CN103174718B - Stop dowel, manufacture method of stop dowel and circuit board compression device - Google Patents
Stop dowel, manufacture method of stop dowel and circuit board compression device Download PDFInfo
- Publication number
- CN103174718B CN103174718B CN201110437194.8A CN201110437194A CN103174718B CN 103174718 B CN103174718 B CN 103174718B CN 201110437194 A CN201110437194 A CN 201110437194A CN 103174718 B CN103174718 B CN 103174718B
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- China
- Prior art keywords
- pipe
- plastic casing
- pin body
- positioning dowel
- dowel
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 230000006835 compression Effects 0.000 title abstract 2
- 238000007906 compression Methods 0.000 title abstract 2
- 239000004033 plastic Substances 0.000 claims abstract description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 38
- 238000003825 pressing Methods 0.000 claims description 30
- 239000000314 lubricant Substances 0.000 claims description 8
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 2
- -1 polysiloxane Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000010687 lubricating oil Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 46
- 230000015572 biosynthetic process Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000005461 lubrication Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010096 film blowing Methods 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a manufacture method of a stop dowel. The manufacture method comprises the following steps: proving a column-shaped dowel body, attaching a lubricating oil layer on the surface of the dowel body, sleeving a plastic sleeve pipe on the surface of the dowel body, wherein the surface of the dowel body is attached with the lubricating oil layer, and heating the plastic sleeve pipe so as to contract the plastic sleeve pipe because of being heated and enable the plastic sleeve pipe to be tightly attached on the surface of the dowel body to form the stop dowel. The invention further relates to a stop dowel formed by the manufactured method being utilized and a circuit board compression device using the stop dowel.
Description
Technical field
The present invention relates to print circuit plates making technology, particularly a kind of for the positioning dowel of locating circuit board, the making method of this positioning dowel and the press fit of circuit boards device utilizing this positioning dowel.
Background technique
Along with electronic product is toward the development in miniaturization, speed up direction, circuit board is also from single-sided circuit board, double-sided PCB toward multilayer circuit board future development.Multilayer circuit board refers to the circuit board with multilayer conductive circuit, it has more wiring area, higher interconnect density, thus be widely used, see document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
Multilayer circuit board is primarily of multiple copper conductors layer and the mutual stacked formation of epoxides insulating substrate, and conductor layer can form circuit via processing procedures such as etching and plating.The stacked processing procedure of multilayer circuit board generally comprises following steps:
Rush multiple positioning hole respectively by for superimposed multiple circuit board and prepreg, this circuit board can be one-sided circuit board or Double-side line, and this prepreg is used for interval circuit board; There is provided a bottom plate, this bottom plate is formed with multiple pin mounting hole, be installed on one end of multiple pin in the plurality of pin mounting hole respectively, quantity and the position of the quantity of this pin mounting hole and position and the plurality of positioning hole are corresponding; Be set on respectively by positioning hole for superimposed circuit board and prepreg on the plurality of pin, the guiding by pin is successfully superimposed on this bottom plate; One upper mounted plate is provided, this upper mounted plate has positioning hole corresponding to multiple and the plurality of pin, be set on by the positioning hole of this upper mounted plate on the plurality of pin, the guiding by pin is pressed on the outermost surface of the sandwich plate base material formed by circuit board and prepreg; This bottom plate carrying circuit board and prepreg is transported in a pressing machine, pressing machine is vacuumized, a press fit device is adopted to force in this upper mounted plate, thus this circuit board of pressing and prepreg, heat this upper mounted plate and bottom plate simultaneously, prepreg is solidified at a certain temperature, thus makes this circuit board formation multilayer circuit board bonding with this prepreg.Certainly, also can form multiple multilayer circuit board by one step press, only need the demarcation strip with positioning hole be set between multiple precompressed plywood.
In order to reduce in bonding processes dislocation slippage between layers as much as possible, usually make the size of positioning hole as far as possible little, as: when the width of pin is diameter A, the width of the positioning hole on circuit board is A+0.0025 millimeter (mm), and on prepreg, the width of tooling hole is A+1.5mm.Because prepreg is being generally 3-4mm by gummosis diameter dimension during pressing, the material of prepreg inevitably flows to the space between the positioning hole of circuit board and demarcation strip etc. and pin, cause pin and circuit board, demarcation strip, bottom plate or upper mounted plate to be bonded together by pre-preg materials, pin cannot be taken out.
Summary of the invention
Therefore, be necessary to provide a kind of making method, positioning dowel and the press fit of circuit boards device that are easy to positioning dowel pin and other components and parts are separated.
A making method for positioning dowel, comprises the following steps: the pin body providing a column; Make this pin body surface attachment lube layer; This sheathed plastic casing-pipe in pin body surface of this lube layer is had in surface attachment; And heat this plastic casing-pipe, make plastic casing-pipe heat shrinkable and be close to the surface of this pin body, forming positioning dowel.
A kind of positioning dowel utilizing said method to make, for the location of circuit board in press fit of circuit boards processing procedure, this positioning dowel comprises a column pin body, be sheathed on the plastic casing-pipe on pin body surface and be arranged at pin body surface and lube layer between this pin body and this plastic casing-pipe, and this lube layer is used for the lubricate when this plastic casing-pipe is separated with this pin body.
A kind of press fit of circuit boards device, for the sandwich plate base material of the pre-formed multilayer circuit board of pressing, comprises multiple positioning dowel as above, a bottom plate and a upper mounted plate.This lower fixed slab has multiple pin fixed hole, and one end of the plurality of positioning dowel is individually fixed in the plurality of pin fixed hole.This upper mounted plate has multiple positioning hole, and the plurality of positioning hole is set in the plurality of positioning dowel respectively.During pressing, this sandwich plate base material is between this bottom plate and this upper mounted plate, and this upper mounted plate is used for pressing and fixes this sandwich plate base material.
In described positioning dowel, outside pin body, plastic casing-pipe is set and between pin body and plastic casing-pipe, lube layer is set, after multilayer circuit board stitching terminates, pin body and other components and parts as multilayer circuit board and upper mounted plate mutually bonding due to the gummosis of prepreg time, positioning dowel makes plastic casing-pipe be separated with pin body together with other components and parts with being separated of other components and parts, and lube layer makes separation become easy.
Accompanying drawing explanation
Fig. 1 is the flow chart of the positioning dowel making method of first embodiment of the invention.
Fig. 2 is the process schematic of method shown in Fig. 1.
Fig. 3 is the schematic diagram after the press fit of circuit boards device bearer circuit plate that provides of second embodiment of the invention and prepreg.
Fig. 4 is that in Fig. 3, press fit of circuit boards device implements the schematic diagram after pressing to the circuit board on it and prepreg.
Primary component symbol description
| Pin body | 10 |
| Lube layer | 20 |
| Plastic casing-pipe | 30 |
| Positioning dowel | 100 |
| Press fit of circuit boards device | 200 |
| The stacking module of circuit board | 40 |
| Upper buffer layer | 50 |
| Bottom breaker | 60 |
| Carrier | 70 |
| Pressboard | 80 |
| Pressing machine | 90 |
| Bottom plate | 401 |
| Demarcation strip | 402 |
| Upper mounted plate | 403 |
| Pin fixed hole | 404 |
| First positioning hole | 405 |
| Second positioning hole | 406 |
| Sandwich plate base material | 300 |
| Double-sided wiring board | 501、502 |
| Film | 503 |
| 3rd positioning hole | 504 |
| 4th positioning hole | 505 |
| Isolation layer | 501a |
| Multilayer circuit board | 506 |
| Line layer | 501b、501c |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1, first embodiment of the invention provides a kind of making method of positioning dowel, comprises the following steps:
Step 101: as shown in Fig. 2 (a), provides a pin body 10.
In the present embodiment, this pin body 10 is cylindric, and its material is generally metal or alloy etc.Be appreciated that this pin body 10 can also be the column structure such as polygon prism, cylindroid, be not limited to the present embodiment.
Step 102: as shown in Fig. 2 (b), is positioned over pin body 10 in lubricant oil and soaks, and makes its surface attachment lube layer 20.
After pin body 10 is soaked in lubricant oil, surface forms one deck lube layer 20, and soaking temperature is general room temperature.Preferably this pin body 10 is all immersed in lubricant oil, can adhere to lube layer 20 to make the whole surface of this pin body 10.In the present embodiment, this lubricant oil is can be resistance to 220 degree or higher than the high temperature of 220 degree, meaning and lubricant oil 220 degree and lower than the temperature of 220 degree under its can not decompose, character do not change, the lubricant oil of the present embodiment can be polysiloxane (also known as organic silicone oil) etc.Being appreciated that the method making pin body 10 surface attachment lube layer 20 can also adopt other, as adopted methods such as spraying or smear, being not limited to the present embodiment.
Step 103: as shown in Fig. 2 (c), at the sheathed plastic casing-pipe 30 in pin body 10 surface.
This plastic casing-pipe 30 is formed by film-blowing process, is sheathed on the surface that pin body 10 has adhered to lube layer 20 after plastic casing-pipe 30 is shaping.The material of this plastic casing-pipe 30 is polycarbonate (PC) or PETG.The film-blowing process of the present embodiment refers to and plastic material is extruded into light wall pipe by extruder raw materials melt, then while hot with pressurized air by its inflation, after cooling and shaping, namely obtain film products.Be set in remain between the plastic casing-pipe 30 on pin body 10 surface and pin body 10 and having space, the width range in this space is generally 1-2 millimeter (mm).
Step 104: as shown in Fig. 2 (d), heats pin body 10 and the plastic casing-pipe 30 that is sheathed on its surface, makes plastic casing-pipe 30 heat shrinkable and be tightly closely attached to the surface that pin body 10 attached to lube layer 20.
Heating-up temperature in step 104, higher than the glass transition temperature of plastic casing-pipe 30, to make plastic casing-pipe 30 melted by heating shrink, and then is close to the surface with lube layer 20 of pin body 10.The method of heating 30 can heat for being positioned over be arranged with 30 10 in baking oven.
Step 105: cool this plastic casing-pipe 30, obtains comprising pin body 10, is close to the positioning dowel 100 of the plastic casing-pipe 30 of pin body 10 surface setting and the lube layer 20 between pin body 10 and plastic casing-pipe 30.
Usually, the thickness range of the plastic casing-pipe 30 after contraction is 0.001mm-1mm, is preferably 0.01mm.Lube layer 20 act as effect plastic casing-pipe 30 being played from pin body 10 is pulled out time lubrication, be easy to glue from pin body 10 to make plastic casing-pipe 30.In the present embodiment, the thickness of lube layer 20 can be ignored compared with the thickness of plastic casing-pipe 30, as long as can play the effect of lubrication.
It should be noted that, after the specification of positioning dowel 100 is determined, when selecting the specification of pin body 10, only the specification of positioning dowel 100 need be deducted the thickness of plastic casing-pipe 30, the cylindric pin of to be radius the be 3mm of the specification as positioning dowel 100, and need the thickness of sheathed plastic casing-pipe 30 to be 0.1mm, so the specification of pin body 10 then selects radius to be the cylindric pin body of 2.9mm.Separately, if when lube layer 20 needs to have certain thickness, then the specification of pin body 10 determines the thickness also needing consideration lube layer 20.
Refer to Fig. 3, second embodiment of the invention provides a kind of press fit of circuit boards device 200, for pressing multilayer circuit board.This press fit of circuit boards device 200 comprises the stacking module of circuit board 40, upper buffer layer 50, bottom breaker 60, carrier 70, pressboard 80 and pressing machine 90, and the stacking module of this circuit board 40, upper buffer layer 50, bottom breaker 60, carrier 70 and pressboard 80 are contained in this pressing machine 90.The stacking module of this circuit board 40 comprises bottom plate 401, multiple demarcation strip 402, upper mounted plate 403 and two positioning dowels 100 as in the first embodiment.
Bottom plate 401 is rectangular, it offers two pin fixed holes 404, this pin fixed hole 404 is inserted in one end of two positioning dowels 100, this pin fixed hole 404 is identical with the shape of cross section of positioning dowel 100 and size is substantially equal, is firmly fixed on this bottom plate 401 to make one end of positioning dowel 100.The plurality of demarcation strip 402 is respectively arranged with first positioning hole 405 corresponding with these two positioning dowels 100, the plurality of demarcation strip 402 is generally steel plate, when pressing forms many group multilayer circuit boards, this first positioning hole 405 is set on the sandwich plate base material of this positioning dowel 100 interval adjacent group.This upper mounted plate 403 is provided with second positioning hole 406 corresponding with these two positioning dowels 100, second positioning hole 406 of this upper mounted plate 403 is set on this positioning dowel 100, this upper mounted plate 403, for stacking gradually after bottom plate 401 at sandwich plate base material, is pressed on the superiors of this sandwich plate base material.Be appreciated that the quantity of this positioning dowel in the present embodiment also more than two, can be not limited to the present embodiment.
This carrier 70 and pressboard 80 are also rectangular, slightly larger than this bottom plate 401, module 40 is folded with bearer circuit sheetpile in the below that this carrier 70 is arranged at the stacking module 40 of circuit board, this pressboard 80 is arranged at the top of the stacking module 40 of circuit board, for this upper mounted plate 403 of pressing, and then pressing forms multilayer circuit board.Meanwhile, carrier 70 and pressboard 80 also can be heated in the process of pressing, and by heat conduction extremely by the sandwich plate base material of pressing.On this, buffer layer 50 and bottom breaker 60 comprise multiwall kraft respectively, the way of this kind of kraft paper is boiled altogether by the mixed solution of pine and various highly basic, after its volatile matter runaway and removing acids, carries out immediately washing and precipitating, suppress after becoming paper pulp, and then form paper wood.Upper buffer layer 50 is arranged between pressboard 80 and upper mounted plate 403, bottom breaker 60 is arranged between carrier 70 and this bottom plate 401, and upper buffer layer 50 and bottom breaker 60 for cushioning the too fast transmission of heat and pressure force in the process of pressing multilayer circuit board.
See also Fig. 2 to Fig. 4, third embodiment of the invention provides a kind of making method of multilayer circuit board, and the method comprises the following steps:
Step 201: as shown in Figure 3, provides circuit board as described in the second embodiment stacking module 40, and two groups of sandwich plate base materials 300, wherein often organizes two double-sided wiring boards 501 and 502 and a film 503 that this sandwich plate base material 300 includes pre-pressing.
This film 503 can be prepreg, is arranged between these two double-sided wiring boards 501 and 502.This double-sided wiring board 501,502 has and these two positioning dowels 100 corresponding two the 3rd positioning holes 504 respectively respectively.Film 503 has and these two positioning dowels 100 corresponding two the 4th positioning holes 505 respectively.
This double-sided wiring board 501 comprises an isolation layer 501a and is formed at line layer 501b and 501c of the relative both sides of isolation layer respectively, this line layer 501b and 501c for the formation of the circuit turn-on of electric elements thereon, the structure of double-sided wiring board 502 and the similar of double-sided wiring board 501.
Step 202: the pin fixed hole 404 one end of two positioning dowels 100 being inserted respectively this bottom plate 401, to a wherein demarcation strip 402, wherein one group of sandwich plate base material 300, another demarcation strip 402, another group sandwich plate base material 300, 3rd demarcation strip 402 and upper mounted plate 403 are sequentially stacked on bottom plate 401, and two positioning dowels 100 are each passed through the first corresponding positioning hole 405, 3rd positioning hole 504, 4th positioning hole 505, and second positioning hole 406 guide this three demarcation strips 402, these two sandwich plate base materials 300 and this upper mounted plate 403 are evenly stacked on bottom plate 401.
Logical above stacking procedure, between the sandwich plate base material 300 of adjacent group, is spaced from each other by demarcation strip 402 between sandwich plate base material 300 and bottom plate 401 and sandwich plate base material 300.Be appreciated that the group number of this sandwich plate base material 300 also can be greater than two, correspondingly, the quantity of demarcation strip 402 also can be greater than three, is not limited to the present embodiment.
It should be noted that, through each layer heap poststack of step 201, the upper end of positioning dowel 100 and upper mounted plate 403 should have suitable distance away from the surface of this sandwich plate base material 300, so that upper mounted plate 403 under a certain pressure can this sandwich plate base material 300 of pressing downwards in follow-up pressing step, this realizes by controlling the modes such as the thickness of upper mounted plate 403, the thickness of demarcation strip 402 and quantity.
Step 203: upper buffer layer 50, bottom breaker 60, carrier 70, pressboard 80 and pressing machine 90 are as described in the second embodiment provided, bottom that this carrier 70 and pressboard 80 are arranged at pressing machine 90 is respectively relative with top, successively by being loaded with the stacking module of circuit board 40 of two groups of sandwich plate base materials 300 in bottom breaker 60, step 2, upper buffer layer 50 to be arranged on this carrier 70 and between this carrier 70 and pressboard 80.
Step 204: as shown in Figure 4, vacuumize in pressing machine 90, and pressboard 80 is moved down apply downward pressure to upper mounted plate 403, flow after making the material pressurized of the film 503 of this many groups sandwich plate base material 300, space between the circuit filling up the line layer of the double-sided wiring board 501 and 502 adjacent with film 503, and two double-sided wiring boards 501 and 502 are bonded together; Meanwhile, heat this carrier 70 and pressboard 80, this film 503 is solidified, the multiple multilayer circuit board 506 of final formation.
Step 205: pressboard 80 and upper buffer layer 50 are also removed by the pressure that release puts on pressboard 80, stacking for circuit board module 40 is shifted out from this pressing machine 90, and multilayer circuit board 506 entirety that upper mounted plate 403, demarcation strip 402 and pressing are formed is extracted out from this positioning dowel 100.
Owing to there is lube layer 20 between the plastic casing-pipe 30 outside positioning dowel 100 and pin body 10, therefore, when the gummosis of film 503 is bonded in plastic casing-pipe 30, can be separated together by related plastic casing-pipe 30 during being separated from positioning dowel 100 of upper mounted plate 403, demarcation strip 402 and multilayer circuit board 506, due to the lubrication of lube layer 20, upper mounted plate 403, demarcation strip 402 and multilayer circuit board 506 can be easy to be separated with the pin body 10 of this positioning dowel 100.
Step 206: multilayer circuit board 506 and the adjacent demarcation strip 402 of formation are separated, form multiple independently multilayer circuit board.
Because the very thin thickness of plastic casing-pipe 30 and intensity is less, so multilayer circuit board 506 is easier to the segregation ratio of adjacent demarcation strip 402.
Be appreciated that the multilayer circuit board 506 outermost surface line layer of above-mentioned formation also for not yet forming the Copper Foil of circuit, can form circuit after to be laminated again.After formation multilayer circuit board 506 to be laminated, generally also need to form a protective layer on outermost surface line layer, not oxidized with the copper of protection circuit layer.
Be appreciated that above-mentioned upper mounted plate 403, demarcation strip 402 and multilayer circuit board 506 also for be separated from pin body 10 one by one, can be not limited to the present embodiment with pin body 10 separation method of this positioning dowel 100 equally.
Utilize in the manufacturing method of multi-layer circuit board of above-mentioned positioning dowel 100, owing to having lube layer 20 between pin body 10 and plastic casing-pipe 30, from this positioning dowel 100, separate multiple layer circuit board is more prone to; And plastic casing-pipe 30 is close to pin body 10 surface, be not easily destroyed, when step 202 stacking each laminate, plastic casing-pipe 30 is not easily destroyed.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection domain that all should belong to the claims in the present invention with distortion.
Claims (11)
1. a making method for positioning dowel, comprises the following steps:
The pin body of one column is provided;
Make this pin body surface attachment lube layer;
This sheathed plastic casing-pipe in pin body surface of this lube layer is had in surface attachment; And
Heat this plastic casing-pipe, make plastic casing-pipe heat shrinkable and be close to the surface that this pin body is attached with this lube layer, form positioning dowel.
2. the making method of positioning dowel as claimed in claim 1, is characterized in that, makes the method for this pin body surface attachment lube layer be that this pin body be soaked in can in the lubricant oil of resistance to 220 degree and above temperature.
3. the making method of positioning dowel as claimed in claim 1, it is characterized in that, this plastic casing-pipe is formed by the method for blown film.
4. the making method of positioning dowel as claimed in claim 3, it is characterized in that, the material of this plastic casing-pipe is polycarbonate (PC) or PETG.
5. the making method of positioning dowel as claimed in claim 1, it is characterized in that, the temperature heating this plastic casing-pipe is greater than the glass transition temperature of this plastic casing-pipe.
6. the making method of positioning dowel as claimed in claim 2, it is characterized in that, the material of this lubricant oil is polysiloxane.
7. a positioning dowel, this positioning dowel is made by making method as claimed in claim 1, for locating circuit board in press fit of circuit boards processing procedure, this positioning dowel comprises a column pin body, be sheathed on the plastic casing-pipe on pin body surface and be arranged at pin body surface and lube layer between this pin body and this plastic casing-pipe, and this lube layer is used for the lubricate when this plastic casing-pipe is separated with this pin body.
8. positioning dowel as claimed in claim 7, it is characterized in that, the thickness of this plastic casing-pipe is 0.001 millimeter to 1 millimeter.
9. positioning dowel as claimed in claim 7, it is characterized in that, the material of this plastic casing-pipe is polycarbonate (PC) or PETG.
10. a press fit of circuit boards device, for pressing sandwich plate base material, this press fit of circuit boards device comprises multiple positioning dowel as described in any one of claim 7 to 9, one bottom plate and a upper mounted plate, this lower fixed slab has and multiple positioning dowel multiple pin fixed hole one to one, this upper mounted plate is relative with bottom plate, for coordinating the sandwich plate base material of pressing between this bottom plate and this upper mounted plate with this upper mounted plate, this upper mounted plate has and multiple positioning dowel multiple positioning hole one to one, the plurality of positioning dowel is between upper mounted plate and bottom plate, for passing this sandwich plate base material to fix this sandwich plate base material, one end of each positioning dowel is individually fixed in a corresponding pin fixed hole, the other end is arranged in a corresponding positioning hole.
11. press fit of circuit boards devices as claimed in claim 10, press fit of circuit boards device comprises a carrier and a pressboard further, this bottom plate is arranged on this carrier, between carrier and sandwich plate base material, this pressboard is arranged on this upper mounted plate, this upper mounted plate is between this sandwich plate base material and this pressboard, and this pressboard is used for applying pressure to this upper mounted plate, and then makes this sandwich plate base material be formed multilayer circuit board by pressing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110437194.8A CN103174718B (en) | 2011-12-23 | 2011-12-23 | Stop dowel, manufacture method of stop dowel and circuit board compression device |
| TW100148791A TWI422296B (en) | 2011-12-23 | 2011-12-27 | Positioning pin, method for manufacturing positioning pin and device for pressing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110437194.8A CN103174718B (en) | 2011-12-23 | 2011-12-23 | Stop dowel, manufacture method of stop dowel and circuit board compression device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103174718A CN103174718A (en) | 2013-06-26 |
| CN103174718B true CN103174718B (en) | 2014-12-24 |
Family
ID=48634799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110437194.8A Expired - Fee Related CN103174718B (en) | 2011-12-23 | 2011-12-23 | Stop dowel, manufacture method of stop dowel and circuit board compression device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103174718B (en) |
| TW (1) | TWI422296B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI655888B (en) * | 2017-09-21 | 2019-04-01 | 采悅科技股份有限公司 | Circuit board alignment hot pressing cushion setting method |
| CN114364129A (en) * | 2021-12-21 | 2022-04-15 | 张浩山 | Flexible circuit board pressing equipment |
| CN116922794B (en) * | 2023-07-03 | 2023-12-22 | 广东大洋医疗科技股份有限公司 | Rubber sleeve sleeving equipment and rubber sleeve sleeving process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2849291Y (en) * | 2005-03-31 | 2006-12-20 | 东风汽车公司 | Limit fixing device |
| CN101290025A (en) * | 2007-04-18 | 2008-10-22 | 上海贤达罗兰压力容器制造有限公司 | Gapless locating dowel |
| CN101776115A (en) * | 2010-03-25 | 2010-07-14 | 吴银辉 | Pin capable of preventing lubricating oil leakage and application thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4070470B2 (en) * | 2002-01-24 | 2008-04-02 | 新光電気工業株式会社 | Multilayer circuit board for semiconductor device, manufacturing method thereof, and semiconductor device |
| TW201008430A (en) * | 2008-08-06 | 2010-02-16 | Chin Poon Ind Co Ltd | Fixation device for the press fit of multilayer circuit board and rivet thereof |
-
2011
- 2011-12-23 CN CN201110437194.8A patent/CN103174718B/en not_active Expired - Fee Related
- 2011-12-27 TW TW100148791A patent/TWI422296B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2849291Y (en) * | 2005-03-31 | 2006-12-20 | 东风汽车公司 | Limit fixing device |
| CN101290025A (en) * | 2007-04-18 | 2008-10-22 | 上海贤达罗兰压力容器制造有限公司 | Gapless locating dowel |
| CN101776115A (en) * | 2010-03-25 | 2010-07-14 | 吴银辉 | Pin capable of preventing lubricating oil leakage and application thereof |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2003-218264A 2003.07.31 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI422296B (en) | 2014-01-01 |
| CN103174718A (en) | 2013-06-26 |
| TW201328455A (en) | 2013-07-01 |
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