CN210405773U - High temperature resistant insulating aluminum substrate - Google Patents
High temperature resistant insulating aluminum substrate Download PDFInfo
- Publication number
- CN210405773U CN210405773U CN201921437492.5U CN201921437492U CN210405773U CN 210405773 U CN210405773 U CN 210405773U CN 201921437492 U CN201921437492 U CN 201921437492U CN 210405773 U CN210405773 U CN 210405773U
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- China
- Prior art keywords
- layer
- copper foil
- copper
- high temperature
- basic unit
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 72
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000004411 aluminium Substances 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 9
- 230000006837 decompression Effects 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of aluminum substrates, and discloses an insulating aluminum substrate with high temperature resistance, which comprises an aluminum base layer, wherein an insulating layer is arranged at the top of the aluminum base layer, one side of the insulating layer, which is far away from the aluminum base layer, is connected with a copper foil layer, screw holes are arranged at the inner side edges of the aluminum base layer, the insulating layer and the copper foil layer, through holes are arranged at the inner middle parts of the aluminum base layer, the insulating layer and the copper foil layer, copper columns are arranged inside the through holes, a heat conducting fin is fixed at the middle part of the top of the copper foil layer, one end of each copper column is connected with the heat conducting fin, the other end of each copper column extends to the outer part of the through hole, a heat conducting block is arranged at the middle part of the bottom of the aluminum base layer, the utility model transmits high-temperature heat to the copper columns through the heat conducting, and then the effectual heat dissipation that dispels the heat, the life of the aluminium base board that increases.
Description
Technical Field
The utility model belongs to the technical field of aluminium base board, concretely relates to aluminium base board with high temperature resistance.
Background
The aluminum substrate is a metal-based copper-clad plate with a good heat dissipation function, a common single-sided plate is composed of three layers of structures, namely a circuit layer (copper foil), an insulating layer and a metal base layer, the high-end copper-clad plate is also designed to be a double-sided plate, the structure is the circuit layer, the insulating layer, the aluminum base, the insulating layer and the circuit layer, the aluminum-based copper-clad plate is rarely applied to a multi-layer plate, and the aluminum-based copper-clad plate can be formed by laminating a common multi-.
However, there are some defects in the use process of the aluminum substrate in the current market, for example, a module on the existing aluminum substrate may generate high temperature and release a large amount of heat, although the aluminum substrate itself is strong in high temperature resistance, the actual heat dissipation effect is poor, the long-time generated high temperature heat is easy to reduce the service life of the device, in addition, a structure for performing pressure reduction protection on the aluminum substrate is not provided, and because the aluminum substrate is light and thin in texture, the aluminum substrate is easy to bend and deform due to the fastening of the mounting screws and the pressure of the surrounding components, thereby affecting the normal use of the device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an insulated aluminum base board with high temperature resistance to the radiating effect who proposes in solving above-mentioned background is relatively poor, and does not set up the problem of carrying out the structure that reduces pressure and protect to aluminium base board.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an insulating aluminium base board with high temperature resistance, includes aluminium basic unit, the insulating layer is installed at aluminium basic unit's top, one side that aluminium basic unit was kept away from to the insulating layer is connected with the copper foil layer, the screw has all been seted up to the inside side of aluminium basic unit, insulating layer and copper foil layer, and has all seted up the through-hole in the middle of aluminium basic unit, insulating layer and the inside of copper foil layer, the internally mounted of through-hole has the copper post, be fixed with the conducting strip in the middle of the top of copper foil layer, the one end of copper post is connected with the conducting strip, and the other end of copper post extends to the outside of through-hole, install the heat conduction piece in the middle of aluminium basic unit's bottom, the heat conduction piece is close to one side of aluminium basic unit and.
Preferably, the fixed columns are installed at positions, close to one side of the heat conducting block, of two ends of the bottom of the aluminum base layer, the bottom of each fixed column is connected with a supporting column, one end, extending to the inside of the supporting column, of each fixed column is provided with a sliding block, the bottom of each sliding block is fixedly provided with a spring, one end, far away from the corresponding sliding block, of each spring is connected with the corresponding supporting column, telescopic cylinders are installed at one sides, close to the corresponding springs, of two ends of the bottom of each sliding block, and one ends, far.
Preferably, the inner wall of the clamping groove is provided with a base plate, and the outer wall of the base plate is provided with an anti-slip groove.
Preferably, the outer wall of the sliding block is provided with a rubber pad, and the outer wall of the rubber pad is provided with a sliding groove.
Preferably, the top side of copper foil layer is installed and is fixed ring, and fixed ring is located the top position department of screw.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses a conducting strip transmits the high temperature heat to the copper post on, then the copper post with high temperature heat conduction to the conducting block on, the conducting block is with heat diffusion to the outside through heat dissipation fin leaf, and then the effectual life who dispels the heat, the aluminium base board of increase.
(2) The utility model discloses a fixed column drives the slider and slides in a flexible section of thick bamboo, and then the slider extrudees the spring downwards, and later spring atress rebound has the effect of buffering decompression, and the stability can through the further additional strengthening of a flexible section of thick bamboo simultaneously, has the effect of supporting the protection, and then has realized the decompression protection, has avoided aluminium base board phenomenon that crooked deformation appears.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is an enlarged view of portion B of FIG. 2;
in the figure: 1-fixing ring, 2-copper foil layer, 3-screw hole, 4-heat conducting sheet, 5-insulating layer, 6-aluminum base layer, 7-heat radiating fin blade, 8-heat conducting block, 9-copper column, 10-clamping groove, 11-backing plate, 12-through hole, 13-fixing column, 14-rubber pad, 15-spring, 16-telescopic cylinder, 17-supporting column and 18-sliding block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a high-temperature-resistant insulating aluminum substrate comprises an aluminum base layer 6, an insulating layer 5 is installed at the top of the aluminum base layer 6, the insulating layer 5 can play a role of insulating and anticreeping electricity, one side, far away from the aluminum base layer 6, of the insulating layer 5 is connected with a copper foil layer 2, screw holes 3 are formed in the inner side edges of the aluminum base layer 6, the insulating layer 5 and the copper foil layer 2, through holes 12 are formed in the middle of the inner portions of the aluminum base layer 6, the insulating layer 5 and the copper foil layer 2, copper columns 9 are installed in the through holes 12, a heat conducting fin 4 is fixed in the middle of the top of the copper foil layer 2, one ends of the copper columns 9 are connected with the heat conducting fin 4, the other ends of the copper columns 9 extend to the outer portions of the through holes 12, a heat conducting block 8 is installed in the middle of the bottom of the aluminum base layer 6, one side, close to the aluminum base, when module work on aluminium base board produced high temperature and released a large amount of heats, the high temperature heat passes through conducting strip 4 and transmits to copper post 9 on, then copper post 9 conducts the high temperature heat to conducting block 8, and conducting block 8 diffuses the heat to the outside through heat dissipation fin leaf 7, and then the effectual life who dispels the heat, the aluminium base board of increase.
In order to prevent the aluminum substrate from being damaged under pressure and affecting the normal use of the device, in this embodiment, preferably, the fixed columns 13 are installed at the positions, close to one side of the heat conducting block 8, of the two ends of the bottom of the aluminum base layer 6, the supporting columns 17 are connected to the bottoms of the fixed columns 13, the sliders 18 are installed at the ends, extending to the inside of the supporting columns 17, of the fixed columns 13, the springs 15 are fixed to the bottoms of the sliders 18, one ends, far away from the sliders 18, of the springs 15 are connected to the supporting columns 17, the telescopic cylinders 16 are installed at the two ends, close to one sides of the springs 15, of the two ends of the bottoms of the sliders 18, are driven by the fixed columns 13 to slide in the telescopic cylinders 16 when the aluminum substrate is under pressure, the sliders 18 downwards extrude the springs 15, the springs 15 are rebounded under force to have a, the phenomenon of bending deformation of the aluminum substrate is avoided, and one end of the telescopic cylinder 16, which is far away from the sliding block 18, is connected with the supporting column 17.
In order to increase the firmness between the heat conducting block 8 and the copper column 9, in the embodiment, preferably, the backing plate 11 is installed on the inner wall of the clamping groove 10, the backing plate 11 plays a role in preventing skidding and stabilizing, and the outer wall of the backing plate 11 is provided with an antiskid groove.
In order to facilitate the movement of the sliding block 18, in the present embodiment, it is preferable that a rubber pad 14 is mounted on an outer wall of the sliding block 18, the rubber pad 14 can make the sliding block 18 closely contact with an inner wall of the fixed column 13, and a sliding groove is formed on an outer wall of the rubber pad 14.
In order to prevent the bolt from being scratched on the module element, in the embodiment, preferably, the fixing ring 1 is installed on the top side edge of the copper foil layer 2, the fixing ring 1 plays a role of protection, the module element can be prevented from being damaged by a raised part when the bolt is installed, and the fixing ring 1 is located at the upper position of the screw hole 3.
The utility model discloses a theory of operation and use flow: the utility model discloses a when using, at first weld electronic module to copper foil layer 2 on, then through bolt nail income screw 3 with aluminium base plate position fixation, the solid fixed ring 1 of screw 3 top can play the effect of restriction to the bolt simultaneously, prevent that the part that the bolt is high from producing module component and scraping and destroying, later when aluminium base plate receives the pressure effect, drive slider 18 through fixed column 13 and slide in expansion cylinder 16, then slider 18 extrudes spring 15 downwards, later spring 15 atress bounce-back has the effect of buffering decompression, simultaneously through the stability ability of the further additional strengthening of expansion cylinder 16, the effect of supporting protection has, and then realized decompression protection, the phenomenon that aluminium base plate appears bending deformation has been avoided, aluminium base layer 6 and insulating layer 5 of aluminium base plate itself can play high temperature resistant and insulating effect, when module work on the aluminium base plate produces high temperature and releases a large amount of heat, high temperature heat passes through conducting strip 4 and transmits to copper post 9 on, then copper post 9 conducts high temperature heat to heat conduction piece 8, and heat conduction piece 8 is with heat diffusion to the outside through heat dissipation fin leaf 7, and then the effectual life who dispels the heat, the aluminium base board of increase.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. An insulated aluminum substrate with high temperature resistance, which is characterized in that: including aluminium basic unit, the insulating layer is installed at aluminium basic unit's top, one side that aluminium basic unit was kept away from to the insulating layer is connected with the copper foil layer, the screw has all been seted up to aluminium basic unit, insulating layer and copper foil layer's inside side, and has all seted up the through-hole in the middle of aluminium basic unit, insulating layer and the inside of copper foil layer, the internally mounted of through-hole has the copper post, be fixed with the conducting strip in the middle of the top of copper foil layer, the one end of copper post is connected with the conducting strip, and the other end of copper post extends to the outside of through-hole, install the conducting block in the middle of aluminium basic unit's the bottom, the conducting block is close to one side of aluminium basic unit and seted up with copper post assorted draw.
2. The insulated aluminum substrate with high temperature resistance according to claim 1, wherein: the aluminum base layer is characterized in that fixed columns are mounted at positions, close to one side of the heat conducting block, of two ends of the bottom of the aluminum base layer, support columns are connected to the bottoms of the fixed columns, a sliding block is mounted at one end, extending to the inside of the support column, of each fixed column, springs are fixed at the bottoms of the sliding blocks, one ends, far away from the sliding blocks, of the springs are connected with the support columns, telescopic cylinders are mounted at one sides, close to the springs, of two ends of the bottom of the sliding blocks, and one ends.
3. The insulated aluminum substrate with high temperature resistance according to claim 1, wherein: the inner wall of the clamping groove is provided with a base plate, and the outer wall of the base plate is provided with an anti-slip groove.
4. The aluminum substrate as claimed in claim 2, wherein: the outer wall of the sliding block is provided with a rubber pad, and the outer wall of the rubber pad is provided with a sliding groove.
5. The insulated aluminum substrate with high temperature resistance according to claim 1, wherein: and a fixing ring is installed on the side edge of the top of the copper foil layer, and the fixing ring is positioned above the screw hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921437492.5U CN210405773U (en) | 2019-08-29 | 2019-08-29 | High temperature resistant insulating aluminum substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921437492.5U CN210405773U (en) | 2019-08-29 | 2019-08-29 | High temperature resistant insulating aluminum substrate |
Publications (1)
Publication Number | Publication Date |
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CN210405773U true CN210405773U (en) | 2020-04-24 |
Family
ID=70340303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201921437492.5U Expired - Fee Related CN210405773U (en) | 2019-08-29 | 2019-08-29 | High temperature resistant insulating aluminum substrate |
Country Status (1)
Country | Link |
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CN (1) | CN210405773U (en) |
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2019
- 2019-08-29 CN CN201921437492.5U patent/CN210405773U/en not_active Expired - Fee Related
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200424 |