this second colloid layer and transparent covering layer are formed to the surface of this conducting wire layer away from this transparent substrates layer successively, and the material of this second colloid layer fills up the space between the circuit of this conducting wire layer.
5. the manufacture method of transparent printed circuit board (PCB) as claimed in claim 1, is characterized in that, the thickness of this first colloid layer and the second colloid layer is all less than 15 microns, and the thickness range of this transparent substrates layer and transparent covering layer is 25 microns to 50 microns.
6. a transparent printed circuit board (PCB), comprising:
Transparent substrates layer;
Conducting wire layer, is adhered to the surface of this transparent substrates layer, and this conducting wire layer comprises copper body layer and be formed at relative two the first surperficial blackening layers of copper body layer and the second blackening layer, and this first blackening layer is adjacent with this transparent substrates layer; And
Transparent covering layer, this transparent covering layer is adhered to this second blackening layer surface.
7. transparent printed circuit board (PCB) as claimed in claim 6, it is characterized in that, between this transparent substrates layer and this conducting wire layer, the first colloid layer is set, so that this transparent substrates layer is mutually bonding with this conducting wire layer, between this conducting wire layer and this transparent covering layer, the second colloid layer is set, with by mutually bonding with this transparent covering layer this conducting wire layer, and the material of this second colloid layer is full of the space between the conducting wire of this conducting wire layer.
8. transparent printed circuit board (PCB) as claimed in claim 7, is characterized in that, the thickness of this first colloid layer and the second colloid layer is all less than 15 microns.
9. transparent printed circuit board (PCB) as claimed in claim 8, is characterized in that, the thickness range of this transparent substrates layer and transparent covering layer is 25 microns to 50 microns.
10. transparent printed circuit board (PCB) as claimed in claim 6, is characterized in that, the material of transparent substrates layer and this transparent covering layer is PET.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210477618.8A CN103841767A (en) | 2012-11-22 | 2012-11-22 | Transparent printed circuit board and manufacturing method thereof |
| TW101144344A TWI561129B (en) | 2012-11-22 | 2012-11-27 | Light-pervious printed circuit board method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210477618.8A CN103841767A (en) | 2012-11-22 | 2012-11-22 | Transparent printed circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103841767A true CN103841767A (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210477618.8A Pending CN103841767A (en) | 2012-11-22 | 2012-11-22 | Transparent printed circuit board and manufacturing method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN103841767A (en) |
| TW (1) | TWI561129B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104135826A (en) * | 2014-07-14 | 2014-11-05 | 中国航天科技集团公司第九研究院第七七一研究所 | Method for plating thick gold on printed board |
| CN105316736A (en) * | 2014-08-05 | 2016-02-10 | 上海蓝沛信泰光电科技有限公司 | Preparation method for low-reflectivity transparent conducting circuits |
| CN106304662A (en) * | 2015-05-27 | 2017-01-04 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN113556882A (en) * | 2020-04-23 | 2021-10-26 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of transparent circuit board and transparent circuit board |
| CN113677085A (en) * | 2020-05-13 | 2021-11-19 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board, transparent circuit board intermediate and transparent circuit board manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108156763B (en) * | 2016-12-05 | 2020-08-07 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and manufacturing method thereof |
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| JP2008028138A (en) * | 2006-07-21 | 2008-02-07 | Kyodo Printing Co Ltd | Method for manufacturing shielding material |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104135826A (en) * | 2014-07-14 | 2014-11-05 | 中国航天科技集团公司第九研究院第七七一研究所 | Method for plating thick gold on printed board |
| CN104135826B (en) * | 2014-07-14 | 2017-06-20 | 中国航天科技集团公司第九研究院第七七一研究所 | A kind of method in the thick gold of pcb plating |
| CN105316736A (en) * | 2014-08-05 | 2016-02-10 | 上海蓝沛信泰光电科技有限公司 | Preparation method for low-reflectivity transparent conducting circuits |
| CN106304662A (en) * | 2015-05-27 | 2017-01-04 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN106304662B (en) * | 2015-05-27 | 2019-06-11 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN113556882A (en) * | 2020-04-23 | 2021-10-26 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of transparent circuit board and transparent circuit board |
| CN113556882B (en) * | 2020-04-23 | 2022-08-16 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of transparent circuit board and transparent circuit board |
| CN113677085A (en) * | 2020-05-13 | 2021-11-19 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board, transparent circuit board intermediate and transparent circuit board manufacturing method |
| CN113677085B (en) * | 2020-05-13 | 2023-01-17 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board, transparent circuit board intermediate and transparent circuit board manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI561129B (en) | 2016-12-01 |
| TW201422069A (en) | 2014-06-01 |
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