CN219225444U

CN219225444U - Embedded main board

Info

Publication number: CN219225444U
Application number: CN202320281695.XU
Authority: CN
Inventors: 彭俊亮; 孙续伟; 汪新辉
Original assignee: Xinman Technology Shenzhen Co ltd
Current assignee: Xinman Technology Shenzhen Co ltd
Priority date: 2023-02-09
Filing date: 2023-02-09
Publication date: 2023-06-20
Anticipated expiration: 2033-02-09

Abstract

The utility model provides an embedded motherboard, which comprises a motherboard body, wherein the motherboard body comprises a substrate, a radiator, a wiring panel and a top plate, wherein a side plate is arranged on the side edge of the substrate, the wiring panel is arranged on the surface of the side plate, the top plate is arranged on the top of the side plate, the top plate and the side plate are welded into a whole, copper columns penetrate through the surface of the substrate, the radiator is arranged on the surface of the top plate, a central processing unit is embedded on the surface of the substrate, the installation depth of the motherboard can be regulated and controlled by using the lengthened copper columns, meanwhile, the specific installation position of the wiring panel can be kept at the set initial position, the installation flexibility of the motherboard is improved, and silicone grease can be prevented from being extruded to the outside when the radiator is installed and pressed by using the radiator to attach and press the central processing unit, so that the condition of overflowing caused by excessive silicone grease coating is avoided.

Description

Embedded main board

Technical Field

The utility model relates to the technical field of mainboards, in particular to an embedded mainboard.

Background

The embedded main board is a cpu board embedded in industrial equipment for control and data processing, and the volume, power consumption, heat dissipation and other requirements of the embedded main board are relatively high. Therefore, in general, the embedded motherboard needs to include: according to the technical scheme disclosed by the embedded main board disclosed in the prior art such as the embedded main board disclosed in Chinese patent document CN201920304785.X, a methyl cellulose waterproof layer is uniformly arranged at the top of the inside of a main board underframe, a rubber plastic fiber insulating layer is uniformly arranged at the bottom of the methyl cellulose waterproof layer, and foam heat insulation inner board layers are uniformly arranged at the bottom of the rubber plastic fiber insulating layer, so that the waterproof and insulating functions of materials adopted by the device are realized, the service life of the device is prolonged when the embedded main board is used, and the safety of the device can be enhanced due to the generation of insulating materials.

According to the technical scheme disclosed by the prior art, the embedded main board still needs to perform heat dissipation treatment on the central processing unit part through the conventional radiator equipment on the surface, so that various electronic components on the surface of the conventional embedded main board can be influenced by heat dissipation airflow for a long time, dust can be accumulated on the surface after long-time use, the fault rate is improved, and on the other hand, the installation position of the conventional embedded main board is fixed and limited by the opening position of the wiring panel, and the installation position cannot be regulated and controlled freely according to the occupation condition of other parts in the equipment.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model aims to provide an embedded main board so as to solve the problems in the background art, improve the protection effect on electronic elements on the main board, and have long service life and higher flexibility.

In order to achieve the above object, the present utility model is realized by the following technical scheme: the utility model provides an embedded mainboard, includes the mainboard body, the mainboard body includes base plate, radiator, wiring panel and roof, the curb plate is installed to the side of base plate, wiring panel sets up the surface at the curb plate, the roof sets up at the top of curb plate, and roof and curb plate welding are whole, the surface of roof alternates there is the copper post, the copper post passes from the surface of base plate, the radiator sets up the surface at the roof, the surface of base plate inlays and is equipped with central processing unit, the bottom of radiator is provided with the laminating board, the laminating board is pressed at central processing unit's surface.

Further, the bottom of copper post is provided with the screw thread post, the surface of copper post is provided with the external screw thread, the surface cover of external screw thread is equipped with the clamping lantern ring.

Furthermore, two clamping collars are sleeved on the surface of each copper column, and the two clamping collars are respectively arranged at the top of the top plate and the bottom of the base plate.

Further, the side of wiring panel has seted up the screw hole, the both ends of curb plate are provided with the splint, the bar hole has been seted up on the surface of curb plate, the both ends of wiring panel laminate mutually with the inboard of two splint respectively.

Further, the side edge of the wiring panel is fixed after sequentially penetrating through the clamping plate and the threaded hole by using a screw, and the rear end of the wiring panel is connected with the control circuit part on the surface of the substrate after penetrating through the strip-shaped hole by using a signal wire.

Further, the radiator comprises radiating fins and a heat conducting layer, a pressing plate is arranged at the bottom end of each radiating fin, an abutting plate is arranged at the bottom end of each pressing plate, the heat conducting layer is arranged at the bottom of each abutting plate, and an attaching plate is arranged at the bottom end of each heat conducting layer.

Furthermore, the outside of the top of the central processing unit is provided with a coaming, and the surface of the central processing unit is coated with a silicone grease layer.

Further, an interlayer is arranged between the coaming and the side edge of the central processing unit, the attaching plate is pressed on the surface of the silicone grease layer, the bottom of the coaming is attached to the bottom shell of the central processing unit, and a plurality of heat dissipation copper pipes are inserted in the heat conducting layer.

The utility model has the beneficial effects that: the embedded main board comprises a main board body, wherein the main board body comprises a base plate, a top plate, copper columns, external threads, thread columns, clamping lantern rings, a wiring panel, a radiator, clamping plates, side plates, strip-shaped holes, threaded holes, radiating fins, pressing plates, butt plates, a heat conducting layer, butt screws, a bonding plate, a central processing unit, a coaming, an interlayer and a silicone grease layer.

1. This embedded mainboard can regulate and control this mainboard through using the copper post of extension, can keep the concrete position of installation of wiring panel on the initial position of settlement simultaneously at the inside position of equipment and embedding degree of depth, has consequently improved the installation flexibility of this mainboard, and does not influence the follow-up wiring and use the degree of difficulty.

2. This embedded mainboard shelters from base plate and all kinds of electronic components on the base plate through the roof, provides extra shielding protection function, sets up the radiator in the outside of roof simultaneously, consequently can avoid the air current that the heat dissipation produced to produce the influence to electronic components, has taken into account protective properties and heat dispersion simultaneously, has reduced the fault rate.

3. According to the embedded main board, the coaming is additionally arranged on the side edge of the central processing unit, so that when the radiator is installed, after the silicone grease layer is coated, silicone grease can be prevented from being extruded to the outside when the central processing unit is laminated and pressed by the radiator, and overflow caused by excessive silicone grease coating is avoided.

Drawings

Fig. 1 is a schematic structural diagram of an external shape of an embedded motherboard according to the present utility model;

FIG. 2 is a schematic view of an embedded motherboard patch panel portion according to the present utility model;

FIG. 3 is a schematic diagram of an embedded motherboard radiator portion according to the present utility model;

FIG. 4 is a cross-sectional view of a bottom portion of an embedded motherboard heat sink according to the present utility model;

in the figure: 1. a substrate; 2. a top plate; 3. copper columns; 4. an external thread; 5. a threaded column; 6. clamping the lantern ring; 7. a wiring panel; 8. a heat sink; 9. a clamping plate; 10. a side plate; 11. a bar-shaped hole; 12. a threaded hole; 13. a heat radiation fin; 14. a pressing plate; 15. an abutting plate; 16. a heat conducting layer; 17. docking the screw; 18. bonding plates; 19. a central processing unit; 20. coaming plate; 21. an interlayer; 22. and a silicone grease layer.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

Referring to fig. 1 to 4, the present utility model provides a technical solution: the utility model provides an embedded mainboard, includes the mainboard body, the mainboard body includes base plate 1, radiator 8, wiring panel 7 and roof 2, curb plate 10 is installed to the side of base plate 1, wiring panel 7 sets up the surface at curb plate 10, roof 2 sets up the top at curb plate 10, and roof 2 and curb plate 10 weld as a whole, the surface of roof 2 alternates there is copper post 3, copper post 3 passes from the surface of base plate 1, radiator 8 sets up the surface at roof 2, the surface of base plate 1 is inlayed and is equipped with central processing unit 19, the bottom of radiator 8 is provided with laminating board 18, laminating board 18 presses the surface at central processing unit 19, the inside of this embedded mainboard installation industrial equipment, during the installation, utilizes copper post 3 to support the lift to whole embedded mainboard, every electronic components and central processing unit 19 part on the mainboard surface all install the surface at base plate 1 to shelter from through roof 2 at the top simultaneously, the side is sheltered from the surface through curb plate 10, then with radiator 8 from the surface pre-opened in roof 2 surface, the bottom is provided with laminating board 18, laminating board 18 presses the surface at the surface processing unit 19 at the center processing unit 19, can be accomplished with the realization of the corresponding cable after the realization of the cable is connected with the outside and can use the realization of the wiring cable to the outside.

According to the embodiment, the threaded column 5 is arranged at the bottom of the copper column 3, the external threads 4 are arranged on the surface of the copper column 3, the clamping collars 6 are sleeved on the surface of the external threads 4, two clamping collars 6 are sleeved on the surface of the copper column 3, the two clamping collars 6 are respectively arranged at the top of the top plate 2 and the bottom of the substrate 1, the position and the embedding depth of the main board inside the device can be regulated and controlled by using the lengthened copper column 3, after the main board mounting position is regulated, the mounting specific position of the wiring panel 7 can still be kept at the set initial position, so that the mounting flexibility of the main board is improved, the subsequent wiring use difficulty is not affected, in particular, during mounting, the threaded column 5 is inserted into a hole pre-opened in the inner wall of the device, then the substrate 1 and the top plate 2 of the whole main board are sleeved on the surface of the copper column 3, the bottom of the substrate 1 is supported by using the clamping collars 6, the surface of the top plate 2 is pressed simultaneously, the state of the main board can be fixed on the inner wall of the main board, and the electronic device can be prevented from being directly contacted with the electronic device 1 by using the substrate 1 at a certain height, and the electronic device can be prevented from being directly contacted with the electronic device.

In this embodiment, screw hole 12 has been seted up to the side of wiring panel 7, the both ends of curb plate 10 are provided with splint 9, bar hole 11 has been seted up on the surface of curb plate 10, the both ends of wiring panel 7 are laminated mutually with the inboard of two splint 9 respectively, the side of wiring panel 7 is fixed after passing splint 9 and screw hole 12 in proper order through using the screw, the rear end of wiring panel 7 is connected with the control circuit part on base plate 1 surface after passing bar hole 11 through using the signal line, supports the installation back to this embedded mainboard through copper post 3, can carry out corresponding regulation and control with wiring panel 7 until wiring panel 7 aligns with the wiring passageway that equipment reserved, specifically, through pulling wiring panel 7, use screw through-connection can after the screw hole 12 of side aligns with the hole that reserves on splint 9.

In this embodiment, the heat spreader 8 includes a heat dissipation fin 13 and a heat conduction layer 16, the bottom end of the heat dissipation fin 13 is provided with a pressing plate 14, the bottom end of the pressing plate 14 is provided with a butt joint plate 15, the heat conduction layer 16 is installed at the bottom of the butt joint plate 15, the bottom end of the heat conduction layer 16 is provided with a bonding plate 18, the outside of the top of the central processing unit 19 is provided with a coaming 20, and the surface of the central processing unit 19 is coated with a silicone grease layer 22), an interlayer 21 is arranged between the coaming 20 and the side of the central processing unit 19), the bonding plate 18 is pressed on the surface of the silicone grease layer 22), the bottom of the coaming 20 is bonded with the bottom shell part of the central processing unit 19, a plurality of heat dissipation copper pipes are inserted in the heat conduction layer 16, the substrate 1 and various electronic components on the substrate 1 are shielded by the top plate 2, providing an additional shielding protection function, and simultaneously arranging the radiator 8 outside the top plate 2, so that the influence of air flow generated by heat dissipation on electronic components can be avoided, meanwhile, the protection performance and the heat dissipation performance are simultaneously considered, the failure rate is reduced, the coaming 20 is additionally arranged on the side edge of the central processing unit 19, therefore, when the radiator 8 is arranged, after the silicone grease layer 22 is coated, the silicone grease is prevented from being extruded to the outside when the central processing unit 19 is laminated and pressed by the radiator 8, and the condition that the silicone grease is excessively coated to cause overflowing is avoided, specifically, when the radiator 8 is arranged, the silicone grease is coated on the surface of the central processing unit 19, then the radiator 8 is integrally pressed on the central processing unit 19, the silicone grease is extruded to the side edge after the pressing, and the extruded part is concentrated and piled in the interlayer 21), then, the butt screw 17 is controlled to press the pressing plate 14 on the surface of the butt plate 15, the pressure on the silicone grease layer 22) is increased, and when the heat is subsequently dissipated, the heat dissipated on the central processing unit 19 is led out to the heat dissipation fins 13 through the heat conduction layer 16, and the heat dissipation effect can be realized by matching with an external heat dissipation fan.

While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. The utility model provides an embedded mainboard, includes the mainboard body, its characterized in that: the mainboard body includes base plate (1), radiator (8), wiring panel (7) and roof (2), curb plate (10) are installed to the side of base plate (1), wiring panel (7) set up the surface at curb plate (10), roof (2) set up the top at curb plate (10), and roof (2) and curb plate (10) welding are whole, the surface of roof (2) alternates there is copper post (3), copper post (3) pass from the surface of base plate (1), radiator (8) set up the surface at roof (2), the surface of base plate (1) inlays and is equipped with central processing unit (19), the bottom of radiator (8) is provided with laminating board (18), laminating board (18) are pressed at the surface of central processing unit (19).

2. An embedded motherboard according to claim 1, wherein: the bottom of copper post (3) is provided with screw thread post (5), the surface of copper post (3) is provided with external screw thread (4), the surface cover of external screw thread (4) is equipped with clamping lantern ring (6).

3. An embedded motherboard according to claim 2, wherein: two clamping lantern rings (6) are sleeved on the surface of each copper column (3), and the two clamping lantern rings (6) are respectively arranged at the top of the top plate (2) and the bottom of the base plate (1).

4. An embedded motherboard according to claim 1, wherein: screw holes (12) are formed in the side edges of the wiring panel (7), clamping plates (9) are arranged at the two ends of the side plates (10), strip-shaped holes (11) are formed in the surfaces of the side plates (10), and the two ends of the wiring panel (7) are respectively attached to the inner sides of the two clamping plates (9).

5. The embedded motherboard of claim 4, wherein: the side of wiring panel (7) is fixed through passing splint (9) and screw hole (12) in proper order through using the screw, the rear end of wiring panel (7) is connected with the control circuit part on base plate (1) surface after passing bar hole (11) through using the signal line.

6. An embedded motherboard according to claim 1, wherein: the radiator (8) comprises radiating fins (13) and a heat conducting layer (16), a pressing plate (14) is arranged at the bottom end of each radiating fin (13), an abutting plate (15) is arranged at the bottom end of each pressing plate (14), the heat conducting layer (16) is arranged at the bottom of each abutting plate (15), and an attaching plate (18) is arranged at the bottom end of each heat conducting layer (16).

7. The embedded motherboard of claim 6, wherein: the top outside of central processing unit (19) is provided with bounding wall (20), and the surface coating of central processing unit (19) has silicone grease layer (22), be connected through butt joint screw rod (17) between clamp plate (14) and butt joint board (15).

8. The embedded motherboard of claim 7, wherein: an interlayer (21) is arranged between the side edges of the coaming (20) and the central processing unit (19), the attaching plate (18) is pressed on the surface of the silicone grease layer (22), the bottom of the coaming (20) is attached to the bottom shell of the central processing unit (19), and a plurality of heat dissipation copper pipes are inserted in the heat conducting layer (16).