CN210405780U

CN210405780U - Improved low-impedance multilayer circuit board

Info

Publication number: CN210405780U
Application number: CN201921335136.2U
Authority: CN
Inventors: 涓ユ尝; 严波
Original assignee: Shenzhen City Gold Zhizhuo Technology Co Ltd
Current assignee: Shenzhen City Gold Zhizhuo Technology Co Ltd
Priority date: 2019-08-17
Filing date: 2019-08-17
Publication date: 2020-04-24
Anticipated expiration: 2029-08-17

Abstract

The utility model relates to the technical field of circuit boards, and discloses an improved low-impedance multilayer circuit board, wherein a first insulating layer is bonded on the lower surface of a top plate, a connecting column is fixedly installed on the lower surface of the first insulating layer, a second circuit board layer is fixedly connected on the lower surface of the connecting column, a third insulating layer is bonded on the lower surface of the second circuit board layer, a connecting column is fixedly connected on the lower surface of the third insulating layer, a first circuit board layer is fixedly connected on the lower surface of the connecting column, a second insulating layer is bonded on the lower surface of the first circuit board layer, a connecting column is fixedly connected on the lower surface of the second insulating layer, a bottom plate is fixedly connected on the lower surface of the connecting column, a connecting component is movably connected on the lower surface of the bottom plate, a heat dissipation component is fixedly installed on the upper surface of the top, ensure the normal and stable working operation of the circuit board.

Description

Improved low-impedance multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is an improvement low impedance multilayer circuit board.

Background

The multilayer board is a multilayer wiring layer, a medium layer is arranged between every two layers, the medium layer can be made to be very thin, the multilayer circuit board is provided with at least three conductive layers, two layers are arranged on the outer surface, the rest layer is combined in an insulating board, the electrical connection between the layers is usually realized through plated through holes in the cross section of the circuit board, the market of circuit board blocks is continuously developed, the demand of the multilayer circuit board is increased, however, the heat dissipation effect of the existing multilayer circuit board is not good, and the mounting and fixing are very troublesome. Accordingly, one skilled in the art provides an improved low impedance multilayer wiring board to solve the above-mentioned problems of the background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an improvement low impedance multilayer circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides an improvement low impedance multilayer circuit board, includes the roof, the lower surface of roof bonds and has the first insulation layer, the lower fixed surface on first insulation layer installs the spliced pole, the lower fixed surface on spliced pole is connected with second circuit board layer, the lower surface on second circuit board layer bonds and has the third insulating layer, the lower fixed surface on third insulating layer is connected with the spliced pole, the lower fixed surface on spliced pole is connected with first circuit board layer, the lower surface on first circuit board layer bonds and has the second insulating layer, the lower fixed surface on second insulating layer is connected with the spliced pole, the lower fixed surface of spliced pole is connected with the bottom plate, the lower surface swing joint of bottom plate has coupling assembling, the last fixed surface of roof installs radiator unit.

As a further aspect of the present invention: coupling assembling includes otic placode, screw hole, spacing bolt, gag lever post, slide, spring and base, the inside fixedly connected with spring of base, spring top fixedly connected with slide, the inside sliding connection of base has the gag lever post, and the front surface through connection of base has spacing bolt, one side fixedly connected with otic placode of base, the upper surface of otic placode is seted up threaded hole.

As a further aspect of the present invention: the radiating assembly comprises a radiating plate, a radiating connecting piece, a radiating connecting strip and a heat absorbing strip, wherein the radiating connecting strip is fixedly connected to the front surface of the heat absorbing strip, the radiating connecting piece is fixedly connected to the upper surface of the radiating connecting strip, and the radiating plate is fixedly connected to the rear surface of the radiating connecting strip.

As a further aspect of the present invention: the material of first insulating layer, second circuit board layer and first circuit board layer is rubber, and the thickness of first insulating layer, second circuit board layer and first circuit board layer is the same, the thickness of first insulating layer, second circuit board layer and first circuit board layer is 0.2 mm.

As a further aspect of the present invention: the quantity of gag lever post is 2, and gag lever post fixed symmetry connects and is close to both ends position department about the bottom plate lower surface.

As a further aspect of the present invention: the quantity of screw hole is 6, and the aperture of screw hole is 2 mm.

As a further aspect of the present invention: the quantity of heat dissipation connecting strip and heat dissipation connection piece is 3 respectively, and the material of heat dissipation connecting strip and heat dissipation connection piece is copper.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses an it can all evacuate away the heat that each layer of circuit board produced as far as to have increased radiator unit, ensure that the circuit board can normal stable work operation, and radiator unit's setting is through the successive layer heat dissipation, make the radiating effect better, can make the circuit board convenient and fast more in the installation through having increased coupling assembling, make the staff at the installation, convenient and fast more when maintaining, make staff's work efficiency obtain improving, and coupling assembling is when guaranteeing to connect firmly, dismantlement that can be very convenient through the setting of spring.

Drawings

FIG. 1 is a schematic diagram of an improved low impedance multi-layer circuit board;

FIG. 2 is a schematic view of a connecting assembly of the improved low impedance multi-layer circuit board;

FIG. 3 is a schematic view of an improved low impedance multi-layer circuit board with heat sink strips mounted thereon.

In the figure: 1. a top plate; 2. a first insulating layer; 3. a heat dissipating component; 4. connecting columns; 5. a heat dissipation plate; 6. a heat dissipation connecting sheet; 7. a connecting assembly; 8. an ear plate; 9. a threaded hole; 10. a second insulating layer; 11. a first circuit board layer; 12. a third insulating layer; 13. a second circuit board layer; 14. a base plate; 15. a limit bolt; 16. a limiting rod; 17. a slide plate; 18. a spring; 19. a base; 20. a heat-dissipating connecting strip; 21. and a heat sink strip.

Detailed Description

Referring to fig. 1 to 3, in an embodiment of the present invention, an improved low impedance multilayer circuit board includes a top plate 1, a first insulating layer 2 is adhered to a lower surface of the top plate 1, a connection post 4 is fixedly installed on a lower surface of the first insulating layer 2, a second circuit board layer 13 is fixedly connected to a lower surface of the connection post 4, a third insulating layer 12 is adhered to a lower surface of the second circuit board layer 13, a connection post 4 is fixedly connected to a lower surface of the third insulating layer 12, a first circuit board layer 11 is fixedly connected to a lower surface of the connection post 4, a second insulating layer 10 is adhered to a lower surface of the first circuit board layer 11, a connection post 4 is fixedly connected to a lower surface of the second insulating layer 10, a bottom plate 14 is fixedly connected to a lower surface of the connection post 4, the first insulating layer 2, the second circuit board layer 13 and the first circuit board layer 11 are made of rubber, thicknesses of the first, the thickness of the first insulating layer 2, the second wiring board layer 13, and the first wiring board layer 11 was 0.5 mm.

In fig. 1 and 2: the lower surface of the bottom plate 14 is movably connected with a connecting assembly 7, the connecting assembly 7 comprises an ear plate 8, a threaded hole 9, a limiting bolt 15, a limiting rod 16, a sliding plate 17, a spring 18 and a base 19, the spring 18 is fixedly connected inside the base 19, the sliding plate 17 is fixedly connected at the top end of the spring 18, the limiting rod 16 is slidably connected inside the base 19, the limiting bolt 15 penetrates through the front surface of the base 19, the ear plate 8 is fixedly connected to one side of the base 19, the threaded hole 9 is formed in the upper surface of the ear plate 8, the number of the limiting rods 16 is 4, the limiting rods 16 are fixedly and symmetrically connected to the lower surface of the bottom plate 14 at positions close to the left end and the right end, the number of the threaded holes 9 is 6, the aperture of the threaded hole 9 is 2mm, the circuit board can be more convenient and fast to install by adding the, the work efficiency of workers is improved, and the connecting component 7 can be conveniently detached through the arrangement of the spring 18 while the connection stability is ensured.

In fig. 1 and 3: fixed surface installs radiator unit 3 on roof 1, radiator unit 3 includes heating panel 5, heat dissipation connection piece 6, heat dissipation connection strip 20 and heat absorption strip 21, the front surface fixedly connected with heat dissipation connection strip 20 of heat absorption strip 21, the last fixed surface of heat dissipation connection strip 20 is connected with heat dissipation connection piece 6, heat dissipation connection piece 6's rear surface fixedly connected with heating panel 5, heat dissipation connection strip 20 is 3 respectively with heat dissipation connection piece 6's quantity, and heat dissipation connection strip 20 is copper with heat dissipation connection piece 6's material, the utility model discloses an it can all evacuate the heat that each layer of circuit board produced as far as to have increased radiator unit 3, ensures that the circuit board can normal stable operational operation to radiator unit 3's setting is passed through the successive layer heat dissipation, makes the radiating effect better.

The utility model discloses a theory of operation is: when the circuit board is installed, firstly, the base 19 is fixed and fixed through the screw holes 9 on the lug plates 8 by screws, then the circuit board is clamped on the base 19, the limiting rod 16 on the lower surface of the bottom plate 14 is clamped on the base 19, then the limiting bolt 15 is screwed, the circuit board is ensured to be fixed and fixed stably, when the circuit board needs to be maintained, a worker only needs to unscrew the limiting bolt 15, then the circuit board can be separated from the base 19, the sliding plate 17 and the spring 18 which are arranged in the base 19 can help the worker to easily take out the circuit board, when the circuit board is maintained through the arrangement of the connecting assembly 7, the worker does not need to carry out complex disassembly and assembly processes, the working efficiency is improved, when the circuit board works, the multilayer circuit board can generate more heat, the heat on the circuit board body is absorbed through the heat absorbing strip 21, then, the heat is transmitted from the heat absorbing strips 21 to the heat dissipating connecting strips 20, and then the heat on the heat dissipating connecting strips 20 is transmitted to the heat dissipating plate 5 through the heat dissipating connecting sheets 6 for heat dissipation.

The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides an improvement low impedance multilayer circuit board, includes roof (1), its characterized in that, the lower surface bonding of roof (1) has first insulating layer (2), the lower fixed surface on first insulating layer (2) installs spliced pole (4), the lower fixed surface of spliced pole (4) is connected with second circuit board layer (13), the lower surface bonding of second circuit board layer (13) has third insulating layer (12), the lower fixed surface of third insulating layer (12) is connected with spliced pole (4), the lower fixed surface of spliced pole (4) is connected with first circuit board layer (11), the lower surface bonding of first circuit board layer (11) has second insulating layer (10), the lower fixed surface of second insulating layer (10) is connected with spliced pole (4), the lower fixed surface of spliced pole (4) is connected with bottom plate (14), the lower surface swing joint of bottom plate (14) has coupling assembling (7), the last fixed surface of roof (1) installs radiator unit (3).

2. An improved low impedance multilayer circuit board according to claim 1, wherein the connection assembly (7) comprises an ear plate (8), a threaded hole (9), a limit bolt (15), a limit rod (16), a sliding plate (17), a spring (18) and a base (19), the spring (18) is fixedly connected inside the base (19), the sliding plate (17) is fixedly connected to the top end of the spring (18), the limit rod (16) is slidably connected inside the base (19), the limit bolt (15) is connected to the front surface of the base (19) in a penetrating manner, the ear plate (8) is fixedly connected to one side of the base (19), and the threaded hole (9) is formed in the upper surface of the ear plate (8).

3. An improved low impedance multilayer circuit board according to claim 1, wherein the heat dissipation assembly (3) comprises a heat dissipation plate (5), a heat dissipation connecting piece (6), a heat dissipation connecting strip (20) and a heat absorption strip (21), the heat dissipation connecting strip (20) is fixedly connected to the front surface of the heat absorption strip (21), the heat dissipation connecting piece (6) is fixedly connected to the upper surface of the heat dissipation connecting strip (20), and the heat dissipation plate (5) is fixedly connected to the rear surface of the heat dissipation connecting piece (6).

4. An improved low impedance multilayer circuit board according to claim 1, wherein the first insulating layer (2), the second circuit board layer (13) and the first circuit board layer (11) are made of rubber, the first insulating layer (2), the second circuit board layer (13) and the first circuit board layer (11) have the same thickness, and the first insulating layer (2), the second circuit board layer (13) and the first circuit board layer (11) have a thickness of 0.5 mm.

5. An improved low impedance multilayer circuit board according to claim 2, wherein the number of the limiting rods (16) is 4, and the limiting rods (16) are fixedly and symmetrically connected to the lower surface of the bottom plate (14) near the left and right ends.

6. An improved low impedance multilayer circuit board according to claim 2, wherein the number of said threaded holes (9) is 6, and the diameter of said threaded holes (9) is 2 mm.

7. An improved low impedance multilayer circuit board according to claim 3, wherein the number of the heat dissipation connecting strips (20) and the number of the heat dissipation connecting pieces (6) are 3 respectively, and the heat dissipation connecting strips (20) and the heat dissipation connecting pieces (6) are made of copper.